CH488375A - Verfahren zum Aufbringen gedruckter Schaltungen auf Schichtpressstoffe - Google Patents

Verfahren zum Aufbringen gedruckter Schaltungen auf Schichtpressstoffe

Info

Publication number: CH488375A
Authority: CH; Switzerland
Prior art keywords: laminates; printed circuits; applying printed; applying; circuits
Prior art date: 1966-06-08

Application number

CH790467A

Other languages

German (de)

English (en)

Inventor

Schneider Ernst

Franz Arnold

Orfgen Kurt

Dieter Klaus

Original Assignee

Dynamit Nobel Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1966-06-08

Filing date

1967-06-05

Publication date

1970-03-31

1967-06-05 Application filed by Dynamit Nobel Ag filed Critical Dynamit Nobel Ag

1970-03-31 Publication of CH488375A publication Critical patent/CH488375A/de

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
Braking Arrangements (AREA)
Laminated Bodies (AREA)

CH790467A 1966-06-08 1967-06-05 Verfahren zum Aufbringen gedruckter Schaltungen auf Schichtpressstoffe CH488375A (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DED0050272		1966-06-08

Publications (1)

Publication Number	Publication Date
CH488375A true CH488375A (de)	1970-03-31

Family

ID=7052519

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CH790467A CH488375A (de)	1966-06-08	1967-06-05	Verfahren zum Aufbringen gedruckter Schaltungen auf Schichtpressstoffe

Country Status (10)

Country	Link
AT (1)	AT266964B (fi)
BE (1)	BE699592A (fi)
CH (1)	CH488375A (fi)
DE (1)	DE1590305A1 (fi)
DK (1)	DK114845B (fi)
FI (1)	FI47441C (fi)
LU (1)	LU53469A1 (fi)
NL (1)	NL6706411A (fi)
NO (1)	NO118858B (fi)
SE (1)	SE311943B (fi)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2239829C2 (de) *	1972-08-12	1982-06-03	Aeg Isolier- Und Kunststoff Gmbh, 3500 Kassel	Verfahren zur Herstellung eines Basismaterials für gedruckte Schaltungen
DE3012889C2 (de) *	1979-04-30	1984-01-12	Kollmorgen Technologies Corp., 75201 Dallas, Tex.	Basismaterial für die Herstellung gedruckter Schaltungen

1966
- 1966-06-08 DE DE19661590305 patent/DE1590305A1/de active Pending
1967
- 1967-04-20 LU LU53469D patent/LU53469A1/xx unknown
- 1967-04-25 FI FI120867A patent/FI47441C/fi active
- 1967-05-08 NL NL6706411A patent/NL6706411A/xx unknown
- 1967-05-30 NO NO16837667A patent/NO118858B/no unknown
- 1967-06-05 AT AT521767A patent/AT266964B/de active
- 1967-06-05 CH CH790467A patent/CH488375A/de not_active IP Right Cessation
- 1967-06-07 SE SE800067A patent/SE311943B/xx unknown
- 1967-06-07 DK DK298167A patent/DK114845B/da unknown
- 1967-06-07 BE BE699592D patent/BE699592A/xx unknown

Also Published As

Publication number	Publication date
NO118858B (fi)	1970-02-23
FI47441B (fi)	1973-07-31
FI47441C (fi)	1973-11-12
AT266964B (de)	1968-12-10
NL6706411A (fi)	1967-12-11
SE311943B (fi)	1969-06-30
BE699592A (fi)	1967-11-16
LU53469A1 (fi)	1967-06-20
DK114845B (da)	1969-08-11
DE1590305A1 (de)	1970-06-04

Publication	Publication Date	Title
CH440406A (de)	1967-07-31	Verfahren zum Anschliessen eines Halbleiterelementes an eine gedruckte Schaltung
AT277179B (de)	1969-12-10	Verfahren zum Verflüssigen von Gas
CH431253A (de)	1967-02-28	Vorrichtung zum Aufbringen von Klebemitteln auf blattförmige Gegenstände
CH480168A (de)	1969-10-31	Verfahren zum Verformen von Faserplatten
CH461787A (de)	1968-08-31	Verfahren und Vorrichtung zum Aufbringen von bedruckten Folien auf Kunststoffgegenstände
AT253431B (de)	1967-04-10	Vorrichtung zum Aufbringen von Etiketten auf Gegenstände
CH424890A (de)	1966-11-30	Verfahren zum Herstellen gedruckter Schaltungen
AT240947B (de)	1965-06-25	Verfahren zum Herstellen von Leitungsmustern für applizierte Schaltungen
CH433002A (de)	1967-03-31	Verfahren zum Aufbringen von Wachs-Polymerisat-Filmen auf Schichtträger
AT277933B (de)	1970-01-12	Verfahren zum Gelieren von Alkalisilikaten
IE32240B1 (en)	1973-05-30	Method to produce printed circuits
CH480438A (de)	1969-10-31	Verfahren zum Zulegieren reaktionsfreudiger Legierungsbestandteile
CH459317A (de)	1968-07-15	Verfahren zum Herstellen von Polyolefinplatten für gedruckte Schaltungen
CH424891A (de)	1966-11-30	Verfahren zum Herstellen gedruckter Schaltungen
AT308639B (de)	1973-07-10	Vorrichtung zum Herstellen von Brett-Lagen
CH484198A (de)	1970-01-15	Verfahren zum Reduzieren von substituierten Silanen
AT266964B (de)	1968-12-10	Verfahren zum Aufbringen gedruckter Schaltungen auf Schichtpreßstoffe
CH532369A (de)	1973-01-15	Verfahren zum Süssen von Substraten
CH413021A (de)	1966-05-15	Verfahren zum Herstellen gedruckter Schaltungen nach der Aufbaumethode
AT252414B (de)	1967-02-27	Verfahren zum Aufbringen von Schutzchichten auf Oberflächen
CH500513A (de)	1970-12-15	Verfahren zum Herstellen von Druckformen
DE1911335B2 (de)	1971-08-12	Verfahren zum herstellen von volumeneffekt halbleiter bauelementen
CH451822A (de)	1968-05-15	Verfahren zum Entfernen von Flüssigkeit aus auf flexiblen, nicht-textilen Unterlagen aufgetragenen Schichten
CH489590A (de)	1970-04-30	Verfahren zum Verkleben von Polyesterfilmen
CH502748A (de)	1971-01-31	Verfahren zum Herstellen einer gedruckten Leiterplatte

Legal Events

Date	Code	Title	Description
1977-01-14	PL	Patent ceased