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ES8707069A1 - Procedimiento para la fabricacion de placas de circuito impreso - Google Patents

Procedimiento para la fabricacion de placas de circuito impreso

Info

Publication number
ES8707069A1
ES8707069A1 ES552730A ES552730A ES8707069A1 ES 8707069 A1 ES8707069 A1 ES 8707069A1 ES 552730 A ES552730 A ES 552730A ES 552730 A ES552730 A ES 552730A ES 8707069 A1 ES8707069 A1 ES 8707069A1
Authority
ES
Spain
Prior art keywords
tracks
printed
pcb
circuit boards
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES552730A
Other languages
English (en)
Other versions
ES552730A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telettra Laboratori di Telefonia Elettronica e Radio SpA
Telettra SpA
Original Assignee
Telettra Telefonia Elettronica e Radio SpA
Telettra Laboratori di Telefonia Elettronica e Radio SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telettra Telefonia Elettronica e Radio SpA, Telettra Laboratori di Telefonia Elettronica e Radio SpA filed Critical Telettra Telefonia Elettronica e Radio SpA
Publication of ES8707069A1 publication Critical patent/ES8707069A1/es
Publication of ES552730A0 publication Critical patent/ES552730A0/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

METODO DE FABRICAR PLACAS DE CIRCUITO IMPRESO. CONSISTE EN: TRANSFORMAR EN IMAGENES ELECTROSTATICAS LABILES DISEÑOS INICIALES DE LA CARA DE LOS COMPONENTES DEL CIRCUITO Y DE LA CARA DE SOLDADURA; APLICAR UN POLVO ELECTRICAMENTE CONDUCTOR SOBRE LAS PILAS DE LAS IMAGENES; Y TRASNFERIR EL MATERIAL CONDUCTOR DISTRIBUIDO POR IMPRESION SOBRE HOJAS AISLANTES, QUE SE APLICAN FIRMEMENTE CADA UNA SOBRE UNA CARA PRINCIPAL DEL SOPORTE RIGIDO, TRATANDOSE EL SOPORTE PORTADOR DE LAS HOJAS IMPRESAS PARA AGRANDAR POR CRECIMIENTO LAS PISTAS DEL MATERIAL CONDUCTOR, Y SOMETIENDOSE LOS SOPORTES PROVISTOS DE LAS HOJAS IMPRESAS, CON PISTAS AGRANDADAS, A OPERACIONES DE TIPO MECANICO. TIENE APLICACIONES EN EL CAMPO DE LA ELECTRONICA.
ES552730A 1985-04-09 1986-03-06 Procedimiento para la fabricacion de placas de circuito impreso Expired ES8707069A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8520284A IT1184408B (it) 1985-04-09 1985-04-09 Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi

Publications (2)

Publication Number Publication Date
ES8707069A1 true ES8707069A1 (es) 1987-07-01
ES552730A0 ES552730A0 (es) 1987-07-01

Family

ID=11165423

Family Applications (1)

Application Number Title Priority Date Filing Date
ES552730A Expired ES8707069A1 (es) 1985-04-09 1986-03-06 Procedimiento para la fabricacion de placas de circuito impreso

Country Status (5)

Country Link
US (1) US4897326A (es)
EP (1) EP0197276A3 (es)
JP (1) JPH06105826B2 (es)
ES (1) ES8707069A1 (es)
IT (1) IT1184408B (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2848830B2 (ja) * 1988-09-02 1999-01-20 旭電化工業株式会社 水に難溶性の脂肪酸エステルの可溶化方法
US4892798A (en) * 1988-12-13 1990-01-09 Minnesota Mining And Manufacturing Company Electrophoretic imaging metal-toner fluid dispersion
US5196286A (en) * 1989-07-31 1993-03-23 Watkins Roger D Method for patterning a substrate
US5416569A (en) * 1991-01-04 1995-05-16 Goldberg; Michael Electrographically making devices having electrically conductive paths corresponding to those graphically represented on a mask
DE4122326C1 (en) * 1991-07-05 1993-02-04 Rolf 7245 Starzach De Jethon Three=dimensional shaped bodies prodn. - by putting powder on photosemiconductor by electrostatic force and transferring to workpiece support
JPH0888456A (ja) * 1994-09-14 1996-04-02 Nikon Corp 基板配線製造方法および製造装置
US6445969B1 (en) * 1997-01-27 2002-09-03 Circuit Image Systems Statistical process control integration systems and methods for monitoring manufacturing processes
JPH11354371A (ja) * 1998-06-04 1999-12-24 Murata Mfg Co Ltd セラミック電子部品の製造方法
SE0000680D0 (sv) * 2000-03-02 2000-03-02 Array Printers Ab Method and device for manufacturing printed circuit boards
AU2002352260A1 (en) * 2002-01-14 2003-07-24 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. System for the production of electric and integrated circuits
JP2004048030A (ja) * 2002-07-15 2004-02-12 Toshiba Corp 電子回路の製造方法および電子回路の製造装置
JP2005050992A (ja) * 2003-07-28 2005-02-24 Toshiba Corp 配線基板および多層配線基板
JP2005195690A (ja) * 2003-12-26 2005-07-21 Toshiba Corp 金属含有樹脂粒子、樹脂粒子、及び電子回路の製造方法
JP4130407B2 (ja) * 2003-12-26 2008-08-06 株式会社東芝 電子回路の製造方法
TW200521171A (en) * 2003-12-26 2005-07-01 Toshiba Kk Resin particles and resin layer containing metal micro particles, its forming method and circuit base board
JP2005203396A (ja) * 2004-01-13 2005-07-28 Toshiba Corp 電子部品の製造装置、電子部品の製造方法および電子部品
KR100645407B1 (ko) * 2004-04-08 2006-11-14 가부시끼가이샤 도시바 화상 형성 장치와 그것을 이용한 전자 회로의 제조 방법
JP2005303090A (ja) * 2004-04-13 2005-10-27 Toshiba Corp 配線基板および配線基板の製造方法
JP4488784B2 (ja) * 2004-04-13 2010-06-23 株式会社東芝 電子回路の製造方法および電子回路

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3275436A (en) * 1962-07-24 1966-09-27 Xerox Corp Method of image reproduction utilizing a uniform releasable surface film
US3862352A (en) * 1968-04-16 1975-01-21 Itek Corp Photographically prepared electrical circuits wherein the photosensitive material is a photoconductor
DE2006134A1 (de) * 1969-02-17 1970-09-03 Electro Connective Systems Inc., Brockton, Mass. (V.St.A. Flexible gedruckte Schaltung sowie Verfahren und Vorrichtung zu ihrer Herstellung
US4066453A (en) * 1973-05-02 1978-01-03 Hoechst Aktiengesellschaft Process for the preparation of printing forms
DE2556386C2 (de) * 1975-12-15 1985-02-28 Hoechst Ag, 6230 Frankfurt Verfahren zur Herstellung von Druckformen und/oder metallisierten Bildern
JPS5437265A (en) * 1977-08-30 1979-03-19 Inoue Japax Res Print wiring substrate
DK153337C (da) * 1979-04-11 1988-11-14 Platonec Aps Fremgangsmaade til toer sensibilisering af en isolerende overflade
JPS56129394A (en) * 1980-03-14 1981-10-09 Dainippon Screen Mfg Method of producing through hole of printed board
DE3024772A1 (de) * 1980-06-30 1982-01-28 Hoechst Ag, 6000 Frankfurt Elastische, laminierbare lichtempfindliche schicht
DE3024718A1 (de) * 1980-06-30 1982-01-28 Hoechst Ag, 6000 Frankfurt Verfahren zur herstellung von druckformen oder gedruckten schaltungen
DE3047498A1 (de) * 1980-12-17 1982-07-22 Herbert 4600 Dortmund Karnikowski Uebertragungsfolie fuer die uebertragung von abbildungen auf oberflaechen, sowie uebertragungsverfahren und vorrichtung
US4439815A (en) * 1982-02-01 1984-03-27 International Telephone And Telegraph Corporation Printed circuit assembly for a card file packaging system
US4467335A (en) * 1982-05-07 1984-08-21 Data Card Corporation System for forming an image on the surface of a plastic card
JPS59112688A (ja) * 1983-12-08 1984-06-29 キヤノン株式会社 電子機器
US4661431A (en) * 1984-09-27 1987-04-28 Olin Hunt Specialty Products, Inc. Method of imaging resist patterns of high resolution on the surface of a conductor

Also Published As

Publication number Publication date
JPS61269393A (ja) 1986-11-28
JPH06105826B2 (ja) 1994-12-21
EP0197276A2 (en) 1986-10-15
US4897326A (en) 1990-01-30
IT1184408B (it) 1987-10-28
EP0197276A3 (en) 1987-05-20
ES552730A0 (es) 1987-07-01
IT8520284A0 (it) 1985-04-09

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Legal Events

Date Code Title Description
MM4A Patent lapsed

Effective date: 19960506