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FR2970117B1 - Procédé de fabrication d'une puce de circuit intégré a connexion par la face arrière - Google Patents

Procédé de fabrication d'une puce de circuit intégré a connexion par la face arrière

Info

Publication number
FR2970117B1
FR2970117B1 FR1061329A FR1061329A FR2970117B1 FR 2970117 B1 FR2970117 B1 FR 2970117B1 FR 1061329 A FR1061329 A FR 1061329A FR 1061329 A FR1061329 A FR 1061329A FR 2970117 B1 FR2970117 B1 FR 2970117B1
Authority
FR
France
Prior art keywords
manufacturing
integrated circuit
circuit chip
side connection
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1061329A
Other languages
English (en)
Other versions
FR2970117A1 (fr
Inventor
Yannick Sanchez
Mickael Fourel
Alain Inard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Crolles 2 SAS
Original Assignee
STMicroelectronics Crolles 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Crolles 2 SAS filed Critical STMicroelectronics Crolles 2 SAS
Priority to FR1061329A priority Critical patent/FR2970117B1/fr
Publication of FR2970117A1 publication Critical patent/FR2970117A1/fr
Application granted granted Critical
Publication of FR2970117B1 publication Critical patent/FR2970117B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
FR1061329A 2010-12-29 2010-12-29 Procédé de fabrication d'une puce de circuit intégré a connexion par la face arrière Expired - Fee Related FR2970117B1 (fr)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2022199790A1 (fr) 2021-03-22 2022-09-29 Symrise Ag Composition détergente liquide

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JP4731191B2 (ja) * 2005-03-28 2011-07-20 富士通セミコンダクター株式会社 半導体装置及び半導体装置の製造方法
US7772116B2 (en) * 2005-09-01 2010-08-10 Micron Technology, Inc. Methods of forming blind wafer interconnects
WO2009140524A2 (fr) * 2008-05-15 2009-11-19 Interplex Industries, Inc. Revêtement en composé d'étain-argent sur cartes à circuits imprimés
JP4601686B2 (ja) * 2008-06-17 2010-12-22 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法
US8759949B2 (en) * 2009-04-30 2014-06-24 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer backside structures having copper pillars

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022199790A1 (fr) 2021-03-22 2022-09-29 Symrise Ag Composition détergente liquide

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