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FI20106359A7 - Method for manufacturing an ultrasonic sensor and a sensor structure - Google Patents

Method for manufacturing an ultrasonic sensor and a sensor structure Download PDF

Info

Publication number
FI20106359A7
FI20106359A7 FI20106359A FI20106359A FI20106359A7 FI 20106359 A7 FI20106359 A7 FI 20106359A7 FI 20106359 A FI20106359 A FI 20106359A FI 20106359 A FI20106359 A FI 20106359A FI 20106359 A7 FI20106359 A7 FI 20106359A7
Authority
FI
Finland
Prior art keywords
wafer
sensor
manufacturing
ultrasonic
polysilicon layer
Prior art date
Application number
FI20106359A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20106359A0 (en
FI20106359L (en
Inventor
Jaakko Saarilahti
Original Assignee
Teknologian Tutkimuskeskus Vtt Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teknologian Tutkimuskeskus Vtt Oy filed Critical Teknologian Tutkimuskeskus Vtt Oy
Priority to FI20106359A priority Critical patent/FI20106359L/en
Publication of FI20106359A0 publication Critical patent/FI20106359A0/en
Priority to PCT/FI2011/051083 priority patent/WO2012085335A1/en
Publication of FI20106359A7 publication Critical patent/FI20106359A7/en
Publication of FI20106359L publication Critical patent/FI20106359L/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H15/00—Measuring mechanical or acoustic impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G01H9/008—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means by using ultrasonic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L11/00—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00
    • G01L11/04—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00 by acoustic means
    • G01L11/06—Ultrasonic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)

Abstract

Keksintö koskee menetelmää ultraäänianturin (1) valmistamiseksi, joka menetelmä käsittää vaiheet, joissa muodostetaan ainakin yhden ultraäänimuuntimen (200) ja ultraääniontelon (4) sisältävä ensimmäinen kiekko (111, laitekiekko) tavanomaisella piitekniikalla. Keksinnön mukaisesti se sisältää seuraavat vaiheet: liitetään ensimmäiseen kiekkoon (111) toinen kiekko (112), joka sisältää substraatin (108) ja polypiikerroksen (201), liitetään toinen kiekko (112) ensimmäiseen kiekkoon (111) niin, että polypiikerros (201) muodostaa liitonpinnan, ja toisen kiekon (112) substraatti (109) etsataan pois ontelon (4) alueelta, jotta saadaan muodostetuksi anturikalvo (201) polypiikerroksesta (111).The invention relates to a method for manufacturing an ultrasonic sensor (1), which method comprises the steps of forming a first wafer (111, device wafer) containing at least one ultrasonic transducer (200) and an ultrasonic cavity (4) using conventional silicon technology. According to the invention, it comprises the following steps: connecting a second wafer (112) containing a substrate (108) and a polysilicon layer (201) to the first wafer (111), connecting the second wafer (112) to the first wafer (111) so that the polysilicon layer (201) forms a bonding surface, and etching the substrate (109) of the second wafer (112) away from the cavity (4) area to form a sensor film (201) from the polysilicon layer (111).

FI20106359A 2010-12-21 2010-12-21 Method for manufacturing an ultrasonic sensor and sensor structure FI20106359L (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20106359A FI20106359L (en) 2010-12-21 2010-12-21 Method for manufacturing an ultrasonic sensor and sensor structure
PCT/FI2011/051083 WO2012085335A1 (en) 2010-12-21 2011-12-07 Method for manufacturing an ultrasonic sensor and a sensor structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20106359A FI20106359L (en) 2010-12-21 2010-12-21 Method for manufacturing an ultrasonic sensor and sensor structure

Publications (3)

Publication Number Publication Date
FI20106359A0 FI20106359A0 (en) 2010-12-21
FI20106359A7 true FI20106359A7 (en) 2012-06-22
FI20106359L FI20106359L (en) 2012-06-22

Family

ID=43415049

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20106359A FI20106359L (en) 2010-12-21 2010-12-21 Method for manufacturing an ultrasonic sensor and sensor structure

Country Status (2)

Country Link
FI (1) FI20106359L (en)
WO (1) WO2012085335A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6338499B2 (en) * 2014-09-24 2018-06-06 三菱電機株式会社 Foreign matter adhesion detection device and foreign matter adhesion detection method
FI128447B (en) 2016-04-26 2020-05-15 Teknologian Tutkimuskeskus Vtt Oy Apparatus associated with analysis of thin film layer and manufacturing method thereof
GB2561613B (en) * 2017-04-21 2019-05-08 The Technology Partnership Plc Acoustic Sensor
WO2020072920A1 (en) 2018-10-05 2020-04-09 Knowles Electronics, Llc Microphone device with ingress protection
WO2020072904A1 (en) 2018-10-05 2020-04-09 Knowles Electronics, Llc Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance
CN112789239A (en) 2018-10-05 2021-05-11 美商楼氏电子有限公司 Method for forming MEMS diaphragm comprising folds
CN112763052B (en) * 2020-12-16 2022-04-08 华中科技大学 Broadband acoustic wave sensor for anti-electronic monitoring
US12240748B2 (en) 2021-03-21 2025-03-04 Knowles Electronics, Llc MEMS die and MEMS-based sensor
US11528546B2 (en) 2021-04-05 2022-12-13 Knowles Electronics, Llc Sealed vacuum MEMS die
US11540048B2 (en) 2021-04-16 2022-12-27 Knowles Electronics, Llc Reduced noise MEMS device with force feedback
FI131134B1 (en) 2021-04-20 2024-10-23 Teknologian Tutkimuskeskus Vtt Oy Ultrasonic sensor device and method for transmitting ultrasound
US11649161B2 (en) 2021-07-26 2023-05-16 Knowles Electronics, Llc Diaphragm assembly with non-uniform pillar distribution
US11772961B2 (en) 2021-08-26 2023-10-03 Knowles Electronics, Llc MEMS device with perimeter barometric relief pierce
US11780726B2 (en) 2021-11-03 2023-10-10 Knowles Electronics, Llc Dual-diaphragm assembly having center constraint
CN114630236B (en) * 2022-02-28 2024-09-10 歌尔微电子股份有限公司 Vibration sensor and electronic device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489593B2 (en) * 2004-11-30 2009-02-10 Vermon Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor
US7037746B1 (en) * 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
FI20075879A0 (en) * 2007-12-05 2007-12-05 Valtion Teknillinen Device for measuring pressure, sound pressure variation, magnetic field, acceleration, vibration and gas composition

Also Published As

Publication number Publication date
WO2012085335A1 (en) 2012-06-28
FI20106359A0 (en) 2010-12-21
FI20106359L (en) 2012-06-22

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Legal Events

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Owner name: TEKNOLOGIAN TUTKIMUSKESKUS VTT

Free format text: TEKNOLOGIAN TUTKIMUSKESKUS VTT

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