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ES514171A0 - "procedimiento para la fabricacion de placas de circuitos que contienen en estado integrado resistencias electricas y-o lugares de contactos de conmutacion". - Google Patents

"procedimiento para la fabricacion de placas de circuitos que contienen en estado integrado resistencias electricas y-o lugares de contactos de conmutacion".

Info

Publication number
ES514171A0
ES514171A0 ES514171A ES514171A ES514171A0 ES 514171 A0 ES514171 A0 ES 514171A0 ES 514171 A ES514171 A ES 514171A ES 514171 A ES514171 A ES 514171A ES 514171 A0 ES514171 A0 ES 514171A0
Authority
ES
Spain
Prior art keywords
switch contact
circuit boards
places
procedure
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES514171A
Other languages
English (en)
Other versions
ES8305179A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Preh GmbH
Original Assignee
Preh GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Preh GmbH filed Critical Preh GmbH
Publication of ES8305179A1 publication Critical patent/ES8305179A1/es
Publication of ES514171A0 publication Critical patent/ES514171A0/es
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
ES514171A 1981-07-30 1982-07-20 "procedimiento para la fabricacion de placas de circuitos que contienen en estado integrado resistencias electricas y-o lugares de contactos de conmutacion". Granted ES514171A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3130159A DE3130159C2 (de) 1981-07-30 1981-07-30 Verfahren zur Herstellung von Leiterplatten

Publications (2)

Publication Number Publication Date
ES8305179A1 ES8305179A1 (es) 1983-04-01
ES514171A0 true ES514171A0 (es) 1983-04-01

Family

ID=6138145

Family Applications (1)

Application Number Title Priority Date Filing Date
ES514171A Granted ES514171A0 (es) 1981-07-30 1982-07-20 "procedimiento para la fabricacion de placas de circuitos que contienen en estado integrado resistencias electricas y-o lugares de contactos de conmutacion".

Country Status (4)

Country Link
EP (1) EP0071003B1 (es)
AT (1) ATE16025T1 (es)
DE (1) DE3130159C2 (es)
ES (1) ES514171A0 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4555414A (en) * 1983-04-15 1985-11-26 Polyonics Corporation Process for producing composite product having patterned metal layer
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
JPS61194794A (ja) * 1985-02-22 1986-08-29 三菱電機株式会社 混成集積回路基板の製造方法
DE3515985A1 (de) * 1985-05-03 1986-11-06 Wilhelm Ruf KG, 8000 München Verfahren zur herstellung einer loetbaren beschichtung auf einem substrat und leiterbahnplatte bzw. loetbare kontaktflaeche
DE3741918A1 (de) * 1987-12-10 1989-06-22 Heino Pachschwoell Verfahren zur herstellung einer elektronischen schaltungsvorrichtung
CN100345350C (zh) * 2004-12-08 2007-10-24 中国南车集团株洲电力机车研究所 一种三维低感母排及其制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1571802B2 (de) * 1966-12-20 1976-07-22 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka (Japan) Verfahren zur herstellung von isolatorplatten fuer gedruckte schaltungen
DE1621207B2 (de) * 1967-02-11 1975-05-28 Friedr. Blasberg Gmbh & Co Kg, 5650 Solingen Wäßriges Bad und Verfahren zur Bekeimung von Kunststoffoberflächen mit Palladium
US3779758A (en) * 1969-03-25 1973-12-18 Photocircuits Corp Photosensitive process for producing printed circuits employing electroless deposition
DE2338746C2 (de) * 1973-07-31 1982-10-21 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Tastschalter
US4287253A (en) * 1975-04-08 1981-09-01 Photocircuits Division Of Kollmorgen Corp. Catalytic filler for electroless metallization of hole walls
DE2553763C3 (de) * 1975-11-29 1982-08-19 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Herstellung einer elektronischen Schaltung
NL7613762A (nl) * 1975-12-12 1977-06-14 Shipley Co Werkwijze ter vervaardiging van platen voor ge- drukte schakelingen, werkwijze ter bereiding van een harsmengsel hiervoor, alsmede de aldus gevormde voortbrengselen.
DE2812497C3 (de) * 1978-03-22 1982-03-11 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
DE2852375A1 (de) * 1978-12-04 1980-06-26 Dynamit Nobel Ag Isolierstoffkoerper mit im harz verteilten metallpartikeln
CA1100165A (en) * 1979-02-02 1981-04-28 Roger Perks Pushbutton switch assembly for telecommunications and other input apparatus
DE2915473A1 (de) * 1979-04-17 1980-10-23 Gottfried Reuter Holding Gmbh Dickschichtschaltungen und verfahren zu ihrer herstellung
DE2924993A1 (de) * 1979-06-21 1981-01-22 Licentia Gmbh Tastenfeld
DE2929574A1 (de) * 1979-07-21 1981-02-05 Licentia Gmbh Tastschalteranordnung

Also Published As

Publication number Publication date
DE3130159C2 (de) 1987-02-05
ES8305179A1 (es) 1983-04-01
ATE16025T1 (de) 1985-10-15
EP0071003B1 (de) 1985-10-09
DE3130159A1 (de) 1983-02-17
EP0071003A1 (de) 1983-02-09

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