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FI20041680L - Elektroniikkamoduuli ja menetelmä sen valmistamiseksi - Google Patents

Elektroniikkamoduuli ja menetelmä sen valmistamiseksi Download PDF

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Publication number
FI20041680L
FI20041680L FI20041680A FI20041680A FI20041680L FI 20041680 L FI20041680 L FI 20041680L FI 20041680 A FI20041680 A FI 20041680A FI 20041680 A FI20041680 A FI 20041680A FI 20041680 L FI20041680 L FI 20041680L
Authority
FI
Finland
Prior art keywords
manufacturing
same
electronic module
module
electronic
Prior art date
Application number
FI20041680A
Other languages
English (en)
Swedish (sv)
Other versions
FI20041680A0 (fi
Inventor
Risto Tuominen
Antti Iihola
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FI20040592A external-priority patent/FI20040592L/fi
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20041680A priority Critical patent/FI20041680L/fi
Publication of FI20041680A0 publication Critical patent/FI20041680A0/fi
Priority to US11/587,586 priority patent/US7719851B2/en
Priority to DE112005000952T priority patent/DE112005000952T5/de
Priority to JP2007510062A priority patent/JP5064210B2/ja
Priority to CN2005800133303A priority patent/CN101027948B/zh
Priority to PCT/FI2005/000200 priority patent/WO2005104636A1/en
Priority to GB0621918A priority patent/GB2429848B/en
Publication of FI20041680L publication Critical patent/FI20041680L/fi
Priority to US12/773,628 priority patent/US8351214B2/en

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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H01L24/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
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    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FI20041680A 2004-04-27 2004-12-29 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi FI20041680L (fi)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI20041680A FI20041680L (fi) 2004-04-27 2004-12-29 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi
US11/587,586 US7719851B2 (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
DE112005000952T DE112005000952T5 (de) 2004-04-27 2005-04-27 Elektronik-Modul und Verfahren zur Herstellung desselben
JP2007510062A JP5064210B2 (ja) 2004-04-27 2005-04-27 電子モジュール及びその製造方法
CN2005800133303A CN101027948B (zh) 2004-04-27 2005-04-27 电子模块及其制造方法
PCT/FI2005/000200 WO2005104636A1 (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
GB0621918A GB2429848B (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
US12/773,628 US8351214B2 (en) 2004-04-27 2010-05-04 Electronics module comprising an embedded microcircuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20040592A FI20040592L (fi) 2004-04-27 2004-04-27 Lämmön johtaminen upotetusta komponentista
FI20041680A FI20041680L (fi) 2004-04-27 2004-12-29 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi

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JP (1) JP5064210B2 (fi)
CN (1) CN101027948B (fi)
DE (1) DE112005000952T5 (fi)
FI (1) FI20041680L (fi)
GB (1) GB2429848B (fi)
WO (1) WO2005104636A1 (fi)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20031341L (fi) 2003-09-18 2005-03-19 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
FI119714B (fi) 2005-06-16 2009-02-13 Imbera Electronics Oy Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi
CN100553408C (zh) * 2006-03-15 2009-10-21 日月光半导体制造股份有限公司 具有嵌入式元件的基板及其制造方法
CN100542379C (zh) * 2006-03-15 2009-09-16 日月光半导体制造股份有限公司 具有嵌入式元件的基板及其制造方法
KR100856209B1 (ko) * 2007-05-04 2008-09-03 삼성전자주식회사 집적회로가 내장된 인쇄회로기판 및 그 제조방법
CN101690434B (zh) * 2007-06-26 2011-08-17 株式会社村田制作所 元器件内置基板的制造方法
KR101143837B1 (ko) * 2007-10-15 2012-07-12 삼성테크윈 주식회사 전자 소자를 내장하는 회로기판 및 회로기판의 제조 방법
US8264085B2 (en) 2008-05-05 2012-09-11 Infineon Technologies Ag Semiconductor device package interconnections
WO2010048653A2 (de) 2008-10-30 2010-05-06 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Verfahren zur integration eines elektronischen bauteils in eine leiterplatte
US8124449B2 (en) 2008-12-02 2012-02-28 Infineon Technologies Ag Device including a semiconductor chip and metal foils
FI20095110A0 (fi) * 2009-02-06 2009-02-06 Imbera Electronics Oy Elektroniikkamoduuli, jossa on EMI-suoja
US8525041B2 (en) * 2009-02-20 2013-09-03 Ibiden Co., Ltd. Multilayer wiring board and method for manufacturing the same
WO2010096213A2 (en) * 2009-02-20 2010-08-26 National Semiconductor Corporation Integrated circuit micro-module
EP2239767A1 (en) 2009-04-08 2010-10-13 Nxp B.V. Package for a semiconductor die and method of making the same
FI20095557A0 (fi) 2009-05-19 2009-05-19 Imbera Electronics Oy Valmistusmenetelmä ja elektroniikkamoduuli, joka tarjoaa uusia mahdollisuuksia johdevedoille
US8390083B2 (en) 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
US20110085310A1 (en) * 2009-10-09 2011-04-14 Cachia Joseph M Space saving circuit board
US8735735B2 (en) 2010-07-23 2014-05-27 Ge Embedded Electronics Oy Electronic module with embedded jumper conductor
WO2012051340A1 (en) 2010-10-12 2012-04-19 Analog Devices, Inc. Microphone package with embedded asic
US9320130B2 (en) * 2010-10-25 2016-04-19 Korea Electric Terminal Co., Ltd. Printed circuit board, and board block for vehicles using the same
AT13055U1 (de) * 2011-01-26 2013-05-15 Austria Tech & System Tech Verfahren zur integration eines elektronischen bauteils in eine leiterplatte oder ein leiterplatten-zwischenprodukt sowie leiterplatte oder leiterplatten-zwischenprodukt
TWI446464B (zh) * 2011-05-20 2014-07-21 Subtron Technology Co Ltd 封裝結構及其製作方法
KR101269903B1 (ko) * 2011-06-27 2013-05-31 주식회사 심텍 다이스택 패키지 및 제조 방법
CN104025728A (zh) * 2011-10-31 2014-09-03 名幸电子有限公司 元器件内置基板的制造方法及使用该方法制造的元器件内置基板
US9155198B2 (en) 2012-05-17 2015-10-06 Eagantu Ltd. Electronic module allowing fine tuning after assembly
AT513047B1 (de) * 2012-07-02 2014-01-15 Austria Tech & System Tech Verfahren zum Einbetten zumindest eines Bauteils in eine Leiterplatte
JP5998792B2 (ja) 2012-09-21 2016-09-28 Tdk株式会社 半導体ｉｃ内蔵基板及びその製造方法
WO2014049721A1 (ja) * 2012-09-26 2014-04-03 株式会社メイコー 部品内蔵基板の製造方法及びこの方法を用いて製造した部品内蔵基板
JP2014192354A (ja) * 2013-03-27 2014-10-06 Nippon Mektron Ltd 部品実装プリント配線板の製造方法、および部品実装プリント配線板
EP2999319B1 (en) * 2013-05-14 2020-07-08 Meiko Electronics Co., Ltd. Method for manufacturing a component-embedded substrate, and a component-embedded substrate
CN104576883B (zh) 2013-10-29 2018-11-16 普因特工程有限公司 芯片安装用阵列基板及其制造方法
EP3075006A1 (de) 2013-11-27 2016-10-05 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenstruktur
AT515101B1 (de) 2013-12-12 2015-06-15 Austria Tech & System Tech Verfahren zum Einbetten einer Komponente in eine Leiterplatte
AT515447B1 (de) 2014-02-27 2019-10-15 At & S Austria Tech & Systemtechnik Ag Verfahren zum Kontaktieren eines in eine Leiterplatte eingebetteten Bauelements sowie Leiterplatte
US11523520B2 (en) 2014-02-27 2022-12-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board
GB2524791B (en) * 2014-04-02 2018-10-03 At & S Austria Tech & Systemtechnik Ag Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate
TW201545614A (zh) * 2014-05-02 2015-12-01 R&D Circuits Inc 製備殼體以接收用於嵌入式元件印刷電路板之元件的結構和方法
US9999136B2 (en) * 2014-12-15 2018-06-12 Ge Embedded Electronics Oy Method for fabrication of an electronic module and electronic module
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
TWI612861B (zh) * 2016-09-02 2018-01-21 先豐通訊股份有限公司 晶片埋入式電路板結構及其製造方法
CN107872925A (zh) * 2016-09-27 2018-04-03 奥特斯奥地利科技与系统技术有限公司 将部件嵌入导电箔上的芯中
CN109587974A (zh) * 2017-09-28 2019-04-05 宏启胜精密电子(秦皇岛)有限公司 柔性电路板及该柔性电路板的制造方法
CN112312656B (zh) * 2019-07-30 2022-09-20 宏启胜精密电子(秦皇岛)有限公司 内埋电路板及其制作方法
EP3852132A1 (en) * 2020-01-20 2021-07-21 Infineon Technologies Austria AG Additive manufacturing of a frontside or backside interconnect of a semiconductor die
CN113286451B (zh) * 2021-05-24 2022-07-19 四川海英电子科技有限公司 一种hdi多层电路板叠层导盲孔制作方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0744320B2 (ja) 1989-10-20 1995-05-15 松下電器産業株式会社 樹脂回路基板及びその製造方法
US5353498A (en) 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US5426263A (en) * 1993-12-23 1995-06-20 Motorola, Inc. Electronic assembly having a double-sided leadless component
US5487033A (en) * 1994-06-28 1996-01-23 Intel Corporation Structure and method for low current programming of flash EEPROMS
JP4606685B2 (ja) * 1997-11-25 2011-01-05 パナソニック株式会社 回路部品内蔵モジュール
US6038133A (en) * 1997-11-25 2000-03-14 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method for producing the same
SE515856C2 (sv) * 1999-05-19 2001-10-22 Ericsson Telefon Ab L M Bärare för elektronikkomponenter
JP2001077483A (ja) * 1999-07-06 2001-03-23 Ngk Spark Plug Co Ltd 配線基板およびその製造方法
EP1137332B1 (en) 1999-09-02 2006-11-22 Ibiden Co., Ltd. Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board
US6284564B1 (en) 1999-09-20 2001-09-04 Lockheed Martin Corp. HDI chip attachment method for reduced processing
US6538210B2 (en) * 1999-12-20 2003-03-25 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module, radio device having the same, and method for producing the same
JP2001332866A (ja) 2000-05-24 2001-11-30 Matsushita Electric Ind Co Ltd 回路基板及びその製造方法
US6841740B2 (en) * 2000-06-14 2005-01-11 Ngk Spark Plug Co., Ltd. Printed-wiring substrate and method for fabricating the same
US6876072B1 (en) 2000-10-13 2005-04-05 Bridge Semiconductor Corporation Semiconductor chip assembly with chip in substrate cavity
TW532050B (en) * 2000-11-09 2003-05-11 Matsushita Electric Ind Co Ltd Circuit board and method for manufacturing the same
JP3553043B2 (ja) * 2001-01-19 2004-08-11 松下電器産業株式会社 部品内蔵モジュールとその製造方法
TW511415B (en) * 2001-01-19 2002-11-21 Matsushita Electric Ind Co Ltd Component built-in module and its manufacturing method
TW586205B (en) * 2001-06-26 2004-05-01 Intel Corp Electronic assembly with vertically connected capacitors and manufacturing method
TW550997B (en) * 2001-10-18 2003-09-01 Matsushita Electric Ind Co Ltd Module with built-in components and the manufacturing method thereof
US6701614B2 (en) 2002-02-15 2004-03-09 Advanced Semiconductor Engineering Inc. Method for making a build-up package of a semiconductor
JP2003249763A (ja) 2002-02-25 2003-09-05 Fujitsu Ltd 多層配線基板及びその製造方法
US6638133B1 (en) * 2002-04-11 2003-10-28 Ronnie Lynn Brancolino Lady's hair accessory doll
JP3602118B2 (ja) * 2002-11-08 2004-12-15 沖電気工業株式会社 半導体装置
FI115601B (fi) 2003-04-01 2005-05-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
JP2005011837A (ja) * 2003-06-16 2005-01-13 Nippon Micron Kk 半導体装置用基板、半導体装置およびその製造方法
US7720107B2 (en) * 2003-06-16 2010-05-18 Cisco Technology, Inc. Aligning data in a wide, high-speed, source synchronous parallel link
CN1577819A (zh) * 2003-07-09 2005-02-09 松下电器产业株式会社 带内置电子部件的电路板及其制造方法
WO2005010987A1 (ja) 2003-07-24 2005-02-03 Matsushita Electric Industrial Co., Ltd. 球状半導体素子埋設配線板

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CN101027948A (zh) 2007-08-29
FI20041680A0 (fi) 2004-12-29
JP2007535157A (ja) 2007-11-29
JP5064210B2 (ja) 2012-10-31
US20100214750A1 (en) 2010-08-26
US20080192450A1 (en) 2008-08-14
WO2005104636A1 (en) 2005-11-03
US8351214B2 (en) 2013-01-08
CN101027948B (zh) 2011-08-03
US7719851B2 (en) 2010-05-18
GB0621918D0 (en) 2006-12-27
GB2429848B (en) 2008-01-30
DE112005000952T5 (de) 2007-04-05
GB2429848A (en) 2007-03-07

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