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FR2271740A1 - Combined semiconductor device-printed circuit board - with semiconductor device requiring fewer connections and less space in layout of board - Google Patents

Combined semiconductor device-printed circuit board - with semiconductor device requiring fewer connections and less space in layout of board

Info

Publication number
FR2271740A1
FR2271740A1 FR7501950A FR7501950A FR2271740A1 FR 2271740 A1 FR2271740 A1 FR 2271740A1 FR 7501950 A FR7501950 A FR 7501950A FR 7501950 A FR7501950 A FR 7501950A FR 2271740 A1 FR2271740 A1 FR 2271740A1
Authority
FR
France
Prior art keywords
semiconductor device
printed circuit
circuit board
board
layout
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7501950A
Other languages
French (fr)
Other versions
FR2271740B3 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Microsystems Holding Corp
Original Assignee
American Microsystems Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Microsystems Holding Corp filed Critical American Microsystems Holding Corp
Publication of FR2271740A1 publication Critical patent/FR2271740A1/en
Application granted granted Critical
Publication of FR2271740B3 publication Critical patent/FR2271740B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Circuit assembly comprises a printed circuit board with a transverse opening surrounded by spaced connecting points for the conductive paths of the circuit board, and a holder for a semiconductor device which has the same size and shape as the opening and which has a surrounding wall for insertion of the semiconductor device. The latter has flat upper and lower surfaces, terminals of a microelectronic circuit in its upper surface, and a thickness far smaller than the length or width of its upper surface. Means are provided for connecting the terminals of the semiconductor device to those of the printed circuit, and are covered together with the semiconductor device and the free upper parts of the holder by a sealing cpd., pref. epoxy material which is applied in liquid form and allowed to cure.
FR7501950A 1974-05-13 1975-01-22 Combined semiconductor device-printed circuit board - with semiconductor device requiring fewer connections and less space in layout of board Granted FR2271740A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46946074A 1974-05-13 1974-05-13

Publications (2)

Publication Number Publication Date
FR2271740A1 true FR2271740A1 (en) 1975-12-12
FR2271740B3 FR2271740B3 (en) 1977-10-21

Family

ID=23863885

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7501950A Granted FR2271740A1 (en) 1974-05-13 1975-01-22 Combined semiconductor device-printed circuit board - with semiconductor device requiring fewer connections and less space in layout of board

Country Status (3)

Country Link
JP (1) JPS50155970A (en)
DE (1) DE2513536A1 (en)
FR (1) FR2271740A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2308275A1 (en) * 1975-04-14 1976-11-12 Nat Semiconductor Corp ELECTRONIC DEVICE WITH COATING EPOXIDE WITH EXPANSION COEFFICIENT SENSITIVELY EQUAL TO THAT OF THE CONDUCTIVE WIRES
EP0111222A1 (en) * 1982-12-06 1984-06-20 Siemens Aktiengesellschaft Small hearing aid apparatus
EP0338641A1 (en) * 1988-04-22 1989-10-25 Philips Composants Method of mounting optical elements on a support and optical circuit obtained in this way

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59167037A (en) * 1983-03-14 1984-09-20 Oki Electric Ind Co Ltd Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2308275A1 (en) * 1975-04-14 1976-11-12 Nat Semiconductor Corp ELECTRONIC DEVICE WITH COATING EPOXIDE WITH EXPANSION COEFFICIENT SENSITIVELY EQUAL TO THAT OF THE CONDUCTIVE WIRES
EP0111222A1 (en) * 1982-12-06 1984-06-20 Siemens Aktiengesellschaft Small hearing aid apparatus
US4628527A (en) * 1982-12-06 1986-12-09 Siemens Aktiengesellschaft Mini hearing aid
EP0338641A1 (en) * 1988-04-22 1989-10-25 Philips Composants Method of mounting optical elements on a support and optical circuit obtained in this way
FR2630550A1 (en) * 1988-04-22 1989-10-27 Radiotechnique Compelec METHOD FOR MOUNTING OPTICAL ELEMENTS ON A SUPPORT AND OPTICAL CIRCUIT THUS OBTAINED

Also Published As

Publication number Publication date
FR2271740B3 (en) 1977-10-21
JPS50155970A (en) 1975-12-16
DE2513536A1 (en) 1975-11-27

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Legal Events

Date Code Title Description
ST Notification of lapse