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FR2569078B1 - Materiau de circuit lamifie - Google Patents

Materiau de circuit lamifie

Info

Publication number
FR2569078B1
FR2569078B1 FR8510310A FR8510310A FR2569078B1 FR 2569078 B1 FR2569078 B1 FR 2569078B1 FR 8510310 A FR8510310 A FR 8510310A FR 8510310 A FR8510310 A FR 8510310A FR 2569078 B1 FR2569078 B1 FR 2569078B1
Authority
FR
France
Prior art keywords
circuit material
laminated circuit
laminated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8510310A
Other languages
English (en)
Other versions
FR2569078A1 (fr
Inventor
Samuel Gazit
Thomas S Kneeland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of FR2569078A1 publication Critical patent/FR2569078A1/fr
Application granted granted Critical
Publication of FR2569078B1 publication Critical patent/FR2569078B1/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/08—Reinforcements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)
FR8510310A 1984-07-09 1985-07-05 Materiau de circuit lamifie Expired FR2569078B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62916484A 1984-07-09 1984-07-09

Publications (2)

Publication Number Publication Date
FR2569078A1 FR2569078A1 (fr) 1986-02-14
FR2569078B1 true FR2569078B1 (fr) 1988-12-16

Family

ID=24521865

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8510310A Expired FR2569078B1 (fr) 1984-07-09 1985-07-05 Materiau de circuit lamifie

Country Status (5)

Country Link
JP (1) JPS6164448A (fr)
KR (1) KR910009491B1 (fr)
DE (1) DE3524482A1 (fr)
FR (1) FR2569078B1 (fr)
GB (1) GB2162124B (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4634631A (en) * 1985-07-15 1987-01-06 Rogers Corporation Flexible circuit laminate and method of making the same
JP2501331B2 (ja) * 1987-03-14 1996-05-29 松下電工株式会社 積層板
JPS63224935A (ja) * 1987-03-14 1988-09-20 松下電工株式会社 積層板
US4833022A (en) * 1987-08-20 1989-05-23 Olin Corporation Polymer/copper laminate and method for fabrication thereof
US4869956A (en) * 1987-08-20 1989-09-26 Olin Corporation Polymer/copper laminate and method for fabrication thereof
JPH02502804A (ja) * 1987-08-20 1990-09-06 オリン コーポレーション 新規のポリマー／金属ラミネートおよびその製造方法
US5055342A (en) * 1990-02-16 1991-10-08 International Business Machines Corporation Fluorinated polymeric composition, fabrication thereof and use thereof
WO1997002904A1 (fr) * 1995-07-12 1997-01-30 E.I. Du Pont De Nemours And Company Amelioration de l'adherence de fluoropolymeres
SE509570C2 (sv) * 1996-10-21 1999-02-08 Ericsson Telefon Ab L M Temperaturkompenserande organ och förfarande vid montering av elektronik på ett mönsterkort
CN110744839A (zh) * 2019-11-01 2020-02-04 中国电子科技集团公司第四十六研究所 一种基于低介电常数车削膜制备复合介质板的工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050976A (en) * 1976-01-27 1977-09-27 Bofors America, Inc. Strain gage application
FR2407815A1 (fr) * 1977-11-04 1979-06-01 Commissariat Energie Atomique Piece composite formable mecaniquement, utilisable notamment pour la realisation de circuits imprimes en forme de plaques incurvees
JPS5669245A (en) * 1979-11-07 1981-06-10 Fuji Fiber Glass Kk Product of cut glass filament
JPS57167256A (en) * 1981-04-08 1982-10-15 Hitachi Chemical Co Ltd Heat insulating film
JPS59112099A (ja) * 1982-12-15 1984-06-28 日本無機株式会社 ガラス紙の製造法

Also Published As

Publication number Publication date
GB8517373D0 (en) 1985-08-14
GB2162124B (en) 1988-06-02
JPS6164448A (ja) 1986-04-02
GB2162124A (en) 1986-01-29
FR2569078A1 (fr) 1986-02-14
KR910009491B1 (en) 1991-11-19
DE3524482A1 (de) 1986-05-07

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Legal Events

Date Code Title Description
SU To be deleted

Free format text: 08/86 PAGE 85

ST Notification of lapse