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FR2384151A1 - Dispositif de fixation pour plaquettes de substrat - Google Patents

Dispositif de fixation pour plaquettes de substrat

Info

Publication number
FR2384151A1
FR2384151A1 FR7807091A FR7807091A FR2384151A1 FR 2384151 A1 FR2384151 A1 FR 2384151A1 FR 7807091 A FR7807091 A FR 7807091A FR 7807091 A FR7807091 A FR 7807091A FR 2384151 A1 FR2384151 A1 FR 2384151A1
Authority
FR
France
Prior art keywords
fixing
base plate
fixing ring
ring
fixing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7807091A
Other languages
English (en)
Other versions
FR2384151B1 (fr
Inventor
Bernhard Bracher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC Oerlikon Balzers AG
Original Assignee
Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Balzers AG filed Critical Balzers AG
Publication of FR2384151A1 publication Critical patent/FR2384151A1/fr
Application granted granted Critical
Publication of FR2384151B1 publication Critical patent/FR2384151B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

L'invention concerne un dispositif de fixation pour plaquettes de substrat. Ce dispositif comporte une plaque de base munie d'une bague de fixation qui est montée rotative dans une ouverture de la plaque de base et qui est munie d'un épaulement de réception d'une plaquette à traiter, la bague de fixation 3 comporte plusieurs fentes 6 ménagées parallelement au plan de la bague, à chacune desquelles est associée une tige de fixation 7 fixée sur la plaque de base au niveau de la périphérie extérieure de la bague de fixation, traversant la fente associée et chevauchant la plaquette 5 à fixer, et la bague de fixation constitue simultanement un dispositif de commande de la tige de fixation. Application notamment aux installations de vaporisation sous vide.
FR7807091A 1977-03-14 1978-03-13 Dispositif de fixation pour plaquettes de substrat Granted FR2384151A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE7707767U DE7707767U1 (de) 1977-03-14 1977-03-14 Halterung fuer substratplaettchen

Publications (2)

Publication Number Publication Date
FR2384151A1 true FR2384151A1 (fr) 1978-10-13
FR2384151B1 FR2384151B1 (fr) 1983-11-18

Family

ID=6676506

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7807091A Granted FR2384151A1 (fr) 1977-03-14 1978-03-13 Dispositif de fixation pour plaquettes de substrat

Country Status (5)

Country Link
US (1) US4182265A (fr)
CH (1) CH631638A5 (fr)
DE (1) DE7707767U1 (fr)
FR (1) FR2384151A1 (fr)
GB (1) GB1562273A (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3028536C2 (de) * 1980-07-28 1983-01-05 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur Halterung von kreisförmigen Substratscheiben und ihre Verwendung
US5074736A (en) * 1988-12-20 1991-12-24 Texas Instruments Incorporated Semiconductor wafer carrier design
DE4116392C2 (de) * 1991-05-18 2001-05-03 Micronas Gmbh Halterung zur einseitigen Naßätzung von Halbleiterscheiben
US5259579A (en) * 1992-04-08 1993-11-09 Prince Corporation Container holder for a vehicle
DE4232902C2 (de) * 1992-09-30 2001-06-28 Leybold Ag Substrathalter
US5799913A (en) * 1996-03-26 1998-09-01 Preston, Sr.; Frederick Byron Beverage holding and locking device
US6041938A (en) * 1996-08-29 2000-03-28 Scp Global Technologies Compliant process cassette
US5840124A (en) * 1997-06-30 1998-11-24 Emcore Corporation Wafer carrier with flexible wafer flat holder
DE10044419C1 (de) * 2000-09-08 2002-05-02 Infineon Technologies Ag Abschattungsring für Plasmabeschichtungsanlagen und dessen Verwendung
US6848458B1 (en) 2002-02-05 2005-02-01 Novellus Systems, Inc. Apparatus and methods for processing semiconductor substrates using supercritical fluids
US6885206B2 (en) * 2003-02-11 2005-04-26 Strasbaugh Device for supporting thin semiconductor wafers
DE10355679B4 (de) * 2003-11-28 2008-08-14 Singulus Technologies Ag Substratträger, Vorrichtung und Verfahren zum Handhaben des Substratträgers und Verwendung in Beschichtungsprozessen
CN103934171B (zh) * 2013-12-31 2016-06-01 浙江吉利控股集团有限公司 一种打胶台
CN112797907A (zh) * 2021-02-05 2021-05-14 北京三禾泰达技术有限公司 一种晶圆厚度激光全自动测试机

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3699917A (en) * 1970-10-02 1972-10-24 Cogar Corp Vapor deposition apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3675624A (en) * 1970-08-06 1972-07-11 Singer Co Apparatus for rotating work for thin film deposition
US3918756A (en) * 1973-12-26 1975-11-11 Fluoroware Inc Wafer holder
US4096023A (en) * 1976-05-06 1978-06-20 Bivens Carl F Lens sealing clamp
SE7710800L (sv) * 1976-10-05 1978-04-06 Western Electric Co Forfarande for astadkommande av ett epitaxiellt skikt pa ett substrat
US4068814A (en) * 1976-10-18 1978-01-17 General Electric Company Semiconductor body holder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3699917A (en) * 1970-10-02 1972-10-24 Cogar Corp Vapor deposition apparatus

Also Published As

Publication number Publication date
US4182265A (en) 1980-01-08
CH631638A5 (de) 1982-08-31
DE7707767U1 (de) 1977-09-08
FR2384151B1 (fr) 1983-11-18
GB1562273A (en) 1980-03-12

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Legal Events

Date Code Title Description
ST Notification of lapse