[go: up one dir, main page]

ES2121996T3 - Procedimiento para producir una union firmemente adherente entre capas de cobre y material ceramico. - Google Patents

Procedimiento para producir una union firmemente adherente entre capas de cobre y material ceramico.

Info

Publication number
ES2121996T3
ES2121996T3 ES93906570T ES93906570T ES2121996T3 ES 2121996 T3 ES2121996 T3 ES 2121996T3 ES 93906570 T ES93906570 T ES 93906570T ES 93906570 T ES93906570 T ES 93906570T ES 2121996 T3 ES2121996 T3 ES 2121996T3
Authority
ES
Spain
Prior art keywords
procedure
produce
adhesive joint
ceramic material
copper layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93906570T
Other languages
English (en)
Inventor
Heinrich Kuhn
Ulrich Bos
Carsten Hannss
Kayser Karl-Friedrich Von
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoechst AG
Original Assignee
Hoechst AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst AG filed Critical Hoechst AG
Application granted granted Critical
Publication of ES2121996T3 publication Critical patent/ES2121996T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5127—Cu, e.g. Cu-CuO eutectic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06—Metallic material
    • C23C4/08—Metallic material containing only metal elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Ceramic Products (AREA)

Abstract

LA INVENCION TRATA DE UN PROCEDIMIENTO PARA REALIZAR UNA UNION ADHESIVA ENTRE CAPAS DE COBRE, QUE SE HACE MEDIANTE LA TECNICA DE LA PULVERIZACION TERMICA DE COBRE EN POLVO (4) O ALEACIONES DE COBRE, Y CERAMICA (6). SE PONE SOBRE LA SUPERFICIE DE CERAMICA (6) COBRE EN FINO POLVO (4) CON UN DIAMETRO MEDIO DE PARTICULA < O = 20 {MI}M POR LA TECNICA DE LA PULVERIZACION TERMICA.
ES93906570T 1992-04-02 1993-03-19 Procedimiento para producir una union firmemente adherente entre capas de cobre y material ceramico. Expired - Lifetime ES2121996T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4210900A DE4210900A1 (de) 1992-04-02 1992-04-02 Verfahren zur Herstellung eines haftfesten Verbundes zwischen Kupferschichten und Keramik

Publications (1)

Publication Number Publication Date
ES2121996T3 true ES2121996T3 (es) 1998-12-16

Family

ID=6455759

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93906570T Expired - Lifetime ES2121996T3 (es) 1992-04-02 1993-03-19 Procedimiento para producir una union firmemente adherente entre capas de cobre y material ceramico.

Country Status (8)

Country Link
US (1) US5648123A (es)
EP (1) EP0733129B1 (es)
JP (1) JP2944215B2 (es)
CA (1) CA2133422C (es)
DE (2) DE4210900A1 (es)
ES (1) ES2121996T3 (es)
NO (1) NO943647L (es)
WO (1) WO1993020255A1 (es)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05166969A (ja) * 1991-10-14 1993-07-02 Fuji Electric Co Ltd 半導体装置
DE4339345C2 (de) * 1993-11-18 1995-08-24 Difk Deutsches Inst Fuer Feuer Verfahren zum Auftragen einer Hartstoffschicht mittels Plasmaspritzen
JP3114538B2 (ja) * 1994-12-12 2000-12-04 株式会社村田製作所 圧電体素子及びその製造方法
DE19610015C2 (de) * 1996-03-14 1999-12-02 Hoechst Ag Thermisches Auftragsverfahren für dünne keramische Schichten und Vorrichtung zum Auftragen
DE19611735A1 (de) * 1996-03-25 1997-10-02 Air Liquide Gmbh Verfahren und Vorrichtung zur thermischen Bearbeitung eines Substrats
US5762711A (en) * 1996-11-15 1998-06-09 Honeywell Inc. Coating delicate circuits
US20030039856A1 (en) 2001-08-15 2003-02-27 Gillispie Bryan A. Product and method of brazing using kinetic sprayed coatings
US6685988B2 (en) * 2001-10-09 2004-02-03 Delphi Technologies, Inc. Kinetic sprayed electrical contacts on conductive substrates
JP2003129212A (ja) * 2001-10-15 2003-05-08 Fujimi Inc 溶射方法
US6623796B1 (en) 2002-04-05 2003-09-23 Delphi Technologies, Inc. Method of producing a coating using a kinetic spray process with large particles and nozzles for the same
US7476422B2 (en) 2002-05-23 2009-01-13 Delphi Technologies, Inc. Copper circuit formed by kinetic spray
US7108893B2 (en) * 2002-09-23 2006-09-19 Delphi Technologies, Inc. Spray system with combined kinetic spray and thermal spray ability
US6743468B2 (en) * 2002-09-23 2004-06-01 Delphi Technologies, Inc. Method of coating with combined kinetic spray and thermal spray
US20040065432A1 (en) * 2002-10-02 2004-04-08 Smith John R. High performance thermal stack for electrical components
US20040101620A1 (en) * 2002-11-22 2004-05-27 Elmoursi Alaa A. Method for aluminum metalization of ceramics for power electronics applications
US20040142198A1 (en) * 2003-01-21 2004-07-22 Thomas Hubert Van Steenkiste Magnetostrictive/magnetic material for use in torque sensors
US6872427B2 (en) * 2003-02-07 2005-03-29 Delphi Technologies, Inc. Method for producing electrical contacts using selective melting and a low pressure kinetic spray process
US6871553B2 (en) * 2003-03-28 2005-03-29 Delphi Technologies, Inc. Integrating fluxgate for magnetostrictive torque sensors
US7125586B2 (en) * 2003-04-11 2006-10-24 Delphi Technologies, Inc. Kinetic spray application of coatings onto covered materials
US6984277B2 (en) * 2003-07-31 2006-01-10 Siemens Westinghouse Power Corporation Bond enhancement for thermally insulated ceramic matrix composite materials
US20050040260A1 (en) * 2003-08-21 2005-02-24 Zhibo Zhao Coaxial low pressure injection method and a gas collimator for a kinetic spray nozzle
US7351450B2 (en) * 2003-10-02 2008-04-01 Delphi Technologies, Inc. Correcting defective kinetically sprayed surfaces
US7335341B2 (en) * 2003-10-30 2008-02-26 Delphi Technologies, Inc. Method for securing ceramic structures and forming electrical connections on the same
US7475831B2 (en) * 2004-01-23 2009-01-13 Delphi Technologies, Inc. Modified high efficiency kinetic spray nozzle
US7024946B2 (en) * 2004-01-23 2006-04-11 Delphi Technologies, Inc. Assembly for measuring movement of and a torque applied to a shaft
US20050214474A1 (en) * 2004-03-24 2005-09-29 Taeyoung Han Kinetic spray nozzle system design
DE102004033933B4 (de) * 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
US7820939B2 (en) * 2004-07-27 2010-10-26 The Regents Of The University Of Michigan Zero-gap laser welding
US20060038044A1 (en) * 2004-08-23 2006-02-23 Van Steenkiste Thomas H Replaceable throat insert for a kinetic spray nozzle
US20060040048A1 (en) * 2004-08-23 2006-02-23 Taeyoung Han Continuous in-line manufacturing process for high speed coating deposition via a kinetic spray process
US20070074656A1 (en) * 2005-10-04 2007-04-05 Zhibo Zhao Non-clogging powder injector for a kinetic spray nozzle system
US7674076B2 (en) * 2006-07-14 2010-03-09 F. W. Gartner Thermal Spraying, Ltd. Feeder apparatus for controlled supply of feedstock
JP2009290135A (ja) * 2008-05-30 2009-12-10 Fujitsu Ltd プリント配線板の製造方法および導電性接合剤
JP2009290124A (ja) * 2008-05-30 2009-12-10 Fujitsu Ltd プリント配線板
JP5217640B2 (ja) * 2008-05-30 2013-06-19 富士通株式会社 プリント配線板の製造方法およびプリント基板ユニットの製造方法
JP5217639B2 (ja) * 2008-05-30 2013-06-19 富士通株式会社 コア基板およびプリント配線板
JP6085787B2 (ja) * 2012-11-12 2017-03-01 北川工業株式会社 放熱部材の製造方法
US10103035B2 (en) * 2014-02-12 2018-10-16 Mitsubishi Materials Corporation Copper-ceramic bonded body and power module substrate
DE102016203112B4 (de) 2016-02-26 2019-08-29 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
DE102016203030A1 (de) 2016-02-26 2017-08-31 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
US10982310B2 (en) 2018-04-09 2021-04-20 ResOps, LLC Corrosion resistant thermal spray alloy
CN111454080B (zh) * 2020-05-12 2021-10-26 清华大学 一种敷铜或敷铜合金氧化铝陶瓷基板及其制备方法
CN114807818B (zh) * 2022-05-17 2023-09-29 中北大学 铜合金表面耐磨导电陶瓷金属熔覆涂层的制备方法
DE102022209709A1 (de) * 2022-09-15 2024-03-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zur ausbildung von einer metallschicht auf einer oberfläche eines festen, ionenleitenden substrats und mit dem verfahren herstellbares substrat
JP2024060734A (ja) 2022-10-20 2024-05-07 国立大学法人大阪大学 セラミックス－金属接合体の製造方法
CN118098989B (zh) * 2024-02-29 2024-12-17 江苏富乐华功率半导体研究院有限公司 一种覆铝氮化铝陶瓷基板双面散热功率模块的制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2824249A1 (de) * 1978-06-02 1979-12-06 Agfa Gevaert Ag Herstellung von photographischen materialien
JPS5633485A (en) * 1979-08-21 1981-04-03 Nishi Nippon Densen Kk Antipollution structure
DE3036128C2 (de) * 1980-09-25 1983-08-18 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten Verbinden von Kupferfolien mit Oxidkeramiksubstraten
US4402494A (en) * 1980-10-08 1983-09-06 Murata Manufacturing Co., Ltd. Process of heat treating copper film on ceramic body and heat treating apparatus therefor
DE3038976C2 (de) * 1980-10-15 1986-05-22 Murata Manufacturing Co., Ltd., Nagaokakyo, Kyoto Verfahren und Vorrichtung zur Verbesserung der Eigenschaften eines auf einen Keramikkörper aufgebrachten Kupferfilms
EP0142460B1 (de) * 1983-08-25 1987-09-16 Schweizerische Aluminium Ag Verfahren zur Herstellung von Aluminiumdünnband und-Folien mit hohem Würfeltexturanteil
HU189862B (en) * 1984-04-18 1986-08-28 Villamosipari Kutato Intezet,Hu Method for making electric contact
JPS61230761A (ja) * 1985-04-05 1986-10-15 Yoshikawa Kogyo Kk 金属薄板への溶射方法
JPS61231155A (ja) * 1985-04-05 1986-10-15 Yoshikawa Kogyo Kk 薄板円筒内面への溶射方法
JPS6247470A (ja) * 1985-08-23 1987-03-02 Toshiba Corp 円筒内面の溶射被覆形成方法
JPS6272583A (ja) * 1985-09-26 1987-04-03 日本碍子株式会社 高温構造部材用炭化珪素焼結部材
CH667106A5 (de) * 1986-09-18 1988-09-15 Emil Baechli Verfahren zur herstellung einer gasdichten verbindung von metall mit glas.
RU94045909A (ru) * 1985-11-29 1996-09-10 Бехли Эмиль Способ изготовления теплоизоляционного строительного и/или светового элемента и устройство для его осуществления
US5058799A (en) * 1986-07-24 1991-10-22 Zsamboky Kalman F Metallized ceramic substrate and method therefor
JPS6459887A (en) * 1987-08-31 1989-03-07 Toshiba Corp Superconductive circuit board
DE3824249A1 (de) * 1988-07-13 1990-01-18 Schering Ag Verfahren zur herstellung hochtemperaturbestaendiger kupferbeschichtungen auf anorganischen dielektrika
US5290606A (en) * 1989-01-30 1994-03-01 Svein Hestevik Method for manufacturing a substrate for a printed circuit board
JPH0385715A (ja) * 1989-08-30 1991-04-10 Matsushita Electric Ind Co Ltd 電子部品の電極形成方法

Also Published As

Publication number Publication date
DE59308833D1 (de) 1998-09-03
JP2944215B2 (ja) 1999-08-30
EP0733129A1 (de) 1996-09-25
NO943647D0 (no) 1994-09-30
NO943647L (no) 1994-09-30
CA2133422C (en) 1999-01-26
US5648123A (en) 1997-07-15
DE4210900A1 (de) 1993-10-14
WO1993020255A1 (de) 1993-10-14
EP0733129B1 (de) 1998-07-29
CA2133422A1 (en) 1993-10-03
JPH07501855A (ja) 1995-02-23

Similar Documents

Publication Publication Date Title
ES2121996T3 (es) Procedimiento para producir una union firmemente adherente entre capas de cobre y material ceramico.
DE3373120D1 (en) An engine part having a ceramics member and a metallic member joined together
ES2080728T3 (es) Procedimiento para la preparacion previa de una superficie de substrato para la union con material sintetico por aplicacion de una capa, y utilizacion de un material eventualmente silanizado y/o de un material que contiene silicio, silanizado.
ATE216758T1 (de) Verbindungselement zur kraftschlüssigen verbindung von bauteilen
WO2004095883A8 (en) Ultrasonic energy system and method including a ceramic horn
ES525135A0 (es) Una composicion adhesiva piezosensible y termofusible
MX9301071A (es) Articulo abrasivo.
ES2048790T3 (es) Dispositivo para la transformacion por flexion o bien para el enderezado de unas piezas de trabajo por medio de una deformacion plastica.
ES2120155T3 (es) Conjunto de plato de freno de disco o friccion.
DE4490829T1 (de) Druckkammer mit Keramikfutter
DE50110502D1 (de) Piezokeramischer biegewandler sowie verwendung des piezokeramischen biegewandlers
EP0337285A3 (en) Fluid permeable ceramic material based on silicon powder reaction bonded in the presence of carbon
KR850006165A (ko) 세라믹 소결체
ES543256A0 (es) Procedimiento para la obtencion de una pieza compuesta a base de fibras ceramicas.
ES2142626T3 (es) Obleas ceramicas y cabezales magneticos de pelicula delgada.
ES2132451T3 (es) Procedimiento para la obtencion de elementos de construccion acusticos dimensionalmente estables.
BR9815719A (pt) Processo de formação de uma camada termoplástica, e, material em folha compósito
NO307491B1 (no) Substansfrigjørende materiale
ATE189160T1 (de) Perforierter wabenkörper
IT8921162A0 (it) Procedimento per la fabbricazione di pezzi stampati ceramici.
ATE120159T1 (de) Natrium/schwefel zelle mit einem keramischen und einem metallischen teil, die verbunden sind.
DE3473958D1 (en) Magnetic disc and process for producing it
ATE308047T1 (de) Streptavidin/avidin beschichtete oberflächen
ITTO930535A1 (it) Procedimento per la realizzazione di lamiere metalliche e/o ceramiche tramite sinterizzazione di polveri e prodotto relativo.
ES2124501T3 (es) Solucion de chapado no electrolitico con oro.

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 733129

Country of ref document: ES