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ES2188870T3 - Sustrato compuesto elastomero selectivamente conductor segun el eje z, reutilizable. - Google Patents

Sustrato compuesto elastomero selectivamente conductor segun el eje z, reutilizable.

Info

Publication number
ES2188870T3
ES2188870T3 ES97307680T ES97307680T ES2188870T3 ES 2188870 T3 ES2188870 T3 ES 2188870T3 ES 97307680 T ES97307680 T ES 97307680T ES 97307680 T ES97307680 T ES 97307680T ES 2188870 T3 ES2188870 T3 ES 2188870T3
Authority
ES
Spain
Prior art keywords
elastomero
axis
reusable
composite substrate
driver according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97307680T
Other languages
English (en)
Inventor
Bradley D Knott
Carmine G Meola
Mark S Spencer
David L Murray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WL Gore and Associates Inc
Original Assignee
WL Gore and Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WL Gore and Associates Inc filed Critical WL Gore and Associates Inc
Application granted granted Critical
Publication of ES2188870T3 publication Critical patent/ES2188870T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24826—Spot bonds connect components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y10T428/249958—Void-containing component is synthetic resin or natural rubbers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249971—Preformed hollow element-containing
    • Y10T428/249974—Metal- or silicon-containing element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982—With component specified as adhesive or bonding agent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

LA INVENCION ESTA RELACIONADA CON UN COMPONENTE CONDUCTOR SELECTIVO, POROSO, DE CELULA ABIERTA, QUE CONTIENE UN ELASTOMERO, Y QUE PUEDE REUTILIZARSE PARA EL USO Y LA PREPARACION. LA ESTRUCTURA DEL ELASTOMERO PRESENTA ZONAS CONDUCTORAS QUE ATRAVIESAN VIAS DE EJE Z CONDUCTORAS, AISLADAS ELECTRICAMENTE DE LAS VIAS DE EJE Z CONDUCTORAS ADYACENTES. EL ELASTOMERO ES NO ADHESIVO Y/O NO ADHERENTE Y PERMITE LA CONEXION TEMPORAL DE COMPONENTES ELECTRONICOS.
ES97307680T 1996-10-01 1997-09-30 Sustrato compuesto elastomero selectivamente conductor segun el eje z, reutilizable. Expired - Lifetime ES2188870T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/724,393 US5731073A (en) 1996-10-01 1996-10-01 Reusable, selectively conductive, Z-axis, elastomeric composite substrate

Publications (1)

Publication Number Publication Date
ES2188870T3 true ES2188870T3 (es) 2003-07-01

Family

ID=24910261

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97307680T Expired - Lifetime ES2188870T3 (es) 1996-10-01 1997-09-30 Sustrato compuesto elastomero selectivamente conductor segun el eje z, reutilizable.

Country Status (6)

Country Link
US (2) US5731073A (es)
EP (1) EP0834886B1 (es)
JP (1) JP4246278B2 (es)
KR (1) KR19980032453A (es)
DE (1) DE69717940T2 (es)
ES (1) ES2188870T3 (es)

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FR2746678B1 (fr) * 1996-03-26 1998-07-03 Commissariat Energie Atomique Procede de realisation d'un depot sur un support amovible, et depot realise sur un support
US5731073A (en) * 1996-10-01 1998-03-24 W. L. Gore & Associates, Inc. Reusable, selectively conductive, Z-axis, elastomeric composite substrate
US5896038A (en) * 1996-11-08 1999-04-20 W. L. Gore & Associates, Inc. Method of wafer level burn-in
US5766979A (en) * 1996-11-08 1998-06-16 W. L. Gore & Associates, Inc. Wafer level contact sheet and method of assembly
US5938452A (en) * 1996-12-23 1999-08-17 General Electric Company Flexible interface structures for electronic devices
US5900674A (en) 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
US5891754A (en) * 1997-02-11 1999-04-06 Delco Electronics Corp. Method of inspecting integrated circuit solder joints with x-ray detectable encapsulant
US6239980B1 (en) 1998-08-31 2001-05-29 General Electric Company Multimodule interconnect structure and process
JP3980801B2 (ja) 1999-09-16 2007-09-26 株式会社東芝 三次元構造体およびその製造方法
US6709806B2 (en) 2000-03-31 2004-03-23 Kabushiki Kaisha Toshiba Method of forming composite member
US20010052384A1 (en) * 2000-04-24 2001-12-20 Michael Hannington Adhesive articles with improved air egress and methods of making the same
US7060351B2 (en) 2000-04-24 2006-06-13 Avery Dennison Corporation Adhesive article with improved air egress
US6630049B2 (en) 2000-04-24 2003-10-07 Avery Dennison Corporation Adhesive articles with improved air egress and methods of making the same
US6840777B2 (en) 2000-11-30 2005-01-11 Intel Corporation Solderless electronics packaging
US6649516B2 (en) 2001-06-05 2003-11-18 Kabushiki Kaisha Toshiba Method for manufacturing a composite member from a porous substrate by selectively infiltrating conductive material into the substrate to form via and wiring regions
US6906423B1 (en) 2001-06-05 2005-06-14 Kabushiki Kaisha Toshiba Mask used for exposing a porous substrate
US6570776B2 (en) 2001-06-20 2003-05-27 Ericsson, Inc. Shielded electronics package structure with enhanced mechanical reliability
US6784363B2 (en) 2001-10-02 2004-08-31 Parker-Hannifin Corporation EMI shielding gasket construction
US6737158B1 (en) * 2002-10-30 2004-05-18 Gore Enterprise Holdings, Inc. Porous polymeric membrane toughened composites
US7241680B2 (en) * 2004-04-30 2007-07-10 Intel Corporation Electronic packaging using conductive interposer connector
US8252407B2 (en) * 2005-01-12 2012-08-28 Avery Dennison Corporation Adhesive article having improved application properties
US9240131B2 (en) * 2007-06-04 2016-01-19 Avery Dennison Corporation Adhesive articles having repositionability or slidability characteristics
DE102018100843A1 (de) * 2018-01-16 2019-07-18 Infineon Technologies Ag Halbleitervorrichtungen mit Metallisierungen aus porösem Kupfer und zugehörige Herstellungsverfahren
DE102019107633A1 (de) 2019-03-25 2020-10-29 Sphera Technology Gmbh Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems

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CA962021A (en) * 1970-05-21 1975-02-04 Robert W. Gore Porous products and process therefor
US3925578A (en) * 1971-07-29 1975-12-09 Kollmorgen Photocircuits Sensitized substrates for chemical metallization
US3993802A (en) * 1971-07-29 1976-11-23 Photocircuits Division Of Kollmorgen Corporation Processes and products for making articles for electroless plating
US4748056A (en) * 1972-07-11 1988-05-31 Kollmorgen Corporation Process and composition for sensitizing articles for metallization
US4662944A (en) * 1972-07-11 1987-05-05 Kollmorgen Technologies Corporation Process and composition for sensitizing articles for metallization
US3969554A (en) * 1972-08-07 1976-07-13 Photocircuits Division Of Kollmorgan Corporation Precious metal sensitizing solutions
US4199623A (en) * 1974-11-01 1980-04-22 Kollmorgen Technologies Corporation Process for sensitizing articles for metallization and resulting articles
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US5026591A (en) * 1987-04-21 1991-06-25 W. L. Gore & Associates, Inc. Coated products and methods for making
JP2559236B2 (ja) * 1987-09-10 1996-12-04 ジャパンゴアテックス株式会社 シート材
JPH01293102A (ja) * 1988-05-23 1989-11-27 Tokuyama Soda Co Ltd 微多孔性中空糸膜及びその製造方法
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US5401901A (en) * 1991-09-19 1995-03-28 W. L. Gore & Associates, Inc. Weather-resistant electromagnetic interference shielding for electronic equipment enclosures
JPH06332334A (ja) * 1993-05-18 1994-12-02 Japan Gore Tex Inc 定着用弾性ロール
US5498467A (en) * 1994-07-26 1996-03-12 W. L. Gore & Associates, Inc. Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom
US5512360A (en) * 1994-09-20 1996-04-30 W. L. Gore & Associates, Inc. PTFE reinforced compliant adhesive and method of fabricating same
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US5731073A (en) * 1996-10-01 1998-03-24 W. L. Gore & Associates, Inc. Reusable, selectively conductive, Z-axis, elastomeric composite substrate

Also Published As

Publication number Publication date
KR19980032453A (ko) 1998-07-25
EP0834886A1 (en) 1998-04-08
US5886413A (en) 1999-03-23
EP0834886B1 (en) 2002-12-18
US5731073A (en) 1998-03-24
JPH10149722A (ja) 1998-06-02
JP4246278B2 (ja) 2009-04-02
DE69717940T2 (de) 2003-11-20
DE69717940D1 (de) 2003-01-30

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