EP4275453A1 - Vitre à élément de connexion électrique - Google Patents
Vitre à élément de connexion électriqueInfo
- Publication number
- EP4275453A1 EP4275453A1 EP21830702.3A EP21830702A EP4275453A1 EP 4275453 A1 EP4275453 A1 EP 4275453A1 EP 21830702 A EP21830702 A EP 21830702A EP 4275453 A1 EP4275453 A1 EP 4275453A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrically conductive
- connection element
- conductive coating
- corrosion
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012799 electrically-conductive coating Substances 0.000 claims abstract description 86
- 238000000576 coating method Methods 0.000 claims abstract description 71
- 239000011248 coating agent Substances 0.000 claims abstract description 65
- 238000005476 soldering Methods 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000012777 electrically insulating material Substances 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 77
- 238000005260 corrosion Methods 0.000 claims description 67
- 230000007797 corrosion Effects 0.000 claims description 62
- 230000002401 inhibitory effect Effects 0.000 claims description 48
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 29
- 229910052709 silver Inorganic materials 0.000 claims description 29
- 239000004332 silver Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 14
- 229910052718 tin Inorganic materials 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 12
- 229910052797 bismuth Inorganic materials 0.000 claims description 11
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052804 chromium Inorganic materials 0.000 claims description 10
- 239000011651 chromium Substances 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000005388 borosilicate glass Substances 0.000 claims description 2
- 239000005357 flat glass Substances 0.000 claims description 2
- 239000005329 float glass Substances 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims description 2
- 239000005361 soda-lime glass Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000033001 locomotion Effects 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 36
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 239000011135 tin Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000035882 stress Effects 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 238000002788 crimping Methods 0.000 description 6
- 230000005764 inhibitory process Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000002346 layers by function Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 239000010955 niobium Substances 0.000 description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- PYLYNBWPKVWXJC-UHFFFAOYSA-N [Nb].[Pb] Chemical compound [Nb].[Pb] PYLYNBWPKVWXJC-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005554 polynitrile Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/006—Constructional features relating to the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
- H01R4/182—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for flat conductive elements, e.g. flat cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
- H01R4/183—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section
- H01R4/184—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section comprising a U-shaped wire-receiving portion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/70—Insulation of connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Definitions
- the invention is in the technical field of pane production and relates to a pane with an electrical connection element, as well as a method for its production and its use.
- Panes in buildings and vehicles are increasingly being provided with large-area, electrically conductive layers that are transparent to visible light and that have to fulfill certain functions (functional layers).
- Electrochromic layer systems through which the light transmission and thus the heat input due to sunlight can be controlled by applying an electrical voltage. Electrochromic layer systems are known, for example, from EP 0867752 A1, US 2007/0097481 A1 and US 2008/0169185 A1.
- Electric heating layers are known (see e.g. WO 2010/043598 A1) which cause the pane to heat up in a targeted manner by applying an electric voltage. Electrical contact is made with the heating layer via busbars, which typically run along the upper and lower edges of the pane.
- the busbars collect the current flowing through the electric heating layer and direct it to external leads that are connected to a voltage source.
- the voltage applied to the electrical heating layer is usually controlled by external switches that are integrated in vehicles, for example, in a dashboard.
- the layer is galvanically or capacitively coupled to a coupling electrode and the antenna signal is available in the edge area of the pane placed.
- the antenna signal decoupled from the planar antenna is fed to an antenna amplifier, which is connected to the metal bodywork in motor vehicles, as a result of which a reference potential that is effective for high-frequency technology is specified for the antenna signal.
- Electrically conductive functional layers are generally electrically contacted by electrical connection elements with solder connection areas on the pane surface.
- the solder forms an electrical connection and often also a mechanical connection between the functional layers and the leads that are connected to the connection element.
- the soldering process can be carried out, for example, by a contact soldering method in which two electrodes are placed on the connection element at a certain distance from one another. The connection element is then heated by an electric current that flows from one electrode to the other using ohmic resistance heating. Alternatively, the soldering process can be carried out by induction soldering. Such a method is known, for example, from DE 10 2004 057 630 B3.
- connection element and the material of the connection element are of decisive importance with regard to the avoidance of thermally induced mechanical stresses, with chromium-containing steel having proven to be advantageous in this respect.
- connection element encapsulated by a casting compound can be found in documents US 2016/001744 A1 and US 2018/014361 A1.
- the object of the present invention is to provide an improved pane with at least one electrical connection element, with which these disadvantages can be avoided.
- the disc should be easy and inexpensive to manufacture in industrial series production.
- a pane with at least one electrical connection element comprises a (flat) substrate and a (flat) electrically conductive coating which is applied to an area of the substrate.
- the pane also includes an electrical connection element, which has an area crimped around a connection cable, the crimped area being electrically conductively connected to the electrically conductive coating via a solder mass.
- the corrosion-inhibiting coating consists of an electrically insulating material that protects the underlying structures from moisture.
- the corrosion-inhibiting coating is preferably in the form of a continuous coating.
- the anti-corrosion coating protects the electrically conductive coating from moisture in the area of the solder joint, so that its corrosion can advantageously be inhibited.
- the corrosion-inhibiting coating is applied to the electrically conductive coating adjacent to the soldering compound and extends at least over a region of the soldering compound. The penetration of moisture into the electrically conductive coating in the area of the soldered connection can be reliably and safely prevented as a result.
- the corrosion-inhibiting coating can also advantageously improve the mechanical stability of the soldered connection.
- Coating is sufficiently strong to be used in particular in a heating field of a pane, in particular a vehicle pane, in which particular requirements are placed on the resistance to temperature changes.
- the anti-corrosion coating consists of a material that protects against moisture.
- the coating represents a barrier for liquid water and water vapor and thus limits the entry of water vapor from the environment into the electrically conductive coating.
- the moisture vapor permeability is less than 100 g/(day ⁇ m 2 ) and more preferably less than 10 g/(day ⁇ m 2 ) as measured by ASTM E96-10.
- the corrosion-inhibiting coating can in particular also be impermeable to water vapor, with the permeability to water vapor being so low that it is negligible.
- the corrosion-inhibiting coating covers the solder mass only partially, ie not completely.
- this is advantageous in terms of a reliable and safe prevention of corrosion of the electrically conductive coating.
- material costs can advantageously be saved in industrial series production.
- the corrosion-inhibiting coating it is also possible for the corrosion-inhibiting coating to completely cover the solder mass. As a result, the access of moisture to the electrically conductive coating in the area of the solder connection can be prevented in a particularly effective manner.
- the corrosion-inhibiting coating completely covers the solder mass and only partially, ie not completely, covers the crimped area of the connection element. In addition to good corrosion inhibition, a significant improvement in the mechanical stability of the soldered connection can also be achieved in this way.
- the corrosion-inhibiting coating does not completely cover the crimped area of the terminal and the solder mass, i.e. does not encapsulate the terminal and the solder mass.
- the corrosion-inhibiting coating can consist of any desired material, as long as the electrically conductive coating in the area of the solder joint is adequately protected against moisture from the environment.
- the corrosion-inhibiting coating contains or consists of a sealant conventionally used in pane manufacture, for example butyl (polyisobutylene). The sealant seals the underlying coatings airtight from the outside environment.
- the corrosion-inhibiting coating may contain or consist of a flux, a primer, a paint, a hot-melt adhesive or a foam tape. These substances are well known to those skilled in the art. Foam tapes are commercially available commercially. These substances can advantageously achieve good corrosion inhibition and significantly improved mechanical stability of the soldered joint.
- the flux advantageously has a high proportion of colophony.
- the primer advantageously contains polyisocyanates.
- a foam tape is used as a corrosion-inhibiting coating, it advantageously contains acrylic or acrylate foam. This is particularly advantageous with regard to the required corrosion inhibition and makes it possible at the same time a particularly stable connection between the connection element and the electrically conductive coating.
- the corrosion-inhibiting coating is intended to inhibit or prevent the ingress of moisture from the environment to the electrically conductive coating in the area of the solder joint.
- the corrosion-inhibiting coating is applied to the electrically conductive coating, adjacent to the solder mass.
- the corrosion-inhibiting coating on the electrically conductive coating starting from the solder mass and in a direction parallel to the substrate surface, in particular perpendicular to the solder mass, always has a dimension of at least 1 mm, in particular from 1 mm to 4 mm.
- this measure achieves good corrosion inhibition and mechanical stabilization of the soldered connection, on the other hand, material costs can be saved and the space required for the corrosion-inhibiting coating can be reduced.
- the substrate is flat and preferably contains or consists of glass, in particular flat glass, float glass, quartz glass, borosilicate glass and/or soda-lime glass.
- the substrate can also contain or consist of polymers, preferably polyethylene, polypropylene, polycarbonate, polymethyl methacrylate, polystyrene, polybutadiene, polynitriles, polyester, polyurethane, polyvinyl chloride, polyacrylate, polyamide, polyethylene terephthalate and/or copolymers or mixtures thereof.
- the substrate is transparent.
- the substrate has, for example, a thickness of 0.5 mm to 25 mm, or 1 mm to 10 mm, in particular 1.5 mm to 5 mm.
- the electrically conductive coating (eg functional layer) is arranged on a surface of the substrate and partially covers the surface of the substrate, but preferably over a large area.
- the expression “extensively” means that at least 50%, at least 60%, at least 70%, at least 75% or preferably at least 90% of the surface of the substrate is covered (eg coated) by the electrically conductive coating.
- the electrically conductive coating can also extend over smaller parts of the surface of the substrate, for example if this is a special connection area, in particular a busbar.
- the electrically conductive coating is preferably transparent to visible light.
- transparent means that the total transmission of the pane complies with the legal provisions for windshields and front side windows in Corresponds to motor vehicles and preferably has a transmittance of more than 70% and in particular more than 75% for visible light.
- transparent can also mean 10% to 70% light transmission.
- "opaque” means a light transmission of less than 15%, preferably less than 5%, in particular 0%.
- the electrically conductive coating contains at least one metal, preferably silver, nickel, chromium, niobium, tin, titanium, copper, palladium, zinc, gold, cadmium, aluminum, silicon, tungsten or alloys thereof, and/or at least one metal oxide layer, preferably Tin-doped indium oxide (ITO), aluminum-doped zinc oxide (AZO), fluorine-doped tin oxide (FTO, SnO 2 :F) or antimony-doped tin oxide (ATO, SnO 2 :Sb).
- Transparent, electrically conductive layers are known, for example, from DE 20 2008 017 611 U1 and EP 0 847 965 B1.
- Transparent, electrically conductive layers preferably have a sheet resistance of from 0.1 ohms/square to 200 ohms/square, more preferably from 1 ohms/square to 50 ohms/square and most preferably from 1 ohms/square to 10 ohms/square.
- the electrically conductive coating contains at least silver, in particular silver particles and glass frits, and has a layer thickness of 5 ⁇ m to 40 ⁇ m, for example.
- the electrically conductive coating can be an electrically heatable layer, for example, which provides the pane with a heating function.
- heatable layers are known per se to those skilled in the art. They typically contain one or more, for example two, three or four, electrically conductive layers. These layers preferably contain or consist of at least one metal, for example silver, gold, copper, nickel and/or chromium, or one Metal alloy and preferably contain at least 90% by weight of the metal, in particular at least 99.9% by weight of the metal.
- Such layers have a particularly advantageous electrical conductivity combined with high transmission in the visible spectral range.
- the thickness of an individual layer is preferably from 5 nm to 50 nm, particularly preferably from 8 nm to 25 nm, as a result of which high transmission in the visible spectral range and a particularly advantageous electrical conductivity are advantageously achieved.
- the electrically heatable coating is electrically connected, for example, to at least two bus bars through which a heating current can be fed into the coating.
- the busbars are preferably arranged in the edge area of the electrically conductive coating along a side edge on the electrically conductive layer.
- the length of the busbar is typically substantially equal to the length of the side edge of the electrically conductive coating, but may be slightly greater or lesser.
- Two busbars are preferably arranged on the electrically conductive layer, in the edge area along two opposite side edges of the electrically conductive coating.
- the width of the bus bar is preferably from 2 mm to 30 mm, particularly preferably from 4 mm to 20 mm.
- the busbars are each typically in the form of a strip, the longer of its dimensions being referred to as length and the shorter of its dimensions being referred to as width.
- Busbars are designed, for example, as a printed and burned-in conductive structure.
- the printed bus bar contains at least one metal, preferably silver.
- the electrical conductivity is preferably realized via metal particles contained in the busbar, particularly preferably via silver particles.
- the metal particles can be in an organic and/or inorganic matrix such as pastes or inks, preferably as a fired screen printing paste with glass frits.
- the layer thickness of the printed busbar is preferably from 5 ⁇ m to 40 ⁇ m, particularly preferably from 8 ⁇ m to 20 ⁇ m and very particularly preferably from 10 ⁇ m to 15 ⁇ m. Printed busbars with these thicknesses are technically easy to implement and have an advantageous current-carrying capacity.
- the electrically conductive coating is applied to the substrate by vapor deposition, chemical vapor deposition (CVD), plasma-enhanced vapor deposition (PECVD) or by wet-chemical methods.
- CVD chemical vapor deposition
- PECVD plasma-enhanced vapor deposition
- wet-chemical methods This is preferably done by magnetic field assisted Cathode sputtering, which is particularly advantageous in terms of simple, fast, inexpensive and uniform coating.
- it is applied to the substrate in a printing process, in particular in a screen printing process, or via other common application processes such as brushing, rolling, spraying and the like, and then preferably baked.
- Sintered coatings, especially those containing silver, are particularly susceptible to a reduction in the mechanical strength of solder joints due to corrosion.
- the soldering compound is lead-free, which is particularly advantageous with regard to the environmental compatibility of the pane with an electrical connection element according to the invention.
- lead-free means that the soldering mass contains less than or equal to 0.1% by weight of lead, in particular no lead, ie 0% by weight of lead.
- Lead-free soldering masses typically have a lower ductility than lead-containing soldering masses, so that mechanical stresses between the connection element and the substrate cannot be compensated as well.
- the corrosion-inhibiting coating used according to the invention can particularly advantageously improve the mechanical stability of the solder joint when using lead-free solders.
- the soldering mass contains tin, bismuth, indium, zinc, copper or silver, in particular compositions thereof.
- the proportion of bismuth, indium, zinc, copper, silver or compositions thereof in the solder composition is from 0.5% by weight to 97% by weight, in particular from 10% by weight to 67% by weight, where the proportion of bismuth, indium, zinc, copper or silver can be 0% by weight.
- the solder composition can contain nickel, germanium, aluminum or phosphorus in a proportion of 0% by weight to 5% by weight.
- the solder composition contains in particular Bi40Sn57Ag3, Sn40Bi57Ag3, Bi59Sn40Ag1, Bi57Sn42Ag1, ln97Ag3, Sn95.5Ag3.8Cu0.7, Bi67ln33, Bi33ln50Sn17, Sn77.2ln20Ag2.8, Sn95Ag4Cu1,
- the layer thickness of the solder mass is preferably less than or equal to 6.0 ⁇ 10 4 m, in particular less than 3.0 ⁇ 10 4 m.
- the soldering compound advantageously contains bismuth. It has been shown that a soldering compound containing bismuth leads to particularly good adhesion of the connection element to the substrate, with damage to the pane being able to be avoided.
- the proportion of bismuth in the solder composition is, for example, from 0.5% by weight to 97% by weight, from 10% by weight to 67% by weight, or from 33% by weight to 67% by weight. , especially from 50% to 60% by weight.
- the solder mass contains in particular tin and silver or tin, silver and copper.
- the solder composition contains at least 35% by weight to 69% by weight bismuth, 30% by weight to 50% by weight tin, 1% by weight to 10% by weight silver and 0% by weight bis 5% by weight copper.
- the solder composition contains at least 49% by weight to 60% by weight bismuth, 39% by weight to 42% by weight tin, 1% by weight to 4% by weight silver and 0% by weight bis 3% by weight copper.
- the solder mass can contain, for example, from 90% by weight to 99.5% by weight tin, or from 95% by weight to 99% by weight tin, in particular from 93% by weight to 98% by weight tin contain.
- the solder composition contains, for example, from 0.5% by weight to 5% by weight silver and from 0% by weight to 5% by weight copper.
- the solder mass emerges with an exit width of less than 1 mm from the intermediate space between the connection element and the electrically conductive coating.
- the maximum exit width is less than 0.5 mm and in particular about 0 mm. This is particularly advantageous with regard to the reduction of mechanical stresses in the pane and the adhesion of the connection element.
- the maximum outlet width is defined as the distance between the outer edges of the connecting element and the point at which the solder mass transfers where the solder mass falls below a layer thickness of 50 ⁇ m. The maximum outlet width is measured after the soldering process on the solidified solder mass.
- a desired maximum exit width is achieved by a suitable choice of solder mass volume and vertical distance between the connection element and the electrically conductive coating, which can be determined by simple tests.
- the perpendicular distance between the connection element and the electrically conductive coating can be specified by a corresponding process tool, for example a tool with an integrated spacer.
- the maximum exit width can also be negative, that is to say drawn back into the intermediate space formed by the connecting element and the electrically conductive coating.
- the maximum exit width in the space formed by the connection element and the electrically conductive coating is retracted in a concave meniscus.
- a concave meniscus is created, for example, by Increasing the perpendicular distance between the spacer and the conductive coating during the soldering process while the solder is still liquid.
- the corrosion inhibiting coating is disposed on the electrically conductive coating adjacent the solder mass, it being understood that only a portion of the electrically conductive coating adjacent the solder mass edge is coated by the corrosion inhibiting coating. In any case, the corrosion-inhibiting coating extends as far as the solder mass in order to achieve reliable and secure protection from moisture for the area of the electrically conductive coating that is directly connected to the solder mass.
- one or more contact elevations are arranged on the side of the connection element facing away from the substrate, which are used for contacting the connection element with the soldering tools during the soldering process.
- the contact elevations preferably have a height of 0.1 mm to 2 mm, in particular 0.2 mm to 1 mm.
- the length and width of the contact bumps is, for example, from 0.1 mm to 5 mm, in particular from 0.4 mm to 3 mm.
- the contact elevations are in particular formed in one piece with the connection element, for example by embossing or deep-drawing.
- Electrodes whose contact side is flat can be used for soldering.
- the electrode surface is brought into contact with the contact bump.
- the electrode surface is arranged parallel to the surface of the substrate.
- the contact area between the electrode surface and the contact bump forms the soldering point.
- the position of the soldering point is determined by the point on the convex surface of the contact bump that has the greatest vertical distance to the surface of the substrate.
- the position of the soldering point is independent of the position of the soldering electrode on the connection element. This is particularly advantageous with regard to reproducible, even heat distribution during the soldering process.
- the heat distribution during the soldering process is determined by the position, size, arrangement and geometry of the bump.
- connection element has an area crimped around a connection cable, but can also be designed overall as a crimp, in particular as a B-crimp.
- the connection element itself is then a crimp, in particular a B crimp.
- the shape of the crimped area or crimp is basically arbitrary and can be determined by a person skilled in the art according to the requirements in the individual case by selecting the crimping tool. The crimp shape results from the cross section of the crimp.
- the crimp-shaped area or crimp can be designed, for example, as an oval crimp, a polygonal crimp (for example, a square crimp, a hexagonal crimp, or a trapezoidal crimp), an O crimp, or a B crimp.
- the connecting element itself is advantageously designed in the form of a crimp, in particular as an open crimp, in particular as a B-crimp, which allows for simple assembly and automation, so that it is particularly suitable for mass production.
- the connection element has a material thickness of 0.1 mm to 2 mm.
- the connecting element has the cold formability required for crimping.
- an advantageous stability of the connection element is achieved in this area for the material thickness.
- the width of the connection element can be suitably selected by a person skilled in the art, taking into account the requirements and current standards, and is, for example, from 1 mm to 5 mm or from 2 mm to 3 mm, in particular 2.5 mm. This is particularly advantageous with regard to the small space requirement of the connection element. In addition, a stable connection between the connection element and the connection cable is achieved in this way.
- the length of the connection element can be suitably selected by the person skilled in the art, taking into account the diameter of the connection cable and common standards, and is, for example, from 2 mm to 8 mm, from 4 mm to 5 mm, or from 4.3 mm to 4.7 mm, in particular 4 .5mm.
- connection element can be suitably selected by a person skilled in the art, taking into account the diameter of the connection cable and current standards, and is, for example, from 1 mm to 5 mm or from 2 mm to 3 mm, in particular 2.5 mm. This is particularly advantageous with regard to the small space requirement of the connecting element and with regard to a stable connection between the connecting element and the connecting cable.
- connection element is advantageously provided as a flat platelet or as a platelet that has been pre-bent to form a crimping claw and is squeezed around the connection cable to form the crimp.
- connection element is advantageously designed as a sleeve (wire end sleeve) that is closed all around and is squeezed around the connection cable.
- connection cable connects the connection element, i.e. the electrically conductive coating of the substrate, with an electrical system, such as an amplifier, control unit or voltage source, which is arranged outside the pane.
- an electrical system such as an amplifier, control unit or voltage source
- connection element i.e. the crimped area or crimp
- the connection element is preferably directly connected to the electrically conductive coating via the solder mass.
- soldering compound is arranged between the connection element and the electrically conductive coating and as a result fixes the connection element in a permanently stable manner on the electrically conductive coating.
- the entire connection element is connected to the electrically conductive coating via the solder mass. This means that solder mass is arranged along the entire length of the connection element. This achieves a particularly stable adhesion of the connecting element to the electrically conductive coating.
- soldering compound it is also possible for the soldering compound to be arranged only between a section of the connection element and the electrically conductive coating. It is also possible that a special connection surface, for example a bus bar, is arranged on the electrically conductive coating and the connection element is electrically connected directly to the connection surface.
- the difference between the thermal expansion coefficient of the substrate and the thermal Coefficient of expansion of the connection element less than 5 ⁇ 10 6 /°C, in particular less than 3 ⁇ 10 6 /°C.
- the thermal expansion coefficient of the substrate is, for example, from 8 ⁇ 10 6 /°C to 9 ⁇ 10 6 /°C.
- the substrate contains glass, for example, which in particular has a thermal expansion coefficient of 8.3 ⁇ 10 ⁇ 6 /°C to 9 ⁇ 10 6 /°C in a temperature range from 0°C to 300°C.
- connection element The coefficient of thermal expansion of the connection element is, for example, from 9 x 10 6 /°C to 13 x 10 6 /°C, or from 10 x 10 6 /°C to 11.5 x 10 6 /°C, in particular from 10 x 10 6 /°C to 10.5 x 10 6 /°C in a temperature range from 0 °C to 300 °C.
- the connecting element preferably contains or consists of a chromium-containing steel with a chromium content of greater than or equal to 10.5% by weight.
- chromium-containing steel with a chromium content of greater than or equal to 10.5% by weight.
- Other alloy components such as molybdenum, manganese or niobium lead to improved corrosion resistance or changed mechanical properties such as tensile strength or cold workability.
- the connection element can also contain admixtures of other elements, including vanadium, aluminum and nitrogen.
- Particularly suitable chromium-containing steels are steels with material numbers 1.4016, 1.4113, 1.4509 and 1.4510 according to EN 10088-2.
- the connection element contains at least 66.5% by weight to 89.5% by weight iron, 10.5% by weight to 20% by weight chromium, 0% by weight up to 1% by weight carbon, 0% by weight to 5% by weight nickel, 0% by weight to 2% by weight manganese, 0% by weight to 2.5% by weight molybdenum, 0 2% by weight niobium and 0% by weight to 1% by weight titanium, in particular at least 77% by weight to 84% by weight iron, 16% by weight to 18.5% by weight % chromium, 0 wt.% to 0.1 wt.% carbon, 0 wt.% to 1 wt.% manganese, 0 wt.% to 1 wt.% niobium, 0 wt.% % to 1.5% by weight molybdenum and 0% by weight to 1% by weight
- Titanium or consists of it
- the electrical connection element has, at least on the surface aligned with the solder mass, a coating that contains copper, zinc, tin, silver, gold or alloys or layers thereof, preferably silver. This will make one improved wetting of the connection element with the solder mass and improved adhesion of the connection element.
- connection element is coated with nickel, tin, copper and/or silver.
- the connecting element is provided in particular with an adhesion-promoting layer, for example made of nickel and/or copper, and additionally with a solderable layer, in particular made of silver.
- the connection element is coated in particular with 0.1 ⁇ m to 0.3 ⁇ m of nickel and/or 3 ⁇ m to 20 ⁇ m of silver.
- the connection element can be nickel-plated, tin-plated, copper-plated and/or silver-plated. Nickel and silver improve the current carrying capacity and corrosion stability of the
- the invention also extends to a method for producing a pane according to the invention with an electrical connection element.
- the above statements on the pane according to the invention apply equally to the method according to the invention.
- soldering compound is applied to the underside of the connection element and/or to the electrically conductive coating.
- the connecting element is arranged on a region of the electrically conductive coating with an intermediate soldering compound.
- the connection element is connected to the electrically conductive coating with the input of energy.
- a corrosion-inhibiting coating which adjoins the solder mass, is applied to the electrically conductive coating and at least in sections to the solder mass, the corrosion-inhibiting coating consisting of an electrically insulating material that protects against moisture.
- the solder mass is preferably applied to the connection element and/or the electrically conductive coating as small plates with a defined layer thickness, volume, shape and arrangement.
- the layer thickness of the small solder mass is, for example, less than or equal to 0.6 mm.
- the solder mass plate has a rectangular shape, for example.
- the underside of the connection element is that side which is intended to be arranged facing the substrate on the electrically conductive coating.
- the introduction of energy during the electrical connection of electrical connection element and electrically conductive coating is preferably carried out with stamps, thermodes, piston soldering, in particular laser soldering, hot air soldering, induction soldering, resistance soldering and/or with ultrasound.
- the invention also includes the use of the pane according to the invention in buildings or in means of transport for traffic on land, in the air or on water, in particular in rail vehicles or motor vehicles, and as a windshield, rear window, side window and/or roof pane, in particular as a heated one disc or as a disc with an antenna function.
- Fig. 1 is a plan view of the disc according to the invention with electric
- FIG. 2 shows a cross section AA ′ through the pane according to FIG. 1,
- FIG. 3 shows a cross section BB ′ through the pane according to FIG. 1,
- FIG. 4a shows a cross section BB ′ through a first embodiment of the pane according to the invention with an electrical connection element after the corrosion-inhibiting coating has been applied
- Fig. 4b shows a cross section BB ' through a further embodiment of the pane according to the invention with an electrical connection element after application of the corrosion-inhibiting coating
- Fig. 4c a cross section BB ' through a further embodiment of the pane with an electrical connection element after application of the anti-corrosion coating, is claimed.
- 5 shows a detailed flow chart of the method according to the invention.
- the pane comprises a substrate 1 which, for example, is a 3 mm thick thermally toughened single-pane safety glass made of soda Lime-
- the substrate 1 has, for example, a width of 150 cm and a height of 80 cm.
- An electrically conductive coating 2 is printed onto the substrate 1 and serves as a heating conductor.
- the electrically conductive coating 2 contains silver particles and glass frits.
- the electrically conductive coating 2 is widened to a width of 10 mm and forms a contact surface for the electrical connection element 3.
- a cover screen print (not shown).
- Solder compound 4 is applied in the area of the contact surface between the electrical connection element 3 and the electrically conductive coating 2 and causes a permanent electrical and mechanical connection between the electrical connection element 3 and the electrically conductive coating 2 .
- the solder mass 4 is lead-free and contains, for example, 57% by weight of bismuth, 40% by weight of tin and 3% by weight of silver.
- the solder mass 4 has a thickness of 250 ⁇ m, for example.
- the electrical connection element 3 consists, for example, of steel with the material number 1.4509 according to EN 10088-2 with a thermal expansion coefficient of 10.5 ⁇ 10 6 /°C in the temperature range from 20°C to 300°C.
- connection element 3 is crimped around the end area of a connection cable 5 along its entire length.
- the connection element 3 is therefore a total of a crimp educated.
- the connection cable 5 contains an electrically conductive core, which is designed as a conventional wire strand conductor.
- the connecting cable 5 also contains a polymeric insulating sheathing, not shown, which is removed in the end region in order to enable the electrically conductive core of the connecting cable 5 to make electrical contact with the connecting element 3 .
- the length of the stripped area exceeds the length L of the crimp by 0.5 mm to 3 mm, for example, in order to ensure that the connection cable 5 can be bent.
- the connecting element 3 is designed here as an open crimp.
- the connection element 3 was provided during production of the pane as a small plate with a material thickness of 0.4 mm, for example, which was bent around the connection cable 5 using a crimping tool and permanently and stably connected to the connection cable 5 by squeezing (crimping).
- the length of the connection element 3 corresponds to the length L of the crimp (crimp length) and is approximately 4.5 mm, for example, and the width of the connection element 3 (crimp width B) is approximately 2.5 mm, for example.
- the connecting element 3 has the shape of a B crimp.
- the lateral edges of the connection element 3 are bent around the connection cable 5 and sunk into the electrically conductive core of the connection cable 5 by piercing the crimping tool, with the wire strands (not shown individually) of the connection cable 5 deviating evenly on both sides into the contact interior.
- the characteristic crushed shape shows in profile two rounded coatings in the manner of the letter "B".
- the characteristic pinched shape is arranged on the upper side of the connection element 3 facing away from the substrate 1 .
- the contact surface between the connection element 3 and the solder mass 4 is arranged opposite the characteristic crimp shape, that is to say on the crimp base. Advantageous wetting of the connecting element 3 with the soldering compound 4 is thus achieved.
- FIGS. 4a, 4b and 4c In order to avoid unnecessary repetition, only the design of the corrosion-inhibiting coating 6 is explained in FIGS. 4a, 4b and 4c described below. Otherwise, reference is made to the above statements according to FIGS.
- FIG. 4a shows a cross section along BB ' through a first embodiment of the washer according to the invention with the electrical connection designed as a B-crimp Connecting element 3 after the application of the corrosion-inhibiting coating 6.
- the corrosion-inhibiting coating 6 is designed to be continuous and is adjacent to the solder mass 4.
- the corrosion-inhibiting coating 6 is applied to the electrically conductive coating 2 and (only) in sections to the solder mass 4 .
- the corrosion-inhibiting coating 6 consists of an electrically insulating material that protects against moisture, which consists here, for example, of a flux with a high proportion of colophony.
- corrosion of the electrically conductive coating 2, which is triggered by moisture entering from the environment (electrocorrosion) can be inhibited in an advantageous manner.
- a mechanically stable connection between the connection element 3 and the electrically conductive coating 2 is achieved. The connection made in this way between connection element 3 and electrically conductive
- Coating 2 is mechanically sufficiently strong to also be able to be used in a heating field of a pane, for example a vehicle pane.
- FIG. 4b shows a cross section along BB ' through a further embodiment of the pane according to the invention with the electrical connection element 3 designed as a B-crimp after the application of the corrosion-inhibiting coating 6, only the differences from FIG. 4a being explained.
- the corrosion-inhibiting coating 6 in FIG. 4b covers the solder mass 4 completely and the connection element 3 partially, ie not completely. This can advantageously a particularly good
- Corrosion inhibition and also a mechanically very stable connection between the connecting element 3 and the electrically conductive coating 2 can be achieved.
- FIG. 4c shows a cross section along BB ′ through a further embodiment of the disk with the electrical connection element 3 designed as a B-crimp after application of the corrosion-inhibiting coating 6, only the differences from FIG. 4a being explained.
- the configuration according to FIG. 4c which is not claimed in the patent claims, differs from the configuration according to FIG. 4a in that the corrosion-inhibiting coating 6 completely encloses or encapsulates both the solder mass 4 and the connecting element 3 designed as a B-crimp .
- the electrically conductive coating 2 shown in the figures can also be understood as a special connection surface, for example a busbar, which is applied to an (actual) functional surface.
- the above statements apply in an analogous manner.
- soldering compound is applied to the underside of the connection element and/or to the electrically conductive coating.
- the connecting element is arranged on a region of the electrically conductive coating with an intermediate soldering compound.
- the connecting element is connected to the electrically conductive coating with the input of energy.
- a corrosion-inhibiting coating which adjoins the solder mass, is applied to the electrically conductive coating and at least in sections to the solder mass.
- the corrosion-inhibiting coating can advantageously delay or prevent the corrosion-related brittleness of the solder joint between the connecting element and the electrically conductive coating over time, with corrosion of the electrically conductive coating being caused by moisture entering from the environment is inhibited.
- the pane according to the invention with an electrical connection element can be produced easily and inexpensively in industrial series production.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Multi-Conductor Connections (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP21150437 | 2021-01-06 | ||
PCT/EP2021/087413 WO2022148667A1 (fr) | 2021-01-06 | 2021-12-22 | Vitre à élément de connexion électrique |
Publications (1)
Publication Number | Publication Date |
---|---|
EP4275453A1 true EP4275453A1 (fr) | 2023-11-15 |
Family
ID=74105855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21830702.3A Pending EP4275453A1 (fr) | 2021-01-06 | 2021-12-22 | Vitre à élément de connexion électrique |
Country Status (9)
Country | Link |
---|---|
US (1) | US20240071650A1 (fr) |
EP (1) | EP4275453A1 (fr) |
JP (1) | JP2024502126A (fr) |
KR (1) | KR20230113801A (fr) |
CN (1) | CN115039513A (fr) |
CA (1) | CA3202914A1 (fr) |
MX (1) | MX2023008071A (fr) |
WO (1) | WO2022148667A1 (fr) |
ZA (1) | ZA202306522B (fr) |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5670966A (en) | 1994-12-27 | 1997-09-23 | Ppg Industries, Inc. | Glass antenna for vehicle window |
FR2746934B1 (fr) | 1996-03-27 | 1998-05-07 | Saint Gobain Vitrage | Dispositif electrochimique |
FR2757151B1 (fr) | 1996-12-12 | 1999-01-08 | Saint Gobain Vitrage | Vitrage comprenant un substrat muni d'un empilement de couches minces pour la protection solaire et/ou l'isolation thermique |
ATE378700T1 (de) | 2000-04-19 | 2007-11-15 | Advanced Automotive Antennas S | Fortschrittliche mehrebenenantenne fuer kraftfahrzeuge |
DE10106125B4 (de) | 2001-02-08 | 2014-04-10 | Delphi Technologies, Inc. | Kraftfahrzeugscheibe mit Antennenstrukturen |
JP3957302B2 (ja) | 2002-03-11 | 2007-08-15 | 日本板硝子株式会社 | 金具が接合されたガラス物品、およびこれを用いた接合構造 |
DE10319606B4 (de) | 2003-05-02 | 2005-07-14 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Antennenscheibe für Fahrzeuge |
US20070105412A1 (en) | 2004-11-12 | 2007-05-10 | Agc Automotive Americas R&D, Inc. | Electrical Connector For A Window Pane Of A Vehicle |
US20070224842A1 (en) | 2004-11-12 | 2007-09-27 | Agc Automotive Americas R&D, Inc. | Electrical Connector For A Window Pane Of A Vehicle |
DE102004057630B3 (de) | 2004-11-30 | 2006-03-30 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Verfahren und Vorrichtung zum Löten von Anschlüssen mit Induktionswärme |
US7372610B2 (en) | 2005-02-23 | 2008-05-13 | Sage Electrochromics, Inc. | Electrochromic devices and methods |
US7593154B2 (en) | 2005-10-11 | 2009-09-22 | Sage Electrochromics, Inc. | Electrochromic devices having improved ion conducting layers |
GB0605884D0 (en) | 2006-03-24 | 2006-05-03 | Pilkington Plc | Electrical connector |
DE102008051730A1 (de) | 2008-10-15 | 2010-04-22 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Transparenter Gegenstand mit einem örtlich begrenzten, strukturierten, elektrisch beheizbaren, transparenten Bereich, Verfahren zu seiner Herstellung und seine Verwendung |
DE202008017611U1 (de) | 2008-12-20 | 2010-04-22 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Scheibenförmiges, transparentes, elektrisch beheizbares Verbundmaterial |
EP2367399A1 (fr) | 2010-03-02 | 2011-09-21 | Saint-Gobain Glass France | Disque doté d'un élément de raccordement électrique |
CA2884777C (fr) * | 2012-09-14 | 2018-02-27 | Saint-Gobain Glass France | Vitre dotee d'un element de raccordement electrique |
US10414378B2 (en) | 2013-07-02 | 2019-09-17 | Pilkington Group Limited | Window assembly |
DE102016112566B4 (de) | 2016-07-08 | 2022-10-06 | Richard Fritz Holding Gmbh | Verbindungsanordnung für einen elektrisch leitenden Kontakt sowie Verfahren zur Herstellung einer solchen Verbindungsanordnung |
US10263362B2 (en) * | 2017-03-29 | 2019-04-16 | Agc Automotive Americas R&D, Inc. | Fluidically sealed enclosure for window electrical connections |
JP7292616B2 (ja) * | 2018-06-05 | 2023-06-19 | Agc株式会社 | 端子付き車両用窓ガラス |
-
2021
- 2021-12-22 EP EP21830702.3A patent/EP4275453A1/fr active Pending
- 2021-12-22 WO PCT/EP2021/087413 patent/WO2022148667A1/fr active Application Filing
- 2021-12-22 CN CN202180006154.XA patent/CN115039513A/zh active Pending
- 2021-12-22 US US18/260,144 patent/US20240071650A1/en active Pending
- 2021-12-22 KR KR1020237022423A patent/KR20230113801A/ko active Pending
- 2021-12-22 JP JP2023541068A patent/JP2024502126A/ja active Pending
- 2021-12-22 MX MX2023008071A patent/MX2023008071A/es unknown
- 2021-12-22 CA CA3202914A patent/CA3202914A1/fr active Pending
-
2023
- 2023-06-23 ZA ZA2023/06522A patent/ZA202306522B/en unknown
Also Published As
Publication number | Publication date |
---|---|
CA3202914A1 (fr) | 2022-07-14 |
ZA202306522B (en) | 2024-11-27 |
CN115039513A (zh) | 2022-09-09 |
AU2021417404A9 (en) | 2025-03-13 |
JP2024502126A (ja) | 2024-01-17 |
KR20230113801A (ko) | 2023-08-01 |
WO2022148667A1 (fr) | 2022-07-14 |
AU2021417404A1 (en) | 2023-07-06 |
US20240071650A1 (en) | 2024-02-29 |
MX2023008071A (es) | 2023-07-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2896269B2 (fr) | Disque doté d'un élément de raccordement électrique | |
EP2896270B1 (fr) | Disque doté d'un élément de raccordement électrique | |
EP2923529B1 (fr) | Disque avec élément de raccordement électrique et plaques de compensateur | |
EP2879869B1 (fr) | Plaque de verre feuilletée avec mise en contact électrique | |
EP2923528B1 (fr) | Disque avec élément de raccordement électrique et barrette de liaison | |
EP2936926B1 (fr) | Vitre avec couche chauffante électrique | |
EP3235340B1 (fr) | Vitre doté d'un élément de raccordement électrique et câble de raccordement souple | |
EP3292737B1 (fr) | Disque doté d'un élément de raccordement électrique et élément de liaison disposé dessus | |
EP3064034B1 (fr) | Tranche comprenant au moins deux éléments de raccordement électriques et conducteur de liaison | |
WO2015165632A1 (fr) | Élément de connexion électrique servant à connecter une structure électriquement conductrice à un substrat | |
DE102006017675A1 (de) | Glasscheibe mit elektrischem Funktionselement mit durch Lötverbindung befestigten Anschlußdrähten und Verfahren zum Herstellen elektrischer Anschlüsse | |
WO2022148667A1 (fr) | Vitre à élément de connexion électrique | |
AU2021417404B2 (en) | Pane with electric connection element | |
DE202012012625U1 (de) | Scheibe mit elektrischer Kontaktierung | |
WO2023052100A1 (fr) | Câble plat pour détection de rupture, ensemble de connexion avec panneau composite, procédé de détection de rupture et utilisation du câble plat | |
EP4408662A1 (fr) | Ensemble de connexion avec panneau composite et câble plat |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: UNKNOWN |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20230612 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
RAV | Requested validation state of the european patent: fee paid |
Extension state: MA Effective date: 20230612 |