FR2962429B1 - Procede de fabrication d'un composant amortissant les vibrations - Google Patents
Procede de fabrication d'un composant amortissant les vibrationsInfo
- Publication number
- FR2962429B1 FR2962429B1 FR1155947A FR1155947A FR2962429B1 FR 2962429 B1 FR2962429 B1 FR 2962429B1 FR 1155947 A FR1155947 A FR 1155947A FR 1155947 A FR1155947 A FR 1155947A FR 2962429 B1 FR2962429 B1 FR 2962429B1
- Authority
- FR
- France
- Prior art keywords
- vibration
- manufacturing
- damper component
- damper
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Vibration Prevention Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010030960.5A DE102010030960B4 (de) | 2010-07-06 | 2010-07-06 | Verfahren zur Herstellung eines schwingungsgedämpften Bauteils |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2962429A1 FR2962429A1 (fr) | 2012-01-13 |
FR2962429B1 true FR2962429B1 (fr) | 2017-07-28 |
Family
ID=44898760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1155947A Active FR2962429B1 (fr) | 2010-07-06 | 2011-07-01 | Procede de fabrication d'un composant amortissant les vibrations |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR101877713B1 (fr) |
CN (1) | CN102311092A (fr) |
DE (1) | DE102010030960B4 (fr) |
FR (1) | FR2962429B1 (fr) |
IT (1) | ITMI20111202A1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011003195B4 (de) | 2011-01-26 | 2019-01-10 | Robert Bosch Gmbh | Bauteil und Verfahren zum Herstellen eines Bauteils |
US8946833B2 (en) * | 2012-10-22 | 2015-02-03 | Freescale Semiconductor, Inc. | Packaging for semiconductor sensor devices and methods |
US10840536B2 (en) | 2013-02-06 | 2020-11-17 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with containment chambers |
US10497633B2 (en) | 2013-02-06 | 2019-12-03 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with fluid containment |
CN105324841A (zh) * | 2013-02-06 | 2016-02-10 | 伊利诺伊大学评议会 | 用于可拉伸的电子器件的自相似和分形设计 |
US9613911B2 (en) | 2013-02-06 | 2017-04-04 | The Board Of Trustees Of The University Of Illinois | Self-similar and fractal design for stretchable electronics |
DE102013204811A1 (de) * | 2013-03-19 | 2014-09-25 | Robert Bosch Gmbh | Sensorvorrichtung zum Sensieren eines Gases, Verfahren zum Betreiben einer Sensorvorrichtung zum Sensieren eines Gases und Herstellungsverfahren für eine Sensorvorrichtung zum Sensieren eines Gases |
DE102013206524A1 (de) * | 2013-04-12 | 2014-10-16 | Robert Bosch Gmbh | Bauelement, Nutzen und Verfahren zum Herstellen eines Bauelements |
DE102014202821B4 (de) * | 2014-02-17 | 2023-03-30 | Robert Bosch Gmbh | Gehäuse für ein mikromechanisches Sensorelement |
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DE102016003944B4 (de) | 2016-04-06 | 2021-10-21 | Masa GmbH | Vorrichtung zur Qualitätsüberwachung an einer Steinformmaschine |
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DE102019204761A1 (de) * | 2019-04-03 | 2020-10-08 | Robert Bosch Gmbh | Verfahren zur Anordnung einer optischen Einrichtung und Kameraeinrichtung |
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DE10259795A1 (de) * | 2002-12-19 | 2004-07-08 | Siemens Ag | Bilderzeugungsvorrichtung zum Einbau im Dachbereich oder im Aussenspiegel eines Kraftfahrzeuges |
JP4238724B2 (ja) * | 2003-03-27 | 2009-03-18 | 株式会社デンソー | 半導体装置 |
DE10332303A1 (de) * | 2003-07-16 | 2005-02-17 | Robert Bosch Gmbh | Halterung für Bauteile |
DE102004043663B4 (de) * | 2004-09-07 | 2006-06-08 | Infineon Technologies Ag | Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip und Verfahren zur Herstellung eines Halbleitersensorbauteils mit Hohlraumgehäuse und Sensorchip |
JP4831949B2 (ja) | 2004-09-08 | 2011-12-07 | 株式会社デンソー | 物理量センサ装置 |
DE102005002813B4 (de) * | 2005-01-20 | 2006-10-19 | Robert Bosch Gmbh | Steuermodul |
DE102005012404B4 (de) * | 2005-03-17 | 2007-05-03 | Siemens Ag | Leiterplatte |
DE102006011753B4 (de) * | 2006-03-13 | 2021-01-28 | Infineon Technologies Ag | Halbleitersensorbauteil, Verfahren zur Herstellung eines Nutzens und Verfahren zur Herstellung von Halbleitersensorbauteilen |
WO2008151675A1 (fr) * | 2007-06-15 | 2008-12-18 | Robert Bosch Gmbh | Boîtier prémoulé comportant une isolation contre les vibrations intégrée |
DE102008016133B4 (de) * | 2008-03-28 | 2013-12-19 | Continental Automotive Gmbh | Leiterplatte und Verfahren zum Herstellen einer Leiterplatte |
EP2112471A1 (fr) * | 2008-04-22 | 2009-10-28 | Microcomponents AG | Dispositif de montage pour composant électronique |
JP4851555B2 (ja) * | 2008-05-13 | 2012-01-11 | 株式会社デンソー | 力学量センサおよびその製造方法 |
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DE102010030960B4 (de) | 2020-12-10 |
FR2962429A1 (fr) | 2012-01-13 |
DE102010030960A1 (de) | 2012-01-12 |
CN102311092A (zh) | 2012-01-11 |
KR20120004335A (ko) | 2012-01-12 |
ITMI20111202A1 (it) | 2012-01-07 |
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