FR2871652A1 - Printed circuit plate, has metal-coated surface creating thermal dissymmetry between conductive hot and cold zones, and connected by thermal bridges to conductive cold zone - Google Patents
Printed circuit plate, has metal-coated surface creating thermal dissymmetry between conductive hot and cold zones, and connected by thermal bridges to conductive cold zone Download PDFInfo
- Publication number
- FR2871652A1 FR2871652A1 FR0406263A FR0406263A FR2871652A1 FR 2871652 A1 FR2871652 A1 FR 2871652A1 FR 0406263 A FR0406263 A FR 0406263A FR 0406263 A FR0406263 A FR 0406263A FR 2871652 A1 FR2871652 A1 FR 2871652A1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- conductive
- circuit board
- thermal
- ceramic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 title abstract 2
- 239000000919 ceramic Substances 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 4
- 238000013021 overheating Methods 0.000 claims abstract description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 3
- 229910014031 strontium zirconium oxide Inorganic materials 0.000 claims description 3
- 238000003763 carbonization Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 206010061218 Inflammation Diseases 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000004054 inflammatory process Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
2871652 12871652 1
Domaine de l'invention La présente invention se rapporte au domaine du montage sur circuit imprimé de composants céramiques et elle concerne plus particulièrement une architecture de circuit imprimé assurant une protection contre les risques d'inflammation en cas de défaut ou de panne de ces composants céramiques. FIELD OF THE INVENTION The present invention relates to the field of circuit board mounting of ceramic components and more particularly to a printed circuit architecture providing protection against the risk of ignition in the event of failure or failure of these ceramic components. .
Art antérieur Les composants céramiques, par exemple des condensateurs, montés sur les circuits imprimés sont sujets à des défaillances liées à différentes origines, comme un délaminage, un choc thermique ou des contraintes mécaniques ou électriques, qui peuvent entraîner une rupture du composant céramique. Cette rupture est de nature à créer un courtcircuit de faible impédance qui en augmentant la température locale au niveau du composant peut créer une inflammation du circuit imprimé sur lequel il est monté et à l'extrême une destruction du produit dans lequel ce circuit et les différents autres composants qu'il supporte sont incorporés. PRIOR ART Ceramic components, for example capacitors, mounted on the printed circuits are subject to failures related to different origins, such as delamination, thermal shock or mechanical or electrical stresses, which can lead to a rupture of the ceramic component. This break is likely to create a short circuit of low impedance which by increasing the local temperature at the component can create an inflammation of the printed circuit board on which it is mounted and to the extreme destruction of the product in which this circuit and the different other components that it supports are incorporated.
Une solution classique à ce problème consiste à mettre en série avec le composant céramique une résistance permettant une limitation de la puissance totale produite. Toutefois, une telle solution est coûteuse du fait de la difficulté d'implémentation qu'elle implique comme du dimensionnement supplémentaire du circuit imprimé qu'elle nécessite. En outre, elle apporte une limitation importante en matière de compatibilité électromagnétique consécutive par exemple au filtrage haute fréquence. A conventional solution to this problem is to put in series with the ceramic component a resistor allowing a limitation of the total power produced. However, such a solution is expensive because of the difficulty of implementation that it involves as additional dimensioning of the printed circuit that it requires. In addition, it brings a significant limitation in terms of electromagnetic compatibility consecutive for example high frequency filtering.
2871652 2 Objet et définition de l'invention La présente invention a donc pour objet de pallier les inconvénients précités en proposant une architecture de circuit imprimé simple, c'est-à-dire sans implémentation complémentaire de composants et fiable évitant tout risque d'inflammation de ce circuit en cas de rupture des composants céramiques montés sur ce circuit. OBJECT AND DEFINITION OF THE INVENTION The object of the present invention is therefore to overcome the aforementioned drawbacks by proposing a simple printed circuit architecture, that is to say without a complementary implementation of components and reliable, avoiding any risk of ignition. of this circuit in case of breakage of the ceramic components mounted on this circuit.
Ces buts sont atteints par une plaque de circuit imprimé comportant des composants électroniques et/ou passifs montés sur cette plaque, dont au moins un composant céramique comportant une première et une seconde broches externes reliées respectivement à des première et seconde plages d'accueil conductrices imprimées sur cette plaque, caractérisée en ce qu'elle comprend un moyen pour créer une dissymétrie thermique entre lesdites deux plages d'accueil conductrices du composant céramique de façon à éviter tout risque d'inflammation de ladite plaque de circuit imprimé. These objects are achieved by a printed circuit board comprising electronic and / or passive components mounted on this plate, including at least one ceramic component having a first and a second external pin respectively connected to first and second printed conductive reception pads. on this plate, characterized in that it comprises a means for creating a thermal asymmetry between said two conductive reception areas of the ceramic component so as to avoid any risk of ignition of said printed circuit board.
Cette structure particulièrement simple en évitant le risque d'inflammation de la plaque de circuit imprimé interdit toute destruction du produit qui l'incorpore. This particularly simple structure avoiding the risk of ignition of the printed circuit board prohibits any destruction of the product that incorporates it.
Selon un mode de réalisation préférentiel, ledit moyen de création d'une dissymétrie thermique comporte une surface métallisée de grande dimension reliée par des ponts thermiques à une desdites plages d'accueil conductrices de façon à se conduire thermiquement comme un dissipateur d'énergie. Ladite surface métallisée de grande dimension est comprise entre 2 et 10 fois la surface de ladite broche externe du composant céramique. According to a preferred embodiment, said means for creating a thermal asymmetry comprises a metallized surface of large dimension connected by thermal bridges to one of said conductive reception pads so as to behave thermally as an energy sink. Said metallized surface of large dimension is between 2 and 10 times the surface of said outer pin of the ceramic component.
Selon un autre mode de réalisation, ledit moyen de création d'une dissymétrie thermique comporte une ouverture réalisée dans ladite plaque entre lesdits première et seconde plages d'accueil conductrices directement sous ledit composant céramique. De préférence, ladite 2871652 3 ouverture est constituée d'une fente dont la longueur est supérieure à celle desdites plages d'accueil conductrices. According to another embodiment, said means for creating a thermal asymmetry comprises an opening made in said plate between said first and second conductive reception areas directly under said ceramic component. Preferably, said opening consists of a slot whose length is greater than that of said conductive reception areas.
Selon encore un autre mode de réalisation, ledit moyen de création d'une dissymétrie thermique comporte immédiatement en aval de l'autre desdites plages d'accueil conductrices une piste conductrice ayant une zone de rétrécissement pour créer un effet fusible de nature à provoquer une coupure de cette piste conductrice en cas d'échauffement du composant céramique. Avantageusement, ladite piste conductrice rétrécie est reliée à un trou métallisé, la traversée de la plaque de circuit imprimé jouant alors un rôle supplémentaire de frein thermique en concentrant l'énergie sur cette piste conductrice rétrécie. Ladite piste conductrice rétrécie s'étend de préférence dans une direction opposée à ladite surface métallisée de grande dimension entourant l'une desdites plages d'accueil conductrices. According to yet another embodiment, said means for creating a thermal asymmetry comprises immediately downstream of the other of said conductive reception areas a conductive track having a narrowing zone to create a fuse effect likely to cause a break of this conductive track in case of heating of the ceramic component. Advantageously, said narrowed conductive track is connected to a metallized hole, the crossing of the printed circuit board then playing an additional role of thermal brake by concentrating the energy on this narrowed conductive track. Said narrowed conductive track preferably extends in a direction opposite to said large metallized surface surrounding one of said conductive receiving lands.
Le composant céramique peut être un condensateur ou un composant constitué de matériaux diélectriques haute température, comme des composants à base de BaTiO3, TiO2 ou SrZrO3 non dopé. The ceramic component may be a capacitor or a component made of high temperature dielectric materials, such as undoped BaTiO3, TiO2 or SrZrO3 components.
L'invention concerne également un procédé de protection d'une plaque de circuit imprimé contre la surchauffe de composants céramiques montés sur cette plaque et reliés par des moyens de fixation à des plages d'accueil conductrices imprimées sur cette plaque, caractérisé en ce que l'on crée une dissymétrie thermique entre lesdites deux plages d'accueil conductrices du composant céramique de façon à éviter tout risque d'inflammation de ladite plaque de circuit imprimé. The invention also relates to a method for protecting a printed circuit board against the overheating of ceramic components mounted on this plate and connected by fixing means to conductive reception areas printed on this plate, characterized in that a thermal dissymmetry is created between said two conductive reception areas of the ceramic component so as to avoid any risk of ignition of said printed circuit board.
Selon les modes de réalisation envisagés, ladite dissymétrie thermique est créée soit par une surface métallisée de grande dimension reliée par des ponts thermiques à une desdites plages d'accueil conductrices de façon à se conduire thermiquement comme un dissipateur d'énergie, soit par une piste conductrice ayant une zone de rétrécissement immédiatement en aval de l'autre desdites plages d'accueil conductrices, 2871652 4 soit par une ouverture disposée entre lesdits première et seconde plages d'accueil conductrices directement sous ledit composant céramique, ces modes de création pouvant se combiner entre eux. According to the embodiments envisaged, said thermal dissymmetry is created either by a metallized surface of large dimension connected by thermal bridges to one of said conductive reception areas so as to behave thermally as an energy dissipator, or by a track conductive having a narrowing zone immediately downstream of the other of said conductive receiving lands, 2871652 4 or by an opening disposed between said first and second conductive receiving areas directly under said ceramic component, these modes of creation being able to combine between them.
Brève description des dessinsBrief description of the drawings
Les caractéristiques et avantages de la présente invention ressortiront mieux de la description suivante, faite à titre indicatif et non limitatif, en regard des dessins annexés sur lesquels: - les figures 1 à 3 illustrent le montage d'un composant céramique sur un circuit imprimé selon différents modes de réalisation de l'invention, et - la figure 4 illustre le montage d'un composant céramique sur un circuit imprimé selon l'art antérieur. The features and advantages of the present invention will become more apparent from the following description, given by way of non-limiting indication, with reference to the accompanying drawings, in which: FIGS. 1 to 3 illustrate the mounting of a ceramic component on a printed circuit according to various embodiments of the invention, and - Figure 4 illustrates the mounting of a ceramic component on a printed circuit according to the prior art.
Description détaillée d'un mode de réalisation préférentiel La figure 4 illustre une architecture conventionnelle de circuit imprimé dit double face dans laquelle un composant céramique 10 est monté sur une face supérieure d'une plaque 12 de circuit isolant comportant des conducteurs ou pistes conductrices dont les plages d'accueil 14A et 14B avec lesquelles il est mis en contact électrique au travers de ces broches externes 10A et 10B. Ce contact électrique est assuré classiquement par des moyens de fixation à chaud, par exemple par brasure ou soudure. Dans l'exemple illustré qui ne saurait être limitatif, le composant céramique est par exemple un condensateur multicouches en boîtier CMS. DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT FIG. 4 illustrates a conventional double-sided printed circuit architecture in which a ceramic component 10 is mounted on an upper face of an insulating circuit plate 12 comprising conductors or conductive tracks whose 14A and 14B reception areas with which it is in electrical contact through these external pins 10A and 10B. This electrical contact is conventionally provided by hot fixing means, for example solder or solder. In the example illustrated, which can not be limiting, the ceramic component is for example a multilayer capacitor in a CMS package.
En cas de défaillance, par exemple une surtension au niveau du composant céramique, la chaleur dégagée par cet élément va entraîner, si la température de dégradation de la plaque de circuit imprimé est dépassée pendant plus de quelques secondes, une carbonisation de cette plaque de circuit imprimé en dessous du composant céramique qui en 2871652 5 rendant cette partie conductrice (par création d'un nouveau chemin de passage pour le courant) va provoquer un court-circuit de ce composant à l'origine d'une inflammation du circuit imprimé (bien entendu sous réserve d'un minimum d'oxygène). In case of failure, for example an overvoltage at the ceramic component, the heat generated by this element will cause, if the degradation temperature of the printed circuit board is exceeded for more than a few seconds, a carbonization of this circuit board printed on the underside of the ceramic component which makes this part conductive (by creating a new path for the current) will cause a short circuit of this component causing an ignition circuit (well heard subject to a minimum of oxygen).
Aussi, selon l'invention, et comme l'illustre le mode de réalisation préférentiel de la figure 1, il est proposé d'améliorer le drainage thermique sous le composant céramique en créant une dissymétrie thermique (de l'ordre de 200 C) entre les deux plages d'accueil conductrices du composant. Pour ce faire, une des plages d'accueil 14A, appelée zone froide, est reliée par des ponts thermiques 16 (avantageusement au nombre de quatre) à une surface métallisée de grande dimension 18 se conduisant thermiquement comme un dissipateur alors que l'autre plage d'accueil 14B, appelée zone chaude, est la plus réduite possible (typiquement de la dimension de la broche externe) afin de ne pas dissiper mais aussi de ne pas se comporter comme une antenne de rayonnement électromagnétique. Par surface de grande dimension, on entend une surface de 2 à 10 fois plus importante que celle de la broche externe du composant céramique reliée à cette zone chaude. Also, according to the invention, and as illustrated in the preferred embodiment of FIG. 1, it is proposed to improve the thermal drainage under the ceramic component by creating a thermal dissymmetry (of the order of 200 C) between the two conductive reception areas of the component. To do this, one of the reception areas 14A, called the cold zone, is connected by thermal bridges 16 (advantageously four in number) to a large metallized surface 18 that thermally conducts like a dissipator while the other home 14B, called hot zone, is as small as possible (typically the size of the external pin) so as not to dissipate but also not to behave as an antenna of electromagnetic radiation. By large surface area is meant a surface 2 to 10 times larger than that of the outer pin of the ceramic component connected to this hot zone.
La conduction thermique ainsi obtenue peut encore être améliorée en reliant la surface 18 à une surface semblable (non représentée) sur l'autre face de la plaque de circuit imprimé par l'intermédiaire de trous métallisés 20 reliant une face à l'autre. The thermal conduction thus obtained can be further improved by connecting the surface 18 to a similar surface (not shown) on the other side of the printed circuit board through metallized holes 20 connecting one face to the other.
Dans le second mode de réalisation de l'invention de la figure 2, la plaque de circùit imprimé 12 est munie d'une ouverture 22 pratiquée entre les plages d'accueil conductrices 14A et 14B directement sous le composant céramique pour supprimer le chemin que pourrait prendre le courant en cas de carbonisation de la plaque de circuit imprimé. En effet, cette carbonisation dans une zone précise peut provoquer la mise en contact de pistes conductrices à des potentiels différents autour de cette zone et ainsi déclencher un court-circuit. Ainsi, on peut prévenir tout 2871652 6 court-circuit et interrompre le processus d'inflammation. Cette configuration qui agit directement sur les effets de la panne est en outre sans influence sur la compatibilité électromagnétique et particulièrement simple à réaliser. L'ouverture 22 peut prendre la forme de perforations (non représentées) ou mieux d'une fente dont la longueur est supérieure à celle des plages d'accueil et la largeur la plus grande possible compatible avec les conditions de fabrication de la plaque de circuit imprimé et la connaissance du phénomène de défaillance du composant céramique (lequel donne des informations sur les courants et les temps mis en oeuvre dans les périodes d'emballement). In the second embodiment of the invention of FIG. 2, the printed circuit plate 12 is provided with an opening 22 made between the conductive receiving surfaces 14A and 14B directly under the ceramic component to eliminate the path that could be take the power in case of carbonization of the printed circuit board. Indeed, this carbonization in a specific area can cause the contacting of conductive tracks at different potentials around this area and thus trigger a short circuit. Thus, one can prevent any short circuit and interrupt the ignition process. This configuration which acts directly on the effects of the failure is further without influence on the electromagnetic compatibility and particularly simple to achieve. The opening 22 may take the form of perforations (not shown) or better of a slot whose length is greater than that of the reception areas and the largest possible width compatible with the conditions of manufacture of the circuit board printed and knowledge of the failure phenomenon of the ceramic component (which gives information on the currents and the times used in the runaway periods).
Un autre mode de réalisation de l'invention permettant également de créer une dissymétrie thermique entre les plages d'accueil conductrices du composant pour stopper le phénomène de propagation de la chaleur, avantageusement juste après son démarrage, est illustré en traits pointillés sur cette figure 2 et sur la figure 3. Il consiste à créer une zone de rétrécissement 24A, 24B dans la piste conductrice, au niveau de la zone chaude immédiatement en aval de la plage d'accueil du composant céramique, ayant un rôle fusible (en cas de sur-courant) ou d'interrupteur par rupture mécanique de la piste en cas d'augmentation rapide de la température. Another embodiment of the invention also making it possible to create a thermal asymmetry between the conductive reception areas of the component to stop the heat propagation phenomenon, advantageously just after it has been started, is illustrated in dotted lines in this FIG. and in FIG. 3. It consists in creating a narrowing zone 24A, 24B in the conductive track, at the hot zone immediately downstream of the reception range of the ceramic component, having a fuse role (in case of on -current) or switch by mechanical breakage of the track in case of rapid increase in temperature.
Le dimensionnement de cette piste rétrécie (avec Lf sa longueur et If sa largeur). peut être effectué comme suit en utilisant la formule simplifiée suivante pour le calcul de Ifmax, la longueur Lf étant choisie la plus grande possible pour favoriser les effets d'interrupteur en cas de surcourant (décollement de piste, étirement) mais inférieure à une valeur déterminée Lmax imposée par les contraintes de rayonnement électromagnétique: Ifmax=81.937[Ipm/(ef/25,4)0.6732xTf 4281 x0,0674]1,485 Avec Ipm le courant pic (en ampères) qui circule au minimum dans 30 le composant défaillant lors de l'avalanche, 2871652 7 Tf la température (en C) de fusion du cuivre recouvrant la plaque de circuit imprimé, Ef l'épaisseur (en micromètre) de la couche de cuivre fixée selon la technologie utilisée (soit 35, 70 ou 105 micromètres). The sizing of this narrowed track (with Lf its length and If its width). can be performed as follows using the following simplified formula for the calculation of Ifmax, the length Lf being chosen as large as possible to promote the effects of switch in case of overcurrent (track detachment, stretching) but less than a determined value Lmax imposed by the constraints of electromagnetic radiation: Ifmax = 81.937 [Ipm / (ef / 25.4) 0.6732xTf 4281 x0.0674] 1.485 With Ipm the peak current (in amperes) which circulates at least in the faulty component during the avalanche, 2871652 7 Tf the temperature (in C) of melting copper covering the printed circuit board, Ef the thickness (in micrometer) of the copper layer fixed according to the technology used (that is 35, 70 or 105 micrometers ).
Ainsi, par exemple, pour un courant de 10 A et ef de 105 micromètres, on obtient un Ifmax de 416 micromètres. Thus, for example, for a current of 10 A and ef of 105 micrometers, an Ifmax of 416 micrometers is obtained.
Comme le montre plus particulièrement la figure 3, cet effet fusible peut être augmenté en reliant la piste conductrice rétrécie à un trou métallisé 26, la traversée de la plaque de circuit imprimé jouant alors un rôle supplémentaire de frein thermique de sorte à concentrer l'énergie sur ce petit bout de piste conductrice rétrécie 24B reliant ce trou à la plage d'accueil 14B du composant en zone chaude. De préférence, la partie fusible 24B est placée le plus loin de la surface métallisée de grande dimension 18 entourant la zone froide, c'est-à-dire qu'elle s'étend depuis la plage d'accueil 14B dans la direction opposée à cette zone froide. As shown more particularly in Figure 3, this fuse effect can be increased by connecting the narrowed conductive track to a metallized hole 26, the crossing of the printed circuit board then playing an additional role of thermal brake so as to concentrate the energy on this small end of narrowed conductive track 24B connecting this hole to the reception area 14B of the hot zone component. Preferably, the fuse portion 24B is located furthest from the large metallized surface 18 surrounding the cold zone, i.e. it extends from the docking area 14B in the opposite direction to this cold zone.
La présente invention est d'une mise en oeuvre particulièrement aisée et peu coûteuse puisque qu'elle n'affecte essentiellement que le dessin de la plaque de circuit imprimé. Elle permet d'obtenir une robustesse intrinsèque du fait qu'elle n'est pas liée à la probabilité de défaillance du composant. En outre, elle limite l'incident thermique localement autour du composant défaillant. The present invention is of a particularly easy and inexpensive implementation since it affects essentially only the design of the printed circuit board. It provides intrinsic robustness because it is not related to the probability of failure of the component. In addition, it limits the thermal problem locally around the failing component.
Bien entendu, la présente invention ne se limite pas au seul montage d'un condensateur céramique tel que décrit précédemment. En effet, on peut par analogie envisager de monter sur le circuit imprimé d'autres types de composants dont le corps est composé de matériaux diélectriques haute température, comme des composants à base de BaTiO3, TiO2 ou SrZrO3 non dopé. Of course, the present invention is not limited to the only assembly of a ceramic capacitor as described above. Indeed, it is analogous to consider mounting on the printed circuit other types of components whose body is composed of high temperature dielectric materials, such as components based on BaTiO3, TiO2 or undoped SrZrO3.
Claims (1)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0406263A FR2871652B1 (en) | 2004-06-10 | 2004-06-10 | PRINTED CIRCUIT WITH PROTECTED COMPONENT |
DE102005026404.2A DE102005026404B4 (en) | 2004-06-10 | 2005-06-08 | Printed circuit for protected ceramic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0406263A FR2871652B1 (en) | 2004-06-10 | 2004-06-10 | PRINTED CIRCUIT WITH PROTECTED COMPONENT |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2871652A1 true FR2871652A1 (en) | 2005-12-16 |
FR2871652B1 FR2871652B1 (en) | 2007-09-21 |
Family
ID=34946873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0406263A Expired - Fee Related FR2871652B1 (en) | 2004-06-10 | 2004-06-10 | PRINTED CIRCUIT WITH PROTECTED COMPONENT |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102005026404B4 (en) |
FR (1) | FR2871652B1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2168410B1 (en) * | 2007-03-19 | 2018-05-16 | Conti Temic microelectronic GmbH | Electronic module comprising a conductor fuse |
US8780518B2 (en) | 2011-02-04 | 2014-07-15 | Denso Corporation | Electronic control device including interrupt wire |
DE102021202801B4 (en) * | 2021-03-23 | 2022-10-13 | Hanon Systems Efp Deutschland Gmbh | Circuit with a printed circuit board and vehicle with at least one such circuit |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01158793A (en) * | 1987-12-15 | 1989-06-21 | Matsushita Electric Ind Co Ltd | Chip component mounting device |
EP0531126A1 (en) * | 1991-09-04 | 1993-03-10 | Nec Corporation | Pattern structure of a printed circuit board |
JPH05226817A (en) * | 1991-02-28 | 1993-09-03 | Nippon Chemicon Corp | Printed circuit device |
EP0611064A1 (en) * | 1993-02-10 | 1994-08-17 | Ford Motor Company | Solder pad configuration for wave soldering |
JPH0888447A (en) * | 1994-09-16 | 1996-04-02 | Ricoh Co Ltd | Method of connecting pad to conductor pattern on printed circuit board |
JPH08316591A (en) * | 1995-05-19 | 1996-11-29 | Fujitsu General Ltd | Printed board |
US5739743A (en) * | 1996-02-05 | 1998-04-14 | Emc Technology, Inc. | Asymmetric resistor terminal |
US6067216A (en) * | 1997-11-28 | 2000-05-23 | Wabco Gmbh | Safeguard feature in a circuit arrangement for protecting an electrical component from an undesirable electrical potential |
US6671176B1 (en) * | 2002-06-27 | 2003-12-30 | Eastman Kodak Company | Method of cooling heat-generating electrical components |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3778532A (en) * | 1972-07-03 | 1973-12-11 | Illinois Tool Works | Electrical circuit component having solder preform connection means |
-
2004
- 2004-06-10 FR FR0406263A patent/FR2871652B1/en not_active Expired - Fee Related
-
2005
- 2005-06-08 DE DE102005026404.2A patent/DE102005026404B4/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01158793A (en) * | 1987-12-15 | 1989-06-21 | Matsushita Electric Ind Co Ltd | Chip component mounting device |
JPH05226817A (en) * | 1991-02-28 | 1993-09-03 | Nippon Chemicon Corp | Printed circuit device |
EP0531126A1 (en) * | 1991-09-04 | 1993-03-10 | Nec Corporation | Pattern structure of a printed circuit board |
EP0611064A1 (en) * | 1993-02-10 | 1994-08-17 | Ford Motor Company | Solder pad configuration for wave soldering |
JPH0888447A (en) * | 1994-09-16 | 1996-04-02 | Ricoh Co Ltd | Method of connecting pad to conductor pattern on printed circuit board |
JPH08316591A (en) * | 1995-05-19 | 1996-11-29 | Fujitsu General Ltd | Printed board |
US5739743A (en) * | 1996-02-05 | 1998-04-14 | Emc Technology, Inc. | Asymmetric resistor terminal |
US6067216A (en) * | 1997-11-28 | 2000-05-23 | Wabco Gmbh | Safeguard feature in a circuit arrangement for protecting an electrical component from an undesirable electrical potential |
US6671176B1 (en) * | 2002-06-27 | 2003-12-30 | Eastman Kodak Company | Method of cooling heat-generating electrical components |
Non-Patent Citations (5)
Title |
---|
HAMMER ET AL.: "Protection of Printed Circuit Cards. October 1976.", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 19, no. 5, 1 October 1976 (1976-10-01), New York, US, pages 1528 - 1529, XP002319852 * |
PATENT ABSTRACTS OF JAPAN vol. 013, no. 429 (E - 823) 25 September 1989 (1989-09-25) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 676 (E - 1475) 13 December 1993 (1993-12-13) * |
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 08 30 August 1996 (1996-08-30) * |
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 03 31 March 1997 (1997-03-31) * |
Also Published As
Publication number | Publication date |
---|---|
DE102005026404A1 (en) | 2006-01-19 |
FR2871652B1 (en) | 2007-09-21 |
DE102005026404B4 (en) | 2021-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2792764A3 (en) | Printed circuit board safety resistance, has thin polymer strip containing conducting particles, conducting elements and insulating films | |
FR3057403B1 (en) | COMPONENT INTEGRATING A THERMOPROTEGED VARIANCE AND A SERIES ECLATOR | |
FR2700416A1 (en) | Semiconductor device having a semiconductor element on a mounting element. | |
EP2771908B1 (en) | Flip-chip hybridization of microelectronic components by local heating of connecting elements | |
FR2759493A1 (en) | SEMICONDUCTOR POWER DEVICE | |
JP3810629B2 (en) | Semiconductor device and method for manufacturing the same | |
EP3712908B1 (en) | Device for surge protection | |
FR2871652A1 (en) | Printed circuit plate, has metal-coated surface creating thermal dissymmetry between conductive hot and cold zones, and connected by thermal bridges to conductive cold zone | |
CN105874553B (en) | Electrical fuse element, fuse, method, paster fuse and the patch circuit for producing fuse | |
EP3499254B1 (en) | Monitoring of a fault in electrical equipment | |
EP3284316B1 (en) | Device for heating and cooling by a printed circuit for regenerating electronic components subjected to radiation | |
EP3101677B1 (en) | Pyrotechnical device for electronic circuit | |
CA2872746A1 (en) | Electrical circuit for the interconnection of an electrical component, such as a power component | |
EP3942577B1 (en) | Surge protector | |
FR2913173A1 (en) | Electronic card for aircraft, has epoxy insulation portion of conducting layer shifted relative to insulation portion of another layer such that part of conducting portion of latter layer is situated at right from part of insulation portion | |
CN107026145B (en) | Semiconductor device with a semiconductor device having a plurality of semiconductor chips | |
EP0955677A1 (en) | Fuse with focus current for integrated circuit | |
EP2741592B1 (en) | Electronic device comprising a heat protection by means of an inserted electronic component, module comprising such a device and process for manufacturing such a device. | |
FR3042940B1 (en) | PRINTED CIRCUIT BOARD WITH IMPROVED THERMAL DISSIPATION | |
WO2013093260A1 (en) | Thermal switch, cryocooler, and equipment including such a thermal switch | |
FR2959614A1 (en) | Device for connecting wire to electric resistor of flat and flexible electric heater, has embrittlement line folding one leg part on another leg part, where opening of former part allows passage of conductor through latter part | |
EP2315243A1 (en) | Interposer between integrated circuits | |
FR2818870A1 (en) | METHOD FOR REALIZING INTERCONNECTION IN A MULTI-LAYER PRINTED CIRCUIT | |
FR3058246A1 (en) | DEVICE COMPRISING A STACK OF ELECTRONIC CHIPS | |
FR3139662A1 (en) | Fuse |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
|
PLFP | Fee payment |
Year of fee payment: 14 |
|
PLFP | Fee payment |
Year of fee payment: 15 |
|
PLFP | Fee payment |
Year of fee payment: 16 |
|
PLFP | Fee payment |
Year of fee payment: 17 |
|
PLFP | Fee payment |
Year of fee payment: 18 |
|
PLFP | Fee payment |
Year of fee payment: 19 |
|
ST | Notification of lapse |
Effective date: 20240205 |