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FR2871652A1 - Printed circuit plate, has metal-coated surface creating thermal dissymmetry between conductive hot and cold zones, and connected by thermal bridges to conductive cold zone - Google Patents

Printed circuit plate, has metal-coated surface creating thermal dissymmetry between conductive hot and cold zones, and connected by thermal bridges to conductive cold zone Download PDF

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Publication number
FR2871652A1
FR2871652A1 FR0406263A FR0406263A FR2871652A1 FR 2871652 A1 FR2871652 A1 FR 2871652A1 FR 0406263 A FR0406263 A FR 0406263A FR 0406263 A FR0406263 A FR 0406263A FR 2871652 A1 FR2871652 A1 FR 2871652A1
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FR
France
Prior art keywords
printed circuit
conductive
circuit board
thermal
ceramic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR0406263A
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French (fr)
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FR2871652B1 (en
Inventor
Thierry Elbhar
Jean Gatinois
Marc Iliozer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Climatisation SA
Original Assignee
Valeo Climatisation SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to FR0406263A priority Critical patent/FR2871652B1/en
Priority to DE102005026404.2A priority patent/DE102005026404B4/en
Publication of FR2871652A1 publication Critical patent/FR2871652A1/en
Application granted granted Critical
Publication of FR2871652B1 publication Critical patent/FR2871652B1/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0293Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/094Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727Varying width along a single conductor; Conductors or pads having different widths
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10181Fuse
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The plate has conductive cold and hot zones (14A, 14B), and a metal-coated surface (18) creating thermal dissymmetry between the zones. The surface is connected by thermal bridges (16) to the zone (14A) in order to act as energy dissipater. An opening between the zones permits to remove path that takes current in case of carbonization of the plate. An independent claim is also included for a method of protecting a printed circuit plate against overheating of ceramic components assembled on the plate.

Description

2871652 12871652 1

Domaine de l'invention La présente invention se rapporte au domaine du montage sur circuit imprimé de composants céramiques et elle concerne plus particulièrement une architecture de circuit imprimé assurant une protection contre les risques d'inflammation en cas de défaut ou de panne de ces composants céramiques.  FIELD OF THE INVENTION The present invention relates to the field of circuit board mounting of ceramic components and more particularly to a printed circuit architecture providing protection against the risk of ignition in the event of failure or failure of these ceramic components. .

Art antérieur Les composants céramiques, par exemple des condensateurs, montés sur les circuits imprimés sont sujets à des défaillances liées à différentes origines, comme un délaminage, un choc thermique ou des contraintes mécaniques ou électriques, qui peuvent entraîner une rupture du composant céramique. Cette rupture est de nature à créer un courtcircuit de faible impédance qui en augmentant la température locale au niveau du composant peut créer une inflammation du circuit imprimé sur lequel il est monté et à l'extrême une destruction du produit dans lequel ce circuit et les différents autres composants qu'il supporte sont incorporés.  PRIOR ART Ceramic components, for example capacitors, mounted on the printed circuits are subject to failures related to different origins, such as delamination, thermal shock or mechanical or electrical stresses, which can lead to a rupture of the ceramic component. This break is likely to create a short circuit of low impedance which by increasing the local temperature at the component can create an inflammation of the printed circuit board on which it is mounted and to the extreme destruction of the product in which this circuit and the different other components that it supports are incorporated.

Une solution classique à ce problème consiste à mettre en série avec le composant céramique une résistance permettant une limitation de la puissance totale produite. Toutefois, une telle solution est coûteuse du fait de la difficulté d'implémentation qu'elle implique comme du dimensionnement supplémentaire du circuit imprimé qu'elle nécessite. En outre, elle apporte une limitation importante en matière de compatibilité électromagnétique consécutive par exemple au filtrage haute fréquence.  A conventional solution to this problem is to put in series with the ceramic component a resistor allowing a limitation of the total power produced. However, such a solution is expensive because of the difficulty of implementation that it involves as additional dimensioning of the printed circuit that it requires. In addition, it brings a significant limitation in terms of electromagnetic compatibility consecutive for example high frequency filtering.

2871652 2 Objet et définition de l'invention La présente invention a donc pour objet de pallier les inconvénients précités en proposant une architecture de circuit imprimé simple, c'est-à-dire sans implémentation complémentaire de composants et fiable évitant tout risque d'inflammation de ce circuit en cas de rupture des composants céramiques montés sur ce circuit.  OBJECT AND DEFINITION OF THE INVENTION The object of the present invention is therefore to overcome the aforementioned drawbacks by proposing a simple printed circuit architecture, that is to say without a complementary implementation of components and reliable, avoiding any risk of ignition. of this circuit in case of breakage of the ceramic components mounted on this circuit.

Ces buts sont atteints par une plaque de circuit imprimé comportant des composants électroniques et/ou passifs montés sur cette plaque, dont au moins un composant céramique comportant une première et une seconde broches externes reliées respectivement à des première et seconde plages d'accueil conductrices imprimées sur cette plaque, caractérisée en ce qu'elle comprend un moyen pour créer une dissymétrie thermique entre lesdites deux plages d'accueil conductrices du composant céramique de façon à éviter tout risque d'inflammation de ladite plaque de circuit imprimé.  These objects are achieved by a printed circuit board comprising electronic and / or passive components mounted on this plate, including at least one ceramic component having a first and a second external pin respectively connected to first and second printed conductive reception pads. on this plate, characterized in that it comprises a means for creating a thermal asymmetry between said two conductive reception areas of the ceramic component so as to avoid any risk of ignition of said printed circuit board.

Cette structure particulièrement simple en évitant le risque d'inflammation de la plaque de circuit imprimé interdit toute destruction du produit qui l'incorpore.  This particularly simple structure avoiding the risk of ignition of the printed circuit board prohibits any destruction of the product that incorporates it.

Selon un mode de réalisation préférentiel, ledit moyen de création d'une dissymétrie thermique comporte une surface métallisée de grande dimension reliée par des ponts thermiques à une desdites plages d'accueil conductrices de façon à se conduire thermiquement comme un dissipateur d'énergie. Ladite surface métallisée de grande dimension est comprise entre 2 et 10 fois la surface de ladite broche externe du composant céramique.  According to a preferred embodiment, said means for creating a thermal asymmetry comprises a metallized surface of large dimension connected by thermal bridges to one of said conductive reception pads so as to behave thermally as an energy sink. Said metallized surface of large dimension is between 2 and 10 times the surface of said outer pin of the ceramic component.

Selon un autre mode de réalisation, ledit moyen de création d'une dissymétrie thermique comporte une ouverture réalisée dans ladite plaque entre lesdits première et seconde plages d'accueil conductrices directement sous ledit composant céramique. De préférence, ladite 2871652 3 ouverture est constituée d'une fente dont la longueur est supérieure à celle desdites plages d'accueil conductrices.  According to another embodiment, said means for creating a thermal asymmetry comprises an opening made in said plate between said first and second conductive reception areas directly under said ceramic component. Preferably, said opening consists of a slot whose length is greater than that of said conductive reception areas.

Selon encore un autre mode de réalisation, ledit moyen de création d'une dissymétrie thermique comporte immédiatement en aval de l'autre desdites plages d'accueil conductrices une piste conductrice ayant une zone de rétrécissement pour créer un effet fusible de nature à provoquer une coupure de cette piste conductrice en cas d'échauffement du composant céramique. Avantageusement, ladite piste conductrice rétrécie est reliée à un trou métallisé, la traversée de la plaque de circuit imprimé jouant alors un rôle supplémentaire de frein thermique en concentrant l'énergie sur cette piste conductrice rétrécie. Ladite piste conductrice rétrécie s'étend de préférence dans une direction opposée à ladite surface métallisée de grande dimension entourant l'une desdites plages d'accueil conductrices.  According to yet another embodiment, said means for creating a thermal asymmetry comprises immediately downstream of the other of said conductive reception areas a conductive track having a narrowing zone to create a fuse effect likely to cause a break of this conductive track in case of heating of the ceramic component. Advantageously, said narrowed conductive track is connected to a metallized hole, the crossing of the printed circuit board then playing an additional role of thermal brake by concentrating the energy on this narrowed conductive track. Said narrowed conductive track preferably extends in a direction opposite to said large metallized surface surrounding one of said conductive receiving lands.

Le composant céramique peut être un condensateur ou un composant constitué de matériaux diélectriques haute température, comme des composants à base de BaTiO3, TiO2 ou SrZrO3 non dopé.  The ceramic component may be a capacitor or a component made of high temperature dielectric materials, such as undoped BaTiO3, TiO2 or SrZrO3 components.

L'invention concerne également un procédé de protection d'une plaque de circuit imprimé contre la surchauffe de composants céramiques montés sur cette plaque et reliés par des moyens de fixation à des plages d'accueil conductrices imprimées sur cette plaque, caractérisé en ce que l'on crée une dissymétrie thermique entre lesdites deux plages d'accueil conductrices du composant céramique de façon à éviter tout risque d'inflammation de ladite plaque de circuit imprimé.  The invention also relates to a method for protecting a printed circuit board against the overheating of ceramic components mounted on this plate and connected by fixing means to conductive reception areas printed on this plate, characterized in that a thermal dissymmetry is created between said two conductive reception areas of the ceramic component so as to avoid any risk of ignition of said printed circuit board.

Selon les modes de réalisation envisagés, ladite dissymétrie thermique est créée soit par une surface métallisée de grande dimension reliée par des ponts thermiques à une desdites plages d'accueil conductrices de façon à se conduire thermiquement comme un dissipateur d'énergie, soit par une piste conductrice ayant une zone de rétrécissement immédiatement en aval de l'autre desdites plages d'accueil conductrices, 2871652 4 soit par une ouverture disposée entre lesdits première et seconde plages d'accueil conductrices directement sous ledit composant céramique, ces modes de création pouvant se combiner entre eux.  According to the embodiments envisaged, said thermal dissymmetry is created either by a metallized surface of large dimension connected by thermal bridges to one of said conductive reception areas so as to behave thermally as an energy dissipator, or by a track conductive having a narrowing zone immediately downstream of the other of said conductive receiving lands, 2871652 4 or by an opening disposed between said first and second conductive receiving areas directly under said ceramic component, these modes of creation being able to combine between them.

Brève description des dessinsBrief description of the drawings

Les caractéristiques et avantages de la présente invention ressortiront mieux de la description suivante, faite à titre indicatif et non limitatif, en regard des dessins annexés sur lesquels: - les figures 1 à 3 illustrent le montage d'un composant céramique sur un circuit imprimé selon différents modes de réalisation de l'invention, et - la figure 4 illustre le montage d'un composant céramique sur un circuit imprimé selon l'art antérieur.  The features and advantages of the present invention will become more apparent from the following description, given by way of non-limiting indication, with reference to the accompanying drawings, in which: FIGS. 1 to 3 illustrate the mounting of a ceramic component on a printed circuit according to various embodiments of the invention, and - Figure 4 illustrates the mounting of a ceramic component on a printed circuit according to the prior art.

Description détaillée d'un mode de réalisation préférentiel La figure 4 illustre une architecture conventionnelle de circuit imprimé dit double face dans laquelle un composant céramique 10 est monté sur une face supérieure d'une plaque 12 de circuit isolant comportant des conducteurs ou pistes conductrices dont les plages d'accueil 14A et 14B avec lesquelles il est mis en contact électrique au travers de ces broches externes 10A et 10B. Ce contact électrique est assuré classiquement par des moyens de fixation à chaud, par exemple par brasure ou soudure. Dans l'exemple illustré qui ne saurait être limitatif, le composant céramique est par exemple un condensateur multicouches en boîtier CMS.  DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT FIG. 4 illustrates a conventional double-sided printed circuit architecture in which a ceramic component 10 is mounted on an upper face of an insulating circuit plate 12 comprising conductors or conductive tracks whose 14A and 14B reception areas with which it is in electrical contact through these external pins 10A and 10B. This electrical contact is conventionally provided by hot fixing means, for example solder or solder. In the example illustrated, which can not be limiting, the ceramic component is for example a multilayer capacitor in a CMS package.

En cas de défaillance, par exemple une surtension au niveau du composant céramique, la chaleur dégagée par cet élément va entraîner, si la température de dégradation de la plaque de circuit imprimé est dépassée pendant plus de quelques secondes, une carbonisation de cette plaque de circuit imprimé en dessous du composant céramique qui en 2871652 5 rendant cette partie conductrice (par création d'un nouveau chemin de passage pour le courant) va provoquer un court-circuit de ce composant à l'origine d'une inflammation du circuit imprimé (bien entendu sous réserve d'un minimum d'oxygène).  In case of failure, for example an overvoltage at the ceramic component, the heat generated by this element will cause, if the degradation temperature of the printed circuit board is exceeded for more than a few seconds, a carbonization of this circuit board printed on the underside of the ceramic component which makes this part conductive (by creating a new path for the current) will cause a short circuit of this component causing an ignition circuit (well heard subject to a minimum of oxygen).

Aussi, selon l'invention, et comme l'illustre le mode de réalisation préférentiel de la figure 1, il est proposé d'améliorer le drainage thermique sous le composant céramique en créant une dissymétrie thermique (de l'ordre de 200 C) entre les deux plages d'accueil conductrices du composant. Pour ce faire, une des plages d'accueil 14A, appelée zone froide, est reliée par des ponts thermiques 16 (avantageusement au nombre de quatre) à une surface métallisée de grande dimension 18 se conduisant thermiquement comme un dissipateur alors que l'autre plage d'accueil 14B, appelée zone chaude, est la plus réduite possible (typiquement de la dimension de la broche externe) afin de ne pas dissiper mais aussi de ne pas se comporter comme une antenne de rayonnement électromagnétique. Par surface de grande dimension, on entend une surface de 2 à 10 fois plus importante que celle de la broche externe du composant céramique reliée à cette zone chaude.  Also, according to the invention, and as illustrated in the preferred embodiment of FIG. 1, it is proposed to improve the thermal drainage under the ceramic component by creating a thermal dissymmetry (of the order of 200 C) between the two conductive reception areas of the component. To do this, one of the reception areas 14A, called the cold zone, is connected by thermal bridges 16 (advantageously four in number) to a large metallized surface 18 that thermally conducts like a dissipator while the other home 14B, called hot zone, is as small as possible (typically the size of the external pin) so as not to dissipate but also not to behave as an antenna of electromagnetic radiation. By large surface area is meant a surface 2 to 10 times larger than that of the outer pin of the ceramic component connected to this hot zone.

La conduction thermique ainsi obtenue peut encore être améliorée en reliant la surface 18 à une surface semblable (non représentée) sur l'autre face de la plaque de circuit imprimé par l'intermédiaire de trous métallisés 20 reliant une face à l'autre.  The thermal conduction thus obtained can be further improved by connecting the surface 18 to a similar surface (not shown) on the other side of the printed circuit board through metallized holes 20 connecting one face to the other.

Dans le second mode de réalisation de l'invention de la figure 2, la plaque de circùit imprimé 12 est munie d'une ouverture 22 pratiquée entre les plages d'accueil conductrices 14A et 14B directement sous le composant céramique pour supprimer le chemin que pourrait prendre le courant en cas de carbonisation de la plaque de circuit imprimé. En effet, cette carbonisation dans une zone précise peut provoquer la mise en contact de pistes conductrices à des potentiels différents autour de cette zone et ainsi déclencher un court-circuit. Ainsi, on peut prévenir tout 2871652 6 court-circuit et interrompre le processus d'inflammation. Cette configuration qui agit directement sur les effets de la panne est en outre sans influence sur la compatibilité électromagnétique et particulièrement simple à réaliser. L'ouverture 22 peut prendre la forme de perforations (non représentées) ou mieux d'une fente dont la longueur est supérieure à celle des plages d'accueil et la largeur la plus grande possible compatible avec les conditions de fabrication de la plaque de circuit imprimé et la connaissance du phénomène de défaillance du composant céramique (lequel donne des informations sur les courants et les temps mis en oeuvre dans les périodes d'emballement).  In the second embodiment of the invention of FIG. 2, the printed circuit plate 12 is provided with an opening 22 made between the conductive receiving surfaces 14A and 14B directly under the ceramic component to eliminate the path that could be take the power in case of carbonization of the printed circuit board. Indeed, this carbonization in a specific area can cause the contacting of conductive tracks at different potentials around this area and thus trigger a short circuit. Thus, one can prevent any short circuit and interrupt the ignition process. This configuration which acts directly on the effects of the failure is further without influence on the electromagnetic compatibility and particularly simple to achieve. The opening 22 may take the form of perforations (not shown) or better of a slot whose length is greater than that of the reception areas and the largest possible width compatible with the conditions of manufacture of the circuit board printed and knowledge of the failure phenomenon of the ceramic component (which gives information on the currents and the times used in the runaway periods).

Un autre mode de réalisation de l'invention permettant également de créer une dissymétrie thermique entre les plages d'accueil conductrices du composant pour stopper le phénomène de propagation de la chaleur, avantageusement juste après son démarrage, est illustré en traits pointillés sur cette figure 2 et sur la figure 3. Il consiste à créer une zone de rétrécissement 24A, 24B dans la piste conductrice, au niveau de la zone chaude immédiatement en aval de la plage d'accueil du composant céramique, ayant un rôle fusible (en cas de sur-courant) ou d'interrupteur par rupture mécanique de la piste en cas d'augmentation rapide de la température.  Another embodiment of the invention also making it possible to create a thermal asymmetry between the conductive reception areas of the component to stop the heat propagation phenomenon, advantageously just after it has been started, is illustrated in dotted lines in this FIG. and in FIG. 3. It consists in creating a narrowing zone 24A, 24B in the conductive track, at the hot zone immediately downstream of the reception range of the ceramic component, having a fuse role (in case of on -current) or switch by mechanical breakage of the track in case of rapid increase in temperature.

Le dimensionnement de cette piste rétrécie (avec Lf sa longueur et If sa largeur). peut être effectué comme suit en utilisant la formule simplifiée suivante pour le calcul de Ifmax, la longueur Lf étant choisie la plus grande possible pour favoriser les effets d'interrupteur en cas de surcourant (décollement de piste, étirement) mais inférieure à une valeur déterminée Lmax imposée par les contraintes de rayonnement électromagnétique: Ifmax=81.937[Ipm/(ef/25,4)0.6732xTf 4281 x0,0674]1,485 Avec Ipm le courant pic (en ampères) qui circule au minimum dans 30 le composant défaillant lors de l'avalanche, 2871652 7 Tf la température (en C) de fusion du cuivre recouvrant la plaque de circuit imprimé, Ef l'épaisseur (en micromètre) de la couche de cuivre fixée selon la technologie utilisée (soit 35, 70 ou 105 micromètres).  The sizing of this narrowed track (with Lf its length and If its width). can be performed as follows using the following simplified formula for the calculation of Ifmax, the length Lf being chosen as large as possible to promote the effects of switch in case of overcurrent (track detachment, stretching) but less than a determined value Lmax imposed by the constraints of electromagnetic radiation: Ifmax = 81.937 [Ipm / (ef / 25.4) 0.6732xTf 4281 x0.0674] 1.485 With Ipm the peak current (in amperes) which circulates at least in the faulty component during the avalanche, 2871652 7 Tf the temperature (in C) of melting copper covering the printed circuit board, Ef the thickness (in micrometer) of the copper layer fixed according to the technology used (that is 35, 70 or 105 micrometers ).

Ainsi, par exemple, pour un courant de 10 A et ef de 105 micromètres, on obtient un Ifmax de 416 micromètres.  Thus, for example, for a current of 10 A and ef of 105 micrometers, an Ifmax of 416 micrometers is obtained.

Comme le montre plus particulièrement la figure 3, cet effet fusible peut être augmenté en reliant la piste conductrice rétrécie à un trou métallisé 26, la traversée de la plaque de circuit imprimé jouant alors un rôle supplémentaire de frein thermique de sorte à concentrer l'énergie sur ce petit bout de piste conductrice rétrécie 24B reliant ce trou à la plage d'accueil 14B du composant en zone chaude. De préférence, la partie fusible 24B est placée le plus loin de la surface métallisée de grande dimension 18 entourant la zone froide, c'est-à-dire qu'elle s'étend depuis la plage d'accueil 14B dans la direction opposée à cette zone froide.  As shown more particularly in Figure 3, this fuse effect can be increased by connecting the narrowed conductive track to a metallized hole 26, the crossing of the printed circuit board then playing an additional role of thermal brake so as to concentrate the energy on this small end of narrowed conductive track 24B connecting this hole to the reception area 14B of the hot zone component. Preferably, the fuse portion 24B is located furthest from the large metallized surface 18 surrounding the cold zone, i.e. it extends from the docking area 14B in the opposite direction to this cold zone.

La présente invention est d'une mise en oeuvre particulièrement aisée et peu coûteuse puisque qu'elle n'affecte essentiellement que le dessin de la plaque de circuit imprimé. Elle permet d'obtenir une robustesse intrinsèque du fait qu'elle n'est pas liée à la probabilité de défaillance du composant. En outre, elle limite l'incident thermique localement autour du composant défaillant.  The present invention is of a particularly easy and inexpensive implementation since it affects essentially only the design of the printed circuit board. It provides intrinsic robustness because it is not related to the probability of failure of the component. In addition, it limits the thermal problem locally around the failing component.

Bien entendu, la présente invention ne se limite pas au seul montage d'un condensateur céramique tel que décrit précédemment. En effet, on peut par analogie envisager de monter sur le circuit imprimé d'autres types de composants dont le corps est composé de matériaux diélectriques haute température, comme des composants à base de BaTiO3, TiO2 ou SrZrO3 non dopé.  Of course, the present invention is not limited to the only assembly of a ceramic capacitor as described above. Indeed, it is analogous to consider mounting on the printed circuit other types of components whose body is composed of high temperature dielectric materials, such as components based on BaTiO3, TiO2 or undoped SrZrO3.

Claims (1)

8 REVENDICATIONS8 claims 1. Plaque de circuit imprimé comportant des composants électroniques et/ou passifs montés sur cette plaque (12), dont au moins un composant céramique (10) comportant une première et une seconde broches externes (10A, 10B) reliées respectivement à des première et seconde plages d'accueil conductrices (14A, 14B) imprimées sur cette plaque, caractérisée en ce qu'elle comprend un moyen (18; 22; 24A, 24B) pour créer une dissymétrie thermique entre lesdites deux plages d'accueil conductrices du composant céramique de façon à éviter tout risque d'inflammation de ladite plaque de circuit imprimé.  A printed circuit board having electronic and / or passive components mounted thereon (12), at least one ceramic component (10) having first and second outer pins (10A, 10B) respectively connected to first and second second conductive reception pads (14A, 14B) printed on this plate, characterized in that it comprises a means (18; 22; 24A, 24B) for creating a thermal dissymmetry between said two conductive reception pads of the ceramic component so as to avoid any risk of ignition of said printed circuit board. 2. Plaque de circuit imprimé selon la revendication 1, caractérisée en ce que ledit moyen de création d'une dissymétrie thermique comporte une surface métallisée de grande dimension (18) reliée par des ponts thermiques (16) à une desdites plages d'accueil conductrices (14A) de façon à se conduire thermiquement comme un dissipateur d'énergie.  2. Printed circuit board according to claim 1, characterized in that said means for creating a thermal asymmetry comprises a large metallized surface (18) connected by thermal bridges (16) to one of said conductive reception areas. (14A) to behave thermally as an energy sink. 3. Plaque de circuit imprimé selon la revendication 2, caractérisée en ce que ladite surface métallisée de grande dimension est comprise entre 2 à 10 fois la surface de ladite broche externe du composant céramique.  3. printed circuit board according to claim 2, characterized in that said metallized surface of large dimension is between 2 to 10 times the surface of said outer pin of the ceramic component. 4. Plaque de circuit imprimé selon la revendication 1 ou la revendication 2, caractérisée en ce que ledit moyen de création d'une dissymétrie thermique comporte une ouverture (22) réalisée dans ladite plaque entre lesdits première et seconde plages d'accueil conductrices directement sous ledit composant céramique.  The printed circuit board according to claim 1 or claim 2, characterized in that said means for creating a thermal dissymmetry comprises an aperture (22) formed in said plate between said first and second conductive reception pads directly under said ceramic component. 5. Plaque de circuit imprimé selon la revendication 4, caractérisée en ce que ladite ouverture est constituée d'une fente dont la longueur est supérieure à celle desdites plages d'accueil conductrices.  5. Printed circuit board according to claim 4, characterized in that said opening consists of a slot whose length is greater than that of said conductive reception areas. 6. Plaque de circuit imprimé selon l'une quelconque des 30 revendications 1 à 5, caractérisée en ce que ledit moyen de création d'une 2871652 9 dissymétrie thermique comporte immédiatement en aval de l'autre desdites plages d'accueil conductrices (14B) une piste conductrice ayant une zone de rétrécissement (24A, 24B) pour créer un effet fusible de nature à provoquer une coupure de cette piste conductrice en cas d'échauffement du composant céramique.  The printed circuit board according to any one of claims 1 to 5, characterized in that said means for creating a thermal dissymmetry comprises immediately downstream of the other said conductive receiving lands (14B). a conductive track having a narrowing zone (24A, 24B) to create a fuse effect such as to cause a break in this conductive track when the ceramic component is heated. 7. Plaque de circuit imprimé selon la revendication 6, caractérisée en ce que ladite piste conductrice rétrécie (24B) est reliée à un trou métallisé (26), la traversée de la plaque de circuit imprimé jouant alors un rôle supplémentaire de frein thermique en concentrant l'énergie sur cette piste conductrice rétrécie.  7. printed circuit board according to claim 6, characterized in that said narrowed conductive track (24B) is connected to a metallized hole (26), the crossing of the printed circuit board then playing an additional role of thermal brake by concentrating the energy on this narrowed conductive track. 8. Plaque de circuit imprimé selon la revendication 7, caractérisée en ce que ladite piste conductrice rétrécie (24B) s'étend dans une direction opposée à ladite surface métallisée de grande dimension (18) entourant l'une desdites plages d'accueil conductrices (14A).  The printed circuit board according to claim 7, characterized in that said narrowed conductive track (24B) extends in a direction opposite to said large metallized surface (18) surrounding one of said conductive receiving lands ( 14A). 9. Plaque de circuit imprimé selon l'une quelconque des revendications 1 à 8, caractérisée en ce que ledit composant céramique est un condensateur.  9. printed circuit board according to any one of claims 1 to 8, characterized in that said ceramic component is a capacitor. 10. Plaque de circuit imprimé selon l'une quelconque des revendications 1 à 8, caractérisée en ce que ledit composant céramique est composé de matériaux diélectriques haute température, comme des composants à base de BaTiO3, TiO2 ou SrZrO3 non dopé.  10. Printed circuit board according to any one of claims 1 to 8, characterized in that said ceramic component is composed of high temperature dielectric materials, such as components based on undoped BaTiO3, TiO2 or SrZrO3. 11. Procédé de protection d'une plaque de circuit imprimé (12) contre la surchauffe de composants céramiques (10) montés sur cette plaque et reliés à des plages d'accueil conductrices (14A, 14B) imprimées sur cette plaque, caractérisé en ce qu'on crée une dissymétrie thermique entre lesdites deux plages d'accueil conductrices du composant céramique de façon à éviter tout risque d'inflammation de ladite plaque de circuit imprimé.  11. A method of protecting a printed circuit board (12) against overheating of ceramic components (10) mounted on said board and connected to conductive receiving areas (14A, 14B) printed on said board, characterized in that that a thermal dissymmetry is created between said two conductive reception areas of the ceramic component so as to avoid any risk of ignition of said printed circuit board.
FR0406263A 2004-06-10 2004-06-10 PRINTED CIRCUIT WITH PROTECTED COMPONENT Expired - Fee Related FR2871652B1 (en)

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DE102021202801B4 (en) * 2021-03-23 2022-10-13 Hanon Systems Efp Deutschland Gmbh Circuit with a printed circuit board and vehicle with at least one such circuit

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