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FR2992772B1 - Procede de realisation de structure composite avec collage de type metal/metal - Google Patents

Procede de realisation de structure composite avec collage de type metal/metal

Info

Publication number
FR2992772B1
FR2992772B1 FR1256161A FR1256161A FR2992772B1 FR 2992772 B1 FR2992772 B1 FR 2992772B1 FR 1256161 A FR1256161 A FR 1256161A FR 1256161 A FR1256161 A FR 1256161A FR 2992772 B1 FR2992772 B1 FR 2992772B1
Authority
FR
France
Prior art keywords
metal
collage
composite structure
producing composite
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1256161A
Other languages
English (en)
Other versions
FR2992772A1 (fr
Inventor
Ionut Radu
Marcel Broekaart
Arnaud Castex
Gweltaz Gaudin
Gregory Riou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR1256161A priority Critical patent/FR2992772B1/fr
Priority to PCT/IB2013/001250 priority patent/WO2014001868A1/fr
Priority to CN201380034211.0A priority patent/CN104412360B/zh
Priority to US14/411,741 priority patent/US9905531B2/en
Priority to KR1020147036622A priority patent/KR102084541B1/ko
Publication of FR2992772A1 publication Critical patent/FR2992772A1/fr
Application granted granted Critical
Publication of FR2992772B1 publication Critical patent/FR2992772B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639—Adjacent, identical composition, components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639—Adjacent, identical composition, components
    • Y10T428/12646—Group VIII or IB metal-base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639—Adjacent, identical composition, components
    • Y10T428/12646—Group VIII or IB metal-base
    • Y10T428/12653—Fe, containing 0.01-1.7% carbon [i.e., steel]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674—Ge- or Si-base component

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  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
FR1256161A 2012-06-28 2012-06-28 Procede de realisation de structure composite avec collage de type metal/metal Active FR2992772B1 (fr)

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FR1256161A FR2992772B1 (fr) 2012-06-28 2012-06-28 Procede de realisation de structure composite avec collage de type metal/metal
PCT/IB2013/001250 WO2014001868A1 (fr) 2012-06-28 2013-06-05 Procédé de production d'une structure composite à liaison métal/métal
CN201380034211.0A CN104412360B (zh) 2012-06-28 2013-06-05 利用金属/金属结合制造复合结构的方法
US14/411,741 US9905531B2 (en) 2012-06-28 2013-06-05 Method for producing composite structure with metal/metal bonding
KR1020147036622A KR102084541B1 (ko) 2012-06-28 2013-06-05 금속/금속 결합을 가지는 복합 구조체의 생산방법

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CN108028180B (zh) * 2016-02-16 2022-01-28 Ev 集团 E·索尔纳有限责任公司 用于接合衬底的方法
US9837682B1 (en) * 2016-08-29 2017-12-05 Microsoft Technology Licensing, Llc Variable layer thickness in curved battery cell
US11058616B2 (en) 2017-12-18 2021-07-13 The Procter & Gamble Company Aerosol antiperspirant methods

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US6962835B2 (en) * 2003-02-07 2005-11-08 Ziptronix, Inc. Method for room temperature metal direct bonding
US20040262772A1 (en) 2003-06-30 2004-12-30 Shriram Ramanathan Methods for bonding wafers using a metal interlayer
FR2880186B1 (fr) * 2004-12-24 2007-07-20 Soitec Silicon On Insulator Procede de traitement d'une surface de plaquette
FR2910177B1 (fr) * 2006-12-18 2009-04-03 Soitec Silicon On Insulator Couche tres fine enterree
US7682933B1 (en) * 2007-09-26 2010-03-23 The United States Of America As Represented By The Secretary Of The Air Force Wafer alignment and bonding
FR2926671B1 (fr) * 2008-01-17 2010-04-02 Soitec Silicon On Insulator Procede de traitement de defauts lors de collage de plaques
FR2931014B1 (fr) * 2008-05-06 2010-09-03 Soitec Silicon On Insulator Procede d'assemblage de plaques par adhesion moleculaire
FR2935537B1 (fr) * 2008-08-28 2010-10-22 Soitec Silicon On Insulator Procede d'initiation d'adhesion moleculaire
US8147630B2 (en) * 2008-11-16 2012-04-03 Suss Microtec Lithography, Gmbh Method and apparatus for wafer bonding with enhanced wafer mating
FR2962594B1 (fr) 2010-07-07 2012-08-31 Soitec Silicon On Insulator Procede de collage par adhesion moleculaire avec compensation de desalignement radial
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WO2014001868A1 (fr) 2014-01-03
KR102084541B1 (ko) 2020-03-05
CN104412360A (zh) 2015-03-11
KR20150023507A (ko) 2015-03-05
US9905531B2 (en) 2018-02-27
FR2992772A1 (fr) 2014-01-03
CN104412360B (zh) 2016-11-09

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