FI875607A0 - CORROSIONBESTAENDIGA STIFT FOER MICROCRETER MED EN METALLISK FOERPACKNING. - Google Patents

CORROSIONBESTAENDIGA STIFT FOER MICROCRETER MED EN METALLISK FOERPACKNING.

Info

Publication number: FI875607A0
Authority: FI; Finland
Prior art keywords: microcreter; metallisk; corrosionbestaendiga; foerpackning; stift
Prior art date: 1986-04-21

Application number

FI875607A

Other languages

Finnish (fi)

Other versions

FI875607A (en

Inventor

Jeremy D Scherer

Phillips Baird

Original Assignee

Aegis Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-04-21

Filing date

1987-12-18

Publication date

1987-12-18

1987-12-18 Application filed by Aegis Inc filed Critical Aegis Inc

1987-12-18 Publication of FI875607A publication Critical patent/FI875607A/en

1987-12-18 Publication of FI875607A0 publication Critical patent/FI875607A0/en

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Connections Arranged To Contact A Plurality Of Conductors (AREA)
Lead Frames For Integrated Circuits (AREA)

FI875607A 1986-04-21 1987-12-18 CORROSIONBESTAENDIGA STIFT FOER MICROCRETER MED EN METALLISK FOERPACKNING. FI875607A0 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US85412386A	1986-04-21	1986-04-21
PCT/US1987/000465 WO1987006765A1 (en)	1986-04-21	1987-03-10	Corrosion resistant pins for metal packaged microcircuits

Publications (2)

Publication Number	Publication Date
FI875607A FI875607A (en)	1987-12-18
FI875607A0 true FI875607A0 (en)	1987-12-18

Family

ID=25317791

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FI875607A FI875607A0 (en)	1986-04-21	1987-12-18	CORROSIONBESTAENDIGA STIFT FOER MICROCRETER MED EN METALLISK FOERPACKNING.

Country Status (6)

Country	Link
EP (1)	EP0266368A4 (en)
JP (1)	JPS63503182A (en)
KR (1)	KR880701463A (en)
AU (1)	AU7207087A (en)
FI (1)	FI875607A0 (en)
WO (1)	WO1987006765A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH04264758A (en) *	1991-02-20	1992-09-21	Nec Corp	Semiconductor chip carrier
US5243132A (en) *	1992-01-17	1993-09-07	Cooper Industries, Inc.	Drain hole core for explosion-proof drain seal fittings
FR2717981B1 (en) *	1994-03-24	1996-06-28	Egide Sa	Method of hermetic and electrically insulating fixing of an electrical conductor passing through a metal wall.
CN104439784A (en) *	2014-11-17	2015-03-25	中国电子科技集团公司第四十三研究所	Butt-joint low-resistance lead for electronic packaging and manufacturing method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2291660A (en) *	1939-07-25	1942-08-04	Raytheon Production Corp	Stem for electrical space discharge devices
US2292863A (en) *	1941-08-26	1942-08-11	Gen Electric	Lead-in arrangement
GB567521A (en) *	1942-05-11	1945-02-19	Gen Electric Co Ltd	Improvements in the sealing of electrical conductors through vitreous walls
GB629742A (en) *	1947-11-14	1949-09-27	Gen Electric Co Ltd	Improvements in or relating to method of manufacturing electrical conductors provided with glass beads
FR1280332A (en) *	1960-02-09	1961-12-29	Texas Instruments Inc	Improvements to the bases for connection terminals
DE1913985A1 (en) *	1969-03-19	1970-10-01	Siemens Ag	Fusion of wires into glass for semi-conductor - constructional elements
US3927841A (en) *	1974-05-09	1975-12-23	Flight Connector Corp	Contact
JPS5250586A (en) *	1975-10-21	1977-04-22	Nec Home Electronics Ltd	Making method for gas-tight terminal
JPS57211255A (en) *	1981-06-22	1982-12-25	Nec Home Electronics Ltd	Manufacture of airtight terminal
JPS59214244A (en) *	1983-05-20	1984-12-04	Nec Corp	Semiconductor device
JPS60194547A (en) *	1984-03-16	1985-10-03	Nec Corp	Semiconductor device
IL74296A0 (en) *	1984-03-20	1985-05-31	Isotronics Inc	Corrosion resistant microcircuit package

1987
- 1987-03-10 AU AU72070/87A patent/AU7207087A/en not_active Abandoned
- 1987-03-10 JP JP62502133A patent/JPS63503182A/en active Pending
- 1987-03-10 EP EP19870902218 patent/EP0266368A4/en not_active Withdrawn
- 1987-03-10 WO PCT/US1987/000465 patent/WO1987006765A1/en not_active Application Discontinuation
- 1987-12-18 FI FI875607A patent/FI875607A0/en not_active IP Right Cessation
- 1987-12-21 KR KR1019870701200A patent/KR880701463A/en not_active Application Discontinuation

Also Published As

Publication number	Publication date
JPS63503182A (en)	1988-11-17
EP0266368A4 (en)	1988-11-24
FI875607A (en)	1987-12-18
EP0266368A1 (en)	1988-05-11
KR880701463A (en)	1988-07-27
AU7207087A (en)	1987-11-24
WO1987006765A1 (en)	1987-11-05

Publication	Publication Date	Title
FI870097A (en)	1987-08-06	BLANDARE MED SLANGSTRILMUNSTYCKE.
FI870474A0 (en)	1987-02-04	MED SVAVELHALTIGA GRUPPER SUBSTITUERADE 5-AMINO-4-HYDROXIVALERYLDERIVAT.
FI863881A (en)	1987-09-23	GLIDLAGERELEMENT MED OHOMOGENT GLIDSKIKT.
FI870031A0 (en)	1987-01-05	KVICKSILVERAONGURLADDNINGSLAMPA MED LAOGT TRYCK.
FI870081A0 (en)	1987-01-09	KNIV MED IHAOLIGT SKAFT.
FI862296A0 (en)	1986-05-30	TVAOKOMPONENTBURK MED PERFORERINGSORGAN.
FI865301A0 (en)	1986-12-23	MED EN FRESNEL-LINS FOERSEDD KAOPA FOER BELYSNINGSANORDNING.
FI870598A (en)	1987-08-20	STYRFOERSTAERKARE FOER EN VISNING UTRUSTAD MED MAETTNINGEN FOERHINDRANDE KRETS.
FI875607A (en)	1987-12-18	CORROSIONBESTAENDIGA STIFT FOER MICROCRETER MED EN METALLISK FOERPACKNING.
FI862763A (en)	1987-12-31	PLASMAPROCESSENHET MED CELLSTRUKTUR.
FI860263A0 (en)	1986-01-21	MED UNDERTRYCK FUNGERANDE FAESTUNDERLAG.
FI870824A (en)	1987-08-28	AVLAGRINGSSYSTEM MED TRANSPORTOER.
FI870902A0 (en)	1987-03-02	FREONSKILJARE MED KOPPLINGSLOCK.
FI865350A (en)	1988-07-01	MED STROEMFOERDELARE FOERSEDD STROEMMAOTTOMVANDLARE.
FI864226A0 (en)	1986-10-17	PROPELLERBANDARE MED LEDAD STOMME.
FI862144A0 (en)	1986-05-21	GEVAERSYSTEM MED MAONGA ANVAENDNINGSMOEJLIGHETER.
FI864167A0 (en)	1986-10-15	STAPLINGS- OCH AVSTAPLINGSANORDNING FOER LASTENHETSUNDERLAG FOERSEDDA MED STYRHJUL.
FI864059A0 (en)	1986-10-08	MED SKIVFRAES FOERSEDD STYCKETORVMASKIN.
FI860729A0 (en)	1986-02-19	GOLVBRUNN FOERSEDD MED STANKLOS.
FI863942A (en)	1988-03-31	SKRAEPFAONGARE FOER EN MED MATRISPLATTA FOERSEDD STYCKETORVS- / GRANULERINGSMASKIN.
FI863442A0 (en)	1986-08-26	MED C-BILDPRINCIP FUNGERANDE ULTRALJUDKAMERA MED REALTID.
FI864258A (en)	1988-04-22	ANORDNING FOER VAEXELSTROEMSBAOGSVETSNING MED SMAELTBAR ELEKTROD.
FI871263A (en)	1987-10-02	MED EN LEDNINGSDRAGANORDNING FOERSEDD FRILEDNINGSISOLERING FOER ELDISTRIBUTION.
FI862753A0 (en)	1986-06-27	EN MED LITEN EFFEKT FUNGERANDE FLYGAPPARAT.
FI862295A0 (en)	1986-05-30	CELLFACKSKIVA MED KORSKNUFAR.

Legal Events

Date	Code	Title	Description
2004-08-31	MM	Patent lapsed	Owner name: AEGIS, INC.