ES2163843T3 - Metodo y aparato para soldar. - Google Patents
Metodo y aparato para soldar.Info
- Publication number
- ES2163843T3 ES2163843T3 ES98304151T ES98304151T ES2163843T3 ES 2163843 T3 ES2163843 T3 ES 2163843T3 ES 98304151 T ES98304151 T ES 98304151T ES 98304151 T ES98304151 T ES 98304151T ES 2163843 T3 ES2163843 T3 ES 2163843T3
- Authority
- ES
- Spain
- Prior art keywords
- welding
- terminal
- coil
- patilla
- welding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 4
- 238000003466 welding Methods 0.000 abstract 6
- 239000000463 material Substances 0.000 abstract 4
- 238000006073 displacement reaction Methods 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0684—Solder baths with dipping means with means for oscillating the workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0228—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections without preliminary removing of insulation before soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/32—Wires
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
- Y10T428/2942—Plural coatings
- Y10T428/2947—Synthetic resin or polymer in plural coatings, each of different type
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
LA INVENCION SE REFIERE A UN PROCEDIMIENTO Y APARATO MEDIANTE EL CUAL SE PRODUCE EL DESPLAZAMIENTO RELATIVO ENTRE EL MATERIAL DE SOLDADURA FUNDIDO (4) Y UNA PATILLA TERMINAL (1) Y ASI MISMO, UN REVESTIMIENTO CONFORMADO EN UNA PARTE EXTREMA DE UNA BOBINA (2A) SE ELIMINA MEDIANTE MATERIAL DE SOLDADURA FUNDIDO Y DE ESTE MODO, LA PARTE EXTREMA QUEDA FIRMEMENTE SOLDADA A LA PATILLA TERMINAL DESPUES DE QUITAR EL REVESTIMIENTO. EL DESPLAZAMIENTO PUEDE CAUSARSE POR UN DISPOSITIVO ACCIONADOR (20) CON MOVIMIENTO ALTERNATIVO. EN CONTRASTE, EN EL CASO DEL PROCEDIMIENTO DE SOLDADURA CONVENCIONAL, CUANDO UNA PATILLA TERMINAL, QUE ESTA INSTALADA SOBRE UNA BASE DE TERMINAL Y TIENE UNA PARTE EXTREMA DE UNA BOBINA DEVANADA A SU ALREDEDOR, SE SUMERGE EN MATERIAL DE SOLDADURA FUNDIDO CONTENIDO EN UN BAÑO DE SOLDADURA, NO EXISTE NINGUN DESPLAZAMIENTO RELATIVO ENTRE LA PATILLA Y EL MATERIAL DE SOLDADURA FUNDIDO. DE ESTE MODO, A VECES EL REVESTIMIENTO FORMADO SOBRE LA BOBINA PERSISTE, DE MODO QUE LA CONEXION DE SOLDADURA ENTRE EL TERMINAL Y LA BOBINA NO SE CONSIGUE SUFICIENTEMENTE. SIN EMBARGO, DE ACUERDO CON EL PROCEDIMIENTO Y APARATO DE LA PRESENTE INVENCION, SE CONSIGUE LA CONEXION FIRME ENTRE AMBOS ELEMENTOS. EN CONSECUENCIA, SE MEJORA LA FIABILIDAD DEL CONJUNTO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9315382A JPH11151572A (ja) | 1997-11-17 | 1997-11-17 | ハンダ付け方法及び装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2163843T3 true ES2163843T3 (es) | 2002-02-01 |
Family
ID=18064741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES98304151T Expired - Lifetime ES2163843T3 (es) | 1997-11-17 | 1998-05-26 | Metodo y aparato para soldar. |
Country Status (13)
Country | Link |
---|---|
US (2) | US6073832A (es) |
EP (1) | EP0917415B1 (es) |
JP (1) | JPH11151572A (es) |
KR (1) | KR100277049B1 (es) |
CN (1) | CN1088637C (es) |
BR (1) | BR9802007A (es) |
CA (1) | CA2239963C (es) |
DE (1) | DE69802653T2 (es) |
ES (1) | ES2163843T3 (es) |
HK (1) | HK1019391A1 (es) |
ID (1) | ID21308A (es) |
MY (1) | MY116298A (es) |
TW (1) | TW581373U (es) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10055178C1 (de) * | 2000-11-08 | 2002-06-27 | Vacuumschmelze Gmbh & Co Kg | Verfahren zum Kontaktieren eines Wicklungsdrahtes einer Spule mit einem Anschlussstift |
ITMI20122147A1 (it) * | 2012-12-14 | 2014-06-15 | Elica Spa | Procedimento per la brasatura di conduttori elettrici in alluminio |
KR101887895B1 (ko) * | 2017-02-13 | 2018-08-13 | 김경한 | 차량의 무선충전기용 셀프본딩 코일 납땜장치 |
CN112872538B (zh) * | 2021-01-08 | 2023-11-17 | 晶澳(邢台)太阳能有限公司 | 一种接线盒补锡装置及补锡方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7810945A (en) * | 1964-10-03 | 1979-02-28 | Camardella Giuseppe | Automatic immersion tinning of wire spool ends in prodn. carousel - with interchangeable cam and follower drive to vary immersion time and depth |
NL7212888A (es) * | 1971-09-29 | 1973-04-02 | ||
US4013212A (en) * | 1972-01-21 | 1977-03-22 | Universal Manufacturing Corporation | Soldering method |
GB1393784A (en) * | 1972-03-27 | 1975-05-14 | Gte International Inc | Assemblies of electrical components |
US3834015A (en) * | 1973-01-29 | 1974-09-10 | Philco Ford Corp | Method of forming electrical connections |
US3991933A (en) * | 1975-09-08 | 1976-11-16 | Blackstone Corporation | Methods and apparatus for soldering |
US3993236A (en) * | 1975-09-08 | 1976-11-23 | Blackstone Corporation | Methods and apparatus for soldering |
US3995584A (en) * | 1976-02-27 | 1976-12-07 | General Electric Company | Portable ultrasonic soldering pot |
US4256252A (en) * | 1979-02-26 | 1981-03-17 | Thermatool Corp. | Soldering apparatus |
US4216263A (en) * | 1979-05-04 | 1980-08-05 | Rea Magnet Wire Co., Inc. | Magnet wire |
DE3036197C2 (de) * | 1980-09-25 | 1982-06-16 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und Vorrichtung zum flußmittelfreien Anlöten von elektrischen Wickelenden an elektrische Anschlußdrähte einer Drossel |
US4437605A (en) * | 1981-10-28 | 1984-03-20 | Western Electric Co., Inc. | Methods of and apparatus for pumping solder |
US4518114A (en) * | 1983-08-08 | 1985-05-21 | Hewlett-Packard Company | Dip soldering apparatus and method |
US4684056A (en) * | 1985-05-03 | 1987-08-04 | Electrovert Limited | Vibratory wave soldering |
US4849596A (en) * | 1985-12-13 | 1989-07-18 | Joyal Products, Inc. | Electrical terminals, terminating methods and assemblies |
US4869418A (en) * | 1986-06-11 | 1989-09-26 | International Business Machines Corporation | Solder leveling method and apparatus |
JP2827236B2 (ja) * | 1988-11-24 | 1998-11-25 | 住友電気工業株式会社 | 自己融着性絶縁電線及びそのコイル |
FR2671107B1 (fr) * | 1990-12-27 | 1993-12-31 | Alcatel Cit | Procede et dispositif d'etamage de plages etamables d'un boitier de composant electronique. |
US5263639A (en) * | 1992-02-10 | 1993-11-23 | Necoa, Incorporated | Robotic coil winding system |
GB2265325A (en) * | 1992-03-18 | 1993-09-29 | Ibm | Solder application to a circuit board |
US5335843A (en) * | 1993-10-13 | 1994-08-09 | William Sund | Soldering process and apparatus |
DE4336000A1 (de) * | 1993-10-21 | 1995-04-27 | Siemens Ag | Verfahren und Vorrichtung zum Kontaktieren des Wicklungsdrahtes einer Spule mit einem Anschlußstift |
US5668702A (en) * | 1994-04-21 | 1997-09-16 | Nassimi; Shary | Combination axial and surface mount cylindrical package containing one or more electronic components |
JP2964447B2 (ja) * | 1994-12-22 | 1999-10-18 | 株式会社ユニシアジェックス | 内燃機関の排気還流装置における診断装置 |
-
1997
- 1997-11-17 JP JP9315382A patent/JPH11151572A/ja active Pending
-
1998
- 1998-05-18 TW TW092220479U patent/TW581373U/zh not_active IP Right Cessation
- 1998-05-21 US US09/082,076 patent/US6073832A/en not_active Expired - Fee Related
- 1998-05-26 ES ES98304151T patent/ES2163843T3/es not_active Expired - Lifetime
- 1998-05-26 DE DE69802653T patent/DE69802653T2/de not_active Expired - Fee Related
- 1998-05-26 EP EP98304151A patent/EP0917415B1/en not_active Expired - Lifetime
- 1998-06-09 CA CA002239963A patent/CA2239963C/en not_active Expired - Fee Related
- 1998-06-10 ID IDP980852A patent/ID21308A/id unknown
- 1998-06-15 BR BR9802007-2A patent/BR9802007A/pt not_active Application Discontinuation
- 1998-06-18 KR KR1019980022916A patent/KR100277049B1/ko not_active IP Right Cessation
- 1998-07-01 CN CN98115562A patent/CN1088637C/zh not_active Expired - Fee Related
- 1998-11-10 MY MYPI98005103A patent/MY116298A/en unknown
-
1999
- 1999-08-27 US US09/384,421 patent/US6082607A/en not_active Expired - Fee Related
- 1999-09-28 HK HK99104215A patent/HK1019391A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69802653D1 (de) | 2002-01-10 |
JPH11151572A (ja) | 1999-06-08 |
EP0917415A1 (en) | 1999-05-19 |
CN1217245A (zh) | 1999-05-26 |
CA2239963A1 (en) | 1999-05-17 |
EP0917415B1 (en) | 2001-11-28 |
CN1088637C (zh) | 2002-08-07 |
ID21308A (id) | 1999-05-20 |
BR9802007A (pt) | 1999-10-19 |
CA2239963C (en) | 2001-05-01 |
TW581373U (en) | 2004-03-21 |
KR19990044759A (ko) | 1999-06-25 |
KR100277049B1 (ko) | 2001-02-01 |
MY116298A (en) | 2003-12-31 |
HK1019391A1 (en) | 2000-02-03 |
US6073832A (en) | 2000-06-13 |
DE69802653T2 (de) | 2002-06-13 |
US6082607A (en) | 2000-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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