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FR2727226A1 - ACTIVE SECURITY DEVICE WITH ELECTRONIC MEMORY - Google Patents

ACTIVE SECURITY DEVICE WITH ELECTRONIC MEMORY Download PDF

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Publication number
FR2727226A1
FR2727226A1 FR9413886A FR9413886A FR2727226A1 FR 2727226 A1 FR2727226 A1 FR 2727226A1 FR 9413886 A FR9413886 A FR 9413886A FR 9413886 A FR9413886 A FR 9413886A FR 2727226 A1 FR2727226 A1 FR 2727226A1
Authority
FR
France
Prior art keywords
safety device
integrated circuits
information
integrated circuit
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9413886A
Other languages
French (fr)
Other versions
FR2727226B1 (en
Inventor
Alain Rhelimi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger SA
Original Assignee
Schlumberger SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger SA filed Critical Schlumberger SA
Priority to FR9413886A priority Critical patent/FR2727226B1/en
Priority to FR9502796A priority patent/FR2727227B1/en
Priority to PCT/FR1995/001497 priority patent/WO1996016378A1/en
Priority to DE69504208T priority patent/DE69504208T2/en
Priority to JP51661296A priority patent/JP4278176B2/en
Priority to EP95940311A priority patent/EP0792497B1/en
Priority to US08/836,563 priority patent/US5877547A/en
Priority to ES95940311T priority patent/ES2122702T3/en
Publication of FR2727226A1 publication Critical patent/FR2727226A1/en
Application granted granted Critical
Publication of FR2727226B1 publication Critical patent/FR2727226B1/en
Priority to JP2005375135A priority patent/JP4456066B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
    • G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
    • G07F7/10—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means together with a coded signal, e.g. in the form of personal identification information, like personal identification number [PIN] or biometric data
    • G07F7/1008—Active credit-cards provided with means to personalise their use, e.g. with PIN-introduction/comparison system
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/30—Payment architectures, schemes or protocols characterised by the use of specific devices or networks
    • G06Q20/34—Payment architectures, schemes or protocols characterised by the use of specific devices or networks using cards, e.g. integrated circuit [IC] cards or magnetic cards
    • G06Q20/341—Active cards, i.e. cards including their own processing means, e.g. including an IC or chip
    • G—PHYSICS
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    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
    • G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
    • G07F7/0806—Details of the card
    • G07F7/0813—Specific details related to card security
    • G07F7/082—Features insuring the integrity of the data on or in the card
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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Abstract

La présente invention concerne un dispositif de sécurité contenant des informations secrètes, du type comprenant une zone mémoire d'un circuit intégré recevant lesdites informations et des moyens de protection recouvrant solidairement au moins la zone mémoire. Les moyens de protections sont constitués par au moins un second circuit intégré (2). Le dispositif comprend en outre des moyens de liaison (9, 9') interactifs entre les deux circuits intégrés, et des moyens de destruction des informations secrètes en cas de rupture ou perturbation de la liaison.The present invention relates to a security device containing secret information, of the type comprising a memory area of an integrated circuit receiving said information and protection means integrally covering at least the memory area. The protection means consist of at least one second integrated circuit (2). The device further comprises interactive connection means (9, 9 ′) between the two integrated circuits, and means for destroying secret information in the event of the connection being broken or disturbed.

Description

DISPOSITIF DH SECURITE ACTIF A NIXOIRI ILECTRONIQUZ
La présente invention concerne un dispositif de sécurité à mémoire électronique destiné à la protection d'informations secrètes contenues dans la mémoire.DH SECURITY ACTIVE DEVICE AT NIXOIRI ILECTRONIQUZ
The present invention relates to a security device with electronic memory intended for the protection of secret information contained in the memory.

De tels dispositifs sont présents notamment dans des terminaux de paiement portables, à l'intérieur d'un module électronique dit de sécurité applicative (SAM). Ces modules sont d'une importance capitale car ils contiennent des informations secrètes (exemple : clés bancaires) dont la découverte permettrait l'accès à l'ensemble d'un système. Such devices are present in particular in portable payment terminals, inside an electronic module known as application security (SAM). These modules are of capital importance because they contain secret information (example: bank keys) whose discovery would allow access to an entire system.

Les informations se trouvent nécessairement dans une couche électronique d'un circuit intégré. Une couche de passivation recouvre généralement la couche électronique. The information is necessarily found in an electronic layer of an integrated circuit. A passivation layer generally covers the electronic layer.

Dans certains cas, il est possible qu'elle ne soit pas un obstacle suffisant à l'accès aux informations secrètes, si des moyens de lecture sophistiqués sont mis en oeuvre pour lire les informations à travers la couche de passivation. Ces moyens de lecture peuvent par exemple mettre en oeuvre des techniques exploratoires du type à faisceaux de particules. In some cases, it may not be a sufficient obstacle to access to secret information, if sophisticated reading means are used to read the information through the passivation layer. These reading means can, for example, use exploratory techniques of the particle beam type.

Parmi les techniques existantes destinées à protéger ces informations, on connaît celle qui consiste à recourir à des capteurs d'intrusion traditionnels qui protègent une enceinte dans laquelle est enfermée la mémoire électronique contenant les informations. Among the existing techniques intended to protect this information, there is known that which consists in using traditional intrusion sensors which protect an enclosure in which the electronic memory containing the information is enclosed.

On connaît également des moyens protégeant directement le circuit intégré contre une lecture à l'aide de moyens sophistiqués. Ces moyens sont de deux types : le premier consiste à masquer le dessin du semi-conducteur, par exemple par métallisation, grille de faux circuits ou couche de carbone diamant ; le second consiste à mémoriser les informations dans une mémoire du type RAM et à les combiner éventuellement avec des nombres aléatoires modifiés en permanence. Les informations ne sont accessibles que par l'intermédiaire d'un système d'exploitation qui en contrôle l'accès. Les principes utilisés sont identiques à ceux des cartes à microprocesseur. Selon ce second type, les secrets contenus dans une mémoire RAM sont systématiquement perdus si l'alimentation du composant est interrompue.Dans ce cas, l'accès aux informations n'est pas totalement insurmontable si on connaît - la manière d'éliminer la résine du boîtier du composant
sous tension, sans créer un court circuit ce qui
entraînerait la perte des informations, - le schéma exact du composant, - la table de "brouillage" de la mémoire, - l'adresse des secrets dans le plan mémoire, - et la manière d'enregistrer et d'analyser correctement
le bus d'adresses et de données en temps réel.Means are also known which directly protect the integrated circuit against reading using sophisticated means. These means are of two types: the first consists in masking the design of the semiconductor, for example by metallization, grid of false circuits or layer of diamond carbon; the second consists in memorizing the information in a memory of the RAM type and in possibly combining it with random numbers permanently modified. Information is only accessible through an operating system that controls access to it. The principles used are identical to those of microprocessor cards. According to this second type, the secrets contained in a RAM memory are systematically lost if the power supply to the component is interrupted. In this case, access to information is not completely insurmountable if we know - how to eliminate the resin component housing
energized without creating a short circuit which
would result in the loss of information, - the exact diagram of the component, - the memory "jamming" table, - the address of secrets in the memory map, - and the way to record and analyze correctly
the address and data bus in real time.

Les différentes techniques antérieures ci-dessus ont l'inconvénient d'être soit inefficaces si des moyens très sophistiqués sont mis en oeuvre, soit d'être onéreuses dans le cas notamment de l'utilisation de masques au carbone diamant. The various prior techniques above have the drawback of being either ineffective if very sophisticated means are used, or of being expensive in the case in particular of the use of diamond carbon masks.

La présente invention a pour but de fournir un dispositif électronique de sécurité dont l'efficacité est améliorée et dont la réalisation est en outre compatible avec des procédés de fabrication standardisés. The object of the present invention is to provide an electronic security device whose efficiency is improved and whose production is also compatible with standardized manufacturing methods.

A cet effet, la présente invention a pour objet un dispositif de sécurité contenant des informations secrètes et destiné à empêcher l'accès à ces informations par des moyens d'exploration externes, du type comprenant une zone mémoire d'un circuit intégré recevant lesdites informations et des moyens de protection recouvrant solidairement au moins ladite zone mémoire de manière à former obstacle à une exploration caractérisé en ce que lesdits moyens de protections sont constitués par au moins un second circuit intégré, et en ce qu'il comprend en outre des moyens de liaison interactifs entre les deux circuits intégrés, et des moyens de destruction des informations secrètes en cas de rupture ou de perturbation de leur liaison. To this end, the subject of the present invention is a security device containing secret information and intended to prevent access to this information by external exploration means, of the type comprising a memory area of an integrated circuit receiving said information. and protection means integrally covering at least said memory area so as to form an obstacle to exploration, characterized in that said protection means are constituted by at least one second integrated circuit, and in that it further comprises means for interactive link between the two integrated circuits, and means for destroying secret information in the event of their link being broken or disturbed.

Selon une caractéristique de l'invention, le dispositif comprend des moyens d'authentification permettant d'authentifier au moins le second circuit intégré. According to a characteristic of the invention, the device comprises authentication means making it possible to authenticate at least the second integrated circuit.

Selon un premier mode de réalisation de l'invention, les circuits intégrés sont montés l'un derrière l'autre et comportent des connexions électriques externes les reliant l'un à l'autre. According to a first embodiment of the invention, the integrated circuits are mounted one behind the other and include external electrical connections connecting them to each other.

Selon un deuxieme mode de réalisation de l'invention, les circuits intégrés sont montés face à face et comportent des connexions électriques internes les reliant l'un à l'autre. According to a second embodiment of the invention, the integrated circuits are mounted face to face and have internal electrical connections connecting them to each other.

D'autres caractéristiques et avantages de la présente invention ressortiront de la description qui va suivre, d'une forme de réalisation de l'invention faite en regard des dessins annexés sur lesquels - la figure 1 représente une coupe de la structure de
l'invention selon un premier mode de réalisation, - la figure 2 représente une coupe de la structure de
l'invention selon un deuxième mode de réalisation, - la figure 3 représente l'invention avec des modes de
liaison interactifs particuliers.Other characteristics and advantages of the present invention will emerge from the description which follows, of an embodiment of the invention made with reference to the appended drawings in which - FIG. 1 represents a section of the structure of
the invention according to a first embodiment, - Figure 2 shows a section of the structure of
the invention according to a second embodiment, - Figure 3 shows the invention with modes of
specific interactive links.

A la figure 1, on voit que le dispositif de sécurité est constitué de deux circuits électroniques disposés l'un au-dessus de l'autre, un premier circuit à protéger l, appelé maître, sous un second circuit protecteur 2 appelé esclave. Il s'agit en l'occurrence de deux circuits intégrés 1, 2 fixés solidairement l'un à l'autre et reliés ensemble par des moyens de liaison. Ces moyens de liaison doivent permettre une interaction entre les circuits maître et esclave : un échange ou une circulation de flux ou de signaux de toute nature (magnétique, électrique, optique, capacitif...). Ils peuvent concerner un simple contact électrique. De préférence, l'interaction est fonction de la distance séparant les circuits intégrés si bien que le moindre déplacement relatif des deux circuits la rompt ou la perturbe. In FIG. 1, it can be seen that the security device consists of two electronic circuits arranged one above the other, a first circuit to be protected, called the master, under a second protective circuit 2 called the slave. It is in this case two integrated circuits 1, 2 fixed integrally to each other and connected together by connecting means. These connection means must allow interaction between the master and slave circuits: an exchange or circulation of flows or signals of any kind (magnetic, electrical, optical, capacitive, etc.). They may relate to a simple electrical contact. Preferably, the interaction is a function of the distance separating the integrated circuits so that the slightest relative displacement of the two circuits breaks or disturbs it.

A défaut de ces moyens de liaisons préférentiels ou de manière complémentaire, les moyens de liaison de l'invention permettent une communication entre les deux circuits, considérés alors comme émetteurs et/ou récepteurs. In the absence of these preferential connecting means or in a complementary manner, the linking means of the invention allow communication between the two circuits, then considered as transmitters and / or receivers.

Chaque circuit intégré est constitué d'un substrat 3, 3' d'une couche électronique 4, 4' sur le substrat et d'une couche de passivation 5, 5' recouvrant la couche électronique. Le substrat est un semi-conducteur géneralement en Silicium ou en Arséniure de Gallium. Cette couche mesure entre 100 et 300 micromètres d'épaisseur. La couche électronique contient des fonctionnalités ainsi qu'une zone mémoire 6, 6' destinée à contenir les informations secrètes. Cette couche mesure une dizaine de micromètres d'épaisseur. La couche de passivation disposée au-dessus de la couche électronique est en matériau inerte par exemple en nitrure de Silicium. Cette couche mesure quelques dizaines de micromètres d'épaisseur. Each integrated circuit consists of a substrate 3, 3 'of an electronic layer 4, 4' on the substrate and a passivation layer 5, 5 'covering the electronic layer. The substrate is a semiconductor generally made of Silicon or Gallium Arsenide. This layer is between 100 and 300 micrometers thick. The electronic layer contains functionalities as well as a memory area 6, 6 ′ intended to contain the secret information. This layer measures ten micrometers thick. The passivation layer placed above the electronic layer is made of an inert material, for example silicon nitride. This layer measures a few tens of micrometers thick.

Le second circuit intégré a une structure globalement équivalente à celle du premier circuit à l'exception de ses dimensions ; la couche électronique peut comprendre une zone mémoire qui peut également contenir une partie des informations secrètes. Le second circuit intégré est disposé au-dessus du premier de telle manière qu'il recouvre au moins la zone mémoire contenant les informations secrètes. Il peut également masquer des circuits sensibles tels que le processeur, le bus et les mémoires et tout élément de circuit susceptible de donner une information sur les secrets.  The second integrated circuit has a structure generally equivalent to that of the first circuit with the exception of its dimensions; the electronic layer may include a memory area which may also contain part of the secret information. The second integrated circuit is arranged above the first in such a way that it covers at least the memory area containing the secret information. It can also mask sensitive circuits such as the processor, the bus and the memories and any element of circuit likely to give information on the secrets.

Les deux circuits intégrés sont reliés solidairement, par exemple par une couche de colle au cyanoacrylate 7 disposée entre la couche de passivation du premier circuit intégré et le substrat du second circuit intégré. The two integrated circuits are connected integrally, for example by a layer of cyanoacrylate adhesive 7 disposed between the passivation layer of the first integrated circuit and the substrate of the second integrated circuit.

La colle peut être choisie de manière à ce que toute tentative de séparation des deux circuits intégrés provoque soit l'arrachement de la couche de passivation soit l'arrachement du substrat.The glue can be chosen so that any attempt to separate the two integrated circuits causes either the tearing of the passivation layer or the tearing of the substrate.

On peut également utiliser plusieurs zones de collage avec chacune une colle de nature différente, ou une combinaison de colles ou autre technique de solidarisation. It is also possible to use several bonding zones, each with a different type of glue, or a combination of glues or other joining technique.

Le premier circuit intégré a une dimension plus importante que le second pour laisser un accès à son alimentation et à des connexions. Des moyens de connexion relient les deux circuits intégrés par l'extérieur ; à cet effet, des points 8 de connexion debouchent sur les surfaces libres 10, 10' respectives de chaque circuit intégré. Ces points de connexion sont reliés par des fils de câblage 9 en or ou aluminium qui passent å l'extérieur des circuits intégrés. L'ensemble électronique est constam- ment maintenu sous tension par une pile de sauvegarde extérieure (non représentée).Le composant maître comporte des points 15 de connexion avec l'environnement, par exemple, avec les éléments constitutifs du SAM. De façon classique, les fils de câblage peuvent être noyés dans un matériau d'enrobage tel que de la resine. The first integrated circuit has a larger dimension than the second to allow access to its power supply and to connections. Connection means connect the two integrated circuits from the outside; for this purpose, connection points 8 open onto the respective free surfaces 10, 10 ′ of each integrated circuit. These connection points are connected by wiring wires 9 in gold or aluminum which pass outside the integrated circuits. The electronic assembly is constantly kept energized by an external backup battery (not shown). The master component comprises points of connection with the environment, for example, with the constituent elements of the SAM. Conventionally, the wiring wires can be embedded in a coating material such as resin.

La mémoire du premier circuit intégré, voire du second peut être de type RAM. The memory of the first integrated circuit, or even of the second, can be of the RAM type.

Selon un aspect amélioré de l'invention, le dispositif de sécurité peut comprendre en outre des moyens d'authentification permettant d'authentifier au moins le second circuit électronique. L'authentification peut être effectuée à tout moment, de manière périodique ou aleatoire. La périodicité doit être inférieure au temps nécessaire pour effectuer une éventuelle substitution du second circuit par un autre circuit de simulation. Ces moyens sont de préférence compris dans l'un et l'autre circuits intégrés. Ils coopèrent ensemble de manière à assurer au moins l'authentification du second circuit intégré. Ainsi, l'authentification peut être soit de nature unilatérale, soit mutuelle.Le fonctionnement de la procédure d'authentification entre les deux circuits intégrés, peut reposer sur un principe traditionnel d'échange de signaux cryptographiques ou électroniques. According to an improved aspect of the invention, the security device can further comprise authentication means making it possible to authenticate at least the second electronic circuit. Authentication can be performed at any time, periodically or randomly. The periodicity must be less than the time necessary to carry out a possible substitution of the second circuit by another simulation circuit. These means are preferably included in one and the other integrated circuits. They cooperate together so as to ensure at least the authentication of the second integrated circuit. Thus, authentication can be either unilateral or mutual in nature. The operation of the authentication procedure between the two integrated circuits can be based on a traditional principle of exchanging cryptographic or electronic signals.

Selon un aspect plus perfectionné du dispositif, les moyens d'authentification peuvent fonctionner selon une procédure mettant en oeuvre une clé secrète de session dynamique connue en soi. Les moyens à mettre en oeuvre sont décrits par la norme américaine ANSI 9.24. According to a more perfected aspect of the device, the authentication means can operate according to a procedure implementing a dynamic session secret key known per se. The means to be implemented are described by the American standard ANSI 9.24.

Le dispositif de sécurité comprend des moyens de destruction des informations secrètes en cas d'absence d'authentification ainsi qu'en cas de déconnexion ou de destruction de l'un des circuits électroniques. Ces moyens font au moins partie du premier circuit intégré et sont connus en soi, ce sont par exemple, des moyens de mise à zéro générale de la mémoire. The security device comprises means for destroying secret information in the absence of authentication as well as in the event of disconnection or destruction of one of the electronic circuits. These means are at least part of the first integrated circuit and are known per se. They are, for example, means for general zeroing of the memory.

A la figure 2, on voit que le dispositif de sécurité selon l'invention se présente sous une forme différente. Il est également composé de deux circuits intégrés dont la structure de chacun est globalement identique à celle des circuits intégrés du précédent mode de réalisation. Les mêmes numéros de référence sont donc utilisés pour désigner les mêmes éléments. La différence essentielle réside dans le fait que les deux circuits intégrés sont montés face à face. In Figure 2, we see that the safety device according to the invention is in a different form. It is also composed of two integrated circuits, the structure of each of which is broadly identical to that of the integrated circuits of the previous embodiment. The same reference numbers are therefore used to designate the same elements. The essential difference lies in the fact that the two integrated circuits are mounted face to face.

Selon ce montage, ces deux circuits intégrés sont mécaniquement solidaires entre eux par l'intermédiaire de leur couche de passivation. Le montage est fait de telle manière que leurs points de connexion se trouvent en regard les uns des autres. Les deux circuits intégrés peuvent être reliés comme précédemment par une couche de colle à base de cyanoacrylate. According to this arrangement, these two integrated circuits are mechanically integral with one another by means of their passivation layer. The assembly is done in such a way that their connection points are facing each other. The two integrated circuits can be connected as before by a layer of glue based on cyanoacrylate.

Le contact électrique entre les deux circuits peut s'effectuer a travers une colle conductrice, par exemple colle à base d'argent. Selon un mode de réalisation des connexions, celles-ci sont réalisées par une technique de soudage, par exemple et de façon classique avec des billes d'indium. The electrical contact between the two circuits can be made through a conductive adhesive, for example silver-based adhesive. According to one embodiment of the connections, these are made by a welding technique, for example and conventionally with indium balls.

La même colle conductrice peut servir non seulement à assurer le contact mais aussi à assurer la solidarisation des deux circuits intégrés. Ainsi, l'utilisation de solvant pour la dissolution de la colle en vue de désolidariser les composants provoque également la rupture électrique de la connexion. The same conductive adhesive can be used not only to ensure contact but also to ensure the joining of the two integrated circuits. Thus, the use of solvent for dissolving the glue in order to separate the components also causes the electrical connection to break.

De manière avantageuse, on peut alimenter d'abord le composant esclave par l'extérieur puis faire transiter l'alimentation à travers des connexions électriques internes entre les deux composants pour alimenter le composant maître ou inversement. Advantageously, it is possible first to supply the slave component from the outside and then have the supply pass through internal electrical connections between the two components to supply the master component or vice versa.

Ainsi en cas de séparation, l'alimentation du con- posant maître est coupée et les informations sont perdues si elles sont dans une mémoire RAM (mémoire volatile non secourue). Thus in the event of separation, the power to the master component is cut off and the information is lost if it is in a RAM memory (volatile memory not backed up).

On s'aperçoit que ce montage est particulièrement intéressant dans la mesure où les connexions entre les deux circuits intégrés sont internes, ce qui représente une barrière supplémentaire à la violabilité du dispositif de sécurité. We realize that this arrangement is particularly interesting insofar as the connections between the two integrated circuits are internal, which represents an additional barrier to the severity of the security device.

On peut prévoir de répartir les informations secrètes dans les deux composants maître et esclave. Ils peuvent avoir la même importance et être maître et esclave à tour de rôle. Provision may be made to distribute the secret information in the two master and slave components. They can have the same importance and be masters and slaves in turn.

Le principe de protection peut être appliqué à plusieurs circuits intégrés au-delà de deux. Ces derniers peuvent être empilés les uns sur les autres.  The protection principle can be applied to several integrated circuits beyond two. These can be stacked on top of each other.

Il peut y avoir également un composant maître comportant n surfaces à protéger, chaque surface étant recouverte par un composant esclave. There may also be a master component comprising n surfaces to be protected, each surface being covered by a slave component.

On peut aussi avoir dans une même couche électronique plusieurs circuits électroniques maîtres contenant chacun une partie des informations secrètes, protégé chacun par un composant esclave. It is also possible to have, in the same electronic layer, several master electronic circuits each containing a part of the secret information, each protected by a slave component.

On comprend que le dispositif peut-être réalisé à partir de deux circuits intégrés selon une technique de fabrication standardisée dite "Multi-Chip-ModuleW (MCM). Ce dispositif a donc l'avantage d'être économique. It is understood that the device can be produced from two integrated circuits according to a standardized manufacturing technique called "Multi-Chip-ModuleW (MCM). This device therefore has the advantage of being economical.

A la figure 3, on voit que les deux composants sont montés face à face comme à la figure 2. Les mêmes numéros de référence sont utilisés pour les mêmes éléments. Les moyens de liaison sont toutefois de nature différente des connexions électriques. In Figure 3, we see that the two components are mounted face to face as in Figure 2. The same reference numbers are used for the same elements. The connection means are however different in nature from the electrical connections.

Les éléments de connexion représentent chacun une bobine électromagnétique gravées sur le semi-conducteur de chaque composant. Ces bobines sont placées face à face avec un couplage électromagnétique, serré de préférence. Par ces moyens, on assure une interaction magnétique entre les deux composants. The connection elements each represent an electromagnetic coil engraved on the semiconductor of each component. These coils are placed face to face with an electromagnetic coupling, preferably tight. By these means, a magnetic interaction is ensured between the two components.

Avantageusement, l'interaction peut être utilisée pour véhiculer des informations de communication entre les deux composants, par exemple dans le but d'une authentification selon la procédure décrite précédemment. Elle peut aussi permettre une alimentation d'un composant à travers l'autre. Advantageously, the interaction can be used to convey communication information between the two components, for example for the purpose of authentication according to the procedure described above. It can also allow a supply of a component through the other.

De préférence, on réalise à la fois une communication pour la transmission de données et une alimentation par le biais des mêmes bobines. Les moyens à mettre en oeuvre, connus en soi, sont décrits dans la norme ISO (IEC 10536 partie 3). Ils font intervenir deux signaux déphasés pour l'activation des bobines.  Preferably, communication for data transmission and a power supply are carried out at the same time using the same coils. The means to be used, known per se, are described in the ISO standard (IEC 10536 part 3). They involve two phase shifted signals for the activation of the coils.

On constate que l'emploi d'un couplage électromagnétique très serré ne supporte pratiquement pas de déplacement relatif d'un composant par rapport à l'autre. It is found that the use of a very tight electromagnetic coupling practically does not support relative displacement of one component with respect to the other.

En effet, le moindre déplacement provoquerait une perturbation ou une coupure de l'interaction des bobines émettrices et réceptrices. De la même façon, toute tentative d'introduction d'un élément de dérivation entre les connexions provoquerait une perturbation détectable ou une coupure de l'interaction.Indeed, the slightest movement would cause a disturbance or a cut in the interaction of the transmitter and receiver coils. Similarly, any attempt to introduce a bypass element between the connections would cause a detectable disturbance or a breakdown in the interaction.

La coupure de l'alimentation d'un composant comportant les informations dans une mémoire RAM entraîne la perte des informations tandis que la perturbation peut entraîner une modification totale ou partielle du signal de communication et la perte de l'intégrité d'un message entre les deux composants. The interruption of the power supply of a component containing the information in a RAM memory leads to the loss of information while the disturbance can lead to a total or partial modification of the communication signal and the loss of the integrity of a message between the two components.

Un des moyens pour détecter la perte de l'intégrité d'un message consiste à recourir à des codes correcteurs d'erreurs ou de détection d'erreurs classiques tels que code de Hamming ou CRC 16 (code polynomial). One of the means for detecting the loss of the integrity of a message is to use error correction codes or conventional error detection codes such as Hamming code or CRC 16 (polynomial code).

En cas de détection d'une erreur, les moyens de destruction sont activés pour éliminer les informations secrètes. En cas d'utilisation d'une mémoire RAM, les moyens de destruction peuvent consister en des moyens de coupure de l'alimentation du composant ; par exemple un transistor monté en série avec le bus d'alimentation de la mémoire. If an error is detected, the destruction means are activated to eliminate the secret information. If a RAM memory is used, the destruction means may consist of means for cutting off the supply of the component; for example a transistor connected in series with the power supply bus of the memory.

Les composants peuvent comporter d'autres moyens de liaison à la place des bobines électromagnétiques. Les éléments 13, 13', 14, 14' peuvent représenter des capacités ou des diodes optiques pour effectuer respectivement une interaction capacitive ou opto-électronique. The components may include other connecting means instead of the electromagnetic coils. The elements 13, 13 ′, 14, 14 ′ can represent capacitors or optical diodes for effecting a capacitive or opto-electronic interaction respectively.

En cas de couplage opto-électronique, on aménage entre les éléments 13, 13' et 14, 14' une fenêtre transparente soit avec absence de matière soit avec une matière transparente (non représentée).  In the case of opto-electronic coupling, a transparent window is arranged between the elements 13, 13 'and 14, 14' either with the absence of material or with a transparent material (not shown).

Les moyens à mettre en oeuvre pour l'exploitation et traitement de tels signaux sont classiques. Les moyens d'authentification et moyens de destruction des informations peuvent être identiques aux moyens décrits aux figures 1 et 2. The means to be used for the exploitation and processing of such signals are conventional. The authentication means and information destruction means can be identical to the means described in FIGS. 1 and 2.

L'alimentation du premier circuit intégré peut être effectué également par couplage capacitif. The supply of the first integrated circuit can also be carried out by capacitive coupling.

Deux types différents de connexions peuvent être utilisés pour l'alimentation et pour la transmission de données, par exemple électromagnétique pour l'une, capacitive pour l'autre. Two different types of connections can be used for power supply and for data transmission, for example electromagnetic for one, capacitive for the other.

Le fonctionnement du dispositif de sécurité de la figure 1, s'effectue comme indiqué ci-après. The operation of the safety device of FIG. 1 is carried out as indicated below.

Le dispositif étant sous tension, par exemple, par une pile de sauvegarde extérieure, une communication périodique est établie entre les deux composants par exemple pour réaliser une procédure d'authentification mutuelle définie notamment par la norme ISO/IEC 9594-8. Si l'un des deux composants rompt la communication et/ou ne s'authentifie pas correctement, les informations secrètes sont effacées dans le composant qui n'authentifie pas l'autre composant. Eventuellement, pour éviter toute simulation des composants en présence, la clé secrète d'authentification est une clé de session dynamique créée à l'initialisation du module de sécurité actif. The device being powered, for example, by an external backup battery, a periodic communication is established between the two components for example to carry out a mutual authentication procedure defined in particular by the ISO / IEC 9594-8 standard. If one of the two components breaks the communication and / or does not authenticate correctly, the secret information is deleted in the component which does not authenticate the other component. Optionally, to avoid any simulation of the components present, the secret authentication key is a dynamic session key created at the initialization of the active security module.

Pour atteindre les secrets contenus dans le premier circuit intégré, il est nécessaire d'enlever au préalable le circuit intégré situé au-dessus sans que celui-ci soit détruit ou modifié. Compte tenu du mode de solidarisation des deux circuits intégrés, par exemple, au moyen d'une colle cyanoacrylate, il est pratiquement impossible ou extrêmement périlleux de tenter une séparation du second circuit sans le détruire. To reach the secrets contained in the first integrated circuit, it is necessary to remove the integrated circuit above it beforehand without it being destroyed or modified. Given the way in which the two integrated circuits are joined, for example, by means of a cyanoacrylate adhesive, it is practically impossible or extremely dangerous to attempt a separation of the second circuit without destroying it.

Dans l'hypothèse où il existerait un moyen pour désolidariser le second circuit intégré du premier circuit sans sa destruction ou sa désactivation, on pourrait alors recourir au mode de réalisation du dispositif de sécurité selon son deuxième mode de réalisation (fig. 2 ou fig. 3). In the event that there is a means to separate the second integrated circuit from the first circuit without destroying or deactivating it, we could then have recourse to the embodiment of the safety device according to its second embodiment (fig. 2 or fig. 3).

Le fonctionnement du dispositif des figures 1 et 2 s'effectue comme indiqué ci-après. The operation of the device in FIGS. 1 and 2 is carried out as indicated below.

Si les connexions électriques sont assurées en interne par simple contact, collage ou soudure par le recours à des billes d'indium, il devient alors impossible de découpler les deux circuits intégrés sans rompre le contact. If the electrical connections are made internally by simple contact, bonding or soldering by using indium balls, it becomes impossible to decouple the two integrated circuits without breaking the contact.

Si les connexions sont réalisées de manière électro-magnétique, capacitive, optique, le simple mouvement relatif d'un composant par rapport à l'autre provoque une perturbation de l'interaction qui est traitée comme une rupture de connexion. If the connections are made electromagnetically, capacitively, optically, the simple relative movement of one component with respect to the other causes a disturbance in the interaction which is treated as a connection break.

Si les connexions servent à assurer l'alimentation des circuits intégrés, la rupture de ces dernières provoque l'effacement des informations qui seraient contenues dans une mémoire volatile RAM. If the connections are used to supply power to the integrated circuits, the breaking of the latter causes the erasure of the information which would be contained in a volatile memory RAM.

Toute tentative de découplage est rendue d'autant plus difficile que les connexions sont proches du milieu du dispositif de sécurité, c'est-à-dire, proches du milieu des surfaces de contact respectives des composants maître et esclave. Any attempt at decoupling is made all the more difficult as the connections are close to the middle of the safety device, that is to say, close to the middle of the respective contact surfaces of the master and slave components.

Le fonctionnement des moyens d'authentification du dispositif de sécurité selon le second mode de réalisation est identique à celui du premier mode. The operation of the authentication means of the security device according to the second embodiment is identical to that of the first mode.

Si des connexions électriques servent à assurer la communication selon une procédure d'authentification, la rupture provoque une absence d'authentification dans la période imposée et les moyens de destruction des informations sont activés, par exemple pour mettre la mémoire au même niveau. If electrical connections are used to ensure communication according to an authentication procedure, the rupture causes an absence of authentication in the imposed period and the means of destruction of the information are activated, for example to put the memory at the same level.

Dans le cas préféré où l'on utilise une mémoire
RAM, pour contenir les informations secrètes, les moyens de destruction sont des moyens de coupure de l'alimentation du composant
Dans tous les cas de figure, selon ce second mode de réalisation, le déplacement relatif des circuits l'un par rapport à l'autre est sanctionné par la perte des informations secrètes. In the preferred case where a memory is used
RAM, to contain the secret information, the destruction means are means for cutting off the supply of the component
In all cases, according to this second embodiment, the relative displacement of the circuits with respect to each other is penalized by the loss of the secret information.

Claims (17)

REVENDICATIONS 1. Dispositif de sécurité contenant des informations1. Security device containing information secrètes et destiné à empêcher l'accès à ces secret and intended to prevent access to these informations par des moyens d'exploration externes, du information by external means of exploration, type comprenant un circuit intégré ayant une zone type comprising an integrated circuit having a zone mémoire recevant lesdites informations et des moyens de memory receiving said information and means of protection recouvrant solidairement au moins ladite protection covering jointly at least the said zone mémoire de manière à former obstacle à une memory area so as to form an obstacle to a exploration caractérisé en ce que lesdits moyens de exploration characterized in that said means of protections sont constitues par au moins un second protections are constituted by at least a second circuit intégré (2), et en ce qu'il comprend en outre integrated circuit (2), and in that it further comprises des moyens de liaison interactifs (9, 9') entre les interactive connecting means (9, 9 ') between the deux circuits intégrés, et des moyens de destruction two integrated circuits, and means of destruction des informations secrètes en cas de rupture ou secret information in the event of a breach or perturbation de leur liaison. disruption of their bond. 2. Dispositif selon la revendication 1, caractérisé en ce2. Device according to claim 1, characterized in that qu'il comprend des moyens d'authentification permettant that it includes authentication means allowing d'authentifier au moins le second circuit intégré. to authenticate at least the second integrated circuit. 3. Dispositif de sécurité selon la revendication 2,3. Safety device according to claim 2, caractérisé en ce que les moyens d'authentification characterized in that the authentication means fonctionnent selon une procédure mettant en oeuvre une operate according to a procedure implementing a clé secrète de session dynamique. dynamic session secret key. 4. Dispositif de sécurité selon l'une des revendications 14. Safety device according to one of claims 1 à 3, caractérisé en ce que les circuits intégrés sont to 3, characterized in that the integrated circuits are montés l'un derrière l'autre et comportent des mounted one behind the other and have connexions électriques (9) externes les reliant l'un &  external electrical connections (9) connecting them to one & l'autre. the other. 5. Dispositif de sécurité selon l'une des revendications 15. Safety device according to one of claims 1 à 3, caractérisé en ce que les circuits intégrés sont  to 3, characterized in that the integrated circuits are montés face à face et comportent des connexions mounted face to face and have connections électriques (9') internes les reliant l'un à l'autre. electric (9 ') internal connecting them to each other. 6. Dispositif de sécurité selon la revendication 5,6. Safety device according to claim 5, caractérisé en ce que les circuits intégrés ont leurs characterized in that integrated circuits have their points de connexion électrique (8, 8') disposés face à electrical connection points (8, 8 ') arranged opposite face. face. 7. Dispositif de sécurité selon la revendication 6,7. Safety device according to claim 6, caractérisé en ce que la connexion des circuits characterized in that the connection of the circuits intégrés est réalisée par soudure. integrated is carried out by welding. 8. Dispositif de sécurité selon la revendication 6,8. Safety device according to claim 6, caractérisé en ce que la connexion est réalisée par characterized in that the connection is made by l'intermédiaire d'une colle conductrice. using a conductive adhesive. 9. Dispositif de sécurité selon l'une des revendications 19. Safety device according to one of claims 1 à 3, caractérisé en ce que les circuits intégrés sont to 3, characterized in that the integrated circuits are montés face à face et comportent des connexions mounted face to face and have connections électromagnétiques ou capacitives internes. electromagnetic or internal capacitive. 10. Dispositif de sécurité selon la revendication 9,10. Safety device according to claim 9, caractérisé en ce que les mêmes connexions assurent characterized in that the same connections ensure l'alimentation du premier circuit intégré et la the supply of the first integrated circuit and the transmission de données. data transmission. 11. Dispositif de sécurité selon les revendications 5 à 10,11. Safety device according to claims 5 to 10, caractérisé en ce que les points de connexion des characterized in that the connection points of the circuits intégrés sont situés dans une zone centrale de integrated circuits are located in a central area of leur face de contact respective. their respective contact face. 12. Dispositif de sécurité selon l'une quelconque des12. Safety device according to any one of revendications précédentes, caractérisé en ce que les previous claims, characterized in that the circuits intégrés sont fixés l'un à l'autre par integrated circuits are fixed to each other by l'intermédiaire d'une couche de colle (7).  through a layer of glue (7). 13. Dispositif de sécurité selon les revendications 8 et13. Safety device according to claims 8 and 12, caractérisé en ce que la fixation des circuits 12, characterized in that the fixing of the circuits intégrés ainsi que la connexion électrique est assurée integrated as well as the electrical connection is ensured par une colle conductrice. with a conductive adhesive. 14. Dispositif de sécurité selon l'une quelconque des14. Safety device according to any one of revendications précédentes, caractérisé en ce que le previous claims, characterized in that the deuxième circuit intégré comporte également une zone second integrated circuit also has a zone mémoire (6') et en ce que les circuits électroniques memory (6 ') and in that the electronic circuits disposent de moyens d'authentification mutuelle. have means of mutual authentication. 15. Dispositif de sécurité selon l'une quelconque des15. Safety device according to any one of revendications précédentes, caractérisé en ce que l'un  previous claims, characterized in that one des circuits intégrés au moins comporte une mémoire RAM integrated circuits at least has a RAM memory dans laquelle se trouvent des informations secrètes. in which there is secret information. 16. Dispositif de sécurité selon l'une quelconque des16. Safety device according to any one of revendications précédentes, caractérisé en ce que les previous claims, characterized in that the circuits intégrés se recouvrent mutuellement leurs integrated circuits overlap their éléments de circuit (6, 6') susceptibles de donner une circuit elements (6, 6 ') capable of giving a information sur les secrets. information about secrets. 17. Dispositif de sécurité selon la revendication 5,17. Safety device according to claim 5, caractérisé en ce que l'alimentation du premier ou characterized in that the feeding of the first or second circuit intégré s'effectue à travers des second integrated circuit is carried out through connexions électriques internes (9').  internal electrical connections (9 ').
FR9413886A 1994-11-17 1994-11-17 ACTIVE SECURITY DEVICE WITH ELECTRONIC MEMORY Expired - Fee Related FR2727226B1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FR9413886A FR2727226B1 (en) 1994-11-17 1994-11-17 ACTIVE SECURITY DEVICE WITH ELECTRONIC MEMORY
FR9502796A FR2727227B1 (en) 1994-11-17 1995-03-08 ACTIVE SECURITY DEVICE WITH ELECTRONIC MEMORY
DE69504208T DE69504208T2 (en) 1994-11-17 1995-11-15 SAFETY DEVICE WITH AN ELECTRONIC MEMORY
JP51661296A JP4278176B2 (en) 1994-11-17 1995-11-15 Active security device with electronic memory
PCT/FR1995/001497 WO1996016378A1 (en) 1994-11-17 1995-11-15 Active security device with electronic memory
EP95940311A EP0792497B1 (en) 1994-11-17 1995-11-15 Active security device with electronic memory
US08/836,563 US5877547A (en) 1994-11-17 1995-11-15 Active security device including an electronic memory
ES95940311T ES2122702T3 (en) 1994-11-17 1995-11-15 ACTIVE SECURITY DEVICE WITH ELECTRONIC MEMORY.
JP2005375135A JP4456066B2 (en) 1994-11-17 2005-12-27 Active security device with electronic memory

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9413886A FR2727226B1 (en) 1994-11-17 1994-11-17 ACTIVE SECURITY DEVICE WITH ELECTRONIC MEMORY

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FR2727226A1 true FR2727226A1 (en) 1996-05-24
FR2727226B1 FR2727226B1 (en) 1996-12-20

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EP1139424A2 (en) * 2000-03-31 2001-10-04 Sharp Kabushiki Kaisha Semiconductor device and method of manufacturing the same
WO2002054492A2 (en) * 2000-12-29 2002-07-11 Infineon Technologies Ag Circuit
WO2008001375A2 (en) * 2006-06-29 2008-01-03 Roseman Engineering Ltd. Tamper-resistant identification device
FR2910708A1 (en) * 2006-12-20 2008-06-27 Commissariat Energie Atomique Electronic component for protecting confidential data in e.g. chip card, has integrated circuit chip comprising internal detection circuit for detecting impedance variation of inductor and providing signal indicating separation of chips

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DE4018688A1 (en) * 1990-06-11 1991-01-10 Siemens Ag Protection of data held on shaft card against external reading - has protective layer that can be periodically checked for attempt to read
US5142345A (en) * 1989-04-13 1992-08-25 Mitsubishi Denki Kabushiki Kaisha Structure of input protection transistor in semiconductor device including memory transistor having double-layered gate and method of manufacturing semiconductor device including such input protection transistor
EP0509567A2 (en) * 1991-03-28 1992-10-21 Koninklijke Philips Electronics N.V. Device with protection against access to secure information

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US5142345A (en) * 1989-04-13 1992-08-25 Mitsubishi Denki Kabushiki Kaisha Structure of input protection transistor in semiconductor device including memory transistor having double-layered gate and method of manufacturing semiconductor device including such input protection transistor
FR2647929A1 (en) * 1989-05-30 1990-12-07 Paul Mayet Electronic device for protection against theft or fraudulent use
DE4018688A1 (en) * 1990-06-11 1991-01-10 Siemens Ag Protection of data held on shaft card against external reading - has protective layer that can be periodically checked for attempt to read
EP0509567A2 (en) * 1991-03-28 1992-10-21 Koninklijke Philips Electronics N.V. Device with protection against access to secure information

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Publication number Priority date Publication date Assignee Title
EP1139424A2 (en) * 2000-03-31 2001-10-04 Sharp Kabushiki Kaisha Semiconductor device and method of manufacturing the same
EP1139424A3 (en) * 2000-03-31 2003-10-22 Sharp Kabushiki Kaisha Semiconductor device and method of manufacturing the same
US6759722B2 (en) 2000-03-31 2004-07-06 Sharp Kabushiki Kaisha Semiconductor device and method of manufacturing the same
WO2002054492A2 (en) * 2000-12-29 2002-07-11 Infineon Technologies Ag Circuit
WO2002054492A3 (en) * 2000-12-29 2003-02-13 Infineon Technologies Ag Circuit
WO2008001375A2 (en) * 2006-06-29 2008-01-03 Roseman Engineering Ltd. Tamper-resistant identification device
WO2008001375A3 (en) * 2006-06-29 2008-07-03 Roseman Engineering Ltd Tamper-resistant identification device
FR2910708A1 (en) * 2006-12-20 2008-06-27 Commissariat Energie Atomique Electronic component for protecting confidential data in e.g. chip card, has integrated circuit chip comprising internal detection circuit for detecting impedance variation of inductor and providing signal indicating separation of chips

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