GB1015532A - Improvements in or relating to semiconductor devices - Google Patents
Improvements in or relating to semiconductor devicesInfo
- Publication number
- GB1015532A GB1015532A GB14602/62A GB1460262A GB1015532A GB 1015532 A GB1015532 A GB 1015532A GB 14602/62 A GB14602/62 A GB 14602/62A GB 1460262 A GB1460262 A GB 1460262A GB 1015532 A GB1015532 A GB 1015532A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- conductor
- electrode
- emitter
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000011521 glass Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- RZVXOCDCIIFGGH-UHFFFAOYSA-N chromium gold Chemical compound [Cr].[Au] RZVXOCDCIIFGGH-UHFFFAOYSA-N 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000010445 mica Substances 0.000 abstract 1
- 229910052618 mica group Inorganic materials 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/30—Devices controlled by electric currents or voltages
- H10D48/32—Devices controlled by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H10D48/34—Bipolar devices
- H10D48/345—Bipolar transistors having ohmic electrodes on emitter-like, base-like, and collector-like regions
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Die Bonding (AREA)
Abstract
1,015,532. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. April 11, 1963 [April 16, 1962], No. 14602/62 Heading H1K. A semi-conductor device with one electrode at one plain face and another electrode at a further face of the semi-conductor is mounted on a thin insulating plate by joining the plain face to an area of metallic film deposited on the plate, the other electrode being connected by a wire to another separate area of metallic film, and the whole assembly is then encapsulated in a hardenable plastics material. In one embodiment (Fig. 1) an NPN silicon transistor 10 formed by epitaxial planar growth has a P- type base 10 and N-type emitter 14 formed by double diffusion into an N-type region 12 through holes, etched by photo-lithographic techniques, in a silicon dioxide layer 15, with aluminium film 18 providing base and emitter electrodes. The transistor is mounted on one end of a thin glass plate 31 (Fig. 3) on which has been vapour deposited gold-chromium stripes 32, 33, 34. Collector connection is effected through the N+ region and emitter and base connections are made by thin gold wires 35, 36 which may be thermo-compression bonded to the stripes or jointed thereto by a silver loaded epoxy resin. The whole assembly is then encapsulated in a mass of resin or glaze. In a further modification (Fig. 7, not shown) a further lead is provided extending out from each stripe through the mass of encapsulating resin which in this case covers the whole of the glass substrate. The invention is applicable to diodes, matched transistors (including integral resistors and capacitors in the semi-conductor material). The substrate may be glass, mica, ceramic or silicon.
Priority Applications (22)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL291538D NL291538A (en) | 1962-04-16 | ||
BE631066D BE631066A (en) | 1962-04-16 | ||
DENDAT1287696D DE1287696B (en) | 1962-04-16 | ||
GB14602/62A GB1015532A (en) | 1962-04-16 | 1962-04-16 | Improvements in or relating to semiconductor devices |
CH452163A CH423995A (en) | 1962-04-16 | 1963-04-09 | Method of mounting and encapsulating a semiconductor device |
DEJ23535A DE1282188B (en) | 1962-04-16 | 1963-04-11 | Electrical semiconductor arrangement with several strip-shaped supply lines isolated from one another |
US273062A US3244939A (en) | 1962-04-16 | 1963-04-15 | Encapsulated die bonded hybrid integrated circuit |
FR931635A FR1354552A (en) | 1962-04-16 | 1963-04-16 | Manufacturing process applicable to semiconductor electronic components for printed circuits |
GB3785/64A GB1036164A (en) | 1962-04-16 | 1964-01-29 | Improvements in or relating to semiconductor devices |
NL6408106A NL6408106A (en) | 1962-04-16 | 1964-07-16 | |
BE651446D BE651446A (en) | 1962-04-16 | 1964-08-06 | |
FR984543A FR86320E (en) | 1962-04-16 | 1964-08-07 | Manufacturing process applicable to semiconductor electronic components for printed circuits |
DE1439529A DE1439529B2 (en) | 1962-04-16 | 1964-08-12 | : Semiconductor component with a planar semiconductor element on a bonding plate and method for producing the same |
DEST22571A DE1292758B (en) | 1962-04-16 | 1964-08-21 | Electric semiconductor component |
NL6409848A NL6409848A (en) | 1962-04-16 | 1964-08-26 | |
NL6409849A NL6409849A (en) | 1962-04-16 | 1964-08-26 | |
FR986227A FR86819E (en) | 1962-04-16 | 1964-08-26 | Manufacturing process applicable to semiconductor electronic components for printed circuits |
BE652660D BE652660A (en) | 1962-04-16 | 1964-09-04 | |
DEST22635A DE1292761B (en) | 1962-04-16 | 1964-09-05 | Planar semiconductor device and method for its manufacture |
CH1250264A CH471468A (en) | 1962-04-16 | 1964-09-25 | Electric semiconductor device |
FR989359A FR86957E (en) | 1962-04-16 | 1964-09-25 | Manufacturing process applicable to semiconductor electronic components for printed circuits |
BE653537D BE653537A (en) | 1962-04-16 | 1964-09-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB14602/62A GB1015532A (en) | 1962-04-16 | 1962-04-16 | Improvements in or relating to semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1015532A true GB1015532A (en) | 1966-01-05 |
Family
ID=10044198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB14602/62A Expired GB1015532A (en) | 1962-04-16 | 1962-04-16 | Improvements in or relating to semiconductor devices |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1015532A (en) |
-
1962
- 1962-04-16 GB GB14602/62A patent/GB1015532A/en not_active Expired
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