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FR2420897A1 - Procede de production d'un circuit imprime avec application d'un liant resistant puis depot de metal conducteur - Google Patents

Procede de production d'un circuit imprime avec application d'un liant resistant puis depot de metal conducteur

Info

Publication number
FR2420897A1
FR2420897A1 FR7907160A FR7907160A FR2420897A1 FR 2420897 A1 FR2420897 A1 FR 2420897A1 FR 7907160 A FR7907160 A FR 7907160A FR 7907160 A FR7907160 A FR 7907160A FR 2420897 A1 FR2420897 A1 FR 2420897A1
Authority
FR
France
Prior art keywords
printed circuit
application
conductive metal
deposit
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7907160A
Other languages
English (en)
Other versions
FR2420897B3 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Preh GmbH
Original Assignee
Preh GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Preh GmbH filed Critical Preh GmbH
Publication of FR2420897A1 publication Critical patent/FR2420897A1/fr
Application granted granted Critical
Publication of FR2420897B3 publication Critical patent/FR2420897B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

L'invention concerne l'obtention d'un circuit imprimé par la technique des additions (dépôt, sur un substrat non conducteur, des zones de résistances électriques et de conducteurs selon des modèles). On applique tout d'abord au substrat un liant organique, jouant le rôle de couche résistante et d'adhésif et contenant de petites particules réfractaires < 20 microns enrobées de C pyrolytique et des catalyseurs pour le dépôt chimique de métaux. Après masquage des zones des résistances, on provoque le dépôt, par un bain approprié, d'un métal conducteur. Application : production de composants, ensembles et dispositifs électroniques.
FR7907160A 1978-03-22 1979-03-21 Procede de production d'un circuit imprime avec application d'un liant resistant puis depot de metal conducteur Granted FR2420897A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2812497A DE2812497C3 (de) 1978-03-22 1978-03-22 Gedruckte Schaltung

Publications (2)

Publication Number Publication Date
FR2420897A1 true FR2420897A1 (fr) 1979-10-19
FR2420897B3 FR2420897B3 (fr) 1981-12-18

Family

ID=6035160

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7907160A Granted FR2420897A1 (fr) 1978-03-22 1979-03-21 Procede de production d'un circuit imprime avec application d'un liant resistant puis depot de metal conducteur

Country Status (5)

Country Link
US (1) US4319217A (fr)
JP (1) JPS54135363A (fr)
DE (1) DE2812497C3 (fr)
FR (1) FR2420897A1 (fr)
GB (1) GB2026250B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3130159C2 (de) * 1981-07-30 1987-02-05 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Verfahren zur Herstellung von Leiterplatten
JPS59227101A (ja) * 1983-06-07 1984-12-20 株式会社日本自動車部品総合研究所 厚膜抵抗
WO1988002592A1 (fr) * 1986-09-30 1988-04-07 Wilde Membran Impulstechnik Gmbh Structure electro-conductrice a metallisation rapportee
DE3733002A1 (de) * 1986-09-30 1988-04-07 Wilde Membran Impuls Tech Additiv metallisierte elektrisch leitfaehige struktur
DE3916921C1 (fr) * 1989-05-24 1990-10-11 Preh-Werke Gmbh & Co Kg, 8740 Bad Neustadt, De
JPH0525648A (ja) * 1991-07-15 1993-02-02 Matsushita Electric Ind Co Ltd プラズマｃｖｄ成膜方法
JPH06163201A (ja) * 1992-06-16 1994-06-10 Philips Electron Nv 抵抗薄膜
DE4314665A1 (de) * 1993-05-04 1994-11-10 Hella Kg Hueck & Co Schaltungsanordnung
GB2343996B (en) * 1998-11-20 2003-03-26 Nec Technologies Current sensing resistor

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB723437A (en) * 1952-02-12 1955-02-09 Frank Raymond Faber Ramsay Gas or liquid fuel fired heater
NL101878C (fr) * 1956-11-08 1900-01-01
US3358362A (en) * 1965-01-21 1967-12-19 Int Resistance Co Method of making an electrical resistor
GB1108967A (en) * 1965-08-23 1968-04-10 Matsushita Electric Ind Co Ltd Carbon film resistor composition
DE1640635A1 (de) * 1966-07-28 1970-12-10 Kupfer Asbest Co Verfahren zur Herstellung gedruckter Schaltungen und Basismaterial hierzu
US3686139A (en) * 1970-03-10 1972-08-22 Globe Union Inc Resistive coating compositions and resistor elements produced therefrom
DE2044484B2 (de) * 1970-09-08 1973-09-27 Standard Elektrik Lorenz Ag, 7000 Stuttgart Haftvermittler fur die Herstellung gedruckter Schaltungen nach der Aufbau methode
US3801364A (en) * 1971-02-03 1974-04-02 Matsushita Electric Ind Co Ltd Method for making printed circuits which include printed resistors
GB1377413A (en) * 1972-03-20 1974-12-18 Universal Oil Prod Co Semiconducting material and method of manufacture and use thereof
CA968429A (en) * 1972-12-14 1975-05-27 Richard E. Caddock Noninductive film-type cylindrical resistor, and method of making the same
AU475305B2 (en) * 1973-12-14 1976-08-19 Caddock, Richard Elliot Method and apparatus for manufacturing cylindrical resistors by thick-film silk-screening
JPS5145766A (ja) * 1974-10-17 1976-04-19 Matsushita Electric Ind Co Ltd Teikotsukiinsatsuhaisenbanno seizoho

Also Published As

Publication number Publication date
DE2812497B2 (de) 1981-05-21
FR2420897B3 (fr) 1981-12-18
US4319217A (en) 1982-03-09
DE2812497C3 (de) 1982-03-11
GB2026250B (en) 1982-04-07
DE2812497A1 (de) 1979-09-27
JPS6350878B2 (fr) 1988-10-12
GB2026250A (en) 1980-01-30
JPS54135363A (en) 1979-10-20

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