[go: up one dir, main page]

FR2431241A1 - Procede et machine de metallisation de languettes de connexion pour plaquettes a circuits imprimes - Google Patents

Procede et machine de metallisation de languettes de connexion pour plaquettes a circuits imprimes

Info

Publication number
FR2431241A1
FR2431241A1 FR7918125A FR7918125A FR2431241A1 FR 2431241 A1 FR2431241 A1 FR 2431241A1 FR 7918125 A FR7918125 A FR 7918125A FR 7918125 A FR7918125 A FR 7918125A FR 2431241 A1 FR2431241 A1 FR 2431241A1
Authority
FR
France
Prior art keywords
printed circuit
circuit boards
machine
metallizing
connection tabs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7918125A
Other languages
English (en)
Other versions
FR2431241B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micro-Plate Inc
Original Assignee
Micro-Plate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micro-Plate Inc filed Critical Micro-Plate Inc
Publication of FR2431241A1 publication Critical patent/FR2431241A1/fr
Application granted granted Critical
Publication of FR2431241B1 publication Critical patent/FR2431241B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne une machine de métallisation de languettes de connexion pour plaquettes à circuits imprimés. Cette machine comporte un mécanisme destiné à faire avancer longitudinalement les plaquettes au moyen de courroies élastiques opposées qui portent contre chaque plaquette suivant une ligne de démarcation délimitant la partie supérieure des languettes de connexion de la plaquette. Un dispositif de pulvérisation applique un fluide d'électrodéposition sur la partie apparente des languettes de connexion. Domaine d'application : fabrication de plaquettes et de cartes à circuits imprimés.
FR7918125A 1978-07-13 1979-07-12 Procede et machine de metallisation de languettes de connexion pour plaquettes a circuits imprimes Granted FR2431241A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/923,939 US4186062A (en) 1978-07-13 1978-07-13 Continuous tab plater and method

Publications (2)

Publication Number Publication Date
FR2431241A1 true FR2431241A1 (fr) 1980-02-08
FR2431241B1 FR2431241B1 (fr) 1984-02-03

Family

ID=25449496

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7918125A Granted FR2431241A1 (fr) 1978-07-13 1979-07-12 Procede et machine de metallisation de languettes de connexion pour plaquettes a circuits imprimes

Country Status (9)

Country Link
US (1) US4186062A (fr)
JP (1) JPS5516499A (fr)
BE (1) BE877535A (fr)
CH (1) CH643005A5 (fr)
DE (1) DE2928904A1 (fr)
FR (1) FR2431241A1 (fr)
GB (1) GB2039952B (fr)
NL (1) NL7905419A (fr)
SE (1) SE7905652L (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0060591A1 (fr) * 1981-03-07 1982-09-22 Meco Equipment Engineers B.V. Installation pour le dépôt électrolytique de revêtements d'aspect moucheté
FR2514207A1 (fr) * 1981-10-02 1983-04-08 Chemcut Corp Appareil et procede d'electrodeposition localisee sur des pattes de cartes a circuits imprimes
FR2549336A1 (fr) * 1983-06-23 1985-01-18 Telmec Spa Tec Elett Mecc Machine pour la dorure en continu de connecteurs lamellaires de circuits imprimes, avec groupe de transport pouvant effectuer une translation

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7812196A (nl) * 1978-12-15 1980-06-17 Galentan Ag Inrichting voor het electrolytisch aanbrengen van metalen deklagen.
US4364328A (en) * 1979-06-01 1982-12-21 Nippon Kokan Kabushiki Kaisha Apparatus for continuous dip-plating on one-side of steel strip
DE3108358C2 (de) * 1981-03-05 1985-08-29 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefaßten Teilen im Durchlaufverfahren
US4374004A (en) * 1981-06-29 1983-02-15 Northern Telecom Limited Method and apparatus for surface-treating predetermined areas of a surface of a body
US4359366A (en) * 1981-07-27 1982-11-16 Micro-Plate, Inc. Plating cell with continuous cathode contact and method
US4376684A (en) * 1981-08-24 1983-03-15 Micro-Plate, Inc. Shielded plating cell and method
US4377461A (en) * 1981-09-23 1983-03-22 Napco, Inc. Tab plater for circuit boards or the like
US4402799A (en) * 1981-10-02 1983-09-06 Chemcut Corporation Apparatus and method of treating tabs of printed circuit boards and the like
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
US4376017A (en) * 1982-01-04 1983-03-08 Western Electric Co., Inc. Methods of electrolytically treating portions of digitated strips and treating cell
US4425213A (en) * 1982-03-22 1984-01-10 National Semiconductor Corporation Discrete length strip plater
US4409924A (en) * 1982-07-01 1983-10-18 National Semiconductor Corporation Self-adjusting plating mask
DE3339328A1 (de) * 1982-11-01 1984-05-10 Omi International Corp., 48089 Warren, Mich. Anodenstruktur fuer eine plattierungszelle
DE3317970A1 (de) * 1983-05-13 1984-11-15 Schering AG, 1000 Berlin und 4709 Bergkamen Vorrichtung und verfahren zur galvanischen abscheidung von metallen
US4826243A (en) * 1987-06-25 1989-05-02 Super Sagless Corporation Recliner chairs
DE3839223C2 (de) * 1988-11-19 1994-10-20 Degussa Vorrichtung zur selektiven galvanischen Beschichtung
US5228553A (en) * 1992-02-24 1993-07-20 Circuit Chemistry Equipment, Inc. Drive mechanism for a conveyor of a printer circuit board processor
DE4405919A1 (de) * 1994-02-24 1995-08-31 Teves Gmbh Alfred Mit galvanisierten , untereinander über Stanzgitter verbundenen Anschlüssen versehene elektrische Baugruppe sowie Herstellungsverfahren hierzu
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
JP2002198635A (ja) * 2000-12-27 2002-07-12 Matsushita Electric Ind Co Ltd 配線板及びその製造方法
US20050006205A1 (en) * 2003-07-07 2005-01-13 Kuo Ming Hong Transporting device for a vertical-type thin circuit board etching machine
DE102005053930B4 (de) * 2005-11-11 2014-10-30 Rohde & Schwarz Gmbh & Co. Kg Befestigungs- und Kontaktvorrichtung für ein Substrat

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2362489A1 (de) * 1972-12-22 1974-07-04 Buckbee Mears Co Abdeckungsvorrichtung zur ermoeglichung einer nur teilweisen galvanischen behandlung der oberflaeche von platten- oder rahmenfoermigen gegenstaenden
FR2215013A1 (fr) * 1973-01-22 1974-08-19 Plisson Yvon
US3974056A (en) * 1975-05-23 1976-08-10 Ann Arbor Circuits, Inc. Electroplating selected portions of a strip
US4000045A (en) * 1975-01-27 1976-12-28 Burroughs Corporation Electroplating contacts of printed circuits
US4029564A (en) * 1976-03-26 1977-06-14 Electroplating Engineers Of Japan, Limited High speed plating device for rectangular sheets

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3274092A (en) * 1962-08-28 1966-09-20 Columbia Cable & Electric Corp Apparatus for electroplating narrow strips
US3933615A (en) * 1969-06-09 1976-01-20 The United States Of America As Represented By The Secretary Of The Air Force Fluid flow stripping and plating system
US3723283A (en) * 1970-12-23 1973-03-27 Select Au Matic Selective plating system
JPS51137629A (en) * 1975-05-23 1976-11-27 Nippon Electro Plating Highhspeed continuous plating method
US4093520A (en) * 1976-02-17 1978-06-06 Bell Telephone Laboratories, Incorporated Process for gold plating

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2362489A1 (de) * 1972-12-22 1974-07-04 Buckbee Mears Co Abdeckungsvorrichtung zur ermoeglichung einer nur teilweisen galvanischen behandlung der oberflaeche von platten- oder rahmenfoermigen gegenstaenden
FR2215013A1 (fr) * 1973-01-22 1974-08-19 Plisson Yvon
US4000045A (en) * 1975-01-27 1976-12-28 Burroughs Corporation Electroplating contacts of printed circuits
US3974056A (en) * 1975-05-23 1976-08-10 Ann Arbor Circuits, Inc. Electroplating selected portions of a strip
US4029564A (en) * 1976-03-26 1977-06-14 Electroplating Engineers Of Japan, Limited High speed plating device for rectangular sheets

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0060591A1 (fr) * 1981-03-07 1982-09-22 Meco Equipment Engineers B.V. Installation pour le dépôt électrolytique de revêtements d'aspect moucheté
FR2514207A1 (fr) * 1981-10-02 1983-04-08 Chemcut Corp Appareil et procede d'electrodeposition localisee sur des pattes de cartes a circuits imprimes
FR2549336A1 (fr) * 1983-06-23 1985-01-18 Telmec Spa Tec Elett Mecc Machine pour la dorure en continu de connecteurs lamellaires de circuits imprimes, avec groupe de transport pouvant effectuer une translation

Also Published As

Publication number Publication date
DE2928904A1 (de) 1980-01-31
GB2039952A (en) 1980-08-20
US4186062A (en) 1980-01-29
GB2039952B (en) 1982-09-08
JPS5516499A (en) 1980-02-05
NL7905419A (nl) 1980-01-15
BE877535A (fr) 1979-11-05
SE7905652L (sv) 1980-01-14
CH643005A5 (fr) 1984-05-15
FR2431241B1 (fr) 1984-02-03

Similar Documents

Publication Publication Date Title
FR2431241A1 (fr) Procede et machine de metallisation de languettes de connexion pour plaquettes a circuits imprimes
FR2566181B1 (fr) Procede d'autopositionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre
FR2570141B1 (fr) Dispositif de fixation pour substrats
FR2534767B1 (fr) Organe de fixation d'une piece sur une plaquette a circuit imprime et procede de fixation d'un transistor et d'un radiateur sur une plaquette a circuit imprime
BE870879A (fr) Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
FR2363963A1 (fr) Dispositif de fixation de connecteurs
DE69017582D1 (de) Zwischenverbindungsvorrichtung für Leiterplatten.
BE903914A (fr) Procede et appareil pour deposer un metal sur des surfaces d'articles globalement plats.
FR2501221B1 (fr) Encre conductrice thermodurcissable et procede pour former un revetement conducteur sur un substrat au moyen de cette encre
NO870893L (no) Apparat for behandling av smeltet metall.
FR2595899B1 (fr) Procede pour monter des composants electroniques en des endroits determines sur une plaquette de circuit imprime
FR2676143B1 (fr) Procede pour fabriquer une electrode metallique dans un dispositif semi-conducteur.
FR2433270A1 (fr) Monture a connexions pour dispositifs electroniques
FR2624304B1 (fr) Procede pour etablir une structure d'interconnexion electrique sur un dispositif semiconducteur au silicium
YU48977B (sh) Ploča štampanog kola i postupak za precizno sklapanje i lemljenje elektronskih komponenata na površini ploče štampanog kola
FR2400304A1 (fr) Procedes et appareils perfectionnes pour la realisation de circuits a conducteurs filaires
FR2670605B1 (fr) Procede de realisation d'une barriere de diffusion electriquement conductrice a l'interface metal/silicium d'un transistor mos et transistor correspondant.
FR2542920B1 (fr) Procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre
FR2597688B1 (fr) Procede et dispositif pour le transfert de signaux entre des modules d'un ensemble electronique.
FR2643192B1 (fr) Procede de fabrication d'un dispositif semi-conducteur comprenant une electrode en metal refractaire sur un substrat semi-isolant
FR2589278B1 (fr) Dispositif electronique pour proteger des circuits integres des charges electrostatiques et procede pour le fabriquer
DE69007500D1 (de) Lösung für stromlose Kupferplattierung.
FR2556916B1 (fr) Procede pour fabriquer un substrat de circuit electronique presentant une ou plusieurs ouvertures traversantes
FR2329135A1 (fr) Dispositif de liaison d'une electrode de raccordement d'un composant electronique avec les voies conductrices d'un circuit imprime
FR2563960B3 (fr) Dispositif pour la fixation de composants electroniques sur des circuits imprimes

Legal Events

Date Code Title Description
ST Notification of lapse