EP3685201A4 - HIGH DENSITY OPTO-ELECTRONIC INTERCONNECT CONFIGURATION USING PASSIVE ALIGNMENT - Google Patents

HIGH DENSITY OPTO-ELECTRONIC INTERCONNECT CONFIGURATION USING PASSIVE ALIGNMENT Download PDF

Info

Publication number: EP3685201A4
Authority: EP; European Patent Office
Prior art keywords: high density; passive alignment; interconnect configuration; electronic interconnect; opto
Prior art date: 2017-09-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP18859632.4A

Other languages

German (de)

French (fr)

Other versions

EP3685201B1 (en

EP3685201A1 (en

Inventor

Kalpendu Shastri

Anujit Shastri

Soham Pathak

Bipin Dama

Alan LEONHARTSBERGER

Rao Yelamarty

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Aayuna Inc

Original Assignee

Aayuna Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-09-20

Filing date

2018-09-20

Publication date

2021-07-07

2018-09-20 Application filed by Aayuna Inc filed Critical Aayuna Inc

2020-07-29 Publication of EP3685201A1 publication Critical patent/EP3685201A1/en

2021-07-07 Publication of EP3685201A4 publication Critical patent/EP3685201A4/en

2024-12-11 Application granted granted Critical

2024-12-11 Publication of EP3685201B1 publication Critical patent/EP3685201B1/en

Status Active legal-status Critical Current

2038-09-20 Anticipated expiration legal-status Critical

Classifications

- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
- G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
- G02B6/4208—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback using non-reciprocal elements or birefringent plates, i.e. quasi-isolators
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4216—Packages, e.g. shape, construction, internal or external details incorporating polarisation-maintaining fibres
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Electromagnetism (AREA)
Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Optical Couplings Of Light Guides (AREA)

EP18859632.4A 2017-09-20 2018-09-20 High density opto-electronic interconnection configuration utilizing passive alignment Active EP3685201B1 (en)

Applications Claiming Priority (6)

Application Number	Priority Date	Filing Date	Title
US201762560859P	2017-09-20	2017-09-20
US201762568013P	2017-10-04	2017-10-04
US201762568362P	2017-10-05	2017-10-05
US201862658668P	2018-04-17	2018-04-17
US16/135,423 US10725254B2 (en)	2017-09-20	2018-09-19	High density opto-electronic interconnection configuration utilizing passive alignment
PCT/US2018/051841 WO2019060473A1 (en)	2017-09-20	2018-09-20	High density opto-electronic interconnection configuration utilizing passive alignment

Publications (3)

Publication Number	Publication Date
EP3685201A1 EP3685201A1 (en)	2020-07-29
EP3685201A4 true EP3685201A4 (en)	2021-07-07
EP3685201B1 EP3685201B1 (en)	2024-12-11

Family

ID=65720142

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP18859632.4A Active EP3685201B1 (en)	2017-09-20	2018-09-20	High density opto-electronic interconnection configuration utilizing passive alignment

Country Status (4)

Country	Link
US (1)	US10725254B2 (en)
EP (1)	EP3685201B1 (en)
CN (1)	CN111095061A (en)
WO (1)	WO2019060473A1 (en)

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Also Published As

Publication number	Publication date
WO2019060473A1 (en)	2019-03-28
EP3685201B1 (en)	2024-12-11
EP3685201A1 (en)	2020-07-29
CN111095061A (en)	2020-05-01
US20190086618A1 (en)	2019-03-21
US10725254B2 (en)	2020-07-28

Publication	Publication Date	Title
EP3685201A4 (en)	2021-07-07	HIGH DENSITY OPTO-ELECTRONIC INTERCONNECT CONFIGURATION USING PASSIVE ALIGNMENT
EP3669319A4 (en)	2021-01-13	EXERGY TOKEN
EP3379307A4 (en)	2019-07-10	ALIGNMENT DEVICE AND ALIGNMENT METHOD
EP3479800A4 (en)	2019-12-18	ADMINISTRATION DEVICE
EP3308212A4 (en)	2019-03-06	BEAM ORIENTATION DEVICE
EP4295929C0 (en)	2025-05-21	TOKEN MANAGEMENT SYSTEM
EP3436111C0 (en)	2024-02-28	INJECTION DEVICE
EP3344326A4 (en)	2019-08-14	INTRAOSSEOUS INJECTION DEVICE
EP3871426A4 (en)	2022-11-30	PASSIVE FITTING TECHNIQUES
EP3275392A4 (en)	2019-01-16	LASER IRRADIATION DEVICE
EP3420885A4 (en)	2020-02-19	LASER ENDOSCOPE DEVICE
EP3747091C0 (en)	2023-11-29	INJECTION LOCKED LASER SYSTEM
EP3410549A4 (en)	2019-01-30	LASER DEVICE
EP3598705A4 (en)	2020-04-01	ROUTING ORDER
EP3281980A4 (en)	2019-01-23	RESIN COMPOSITION AND MULTILAYER STRUCTURE USING SAME, AND METHOD FOR ENHANCING LONG-TERM STABILITY
DK3497403T3 (en)	2021-10-04	GEOLOCATION OF PERSONS BASED ON A DERIVATIVE SOCIAL NETWORK
EP3334413A4 (en)	2019-04-03	ADMINISTRATION DEVICE
EP3358684A4 (en)	2019-08-21	SEMICONDUCTOR LASER DEVICE
EP3520171A4 (en)	2020-05-13	PASSIVE INTERMODULATION PROBE (PIM)
FR3033619B1 (en)	2017-09-08	DAMPING DEVICE
EP3317477A4 (en)	2019-03-06	DEVICE FOR LOCKING SCAFFOLDING BOARDS
EP3878606A4 (en)	2022-08-17	ALIGNMENT DEVICE
EP3553901A4 (en)	2020-04-01	LASER DEVICE
EP3398635A4 (en)	2019-08-28	INJECTION DEVICE
FR3060851B1 (en)	2018-12-07	OPTOELECTRONIC 3D IMAGING MODULE

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