ES2152033T3 - Aparato y metodo de suministro de fluido. - Google Patents
Aparato y metodo de suministro de fluido.Info
- Publication number
- ES2152033T3 ES2152033T3 ES96924389T ES96924389T ES2152033T3 ES 2152033 T3 ES2152033 T3 ES 2152033T3 ES 96924389 T ES96924389 T ES 96924389T ES 96924389 T ES96924389 T ES 96924389T ES 2152033 T3 ES2152033 T3 ES 2152033T3
- Authority
- ES
- Spain
- Prior art keywords
- fluid
- liquid
- openings
- gas
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
- B08B5/026—Cleaning moving webs
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Nozzles (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
SE PROPORCIONA UN APARATO Y PROCEDIMIENTO PARA LA DISTRIBUCION DE FLUIDO EN EL QUE SE SUMINISTRA UN FLUIDO LIQUIDO O GASEOSO DESDE LOS COLECTORES (35) DE UN DISTRIBUIDOR DE FLUIDO, VIA UNAS PLACAS (40) DE TOBERA ASOCIADAS CON LOS MISMOS, A CADA LADO DE UN RECORRIDO DE DESPLAZAMIENTO (22) DE ARTICULOS (11) QUE SE VAN A TRATAR CON EL FLUIDO, Y EN EL QUE LAS ABERTURAS (41, 42, 43) DE LAS TOBERAS EN LAS PLACAS (40) DE LAS TOBERAS COOPERAN CON UN SURCO (67) O SURCOS TRANSVERSALES PARA SUMINISTRAR UNA CORTINA DE FLUIDO EXTENDIDA TRANSVERSALMENTE AL RECORRIDO DE DESPLAZAMIENTO (22) DE LOS ARTICULOS (11). EN EL CASO DE QUE EL FLUIDO SEA UN LIQUIDO, LAS ABERTURAS (41, 42, 43) DE LAS TOBERAS SUMINISTRAN UNAS COLUMNAS DE LIQUIDO SIMILARES A FILAMENTOS QUE SON CONVERTIDAS POR LOS SURCOS (67) ASOCIADOS EN UNA CORTINA DE LIQUIDO PULVERIZADO, GENERALMENTE PLANA Y DISPUESTA TRANSVERSALMENTE. EN EL CASO DE QUE EL FLUIDO SEA UN GAS, LAS ABERTURAS (41, 42, 43) DE LAS TOBERAS Y LOS SURCOS (67) TRANSVERSALES COOPERAN PARA SUMINISTRAR EL GAS EN ZONAS DE GAS PLANAS, TRANSVERSALES Y SEPARADAS DE FORMA TRANSVERSAL DIRIGIDAS HACIA EL RECORRIDOS DEL DESPLAZAMIENTO (22) DEL ARTICULO. EN EL CASO DE FLUJO LIQUIDO, LAS ABERTURAS (41, 42, 43) SON GENERICAMENTE CILINDRICAS, Y EN EL CASO DE FLUJO DE GAS, LAS ABERTURAS (41, 42, 43) SON GENERICAMENTE UNOS TALADROS RANURADOS SEPARADOS. EN EL CASO DE QUE AMBOS FLUIDOS SEAN LIQUIDO Y GAS, UNO DE LOS SURCOS (67) Y/O LAS TOBERAS (41, 42, 43) SON DIRIGIDAS CORRIENTE ARRIBA CON RELACION AL RECORRIDO DEL FLUJO (22) DEL ARTICULO. ESTAN PROVISTOS DIVERSOS ELEMENTOS DE AJUSTE PARA AJUSTAR LAS POSICIONES DE LAS PLACAS (40) DE LAS TOBERAS CON RELACION AL RECORRIDO DEL FLUJO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/514,313 US5614264A (en) | 1995-08-11 | 1995-08-11 | Fluid delivery apparatus and method |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2152033T3 true ES2152033T3 (es) | 2001-01-16 |
Family
ID=24046664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96924389T Expired - Lifetime ES2152033T3 (es) | 1995-08-11 | 1996-07-08 | Aparato y metodo de suministro de fluido. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5614264A (es) |
EP (1) | EP0820351B1 (es) |
JP (1) | JPH11510734A (es) |
CA (1) | CA2218883A1 (es) |
DE (1) | DE69610763T2 (es) |
ES (1) | ES2152033T3 (es) |
WO (1) | WO1997006895A1 (es) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5876499A (en) * | 1991-05-08 | 1999-03-02 | Lymn; Peter P. | Solder spray leveller |
US5720813A (en) | 1995-06-07 | 1998-02-24 | Eamon P. McDonald | Thin sheet handling system |
US5904773A (en) * | 1995-08-11 | 1999-05-18 | Atotech Usa, Inc. | Fluid delivery apparatus |
US5824157A (en) * | 1995-09-06 | 1998-10-20 | International Business Machines Corporation | Fluid jet impregnation |
JP3317477B2 (ja) * | 1996-09-27 | 2002-08-26 | 本田技研工業株式会社 | ブランク材洗浄ブース及びブランク材洗浄装置 |
AU7519998A (en) * | 1997-05-28 | 1998-12-30 | Rockwool International A/S | Plant and process for coating a multi-sided mineral fibre element |
BR9904904A (pt) * | 1998-03-11 | 2000-10-03 | Mitsubishi Heavy Ind Ltd | Dispositivo de decapagem por ácido |
TW391895B (en) * | 1998-10-02 | 2000-06-01 | Ultra Clean Technology Asia Pt | Method and apparatus for washing and drying semi-conductor devices |
FI108993B (fi) * | 1999-06-30 | 2002-05-15 | Metso Paper Inc | Menetelmä ja sovitelma käsittelyaineen levittämiseksi liikkuvalle pinnalle |
US6539963B1 (en) * | 1999-07-14 | 2003-04-01 | Micron Technology, Inc. | Pressurized liquid diffuser |
DE19934487B4 (de) * | 1999-07-22 | 2004-04-29 | Systronic Systemlösungen für die Elektronikindustrie GmbH | Durchlauftrockner für Platten oder Bahnen |
US6265020B1 (en) * | 1999-09-01 | 2001-07-24 | Shipley Company, L.L.C. | Fluid delivery systems for electronic device manufacture |
DE10039558B4 (de) * | 2000-08-12 | 2005-09-08 | Pill E.K. | Vorrichtung zur Sprühbehandlung von Leiterplatten |
JP2002075947A (ja) * | 2000-08-30 | 2002-03-15 | Alps Electric Co Ltd | ウェット処理装置 |
EP1414594A1 (en) * | 2001-08-06 | 2004-05-06 | Amersham Biosciences Corp. | Instrument treatment station |
US20050015050A1 (en) * | 2003-07-15 | 2005-01-20 | Kimberly-Clark Worldwide, Inc. | Apparatus for depositing fluid material onto a substrate |
DE10358147C5 (de) * | 2003-12-10 | 2007-11-22 | Höllmüller Maschinenbau GmbH | Verfahren und Vorrichtung zum Behandeln von ebenem Gut in Durchlaufanlagen |
DE10358149B3 (de) * | 2003-12-10 | 2005-05-12 | Höllmüller Maschinenbau GmbH | Verfahren und Vorrichtung zum berührungslosen Behandeln von ebenem Gut in Durchlaufanlagen |
DE102006003141A1 (de) * | 2006-01-24 | 2007-07-26 | Airmatic Gmbh | Vorrichtung zur Bandreinigung mit Hochdruck-Vakuum-Technik und Bandniederhaltung |
WO2008084224A2 (en) * | 2007-01-11 | 2008-07-17 | Peter Philip Andrew Lymn | Liquid treatment apparatus |
MY161195A (en) | 2009-12-22 | 2017-04-14 | 3M Innovative Properties Co | Apparatus and methods for impinging fluids on substrates |
US9126224B2 (en) * | 2011-02-17 | 2015-09-08 | 3M Innovative Properties Company | Apparatus and methods for impinging fluids on substrates |
TWI831852B (zh) * | 2019-10-24 | 2024-02-11 | 香港商亞洲電鍍器材有限公司 | 流體輸送系統及電鍍工件的方法 |
JP7347809B2 (ja) * | 2020-03-10 | 2023-09-20 | ヒューグル開発株式会社 | 除塵装置及び除塵方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3734109A (en) * | 1971-03-08 | 1973-05-22 | P Hebner | Spray cleaning system |
US3871914A (en) * | 1971-10-18 | 1975-03-18 | Chemcut Corp | Etchant rinse apparatus |
US3935041A (en) * | 1971-10-18 | 1976-01-27 | Chemcut Corporation | Method for treatment fluid application and removal |
US3905827A (en) * | 1971-10-18 | 1975-09-16 | Chemcut Corp | Etchant rinse method |
US4015706A (en) | 1971-11-15 | 1977-04-05 | Chemcut Corporation | Connecting modules for an etching system |
US3776800A (en) * | 1971-12-06 | 1973-12-04 | Chemut Corp | Etching apparatus |
US4046248A (en) | 1974-01-15 | 1977-09-06 | Chemcut Corporation | Connecting and alignment means for modular chemical treatment system |
US4017982A (en) * | 1975-07-28 | 1977-04-19 | Chemcut Corporation | Drying apparatus |
FR2355697A1 (fr) * | 1976-06-25 | 1978-01-20 | Bertin & Cie | Procede pour etancher l'intervalle entre une paroi et une surface en regard, dispositifs de mise en oeuvre du procede et applications |
US4174261A (en) * | 1976-07-16 | 1979-11-13 | Pellegrino Peter P | Apparatus for electroplating, deplating or etching |
US4202073A (en) * | 1978-07-25 | 1980-05-13 | Research Technology Inc. | Moisture stripping device for film cleaning apparatus |
US4270317A (en) * | 1978-10-10 | 1981-06-02 | Midland-Ross Corporation | Apparatus used in the treatment of a continuous strip of metal and method of use thereof |
US4425869A (en) * | 1982-09-07 | 1984-01-17 | Advanced Systems Incorporated | Fluid flow control mechanism for circuit board processing apparatus |
JPS609129A (ja) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | ウエツト処理装置 |
US4576685A (en) * | 1985-04-23 | 1986-03-18 | Schering Ag | Process and apparatus for plating onto articles |
DE3528575A1 (de) * | 1985-08-06 | 1987-02-19 | Schering Ag | Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten |
US4938257A (en) * | 1986-11-21 | 1990-07-03 | Teledyne Industries, Inc. | Printed circuit cleaning apparatus |
US4854004A (en) * | 1987-12-28 | 1989-08-08 | Orc Manufacturing Co., Ltd. | Device for clearing the hole blockage of a liquid resist substrate |
US5063951A (en) * | 1990-07-19 | 1991-11-12 | International Business Machines Corporation | Fluid treatment device |
US5289639A (en) * | 1992-07-10 | 1994-03-01 | International Business Machines Corp. | Fluid treatment apparatus and method |
-
1995
- 1995-08-11 US US08/514,313 patent/US5614264A/en not_active Expired - Fee Related
-
1996
- 1996-07-08 EP EP96924389A patent/EP0820351B1/en not_active Expired - Lifetime
- 1996-07-08 CA CA002218883A patent/CA2218883A1/en not_active Abandoned
- 1996-07-08 ES ES96924389T patent/ES2152033T3/es not_active Expired - Lifetime
- 1996-07-08 WO PCT/US1996/011410 patent/WO1997006895A1/en active IP Right Grant
- 1996-07-08 DE DE69610763T patent/DE69610763T2/de not_active Expired - Fee Related
- 1996-07-08 JP JP9509269A patent/JPH11510734A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH11510734A (ja) | 1999-09-21 |
EP0820351B1 (en) | 2000-10-25 |
WO1997006895A1 (en) | 1997-02-27 |
DE69610763D1 (de) | 2000-11-30 |
CA2218883A1 (en) | 1997-02-27 |
EP0820351A4 (en) | 1999-06-16 |
DE69610763T2 (de) | 2001-05-31 |
EP0820351A1 (en) | 1998-01-28 |
US5614264A (en) | 1997-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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