GB1169657A - Electroless Deposition of a Ni-Co-P Magnetic Alloy - Google Patents
Electroless Deposition of a Ni-Co-P Magnetic AlloyInfo
- Publication number
- GB1169657A GB1169657A GB55468A GB55468A GB1169657A GB 1169657 A GB1169657 A GB 1169657A GB 55468 A GB55468 A GB 55468A GB 55468 A GB55468 A GB 55468A GB 1169657 A GB1169657 A GB 1169657A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electroless deposition
- magnetic alloy
- solution
- substrate
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
Abstract
1,169,657. Electroless deposition of Ni-Co- P alloys. STANDARD TELEPHONES & CABLES Ltd. Jan.4, 1968, No.554/68. Heading C7F. A coating of a Ni-Co-P magnetic material is deposited on a substrate e.g. of Cu by electroless deposition from a solution containing 35g/1 COSO 4 7H 2 O 10g/1 NiSO 4 TH 2 O 35g/1 Na 3 C 6 H 5 O 7 2H 2 O (sodium citrate) 30g/1 NaH 2 PO 2 H 2 O 60g/1 (NH 4 ) 2 SO 4 the pH of the solution being maintained between 8À0 and 8À5 at the operating temperature 85‹-90‹C. The pH is controlled by the addition of NaOH and the alloy deposited contains 80-30% Ni the remainder being Co and P. The Cu substrate is first activated by dipping in a 1% solution of palladium chloride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB55468A GB1169657A (en) | 1968-01-04 | 1968-01-04 | Electroless Deposition of a Ni-Co-P Magnetic Alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB55468A GB1169657A (en) | 1968-01-04 | 1968-01-04 | Electroless Deposition of a Ni-Co-P Magnetic Alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1169657A true GB1169657A (en) | 1969-11-05 |
Family
ID=9706430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB55468A Expired GB1169657A (en) | 1968-01-04 | 1968-01-04 | Electroless Deposition of a Ni-Co-P Magnetic Alloy |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1169657A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7622205B2 (en) | 2004-04-16 | 2009-11-24 | Fuji Electric Device Technology Co. Ltd. | Disk substrate for a perpendicular magnetic recording medium and a perpendicular magnetic recording medium using the substrate |
| US8039045B2 (en) | 2004-07-27 | 2011-10-18 | Fuji Electric Co., Ltd. | Method of manufacturing a disk substrate for a magnetic recording medium |
-
1968
- 1968-01-04 GB GB55468A patent/GB1169657A/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7622205B2 (en) | 2004-04-16 | 2009-11-24 | Fuji Electric Device Technology Co. Ltd. | Disk substrate for a perpendicular magnetic recording medium and a perpendicular magnetic recording medium using the substrate |
| US8039045B2 (en) | 2004-07-27 | 2011-10-18 | Fuji Electric Co., Ltd. | Method of manufacturing a disk substrate for a magnetic recording medium |
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