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ES8407520A1 - Electroless gold plating - Google Patents

Electroless gold plating

Info

Publication number
ES8407520A1
ES8407520A1 ES523032A ES523032A ES8407520A1 ES 8407520 A1 ES8407520 A1 ES 8407520A1 ES 523032 A ES523032 A ES 523032A ES 523032 A ES523032 A ES 523032A ES 8407520 A1 ES8407520 A1 ES 8407520A1
Authority
ES
Spain
Prior art keywords
alkali metal
gold
electroless
nickel
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES523032A
Other languages
Spanish (es)
Other versions
ES523032A0 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Occidental Chemical Corp
Original Assignee
Occidental Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occidental Chemical Corp filed Critical Occidental Chemical Corp
Publication of ES523032A0 publication Critical patent/ES523032A0/en
Publication of ES8407520A1 publication Critical patent/ES8407520A1/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Cosmetics (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

An electroless or autocatalytic gold plating bath includes, as the gold ingredient, an admixture of (a) a water soluble trivalent gold component selected from an alkali metal auricyanide, an alkali metal aurihydroxide, and an alkali metal aurate and (b) a water-soluble monovalent gold component such as an alkali metal aurocyanide. The bath contains an amino borane, alkali metal borohydride, alkali metal cyanoborohydride, hydrazine, or hyposulphite as the reducing agent an alkaline agent such as an alkali metal hydroxide and an alkaline buffering agent. The method of using such an electroless or autocatalytic plating bath for depositing gold on metallic substrates such as gold, copper, copper alloys, electroless copper, electroless nickel, nickel, nickel alloys, etc. and on a nonmetallic substrate is also described.
ES523032A 1982-06-07 1983-06-06 Electroless gold plating Expired ES8407520A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38561782A 1982-06-07 1982-06-07

Publications (2)

Publication Number Publication Date
ES523032A0 ES523032A0 (en) 1984-09-16
ES8407520A1 true ES8407520A1 (en) 1984-09-16

Family

ID=23522165

Family Applications (1)

Application Number Title Priority Date Filing Date
ES523032A Expired ES8407520A1 (en) 1982-06-07 1983-06-06 Electroless gold plating

Country Status (14)

Country Link
JP (1) JPS591668A (en)
AT (1) AT380902B (en)
AU (1) AU541923B2 (en)
BE (1) BE896977A (en)
CA (1) CA1188458A (en)
CH (1) CH655132A5 (en)
DE (1) DE3320308C2 (en)
DK (1) DK231783A (en)
ES (1) ES8407520A1 (en)
FR (1) FR2528073B1 (en)
GB (1) GB2121444B (en)
IT (1) IT1171818B (en)
NL (1) NL8302029A (en)
SE (1) SE8302798L (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050719A (en) * 1976-08-24 1977-09-27 Cunningham Walter F Color coded indexing system
DE3580585D1 (en) * 1984-08-27 1990-12-20 Toyota Motor Co Ltd STRUCTURE OF A STEERING COLUMN TUBE.
JPS6299477A (en) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd Electroless gold plating solution
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
DE3640028C1 (en) * 1986-11-24 1987-10-01 Heraeus Gmbh W C Acid bath for the electroless deposition of gold layers
JPS6452082A (en) * 1987-06-22 1989-02-28 Gen Electric Electroless gold plating composition and method
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
US4979988A (en) * 1989-12-01 1990-12-25 General Electric Company Autocatalytic electroless gold plating composition
JP2538461B2 (en) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 Electroless gold plating method
DE10101375A1 (en) * 2001-01-13 2002-07-18 Forschungszentrum Juelich Gmbh Point contacts for semiconductors and their manufacture
JP5526458B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
JP5526459B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
JP5526440B2 (en) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 Printed wiring board formed using reduced deposition type electroless gold plating solution for palladium film

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151637A (en) * 1976-04-29 1977-12-16 Trw Inc Aqueous solution for gold plating and method of applying gold film onto nickel surface at room temperature
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating

Also Published As

Publication number Publication date
ES523032A0 (en) 1984-09-16
CH655132A5 (en) 1986-03-27
BE896977A (en) 1983-12-06
AT380902B (en) 1986-07-25
DK231783D0 (en) 1983-05-24
CA1188458A (en) 1985-06-11
FR2528073A1 (en) 1983-12-09
IT8348420A0 (en) 1983-06-03
SE8302798L (en) 1983-12-08
AU1486083A (en) 1983-12-15
DE3320308C2 (en) 1985-05-15
FR2528073B1 (en) 1986-02-14
DK231783A (en) 1983-12-08
GB8315556D0 (en) 1983-07-13
GB2121444B (en) 1986-03-12
NL8302029A (en) 1984-01-02
ATA193183A (en) 1985-12-15
AU541923B2 (en) 1985-01-31
JPS591668A (en) 1984-01-07
DE3320308A1 (en) 1983-12-08
SE8302798D0 (en) 1983-05-18
IT1171818B (en) 1987-06-10
GB2121444A (en) 1983-12-21

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