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FI971657A0 - Kapselointimateriaalin ruiskutus optokomponenttiin - Google Patents

Kapselointimateriaalin ruiskutus optokomponenttiin

Info

Publication number
FI971657A0
FI971657A0 FI971657A FI971657A FI971657A0 FI 971657 A0 FI971657 A0 FI 971657A0 FI 971657 A FI971657 A FI 971657A FI 971657 A FI971657 A FI 971657A FI 971657 A0 FI971657 A0 FI 971657A0
Authority
FI
Finland
Prior art keywords
optocomponent
injection
encapsulation material
encapsulation
Prior art date
Application number
FI971657A
Other languages
English (en)
Swedish (sv)
Other versions
FI971657A (fi
Inventor
Odd Steijer
Hans-Christer Moll
Paul Eriksen
Jan-Aoke Engstrand
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of FI971657A0 publication Critical patent/FI971657A0/fi
Publication of FI971657A publication Critical patent/FI971657A/fi

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0033—Moulds or cores; Details thereof or accessories therefor constructed for making articles provided with holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
FI971657A 1994-10-19 1997-04-18 Kapselointimateriaalin ruiskutus optokomponenttiin FI971657A (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9403573A SE514116C2 (sv) 1994-10-19 1994-10-19 Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
PCT/SE1995/001232 WO1996013068A1 (en) 1994-10-19 1995-10-19 Injection of encapsulating material on an optocomponent

Publications (2)

Publication Number Publication Date
FI971657A0 true FI971657A0 (fi) 1997-04-18
FI971657A FI971657A (fi) 1997-06-19

Family

ID=20395667

Family Applications (1)

Application Number Title Priority Date Filing Date
FI971657A FI971657A (fi) 1994-10-19 1997-04-18 Kapselointimateriaalin ruiskutus optokomponenttiin

Country Status (12)

Country Link
US (3) US5970323A (fi)
EP (1) EP0792526B1 (fi)
JP (1) JPH10507847A (fi)
KR (1) KR100309406B1 (fi)
CN (1) CN1107983C (fi)
AU (1) AU3819995A (fi)
CA (1) CA2203114C (fi)
DE (1) DE69522116T2 (fi)
ES (1) ES2160719T3 (fi)
FI (1) FI971657A (fi)
SE (1) SE514116C2 (fi)
WO (1) WO1996013068A1 (fi)

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* Cited by examiner, † Cited by third party
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SE514116C2 (sv) * 1994-10-19 2001-01-08 Ericsson Telefon Ab L M Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
SE516160C2 (sv) 1995-04-28 2001-11-26 Ericsson Telefon Ab L M Kapslad optoelektronisk komponent
SE510365C2 (sv) 1996-05-03 1999-05-17 Ericsson Telefon Ab L M Förfarande för framställning av ett opto-mekaniskt don samt sådant don
DE19625228C2 (de) * 1996-06-24 1998-05-14 Siemens Ag Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse
DE19642088A1 (de) * 1996-10-12 1998-04-16 Bosch Gmbh Robert Verfahren zur Herstellung eines mikrostrukturierten Körpers, eines Gußrahmens und eines integriert-optischen Bauteils
DE19920638C2 (de) * 1999-04-29 2001-09-13 Infineon Technologies Ag Modul zur parallelen optischen Datenübertragung
US6576496B1 (en) 2000-08-21 2003-06-10 Micron Technology, Inc. Method and apparatus for encapsulating a multi-chip substrate array
US7345316B2 (en) * 2000-10-25 2008-03-18 Shipley Company, L.L.C. Wafer level packaging for optoelectronic devices
JP4549521B2 (ja) * 2000-12-14 2010-09-22 フィーサ株式会社 インサート成形方法及び金型
EP1220309A1 (en) * 2000-12-28 2002-07-03 STMicroelectronics S.r.l. Manufacturing method of an electronic device package
JP4769380B2 (ja) * 2001-05-18 2011-09-07 ルネサスエレクトロニクス株式会社 クリーニング用シートおよびそれを用いた半導体装置の製造方法
US6860731B2 (en) * 2001-07-09 2005-03-01 Asm Technology Singapore Pte Ltd. Mold for encapsulating a semiconductor chip
JP2003066290A (ja) * 2001-08-29 2003-03-05 Sumitomo Electric Ind Ltd 光通信モジュール
JP2003069054A (ja) * 2001-08-29 2003-03-07 Sumitomo Electric Ind Ltd 光通信モジュール
US7275925B2 (en) * 2001-08-30 2007-10-02 Micron Technology, Inc. Apparatus for stereolithographic processing of components and assemblies
US20050009239A1 (en) * 2003-07-07 2005-01-13 Wolff Larry Lee Optoelectronic packaging with embedded window
ATE535939T1 (de) * 2004-06-25 2011-12-15 Conti Temic Microelectronic Elektrische baugruppe mit einer schutzhülle
JP4740765B2 (ja) * 2006-02-24 2011-08-03 エルピーダメモリ株式会社 半導体装置及びその製造方法
DE102007008464B4 (de) * 2007-02-19 2012-01-05 Hottinger Baldwin Messtechnik Gmbh Optischer Dehnungsmessstreifen
EP2288312B1 (en) 2007-12-07 2016-09-28 Zimmer Orthopaedic Surgical Products, Inc. Spacer molds and methods therefor
JPWO2009084414A1 (ja) * 2007-12-28 2011-05-19 コニカミノルタオプト株式会社 成形金型及び光学素子の成形方法
US7943434B2 (en) * 2008-03-21 2011-05-17 Occam Portfolio Llc Monolithic molded flexible electronic assemblies without solder and methods for their manufacture
US20090250836A1 (en) * 2008-04-04 2009-10-08 Toko, Inc. Production Method for Molded Coil
US8414286B2 (en) * 2008-10-29 2013-04-09 Zimmer Orthopaedic Surgical Products, Inc. Spacer molds with releasable securement
EP2192825A1 (en) * 2008-11-26 2010-06-02 Osram Gesellschaft mit Beschränkter Haftung An injection tool for encapsulating electronic circuits with light sources, and related encapsulation process
CN102230991B (zh) * 2009-10-23 2013-01-09 鸿富锦精密工业（深圳）有限公司 光纤耦合连接器
CN102935693A (zh) * 2012-11-08 2013-02-20 凡嘉科技（无锡）有限公司 插针连接器模具结构
US9269597B2 (en) * 2013-01-23 2016-02-23 Microchip Technology Incorporated Open cavity plastic package
CN104414287B (zh) * 2013-08-29 2015-12-02 郑永如 带弹簧的竹凉席及其制造方法
JP2019060978A (ja) * 2017-09-25 2019-04-18 株式会社エンプラス 光レセプタクルの製造方法およびそれに用いる金型
CN110716269B (zh) * 2019-09-20 2021-10-29 武汉电信器件有限公司 一种可采用液体浸没式制冷的光模块及其制作方法
KR102239264B1 (ko) * 2020-07-28 2021-04-14 주식회사 제일금형 고무 가류제품의 사출 금형장치 및 제품의 탈거 방법

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US4043027A (en) * 1963-12-16 1977-08-23 Texas Instruments Incorporated Process for encapsulating electronic components in plastic
CH628152A5 (fr) * 1977-11-24 1982-02-15 Comp Generale Electricite Fiche de connecteur fibre a fibre pour cable optique multifibre.
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US4861251A (en) * 1988-02-29 1989-08-29 Diehard Engineering, Inc. Apparatus for encapsulating selected portions of a printed circuit board
SE461456B (sv) * 1988-06-23 1990-02-19 Ericsson Telefon Ab L M Formverktyg
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JPH0325945A (ja) * 1989-06-23 1991-02-04 Nec Corp 樹脂封止型半導体集積回路の樹脂封止装置
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JPH03291606A (ja) * 1990-04-10 1991-12-20 Furukawa Electric Co Ltd:The 光コネクタ用フェルールの製造方法
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JPH04291205A (ja) * 1991-03-19 1992-10-15 Fujitsu Ltd 導波路型光デバイス
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US5233222A (en) * 1992-07-27 1993-08-03 Motorola, Inc. Semiconductor device having window-frame flag with tapered edge in opening
US5394524A (en) * 1992-08-07 1995-02-28 International Business Machines Corporation Method and apparatus for processing two graphics data streams in parallel
JPH06177283A (ja) * 1992-12-03 1994-06-24 Nec Corp 樹脂封止型半導体装置
US5367593A (en) * 1993-09-03 1994-11-22 Motorola, Inc. Optical/electrical connector and method of fabrication
US5558883A (en) * 1993-12-28 1996-09-24 Mitsui Toatsu Chemicals, Inc. Mold design and process for producing a multilayer part by injection process molding
US5489805A (en) * 1993-12-29 1996-02-06 Intel Corporation Slotted thermal dissipater for a semiconductor package
SE513183C2 (sv) 1994-03-18 2000-07-24 Ericsson Telefon Ab L M Förfarande för framställning av en optokomponent samt kapslad optokomponent
US5602951A (en) * 1994-04-14 1997-02-11 Sumitomo Electric Industries, Ltd. Ferrule for optical connector and process for making same
SE9403574L (sv) * 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Optokomponentkapsel med optiskt gränssnitt
SE514116C2 (sv) * 1994-10-19 2001-01-08 Ericsson Telefon Ab L M Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
SE9403575L (sv) * 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Benram för kapslad optokomponent

Also Published As

Publication number Publication date
JPH10507847A (ja) 1998-07-28
DE69522116T2 (de) 2001-11-22
US6193493B1 (en) 2001-02-27
CA2203114C (en) 2006-01-24
FI971657A (fi) 1997-06-19
US6326680B1 (en) 2001-12-04
EP0792526A1 (en) 1997-09-03
WO1996013068A1 (en) 1996-05-02
CA2203114A1 (en) 1996-05-02
EP0792526B1 (en) 2001-08-08
ES2160719T3 (es) 2001-11-16
CN1170476A (zh) 1998-01-14
CN1107983C (zh) 2003-05-07
SE514116C2 (sv) 2001-01-08
KR100309406B1 (ko) 2001-12-17
AU3819995A (en) 1996-05-15
SE9403573L (sv) 1996-04-20
US5970323A (en) 1999-10-19
DE69522116D1 (de) 2001-09-13
SE9403573D0 (sv) 1994-10-19

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Legal Events

Date Code Title Description
MA Patent expired