FI47441C - Menetelmä painettujen kytkentöjen sovittamiseksi kerrospuristeaineisii n. - Google Patents

Menetelmä painettujen kytkentöjen sovittamiseksi kerrospuristeaineisii n.

Info

Publication number: FI47441C
Authority: FI; Finland
Prior art keywords: bed press; press materials; fitting printed; printed connections; connections
Prior art date: 1966-06-08

Application number

FI120867A

Other languages

English (en)

Swedish (sv)

Other versions

FI47441B (fi

Inventor

Schneider

Franz

Orfgen

Krieger

Original Assignee

Dynamit Nobel Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1966-06-08

Filing date

1967-04-25

Publication date

1973-11-12

1967-04-25 Application filed by Dynamit Nobel Ag filed Critical Dynamit Nobel Ag

1973-07-31 Publication of FI47441B publication Critical patent/FI47441B/fi

1973-11-12 Application granted granted Critical

1973-11-12 Publication of FI47441C publication Critical patent/FI47441C/fi

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
Braking Arrangements (AREA)
Laminated Bodies (AREA)

FI120867A 1966-06-08 1967-04-25 Menetelmä painettujen kytkentöjen sovittamiseksi kerrospuristeaineisii n. FI47441C (fi)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DED0050272		1966-06-08

Publications (2)

Publication Number	Publication Date
FI47441B FI47441B (fi)	1973-07-31
FI47441C true FI47441C (fi)	1973-11-12

Family

ID=7052519

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FI120867A FI47441C (fi)	1966-06-08	1967-04-25	Menetelmä painettujen kytkentöjen sovittamiseksi kerrospuristeaineisii n.

Country Status (10)

Country	Link
AT (1)	AT266964B (fi)
BE (1)	BE699592A (fi)
CH (1)	CH488375A (fi)
DE (1)	DE1590305A1 (fi)
DK (1)	DK114845B (fi)
FI (1)	FI47441C (fi)
LU (1)	LU53469A1 (fi)
NL (1)	NL6706411A (fi)
NO (1)	NO118858B (fi)
SE (1)	SE311943B (fi)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2239829C2 (de) *	1972-08-12	1982-06-03	Aeg Isolier- Und Kunststoff Gmbh, 3500 Kassel	Verfahren zur Herstellung eines Basismaterials für gedruckte Schaltungen
DE3012889C2 (de) *	1979-04-30	1984-01-12	Kollmorgen Technologies Corp., 75201 Dallas, Tex.	Basismaterial für die Herstellung gedruckter Schaltungen

1966
- 1966-06-08 DE DE19661590305 patent/DE1590305A1/de active Pending
1967
- 1967-04-20 LU LU53469D patent/LU53469A1/xx unknown
- 1967-04-25 FI FI120867A patent/FI47441C/fi active
- 1967-05-08 NL NL6706411A patent/NL6706411A/xx unknown
- 1967-05-30 NO NO16837667A patent/NO118858B/no unknown
- 1967-06-05 AT AT521767A patent/AT266964B/de active
- 1967-06-05 CH CH790467A patent/CH488375A/de not_active IP Right Cessation
- 1967-06-07 SE SE800067A patent/SE311943B/xx unknown
- 1967-06-07 DK DK298167A patent/DK114845B/da unknown
- 1967-06-07 BE BE699592D patent/BE699592A/xx unknown

Also Published As

Publication number	Publication date
NO118858B (fi)	1970-02-23
FI47441B (fi)	1973-07-31
CH488375A (de)	1970-03-31
AT266964B (de)	1968-12-10
NL6706411A (fi)	1967-12-11
SE311943B (fi)	1969-06-30
BE699592A (fi)	1967-11-16
LU53469A1 (fi)	1967-06-20
DK114845B (da)	1969-08-11
DE1590305A1 (de)	1970-06-04

Publication	Publication Date	Title
CH477978A (de)	1969-09-15	Druckerpresse
DK124934B (da)	1972-12-11	Trykpresse.
DK124064B (da)	1972-09-11	Flerfarvepresse.
NL139111B (nl)	1973-06-15	Voederkorrelpers.
AT293860B (de)	1971-10-25	Einzugspresse
DK120014B (da)	1971-03-22	Presse til landbrugsfoderstoffer.
CH517001A (de)	1971-12-31	Druckmaschine
AT296352B (de)	1972-02-10	Druckmaschine
CH528978A (de)	1972-10-15	Druckerpresse
FI53602C (fi)	1978-06-12	Press
CH460621A (de)	1968-07-31	Pressbackensystem
FI47441C (fi)	1973-11-12	Menetelmä painettujen kytkentöjen sovittamiseksi kerrospuristeaineisii n.
FR1441602A (fr)	1966-06-10	Filtre-presse drnamique
DK119864B (da)	1971-03-01	Jernberiget kompletteringsfoder for pattegrise.
SU468803A1 (ru)	1975-04-30	Станина горизонтального гидравлического пресса
CH437211A (de)	1967-06-15	Filterpresse
AT253942B (de)	1967-04-25	Dickstoffpresse
CH489364A (de)	1970-04-30	Pressenstrasse
FR1511844A (fr)	1968-02-02	Filtre-presse
FR1481140A (fr)	1967-05-19	Filtre-presse
AT268018B (de)	1969-01-27	Preßmatrize
DE1504967B2 (de)	1971-10-21	Schallplattenpresse
CH441383A (de)	1967-08-15	Druckerpresse
FR1434328A (fr)	1966-04-08	Filtre-presse
FR1447084A (fr)	1966-07-22	Perfectionnements aux presses