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FR2871652B1 - PRINTED CIRCUIT WITH PROTECTED COMPONENT - Google Patents

PRINTED CIRCUIT WITH PROTECTED COMPONENT

Info

Publication number
FR2871652B1
FR2871652B1 FR0406263A FR0406263A FR2871652B1 FR 2871652 B1 FR2871652 B1 FR 2871652B1 FR 0406263 A FR0406263 A FR 0406263A FR 0406263 A FR0406263 A FR 0406263A FR 2871652 B1 FR2871652 B1 FR 2871652B1
Authority
FR
France
Prior art keywords
printed circuit
protected component
protected
component
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0406263A
Other languages
French (fr)
Other versions
FR2871652A1 (en
Inventor
Thierry Elbhar
Jean Gatinois
Marc Iliozer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Climatisation SA
Original Assignee
Valeo Climatisation SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Climatisation SA filed Critical Valeo Climatisation SA
Priority to FR0406263A priority Critical patent/FR2871652B1/en
Priority to DE102005026404.2A priority patent/DE102005026404B4/en
Publication of FR2871652A1 publication Critical patent/FR2871652A1/en
Application granted granted Critical
Publication of FR2871652B1 publication Critical patent/FR2871652B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
FR0406263A 2004-06-10 2004-06-10 PRINTED CIRCUIT WITH PROTECTED COMPONENT Expired - Fee Related FR2871652B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0406263A FR2871652B1 (en) 2004-06-10 2004-06-10 PRINTED CIRCUIT WITH PROTECTED COMPONENT
DE102005026404.2A DE102005026404B4 (en) 2004-06-10 2005-06-08 Printed circuit for protected ceramic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0406263A FR2871652B1 (en) 2004-06-10 2004-06-10 PRINTED CIRCUIT WITH PROTECTED COMPONENT

Publications (2)

Publication Number Publication Date
FR2871652A1 FR2871652A1 (en) 2005-12-16
FR2871652B1 true FR2871652B1 (en) 2007-09-21

Family

ID=34946873

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0406263A Expired - Fee Related FR2871652B1 (en) 2004-06-10 2004-06-10 PRINTED CIRCUIT WITH PROTECTED COMPONENT

Country Status (2)

Country Link
DE (1) DE102005026404B4 (en)
FR (1) FR2871652B1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008113343A2 (en) * 2007-03-19 2008-09-25 Conti Temic Microelectronic Gmbh Electronic module comprising a conductor fuse
US8780518B2 (en) 2011-02-04 2014-07-15 Denso Corporation Electronic control device including interrupt wire
DE102021202801B4 (en) * 2021-03-23 2022-10-13 Hanon Systems Efp Deutschland Gmbh Circuit with a printed circuit board and vehicle with at least one such circuit

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778532A (en) * 1972-07-03 1973-12-11 Illinois Tool Works Electrical circuit component having solder preform connection means
JPH01158793A (en) * 1987-12-15 1989-06-21 Matsushita Electric Ind Co Ltd Chip component mounting device
JPH05226817A (en) * 1991-02-28 1993-09-03 Nippon Chemicon Corp Printed circuit device
JP2541063Y2 (en) * 1991-09-04 1997-07-09 日本電気株式会社 Printed circuit board pattern structure
US5307980A (en) * 1993-02-10 1994-05-03 Ford Motor Company Solder pad configuration for wave soldering
JPH0888447A (en) * 1994-09-16 1996-04-02 Ricoh Co Ltd Method of connecting pad to conductor pattern on printed circuit board
JPH08316591A (en) * 1995-05-19 1996-11-29 Fujitsu General Ltd Printed board
US5739743A (en) * 1996-02-05 1998-04-14 Emc Technology, Inc. Asymmetric resistor terminal
DE19752781A1 (en) * 1997-11-28 1999-06-02 Wabco Gmbh Circuit arrangement for protecting an electrical component from an electrical potential
US6671176B1 (en) * 2002-06-27 2003-12-30 Eastman Kodak Company Method of cooling heat-generating electrical components

Also Published As

Publication number Publication date
FR2871652A1 (en) 2005-12-16
DE102005026404A1 (en) 2006-01-19
DE102005026404B4 (en) 2021-03-04

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