ES443389A1 - Unos perfeccionamientos en la fabricacion de semiconducto- res. - Google Patents

Unos perfeccionamientos en la fabricacion de semiconducto- res.

Info

Publication number: ES443389A1
Authority: ES; Spain
Prior art keywords: gold; production; semiconductor devices; electrodepositing; alkali metal
Prior art date: 1974-12-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

ES443389A

Other languages

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

BASF Catalysts UK Holdings Ltd

Original Assignee

Engelhard Industries Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-12-04

Filing date

1975-12-03

Publication date

1977-05-01

1975-12-03 Application filed by Engelhard Industries Ltd filed Critical Engelhard Industries Ltd

1977-05-01 Publication of ES443389A1 publication Critical patent/ES443389A1/es

Status Expired legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01011—Sodium [Na]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01084—Polonium [Po]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Power Engineering (AREA)
Chemical & Material Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Electrochemistry (AREA)
Organic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Metallurgy (AREA)
Materials Engineering (AREA)
Chemical Kinetics & Catalysis (AREA)
Electroplating And Plating Baths Therefor (AREA)
Electroplating Methods And Accessories (AREA)

ES443389A 1974-12-04 1975-12-03 Unos perfeccionamientos en la fabricacion de semiconducto- res. Expired ES443389A1 (es)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GBGB52520/74A GB1506380A (en)	1974-12-04	1974-12-04	Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices

Publications (1)

Publication Number	Publication Date
ES443389A1 true ES443389A1 (es)	1977-05-01

Family

ID=10464233

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ES443389A Expired ES443389A1 (es)	1974-12-04	1975-12-03	Unos perfeccionamientos en la fabricacion de semiconducto- res.

Country Status (14)

Country	Link
JP (1)	JPS5198639A (es)
AT (1)	ATA908275A (es)
BE (1)	BE836293A (es)
CH (1)	CH606505A5 (es)
DE (1)	DE2554583A1 (es)
DK (1)	DK545375A (es)
ES (1)	ES443389A1 (es)
FR (1)	FR2293500A1 (es)
GB (1)	GB1506380A (es)
HK (1)	HK73378A (es)
IT (1)	IT1052476B (es)
MY (1)	MY7900005A (es)
NL (1)	NL7513699A (es)
SE (1)	SE7513620L (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4465564A (en) *	1983-06-27	1984-08-14	American Chemical & Refining Company, Inc.	Gold plating bath containing tartrate and carbonate salts

1974
- 1974-12-04 GB GBGB52520/74A patent/GB1506380A/en not_active Expired
1975
- 1975-11-24 NL NL7513699A patent/NL7513699A/xx not_active Application Discontinuation
- 1975-11-28 AT AT908275A patent/ATA908275A/de not_active Application Discontinuation
- 1975-12-02 CH CH1566675A patent/CH606505A5/xx not_active IP Right Cessation
- 1975-12-02 IT IT52492/75A patent/IT1052476B/it active
- 1975-12-02 FR FR7536819A patent/FR2293500A1/fr active Granted
- 1975-12-03 DK DK545375A patent/DK545375A/da unknown
- 1975-12-03 SE SE7513620A patent/SE7513620L/xx not_active Application Discontinuation
- 1975-12-03 ES ES443389A patent/ES443389A1/es not_active Expired
- 1975-12-04 BE BE162465A patent/BE836293A/xx not_active IP Right Cessation
- 1975-12-04 DE DE19752554583 patent/DE2554583A1/de not_active Withdrawn
- 1975-12-04 JP JP50143410A patent/JPS5198639A/ja active Pending
1978
- 1978-12-14 HK HK733/78A patent/HK73378A/xx unknown
1979
- 1979-12-31 MY MY19795A patent/MY7900005A/xx unknown

Also Published As

Publication number	Publication date
CH606505A5 (es)	1978-10-31
MY7900005A (en)	1979-12-31
ATA908275A (de)	1978-10-15
NL7513699A (nl)	1976-06-09
FR2293500B1 (es)	1980-08-01
HK73378A (en)	1978-12-22
JPS5198639A (en)	1976-08-31
GB1506380A (en)	1978-04-05
DK545375A (da)	1976-06-05
BE836293A (fr)	1976-06-04
SE7513620L (sv)	1976-06-08
IT1052476B (it)	1981-06-20
FR2293500A1 (fr)	1976-07-02
DE2554583A1 (de)	1976-06-10
AU8674075A (en)	1977-05-26

Publication	Publication Date	Title
ES434856A1 (es)	1976-12-01	Perfeccionamientos en la produccion de banos acidos acuososde electro-deposicion de estano.
ES382607A1 (es)	1972-10-16	Procedimiento de obtencion de banos acuosos para el deposi-to electrolitico de oro o de una aleacion de oro sobre un articulo conductor.
ES443389A1 (es)	1977-05-01	Unos perfeccionamientos en la fabricacion de semiconducto- res.
ES323939A1 (es)	1966-11-16	Un procedimiento para producir un contacto electrico que tiene un recubrimiento de paladio ductil.
ES375824A1 (es)	1972-04-16	Mejoras en la deposicion electrolitica del cobre.
ES387267A1 (es)	1973-05-01	Metodo para corroer, electroliticamente, de manera selecti-va, una porcion de un cuerpo semiconductor.
GB1304424A (es)	1973-01-24
ES315147A1 (es)	1966-08-01	Metodo de depositar electroliticamente un chapeado de una aleacion de estaño y bismuto.
GB953432A (en)	1964-03-25	Improvements in or relating to the production of noble-metal layers
GB575309A (en)	1946-02-12	Improvements in or relating to electro-plating
GB1452563A (en)	1976-10-13	Additive process for the production of printed circuit boards
JPS5322365A (en)	1978-03-01	Resin mold type semiconductor device and its production
GB1338414A (en)	1973-11-21	High purity copper wire and the process of making it
FR2277907A2 (fr)	1976-02-06	Procede de metallisation de substrats
ES388292A1 (es)	1974-02-16	Un procedimiento para la deposicion electrolitica de oro.
ES314621A1 (es)	1966-08-01	Procedimiento para la reduccion de iones cupricos.
JPS54116686A (en)	1979-09-11	Preparation of waveguide
GB1156186A (en)	1969-06-25	Gold Plating
ES377294A1 (es)	1973-02-01	Un metodo de recubrimiento electrolitico con oro.
Egeberg et al.	1938	Brighteners in Silver Plating Solutions: A Preliminary Study
GB2016049A (en)	1979-09-19	A method of producing large area semiconductor components by electrolytic deposition
GB850468A (en)	1960-10-05	Improvements in or relating to electro-deposition
ES416493A1 (es)	1976-05-01	Un procedimiento para preparar un bano acuoso de deposicionelectrolitica.
GB512484A (en)	1939-09-18	Process for plating nickel on electro-positive metals especially zinc and zinc alloys
GB892149A (en)	1962-03-21	Process of metallising non-conducting surfaces

Legal Events

Date	Code	Title	Description
1998-01-01	FD1A	Patent lapsed	Effective date: 19971103