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FR2742925B1 - SEMICONDUCTOR DEVICE OF THE TYPE HAVING A FRAME FOR DISCHARGING THE HEAT, AND MANUFACTURING METHOD THEREOF - Google Patents

SEMICONDUCTOR DEVICE OF THE TYPE HAVING A FRAME FOR DISCHARGING THE HEAT, AND MANUFACTURING METHOD THEREOF

Info

Publication number
FR2742925B1
FR2742925B1 FR9615959A FR9615959A FR2742925B1 FR 2742925 B1 FR2742925 B1 FR 2742925B1 FR 9615959 A FR9615959 A FR 9615959A FR 9615959 A FR9615959 A FR 9615959A FR 2742925 B1 FR2742925 B1 FR 2742925B1
Authority
FR
France
Prior art keywords
supporter
pedestal
tilting part
main surface
tilting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9615959A
Other languages
French (fr)
Other versions
FR2742925A1 (en
Inventor
Hizao Tomizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority claimed from AU23707/97A external-priority patent/AU722964B2/en
Publication of FR2742925A1 publication Critical patent/FR2742925A1/en
Application granted granted Critical
Publication of FR2742925B1 publication Critical patent/FR2742925B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H05K2201/10772—Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To avoid the tilt of a pedestal as well as the uneven or insufficient thickness of a wax material by a method wherein a tilting part is formed fanwise on the surface fixed to the supporter of the pedestal while the leg parts protruding inside the tilting part so that a brazing material may be filled up in the opposing regions of the pedestal and the supporter while covering the tilting part. SOLUTION: A tilting part 8 tilting fanwise in the direction separating from one main surface of one supporter 1 is formed on the outer edge part of a main surface fixed to the supporter 1 of a pedestal 2. Next, the leg parts 7 are formed inside the tilting part 8 protruding to one main surface side of the supporter abutting against the other main surface of the supporter 1. Next, the opposing regions of the pedestal 2 and the supporter 1 are filled up with a brazing material 9 further covering the tilting part 8. Through these procedures, the tilt of the pedestal 2 as well as the uneven or insufficient thickness of the brazing material 9 can be avoided thereby enabling the production yield to be increased causing no defective characteristics applicable meeting the severe temperature requirements.
FR9615959A 1995-12-26 1996-12-24 SEMICONDUCTOR DEVICE OF THE TYPE HAVING A FRAME FOR DISCHARGING THE HEAT, AND MANUFACTURING METHOD THEREOF Expired - Lifetime FR2742925B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP35474195A JP2992873B2 (en) 1995-12-26 1995-12-26 Semiconductor device
AU23707/97A AU722964B2 (en) 1997-05-30 1997-05-30 Semiconductor device and method for manufacture thereof
DE19724909A DE19724909A1 (en) 1995-12-26 1997-06-12 Semiconductor device with mount for its securing to PCB

Publications (2)

Publication Number Publication Date
FR2742925A1 FR2742925A1 (en) 1997-06-27
FR2742925B1 true FR2742925B1 (en) 1999-03-12

Family

ID=27152821

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9615959A Expired - Lifetime FR2742925B1 (en) 1995-12-26 1996-12-24 SEMICONDUCTOR DEVICE OF THE TYPE HAVING A FRAME FOR DISCHARGING THE HEAT, AND MANUFACTURING METHOD THEREOF

Country Status (4)

Country Link
JP (1) JP2992873B2 (en)
DE (1) DE19724909A1 (en)
FR (1) FR2742925B1 (en)
GB (1) GB2308736B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6246587B1 (en) * 1998-12-03 2001-06-12 Intermedics Inc. Surface mounted device with grooves on a termination lead and methods of assembly
FR2813442A1 (en) * 2000-08-31 2002-03-01 Valeo Equip Electr Moteur Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles
US20050017371A1 (en) * 2003-07-22 2005-01-27 Zhiyong Wang Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same
DE10339487B4 (en) * 2003-08-27 2007-03-15 Infineon Technologies Ag Method for applying a semiconductor chip to a carrier
JP3988735B2 (en) 2004-03-15 2007-10-10 日立金属株式会社 Semiconductor device and manufacturing method thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3434018A (en) * 1966-07-05 1969-03-18 Motorola Inc Heat conductive mounting base for a semiconductor device
US3740617A (en) * 1968-11-20 1973-06-19 Matsushita Electronics Corp Semiconductor structure and method of manufacturing same
JPS58210643A (en) * 1982-06-01 1983-12-07 Mitsubishi Electric Corp semiconductor equipment
JPS6272147A (en) * 1985-09-26 1987-04-02 Toshiba Corp Resin-sealed semiconductor device
JPS62283648A (en) * 1986-06-02 1987-12-09 Matsushita Electronics Corp Resin-sealed semiconductor device
US4862247A (en) * 1987-11-24 1989-08-29 Texas Instruments Incorporated Contact joint for semiconductor chip carriers
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
DE4201931C1 (en) * 1992-01-24 1993-05-27 Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh + Co.Kg, 4788 Warstein, De
US5410451A (en) * 1993-12-20 1995-04-25 Lsi Logic Corporation Location and standoff pins for chip on tape
JP3426692B2 (en) * 1994-03-30 2003-07-14 三菱電機株式会社 Semiconductor device

Also Published As

Publication number Publication date
JP2992873B2 (en) 1999-12-20
FR2742925A1 (en) 1997-06-27
GB2308736A (en) 1997-07-02
GB9626677D0 (en) 1997-02-12
DE19724909A1 (en) 1998-12-17
JPH09181229A (en) 1997-07-11
GB2308736B (en) 2000-06-28

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