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FR2390005A1 - - Google Patents

Info

Publication number
FR2390005A1
FR2390005A1 FR7812638A FR7812638A FR2390005A1 FR 2390005 A1 FR2390005 A1 FR 2390005A1 FR 7812638 A FR7812638 A FR 7812638A FR 7812638 A FR7812638 A FR 7812638A FR 2390005 A1 FR2390005 A1 FR 2390005A1
Authority
FR
France
Prior art keywords
substrate
small spacer
thick film
electrical
spacer pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7812638A
Other languages
English (en)
Other versions
FR2390005B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2390005A1 publication Critical patent/FR2390005A1/fr
Application granted granted Critical
Publication of FR2390005B1 publication Critical patent/FR2390005B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)

Abstract

Dans le cas d'un procédé de dépôt de petites pièces entretoises sur un substrat isolant, ces petites pièces entretoises déterminant l'épaisseur d'une liaison entre un composant électrique et un substrat, les petites pièces entretoises sont déposées fixes sur le substrat sous la forme d'une pellicule épaisse de gabarit donné, ceci en même temps et avec la même matière que le dépôt sur le substrat d'au moins une autre pellicule epaisse necessaire pour un circuit électrique sur le substrat Application aux composants électriques.
FR7812638A 1977-05-02 1978-04-28 Expired FR2390005B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7704770A NL7704770A (nl) 1977-05-02 1977-05-02 Werkwijze voor het aanbrengen van afstandstukjes op een isolerend substraat.

Publications (2)

Publication Number Publication Date
FR2390005A1 true FR2390005A1 (fr) 1978-12-01
FR2390005B1 FR2390005B1 (fr) 1983-12-09

Family

ID=19828467

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7812638A Expired FR2390005B1 (fr) 1977-05-02 1978-04-28

Country Status (9)

Country Link
US (1) US4184043A (fr)
JP (1) JPS53135462A (fr)
AU (1) AU513792B2 (fr)
CA (1) CA1112371A (fr)
DE (1) DE2817286C2 (fr)
FR (1) FR2390005B1 (fr)
GB (1) GB1583288A (fr)
IT (1) IT1094980B (fr)
NL (1) NL7704770A (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2452786A1 (fr) * 1979-03-30 1980-10-24 Silicium Semiconducteur Ssc Procede de montage par soudage d'une pastille semi-conductrice sur un radiateur et dispositif obtenu
DE4228012A1 (de) * 1992-08-24 1994-03-10 Siemens Ag Verfahren zum Beabstanden zweier Bauteile
EP0732736A2 (fr) * 1991-09-02 1996-09-18 Fujitsu Limited Empaquetage semi-conducteur pour le procédé de montage à pastille renversée
DE19518027A1 (de) * 1995-05-17 1996-11-21 Lust Hybrid Technik Gmbh Verfahren zur abstandsgenauen Umhüllung mit funktionstragenden Schichten versehener Bauelemente und danach hergestellte Bauelemente
DE10030697A1 (de) * 2000-06-23 2002-01-10 Infineon Technologies Ag Verfahren zum Befestigen eines Halbleiterchips auf einem Substrat

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4391845A (en) * 1981-11-19 1983-07-05 Oak Industries Inc. Method of making a membrane switch
US4545610A (en) * 1983-11-25 1985-10-08 International Business Machines Corporation Method for forming elongated solder connections between a semiconductor device and a supporting substrate
US4641222A (en) * 1984-05-29 1987-02-03 Motorola, Inc. Mounting system for stress relief in surface mounted components
JPS6255996A (ja) * 1985-09-05 1987-03-11 日本電気株式会社 配線基板
DE3534502A1 (de) * 1985-09-27 1987-04-09 Licentia Gmbh Verfahren zum herstellen einer klebekontaktierung
US4777564A (en) * 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
JPH02117196A (ja) * 1988-10-26 1990-05-01 Canon Inc プリント基板
US5045142A (en) * 1989-11-22 1991-09-03 Xerox Corporation Stand-off structure for flipped chip butting
US5001829A (en) * 1990-01-02 1991-03-26 General Electric Company Method for connecting a leadless chip carrier to a substrate
JP2555811B2 (ja) * 1991-09-10 1996-11-20 富士通株式会社 半導体チップのフリップチップ接合方法
US5255431A (en) * 1992-06-26 1993-10-26 General Electric Company Method of using frozen epoxy for placing pin-mounted components in a circuit module
US5573172A (en) * 1993-11-08 1996-11-12 Sawtek, Inc. Surface mount stress relief hidden lead package device and method
DE9411391U1 (de) * 1994-07-14 1995-11-16 Gira Giersiepen Gmbh & Co Kg, 42477 Radevormwald Elektro-Installationsgerät
JPH097660A (ja) * 1995-06-22 1997-01-10 Yazaki Corp 信号伝達装置
DE19533251A1 (de) * 1995-06-27 1997-01-02 Braun Ag Verfahren zur wärmeleitenden Befestigung eines elektronischen Leistungsbauelementes auf einer Leiterplatte mit einem Kühlblech oder Kühlkörper
ATE203355T1 (de) * 1995-06-27 2001-08-15 Braun Gmbh Wärmeleite-befestigung eines elektronischen leistungsbauelementes auf einer leiterplatte mit kühlblech
DE19750073A1 (de) * 1997-11-12 1999-05-20 Bosch Gmbh Robert Schaltungsträgerplatte
US6086705A (en) * 1998-09-14 2000-07-11 Industrial Technology Research Institute Bonding of micro elements
US7518223B2 (en) * 2001-08-24 2009-04-14 Micron Technology, Inc. Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer
US7109583B2 (en) * 2004-05-06 2006-09-19 Endwave Corporation Mounting with auxiliary bumps
DE102004037610B3 (de) * 2004-08-03 2006-03-16 Infineon Technologies Ag Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung
DE102004039853A1 (de) * 2004-08-17 2006-03-09 Siemens Ag Elektrische Baueinheit und Verfahren zum Herstellen einer solchen Baueinheit
US8957511B2 (en) * 2005-08-22 2015-02-17 Madhukar B. Vora Apparatus and methods for high-density chip connectivity
US7745301B2 (en) * 2005-08-22 2010-06-29 Terapede, Llc Methods and apparatus for high-density chip connectivity
DE102005050830A1 (de) * 2005-10-24 2007-04-26 Tridonicatco Gmbh & Co. Kg Beabstandung von Bauelementen auf der Bestückungsfläche einer Leiterplatte
CN108781515B (zh) * 2016-02-18 2021-03-12 三菱电机株式会社 电子装置及其制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3098287A (en) * 1958-07-22 1963-07-23 Hazeltine Research Inc Method of assembling components on printed wiring boards
US3832769A (en) * 1971-05-26 1974-09-03 Minnesota Mining & Mfg Circuitry and method
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2452786A1 (fr) * 1979-03-30 1980-10-24 Silicium Semiconducteur Ssc Procede de montage par soudage d'une pastille semi-conductrice sur un radiateur et dispositif obtenu
EP0732736A2 (fr) * 1991-09-02 1996-09-18 Fujitsu Limited Empaquetage semi-conducteur pour le procédé de montage à pastille renversée
EP0732736A3 (fr) * 1991-09-02 1996-10-30 Fujitsu Limited Empaquetage semi-conducteur pour le procédé de montage à pastille renversée
DE4228012A1 (de) * 1992-08-24 1994-03-10 Siemens Ag Verfahren zum Beabstanden zweier Bauteile
DE19518027A1 (de) * 1995-05-17 1996-11-21 Lust Hybrid Technik Gmbh Verfahren zur abstandsgenauen Umhüllung mit funktionstragenden Schichten versehener Bauelemente und danach hergestellte Bauelemente
DE10030697A1 (de) * 2000-06-23 2002-01-10 Infineon Technologies Ag Verfahren zum Befestigen eines Halbleiterchips auf einem Substrat
DE10030697C2 (de) * 2000-06-23 2002-06-27 Infineon Technologies Ag Verfahren zum Befestigen eines Halbleiterchips auf einem Substrat

Also Published As

Publication number Publication date
IT7822878A0 (it) 1978-04-28
AU513792B2 (en) 1981-01-08
DE2817286C2 (de) 1984-03-22
DE2817286A1 (de) 1978-11-09
US4184043A (en) 1980-01-15
GB1583288A (en) 1981-01-21
CA1112371A (fr) 1981-11-10
IT1094980B (it) 1985-08-10
NL7704770A (nl) 1978-11-06
JPS53135462A (en) 1978-11-27
FR2390005B1 (fr) 1983-12-09
AU3556878A (en) 1979-11-01

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