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FR3154502B1 - Device for testing a plurality of integrated circuits on a semiconductor wafer - Google Patents

Device for testing a plurality of integrated circuits on a semiconductor wafer

Info

Publication number
FR3154502B1
FR3154502B1 FR2311298A FR2311298A FR3154502B1 FR 3154502 B1 FR3154502 B1 FR 3154502B1 FR 2311298 A FR2311298 A FR 2311298A FR 2311298 A FR2311298 A FR 2311298A FR 3154502 B1 FR3154502 B1 FR 3154502B1
Authority
FR
France
Prior art keywords
integrated circuits
circuits
semiconductor wafer
tester
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2311298A
Other languages
French (fr)
Other versions
FR3154502A1 (en
Inventor
Christophe Bastien
Mohamed Mohamedoun Ag
Thomas Vautrin
Lucas Mazzeo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemiafrance
Original Assignee
Idemiafrance
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemiafrance filed Critical Idemiafrance
Priority to FR2311298A priority Critical patent/FR3154502B1/en
Priority to PCT/EP2024/079067 priority patent/WO2025082986A1/en
Publication of FR3154502A1 publication Critical patent/FR3154502A1/en
Application granted granted Critical
Publication of FR3154502B1 publication Critical patent/FR3154502B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07385—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Carte à sonde (3002) pour tester une pluralité de circuits intégrés (1001) sur une galette (1000) en semi-conducteur, ladite carte à sonde (3002) comprenant : - une pluralité de pointes (3002a) adaptées à assurer une connexion électrique temporaire avec les connecteurs (2000) d’une pluralité de circuits intégrés (1001) à tester sur une galette (1000) en semi-conducteur ; - au moins un circuit tampon (4001a) arrangé pour partager une même ressource d’alimentation électrique (SC1) d’un testeur (3004) avec les entrées d’alimentation électrique (VCC) d’un groupe d’au moins quatre circuits intégrés (1001a-d) parmi la pluralité de circuits intégrés (1001) à tester ; - au moins un groupe (4002) d’au moins quatre circuits multiplexeurs (4002a-d) arrangés de sorte qu’une même ressource haute-tension (HVC1) du testeur (3004) est partagée avec une première entrée de chacun des quatre circuits multiplexeur (4002a-d), une ressource électronique entrée/sortie de données différente (DC1-4) du testeur (3004) est en communication électrique avec une deuxième entrée de chacun des quatre circuits multiplexeur (4002a-d), et la sortie de chacun des quatre circuits multiplexeur (4002a-d) est en communication électrique avec une entrée/sortie de test (SPT) d’un circuit intégré (1001a-d) dudit groupe d’au moins quatre circuits intégrés (1001a-d) parmi la pluralité de circuits intégrés (1001) à tester.Probe card (3002) for testing a plurality of integrated circuits (1001) on a semiconductor wafer (1000), said probe card (3002) comprising: - a plurality of probes (3002a) adapted to ensure a temporary electrical connection with the connectors (2000) of a plurality of integrated circuits (1001) to be tested on a semiconductor wafer (1000); - at least one buffer circuit (4001a) arranged to share the same power supply resource (SC1) of a tester (3004) with the power supply inputs (VCC) of a group of at least four integrated circuits (1001a-d) from among the plurality of integrated circuits (1001) to be tested; - at least one group (4002) of at least four multiplexer circuits (4002a-d) arranged so that the same high-voltage resource (HVC1) of the tester (3004) is shared with a first input of each of the four multiplexer circuits (4002a-d), a different electronic data input/output resource (DC1-4) of the tester (3004) is in electrical communication with a second input of each of the four multiplexer circuits (4002a-d), and the output of each of the four multiplexer circuits (4002a-d) is in electrical communication with a test input/output (SPT) of an integrated circuit (1001a-d) of said group of at least four integrated circuits (1001a-d) from among the plurality of integrated circuits (1001) to be tested.

FR2311298A 2023-10-19 2023-10-19 Device for testing a plurality of integrated circuits on a semiconductor wafer Active FR3154502B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR2311298A FR3154502B1 (en) 2023-10-19 2023-10-19 Device for testing a plurality of integrated circuits on a semiconductor wafer
PCT/EP2024/079067 WO2025082986A1 (en) 2023-10-19 2024-10-15 Device for testing a plurality of integrated circuits on a semiconductor wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2311298A FR3154502B1 (en) 2023-10-19 2023-10-19 Device for testing a plurality of integrated circuits on a semiconductor wafer
FR2311298 2023-10-19

Publications (2)

Publication Number Publication Date
FR3154502A1 FR3154502A1 (en) 2025-04-25
FR3154502B1 true FR3154502B1 (en) 2025-11-28

Family

ID=90904626

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2311298A Active FR3154502B1 (en) 2023-10-19 2023-10-19 Device for testing a plurality of integrated circuits on a semiconductor wafer

Country Status (2)

Country Link
FR (1) FR3154502B1 (en)
WO (1) WO2025082986A1 (en)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956602A (en) 1989-02-14 1990-09-11 Amber Engineering, Inc. Wafer scale testing of redundant integrated circuit dies
US5442282A (en) * 1992-07-02 1995-08-15 Lsi Logic Corporation Testing and exercising individual, unsingulated dies on a wafer
JP3838381B2 (en) * 1995-11-22 2006-10-25 株式会社アドバンテスト Probe card
US6246250B1 (en) 1998-05-11 2001-06-12 Micron Technology, Inc. Probe card having on-board multiplex circuitry for expanding tester resources
US6400173B1 (en) 1999-11-19 2002-06-04 Hitachi, Ltd. Test system and manufacturing of semiconductor device
US6871307B2 (en) 2001-10-10 2005-03-22 Tower Semiconductorltd. Efficient test structure for non-volatile memory and other semiconductor integrated circuits
DE10202904B4 (en) 2002-01-25 2004-11-18 Infineon Technologies Ag Device and method for parallel and independent testing of voltage-supplied semiconductor memory devices
US8581610B2 (en) 2004-04-21 2013-11-12 Charles A Miller Method of designing an application specific probe card test system
US7307433B2 (en) * 2004-04-21 2007-12-11 Formfactor, Inc. Intelligent probe card architecture
US7245134B2 (en) 2005-01-31 2007-07-17 Formfactor, Inc. Probe card assembly including a programmable device to selectively route signals from channels of a test system controller to probes
US7852094B2 (en) * 2006-12-06 2010-12-14 Formfactor, Inc. Sharing resources in a system for testing semiconductor devices
US7576550B2 (en) * 2007-03-30 2009-08-18 Qualitau, Inc. Automatic multiplexing system for automated wafer testing
US8531202B2 (en) * 2007-10-11 2013-09-10 Veraconnex, Llc Probe card test apparatus and method
US7893701B2 (en) * 2008-05-05 2011-02-22 Formfactor, Inc. Method and apparatus for enhanced probe card architecture
JP5312227B2 (en) * 2009-06-29 2013-10-09 株式会社日本マイクロニクス Probe card and inspection device
KR101550870B1 (en) 2009-12-02 2015-09-07 삼성전자주식회사 TEST DEVICE WITH PROBE CARD AND TEST METHOD USING THE SAME
US9488674B2 (en) 2014-07-09 2016-11-08 Infineon Technologies Ag Testing device and a circuit arrangement
IT202000012556A1 (en) * 2020-05-27 2021-11-27 Crea Collaudi Elettr Automatizzati Srl SAFETY SYSTEM FOR NEEDLE PROBE CARD FOR HIGH VOLTAGE AND HIGH CURRENT TEST ON POWER SEMICONDUCTOR DEVICES AND RELATED TEST MACHINE.
US11630153B2 (en) 2021-04-26 2023-04-18 Winbond Electronics Corp. Chip testing apparatus and system with sharing test interface

Also Published As

Publication number Publication date
FR3154502A1 (en) 2025-04-25
WO2025082986A1 (en) 2025-04-24

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