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FR2337381B1 - - Google Patents

Info

Publication number
FR2337381B1
FR2337381B1 FR7540361A FR7540361A FR2337381B1 FR 2337381 B1 FR2337381 B1 FR 2337381B1 FR 7540361 A FR7540361 A FR 7540361A FR 7540361 A FR7540361 A FR 7540361A FR 2337381 B1 FR2337381 B1 FR 2337381B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7540361A
Other languages
French (fr)
Other versions
FR2337381A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CII HONEYWELL BULL
Original Assignee
CII HONEYWELL BULL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CII HONEYWELL BULL filed Critical CII HONEYWELL BULL
Priority to FR7540361A priority Critical patent/FR2337381A1/en
Priority to IT3018576A priority patent/IT1124741B/en
Priority to CH1558976A priority patent/CH619310A5/en
Priority to CA268,082A priority patent/CA1083714A/en
Priority to GB5321476A priority patent/GB1567784A/en
Priority to ES454567A priority patent/ES454567A1/en
Priority to JP15766976A priority patent/JPS5283132A/en
Priority to SE7614622A priority patent/SE415304B/en
Priority to DE19762659573 priority patent/DE2659573C2/en
Priority to BR7608831A priority patent/BR7608831A/en
Priority to NL7614637A priority patent/NL190131C/en
Publication of FR2337381A1 publication Critical patent/FR2337381A1/en
Priority to US05/931,686 priority patent/US4216577A/en
Priority to US06/004,588 priority patent/US4222516A/en
Application granted granted Critical
Publication of FR2337381B1 publication Critical patent/FR2337381B1/fr
Priority to JP61052763A priority patent/JPS625894A/en
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0105Tin [Sn]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01058Cerium [Ce]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01063Europium [Eu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01094Plutonium [Pu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1517Multilayer substrate
    • H01L2924/15172Fan-out arrangement of the internal vias
    • H01L2924/15173Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10681Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Audible And Visible Signals (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Handling Of Sheets (AREA)
FR7540361A 1975-12-31 1975-12-31 PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD Granted FR2337381A1 (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
FR7540361A FR2337381A1 (en) 1975-12-31 1975-12-31 PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD
IT3018576A IT1124741B (en) 1975-12-31 1976-12-09 PORTABLE BOARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEMS AND MANUFACTURING PROCEDURE OF THE BOARD
CH1558976A CH619310A5 (en) 1975-12-31 1976-12-10 Portable card for signal processing system and method of manufacturing this card
CA268,082A CA1083714A (en) 1975-12-31 1976-12-16 Portable card for electrical signal processing system and method for making same
GB5321476A GB1567784A (en) 1975-12-31 1976-12-20 Portable card for systems for processing electrical signals and a method of manufacturing such a card
ES454567A ES454567A1 (en) 1975-12-31 1976-12-23 Portable card for systems for processing electrical signals and a method of manufacturing such a card
JP15766976A JPS5283132A (en) 1975-12-31 1976-12-28 Portable card for electric signal processor and method of fabricating same
SE7614622A SE415304B (en) 1975-12-31 1976-12-28 SIGNAL PROCESSING SYSTEM CARDS AND PROCEDURES FOR PRODUCING THE SAME
DE19762659573 DE2659573C2 (en) 1975-12-31 1976-12-30 Card in the manner of a standardized credit card for processing electrical signals and a method for producing the card
BR7608831A BR7608831A (en) 1975-12-31 1976-12-30 SUPPORTING CARD FOR ELECTRIC SIGNAL TREATMENT SYSTEM AND MANUFACTURING PROCESS FOR THIS CARD
NL7614637A NL190131C (en) 1975-12-31 1976-12-31 SIGNAL PROCESSING SYSTEM CARD.
US05/931,686 US4216577A (en) 1975-12-31 1978-08-07 Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
US06/004,588 US4222516A (en) 1975-12-31 1979-01-18 Standardized information card
JP61052763A JPS625894A (en) 1975-12-31 1986-03-12 Card and manufacture of card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7540361A FR2337381A1 (en) 1975-12-31 1975-12-31 PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD

Publications (2)

Publication Number Publication Date
FR2337381A1 FR2337381A1 (en) 1977-07-29
FR2337381B1 true FR2337381B1 (en) 1979-07-06

Family

ID=9164418

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7540361A Granted FR2337381A1 (en) 1975-12-31 1975-12-31 PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD

Country Status (11)

Country Link
JP (2) JPS5283132A (en)
BR (1) BR7608831A (en)
CA (1) CA1083714A (en)
CH (1) CH619310A5 (en)
DE (1) DE2659573C2 (en)
ES (1) ES454567A1 (en)
FR (1) FR2337381A1 (en)
GB (1) GB1567784A (en)
IT (1) IT1124741B (en)
NL (1) NL190131C (en)
SE (1) SE415304B (en)

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BR7608831A (en) 1977-10-25
CH619310A5 (en) 1980-09-15
JPS5283132A (en) 1977-07-11
DE2659573C2 (en) 1986-02-27
NL190131C (en) 1993-11-01
FR2337381A1 (en) 1977-07-29
IT1124741B (en) 1986-05-14
GB1567784A (en) 1980-05-21
ES454567A1 (en) 1977-12-16
NL7614637A (en) 1977-07-04
JPS6313840B2 (en) 1988-03-28
NL190131B (en) 1993-06-01
JPS625894A (en) 1987-01-12
JPS6130315B2 (en) 1986-07-12
DE2659573A1 (en) 1977-07-14
CA1083714A (en) 1980-08-12
SE7614622L (en) 1977-07-02
SE415304B (en) 1980-09-22

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