FI891740A0 - Foerfarande foer avskiktande av fotolack. - Google Patents
Foerfarande foer avskiktande av fotolack.Info
- Publication number
- FI891740A0 FI891740A0 FI891740A FI891740A FI891740A0 FI 891740 A0 FI891740 A0 FI 891740A0 FI 891740 A FI891740 A FI 891740A FI 891740 A FI891740 A FI 891740A FI 891740 A0 FI891740 A0 FI 891740A0
- Authority
- FI
- Finland
- Prior art keywords
- avskiktande
- fotolack
- foerfarande foer
- foerfarande
- foer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3812315 | 1988-04-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
FI891740A0 true FI891740A0 (fi) | 1989-04-12 |
FI891740A FI891740A (fi) | 1989-10-14 |
Family
ID=6351902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI891740A FI891740A (fi) | 1988-04-13 | 1989-04-12 | Foerfarande foer avskiktande av fotolack. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4966664A (fi) |
EP (1) | EP0337342A1 (fi) |
JP (1) | JPH0212154A (fi) |
FI (1) | FI891740A (fi) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2226991A (en) * | 1989-01-13 | 1990-07-18 | Ibm | Etching organic polymeric materials |
US5186797A (en) * | 1991-02-13 | 1993-02-16 | Future Automation, Inc. | Method and system for removing resin bleed from electronic components |
US5318677A (en) * | 1991-02-13 | 1994-06-07 | Future Automation, Inc. | Process and solutions for removing resin bleed from electronic components |
US6001672A (en) * | 1997-02-25 | 1999-12-14 | Micron Technology, Inc. | Method for transfer molding encapsulation of a semiconductor die with attached heat sink |
KR100271138B1 (ko) * | 1998-01-22 | 2001-03-02 | 윤덕용 | 잉크젯 프린트 헤드 및 그 제조 방법 |
US6203691B1 (en) | 1998-09-18 | 2001-03-20 | Hoffman Industries International, Ltd. | Electrolytic cleaning of conductive bodies |
US6734120B1 (en) * | 1999-02-19 | 2004-05-11 | Axcelis Technologies, Inc. | Method of photoresist ash residue removal |
US6436276B1 (en) * | 1999-10-07 | 2002-08-20 | Polyclad Laminates, Inc. | Cathodic photoresist stripping process |
US7220615B2 (en) * | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
DE10259364A1 (de) * | 2002-12-18 | 2004-07-08 | Siemens Ag | Verfahren zum Entfernen von zumindest einem Oberflächenbereich eines Beuteils |
DE10259363A1 (de) * | 2002-12-18 | 2004-07-08 | Siemens Ag | Verfahren zum Entfernen von zumindest einem Oberflächenbereich eines Bauteils |
US20050167284A1 (en) * | 2004-01-30 | 2005-08-04 | International Business Machines Corporation | Electrolytic method for photoresist stripping |
KR20090076938A (ko) * | 2006-09-25 | 2009-07-13 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 웨이퍼 재작업 적용을 위한 포토레지스트의 제거를 위한 조성물 및 방법 |
US9683305B2 (en) * | 2011-12-20 | 2017-06-20 | Apple Inc. | Metal surface and process for treating a metal surface |
CN104409328B (zh) * | 2014-11-21 | 2018-01-30 | 深圳市华星光电技术有限公司 | 掩膜板的清洗方法及清洗装置 |
JP7352301B2 (ja) * | 2021-12-24 | 2023-09-28 | ハニー化成株式会社 | 電着フォトレジスト塗膜の剥離方法 |
CN114273343A (zh) * | 2022-01-18 | 2022-04-05 | 中国石油大学(华东) | 一种原位电致气泡除污方法及应用 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3900337A (en) * | 1974-04-05 | 1975-08-19 | Ibm | Method for stripping layers of organic material |
JPS5141032A (ja) * | 1974-10-04 | 1976-04-06 | Jidosha Kiki Co | Tomakunodenkaihakuriho |
IT1125196B (it) * | 1975-08-01 | 1986-05-14 | Allied Chem | Disassorbitore fotoresistivo privo di fenolo |
DD220623B1 (de) * | 1983-12-05 | 1987-07-01 | Sangerhausen Maschf | Verfahren zum entfernen gehaerteter kopierschichten von metalloberflaechen |
JPH0721638B2 (ja) * | 1986-07-18 | 1995-03-08 | 東京応化工業株式会社 | 基板の処理方法 |
-
1989
- 1989-04-10 EP EP89106277A patent/EP0337342A1/de not_active Withdrawn
- 1989-04-10 JP JP1090522A patent/JPH0212154A/ja active Pending
- 1989-04-10 US US07/335,858 patent/US4966664A/en not_active Expired - Fee Related
- 1989-04-12 FI FI891740A patent/FI891740A/fi not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
FI891740A (fi) | 1989-10-14 |
JPH0212154A (ja) | 1990-01-17 |
US4966664A (en) | 1990-10-30 |
EP0337342A1 (de) | 1989-10-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM | Patent lapsed |
Owner name: SIEMENS AKTIENGESELLSCHAFT |