DE69316750D1 - Verfahren zur herstellung einer leiterplatte. - Google Patents
Verfahren zur herstellung einer leiterplatte.Info
- Publication number
- DE69316750D1 DE69316750D1 DE69316750T DE69316750T DE69316750D1 DE 69316750 D1 DE69316750 D1 DE 69316750D1 DE 69316750 T DE69316750 T DE 69316750T DE 69316750 T DE69316750 T DE 69316750T DE 69316750 D1 DE69316750 D1 DE 69316750D1
- Authority
- DE
- Germany
- Prior art keywords
- board
- substrate
- holes
- circuit elements
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0565—Resist used only for applying catalyst, not for plating itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB929212395A GB9212395D0 (en) | 1992-06-11 | 1992-06-11 | Method of making a printed circuit board |
| GB9225895A GB2267784B (en) | 1992-06-11 | 1992-12-11 | Method of making a printed circuit board |
| PCT/GB1993/001152 WO1993026145A1 (en) | 1992-06-11 | 1993-06-01 | Method of making a printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69316750D1 true DE69316750D1 (de) | 1998-03-05 |
| DE69316750T2 DE69316750T2 (de) | 1998-09-17 |
Family
ID=26301053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69316750T Expired - Lifetime DE69316750T2 (de) | 1992-06-11 | 1993-06-01 | Verfahren zur herstellung einer leiterplatte. |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0645074B1 (de) |
| JP (1) | JP3037755B2 (de) |
| AT (1) | ATE162923T1 (de) |
| AU (1) | AU4338693A (de) |
| CA (1) | CA2137823C (de) |
| DE (1) | DE69316750T2 (de) |
| ES (1) | ES2114608T3 (de) |
| WO (1) | WO1993026145A1 (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6403146B1 (en) | 1994-08-26 | 2002-06-11 | Gary B. Larson | Process for the manufacture of printed circuit boards |
| US5620612A (en) * | 1995-08-22 | 1997-04-15 | Macdermid, Incorporated | Method for the manufacture of printed circuit boards |
| EP0762813A1 (de) * | 1995-08-25 | 1997-03-12 | Macdermid Incorporated | Verfahren zur Herstellung von Leiterplatten |
| US5699613A (en) * | 1995-09-25 | 1997-12-23 | International Business Machines Corporation | Fine dimension stacked vias for a multiple layer circuit board structure |
| US6044550A (en) * | 1996-09-23 | 2000-04-04 | Macdermid, Incorporated | Process for the manufacture of printed circuit boards |
| US6023842A (en) * | 1996-09-24 | 2000-02-15 | Macdermid, Incorporated | Process for the manufacture of printed circuit boards |
| US5747098A (en) * | 1996-09-24 | 1998-05-05 | Macdermid, Incorporated | Process for the manufacture of printed circuit boards |
| US6023029A (en) * | 1998-03-19 | 2000-02-08 | International Business Machines Corporation | Use of blind vias for soldered interconnections between substrates and printed wiring boards |
| JP2000252630A (ja) * | 1999-02-24 | 2000-09-14 | Omg Fidelity | ニッケルメッキされたスルーホールおよび／またはブラインド経由路を備えた基板 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3269861A (en) * | 1963-06-21 | 1966-08-30 | Day Company | Method for electroless copper plating |
| FR1431918A (fr) * | 1965-02-05 | 1966-03-18 | Jean Graniou Ets | Procédé de nickelage et de finition de circuits imprimés |
| US4782007A (en) * | 1987-04-28 | 1988-11-01 | Macdermid, Incorporated | Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists |
| JP5640518B2 (ja) | 2010-07-16 | 2014-12-17 | 株式会社オートネットワーク技術研究所 | 車載用ｅｃｕ |
-
1993
- 1993-06-01 AT AT93913258T patent/ATE162923T1/de not_active IP Right Cessation
- 1993-06-01 EP EP93913258A patent/EP0645074B1/de not_active Expired - Lifetime
- 1993-06-01 AU AU43386/93A patent/AU4338693A/en not_active Abandoned
- 1993-06-01 DE DE69316750T patent/DE69316750T2/de not_active Expired - Lifetime
- 1993-06-01 ES ES93913258T patent/ES2114608T3/es not_active Expired - Lifetime
- 1993-06-01 JP JP05516875A patent/JP3037755B2/ja not_active Expired - Lifetime
- 1993-06-01 CA CA002137823A patent/CA2137823C/en not_active Expired - Lifetime
- 1993-06-01 WO PCT/GB1993/001152 patent/WO1993026145A1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| EP0645074A1 (de) | 1995-03-29 |
| ES2114608T3 (es) | 1998-06-01 |
| ATE162923T1 (de) | 1998-02-15 |
| AU4338693A (en) | 1994-01-04 |
| CA2137823A1 (en) | 1993-12-23 |
| DE69316750T2 (de) | 1998-09-17 |
| WO1993026145A1 (en) | 1993-12-23 |
| CA2137823C (en) | 2000-10-10 |
| EP0645074B1 (de) | 1998-01-28 |
| JP3037755B2 (ja) | 2000-05-08 |
| JPH08501410A (ja) | 1996-02-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8328 | Change in the person/name/address of the agent |
Representative=s name: STROHSCHAENK UND KOLLEGEN, 85521 OTTOBRUNN |