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FR1250270A - Procédé de fabrication de dispositifs semi-conducteurs à jonctions uniformes - Google Patents

Procédé de fabrication de dispositifs semi-conducteurs à jonctions uniformes

Info

Publication number
FR1250270A
FR1250270A FR820520A FR820520A FR1250270A FR 1250270 A FR1250270 A FR 1250270A FR 820520 A FR820520 A FR 820520A FR 820520 A FR820520 A FR 820520A FR 1250270 A FR1250270 A FR 1250270A
Authority
FR
France
Prior art keywords
semiconductor devices
manufacturing semiconductor
junctions
uniform
uniform junctions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR820520A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Priority to FR820520A priority Critical patent/FR1250270A/fr
Application granted granted Critical
Publication of FR1250270A publication Critical patent/FR1250270A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/138—Roughened surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/914—Doping
    • Y10S438/923—Diffusion through a layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/974—Substrate surface preparation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • ing And Chemical Polishing (AREA)
FR820520A 1959-03-06 1960-03-05 Procédé de fabrication de dispositifs semi-conducteurs à jonctions uniformes Expired FR1250270A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR820520A FR1250270A (fr) 1959-03-06 1960-03-05 Procédé de fabrication de dispositifs semi-conducteurs à jonctions uniformes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US797651A US3009841A (en) 1959-03-06 1959-03-06 Preparation of semiconductor devices having uniform junctions
FR820520A FR1250270A (fr) 1959-03-06 1960-03-05 Procédé de fabrication de dispositifs semi-conducteurs à jonctions uniformes

Publications (1)

Publication Number Publication Date
FR1250270A true FR1250270A (fr) 1961-01-06

Family

ID=25171443

Family Applications (1)

Application Number Title Priority Date Filing Date
FR820520A Expired FR1250270A (fr) 1959-03-06 1960-03-05 Procédé de fabrication de dispositifs semi-conducteurs à jonctions uniformes

Country Status (5)

Country Link
US (1) US3009841A (fr)
BE (1) BE588323A (fr)
CH (1) CH389101A (fr)
FR (1) FR1250270A (fr)
GB (1) GB879406A (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL249774A (fr) * 1959-03-26
NL249303A (fr) * 1959-05-06
US3116184A (en) * 1960-12-16 1963-12-31 Bell Telephone Labor Inc Etching of germanium surfaces prior to evaporation of aluminum
US3151004A (en) * 1961-03-30 1964-09-29 Rca Corp Semiconductor devices
NL280579A (fr) * 1961-07-10
US3209428A (en) * 1961-07-20 1965-10-05 Westinghouse Electric Corp Process for treating semiconductor devices
US3232800A (en) * 1961-12-16 1966-02-01 Nippon Electric Co Method of making semiconductor devices by forming a damage layer on a surface of a semiconductor body and then alloying through said damage layer
US3271210A (en) * 1963-07-24 1966-09-06 Westinghouse Electric Corp Formation of p-nu junctions in silicon
DE1229986B (de) * 1964-07-21 1966-12-08 Siemens Ag Vorrichtung zur Gewinnung reinen Halbleiter-materials
BE671953A (fr) * 1964-11-05
US3544395A (en) * 1965-11-30 1970-12-01 Matsushita Electric Ind Co Ltd Silicon p-n junction device and method of making the same
US3468729A (en) * 1966-03-21 1969-09-23 Westinghouse Electric Corp Method of making a semiconductor by oxidizing and simultaneous diffusion of impurities having different rates of diffusivity
US3396456A (en) * 1966-05-12 1968-08-13 Int Rectifier Corp Process for diffusion of contoured junction
DE1919563A1 (de) * 1969-04-17 1970-10-29 Siemens Ag Verfahren zum Herstellen von mit Gallium diffundierten Zonen in Halbleiterkristallen
US3905844A (en) * 1971-06-15 1975-09-16 Matsushita Electric Ind Co Ltd Method of making a PN junction device by metal dot alloying and recrystallization
US3961353A (en) * 1974-10-21 1976-06-01 International Business Machines Corporation High power semiconductor device
JPS54110783A (en) * 1978-02-20 1979-08-30 Hitachi Ltd Semiconductor substrate and its manufacture
US4944836A (en) * 1985-10-28 1990-07-31 International Business Machines Corporation Chem-mech polishing method for producing coplanar metal/insulator films on a substrate
US4735679A (en) * 1987-03-30 1988-04-05 International Business Machines Corporation Method of improving silicon-on-insulator uniformity
US20060194441A1 (en) * 2005-02-25 2006-08-31 Sakae Koyata Method for etching a silicon wafer and method for performing differentiation between the obverse and the reverse of a silicon wafer using the same method
JP4831709B2 (ja) 2010-05-21 2011-12-07 シャープ株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2846346A (en) * 1954-03-26 1958-08-05 Philco Corp Semiconductor device
NL209275A (fr) * 1955-09-02
US2854365A (en) * 1956-03-16 1958-09-30 Tung Sol Electric Inc Potential graded semi-conductor and method of making the same

Also Published As

Publication number Publication date
GB879406A (en) 1961-10-11
US3009841A (en) 1961-11-21
CH389101A (de) 1965-03-15
BE588323A (fr) 1960-07-01

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