GB1022061A - Solutions for immersion plating gold and silver - Google Patents
Solutions for immersion plating gold and silverInfo
- Publication number
- GB1022061A GB1022061A GB247063A GB247063A GB1022061A GB 1022061 A GB1022061 A GB 1022061A GB 247063 A GB247063 A GB 247063A GB 247063 A GB247063 A GB 247063A GB 1022061 A GB1022061 A GB 1022061A
- Authority
- GB
- United Kingdom
- Prior art keywords
- gold
- silver
- compound
- plating
- litre
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 title abstract 7
- 239000010931 gold Substances 0.000 title abstract 6
- 229910052737 gold Inorganic materials 0.000 title abstract 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract 4
- 229910052709 silver Inorganic materials 0.000 title abstract 4
- 238000007654 immersion Methods 0.000 title abstract 3
- 239000004332 silver Substances 0.000 title abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 5
- 239000007853 buffer solution Substances 0.000 abstract 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 3
- 229910052759 nickel Inorganic materials 0.000 abstract 3
- 150000003839 salts Chemical class 0.000 abstract 3
- 239000000243 solution Substances 0.000 abstract 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 2
- 239000007864 aqueous solution Substances 0.000 abstract 2
- 239000008139 complexing agent Substances 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 150000002344 gold compounds Chemical class 0.000 abstract 2
- 150000002500 ions Chemical class 0.000 abstract 2
- 229910021645 metal ion Inorganic materials 0.000 abstract 2
- 150000001455 metallic ions Chemical class 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 abstract 2
- QBYIENPQHBMVBV-HFEGYEGKSA-N (2R)-2-hydroxy-2-phenylacetic acid Chemical compound O[C@@H](C(O)=O)c1ccccc1.O[C@@H](C(O)=O)c1ccccc1 QBYIENPQHBMVBV-HFEGYEGKSA-N 0.000 abstract 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 abstract 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 abstract 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 1
- IWYDHOAUDWTVEP-UHFFFAOYSA-N R-2-phenyl-2-hydroxyacetic acid Natural products OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 abstract 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 abstract 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- MJOQJPYNENPSSS-XQHKEYJVSA-N [(3r,4s,5r,6s)-4,5,6-triacetyloxyoxan-3-yl] acetate Chemical compound CC(=O)O[C@@H]1CO[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O MJOQJPYNENPSSS-XQHKEYJVSA-N 0.000 abstract 1
- 235000019270 ammonium chloride Nutrition 0.000 abstract 1
- 235000011114 ammonium hydroxide Nutrition 0.000 abstract 1
- 229960004106 citric acid Drugs 0.000 abstract 1
- 229910017052 cobalt Inorganic materials 0.000 abstract 1
- 239000010941 cobalt Substances 0.000 abstract 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract 1
- 229960002510 mandelic acid Drugs 0.000 abstract 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 abstract 1
- NRTDAKURTMLAFN-UHFFFAOYSA-N potassium;gold(3+);tetracyanide Chemical compound [K+].[Au+3].N#[C-].N#[C-].N#[C-].N#[C-] NRTDAKURTMLAFN-UHFFFAOYSA-N 0.000 abstract 1
- 229960004889 salicylic acid Drugs 0.000 abstract 1
- 229940100890 silver compound Drugs 0.000 abstract 1
- 150000003379 silver compounds Chemical class 0.000 abstract 1
- 229910052708 sodium Inorganic materials 0.000 abstract 1
- 239000011734 sodium Substances 0.000 abstract 1
- 229960001367 tartaric acid Drugs 0.000 abstract 1
- 239000011975 tartaric acid Substances 0.000 abstract 1
- 235000002906 tartaric acid Nutrition 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
A gold-plating aqueous solution for immersion plating gold contains a soluble gold compound, a compound forming complex ions with metallic ions originating from the foundation metal to be plated, a buffer solution and added active metal ions e.g. Cu, Ni, Co, added as salts. A silver-plating solution for immersion plating silver comprises an aqueous solution consisting of a silver compound, a cyanide, a compound for forming complex ions with metallic ions originating from the foundation metal to be plated and a soluble salt of at least one element from copper, nickel, cobalt, zinc and gold. The added active metal ions are added to the gold or silver plating solutions to change the electrode potential of the foundation metal to be plated by at least 150 millivolts as measured before and during plating operation. Suitable soluble gold compounds include gold-potassium cyanide; suitable complexing agents are ethylene diamine 2-sodium tetraacetate, citric acid, salicylic acid, mandelic acid and tartaric acid. As the buffer solution a mixture of NH4OH and NH4Cl may be used for the pH range 8-11 and a mixture of triethanolamine and its chloride for the pH range 6.5-8. The solution may contain from 0.003-0.1 mol/litre of soluble Au compound, from 0.004-0.08 mol/litre of active metal salt, from 0.27-0.027 mol/litre of complexing agent, and from 1-120 c.cs./litre of buffer solution for setting the pH value from 5-11. Preferably the foundation metal e.g. nickel to be plated with Au or Ag is preliminarily dipped in 1:1 HCl at 80 DEG C. for 1 minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US376031A US3342034A (en) | 1963-06-21 | 1964-06-18 | Roof supports |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP184662 | 1962-01-19 | ||
| JP2462962 | 1962-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1022061A true GB1022061A (en) | 1966-03-09 |
Family
ID=26335135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB247063A Expired GB1022061A (en) | 1962-01-19 | 1963-06-21 | Solutions for immersion plating gold and silver |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1022061A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3506462A (en) * | 1966-10-29 | 1970-04-14 | Nippon Electric Co | Electroless gold plating solutions |
| DE2807564A1 (en) * | 1978-02-22 | 1979-08-30 | Burr Brown Res Corp | Electroless gold plating a nickel plated workpiece - to provide a nickel-gold alloy layer |
| DE19745602C1 (en) * | 1997-10-08 | 1999-07-15 | Atotech Deutschland Gmbh | Method and solution for the production of gold layers |
| WO2002029132A1 (en) * | 2000-10-06 | 2002-04-11 | Atotech Deutschland Gmbh | Bath and method of electroless plating of silver on metal surfaces |
| CN102747347A (en) * | 2012-07-31 | 2012-10-24 | 淮安市曼蒂科技发展有限公司 | Chemical silver plating solution and preparation method thereof |
-
1963
- 1963-06-21 GB GB247063A patent/GB1022061A/en not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3506462A (en) * | 1966-10-29 | 1970-04-14 | Nippon Electric Co | Electroless gold plating solutions |
| DE2807564A1 (en) * | 1978-02-22 | 1979-08-30 | Burr Brown Res Corp | Electroless gold plating a nickel plated workpiece - to provide a nickel-gold alloy layer |
| DE19745602C1 (en) * | 1997-10-08 | 1999-07-15 | Atotech Deutschland Gmbh | Method and solution for the production of gold layers |
| US6336962B1 (en) | 1997-10-08 | 2002-01-08 | Atotech Deutschland Gmbh | Method and solution for producing gold coating |
| WO2002029132A1 (en) * | 2000-10-06 | 2002-04-11 | Atotech Deutschland Gmbh | Bath and method of electroless plating of silver on metal surfaces |
| US6869637B2 (en) | 2000-10-06 | 2005-03-22 | Atotech Deutschland Gmbh | Bath and method of electroless plating of silver on metal surfaces |
| KR100809891B1 (en) | 2000-10-06 | 2008-03-06 | 아토테크 도이칠란드 게엠베하 | Electroless Silver Plating Baths and Plating Methods on Metal Surfaces |
| CN102747347A (en) * | 2012-07-31 | 2012-10-24 | 淮安市曼蒂科技发展有限公司 | Chemical silver plating solution and preparation method thereof |
| CN102747347B (en) * | 2012-07-31 | 2014-06-11 | 淮安市曼蒂科技发展有限公司 | Chemical silver plating solution and preparation method thereof |
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