EP3448133A4 - MULTI-ELEMENT WIRING BOARD, MANUFACTURING METHOD THEREOF, AND WIRING BOARD - Google Patents

MULTI-ELEMENT WIRING BOARD, MANUFACTURING METHOD THEREOF, AND WIRING BOARD Download PDF

Info

Publication number: EP3448133A4
Authority: EP; European Patent Office
Prior art keywords: wiring board; manufacturing; element wiring; board; wiring
Prior art date: 2016-04-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP17786025.1A

Other languages

German (de)

French (fr)

Other versions

EP3448133A1 (en

EP3448133B1 (en

Inventor

Yoshitomo ONITSUKA

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kyocera Corp

Original Assignee

Kyocera Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-04-22

Filing date

2017-04-20

Publication date

2019-12-18

2017-04-20 Application filed by Kyocera Corp filed Critical Kyocera Corp

2019-02-27 Publication of EP3448133A1 publication Critical patent/EP3448133A1/en

2019-12-18 Publication of EP3448133A4 publication Critical patent/EP3448133A4/en

2020-12-02 Application granted granted Critical

2020-12-02 Publication of EP3448133B1 publication Critical patent/EP3448133B1/en

Status Active legal-status Critical Current

2037-04-20 Anticipated expiration legal-status Critical

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/058—Holders or supports for surface acoustic wave devices
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
- H03B5/326—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator the resonator being an acoustic wave device, e.g. SAW or BAW device
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Acoustics & Sound (AREA)
General Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Computer Hardware Design (AREA)
Power Engineering (AREA)
Optics & Photonics (AREA)
Chemical & Material Sciences (AREA)
Inorganic Chemistry (AREA)
Structure Of Printed Boards (AREA)
Ceramic Engineering (AREA)

EP17786025.1A 2016-04-22 2017-04-20 Multipiece wiring board, wiring board, and method for manufacturing multipiece wiring board Active EP3448133B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2016086267		2016-04-22
PCT/JP2017/015867 WO2017183688A1 (en)	2016-04-22	2017-04-20	Multipiece wiring board, wiring board, and method for manufacturing multipiece wiring board

Publications (3)

Publication Number	Publication Date
EP3448133A1 EP3448133A1 (en)	2019-02-27
EP3448133A4 true EP3448133A4 (en)	2019-12-18
EP3448133B1 EP3448133B1 (en)	2020-12-02

Family

ID=60116836

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP17786025.1A Active EP3448133B1 (en)	2016-04-22	2017-04-20	Multipiece wiring board, wiring board, and method for manufacturing multipiece wiring board

Country Status (6)

Country	Link
US (2)	US10499510B2 (en)
EP (1)	EP3448133B1 (en)
JP (1)	JP6517942B2 (en)
KR (1)	KR102021800B1 (en)
CN (1)	CN108781502B (en)
WO (1)	WO2017183688A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7153438B2 (en) *	2017-10-26	2022-10-14	日東電工株式会社	Substrate assembly sheet
CN113632189B (en) *	2019-03-27	2023-04-28	松下知识产权经营株式会社	Electrolytic capacitor and method for manufacturing the same
WO2021106655A1 (en) *	2019-11-26	2021-06-03	京セラ株式会社	Package for housing electronic component, electronic device, and electronic module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20090166895A1 (en) *	2007-12-26	2009-07-02	Sanyo Electric Co., Ltd.	Circuit substrate, circuit device and manufacturing process thereof
WO2011049234A1 (en) *	2009-10-21	2011-04-28	三洋電機株式会社	Substrate and method for manufacturing circuit device using same
EP2514576A1 (en) *	2011-04-19	2012-10-24	NGK Insulators, Ltd.	A method of producing ceramic substrates

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH11163478A (en) *	1997-11-28	1999-06-18	Kyocera Corp	Ceramic substrate with split grooves
JP4812516B2 (en)	2006-05-29	2011-11-09	京セラ株式会社	Multiple wiring board
JP5297139B2 (en) *	2008-10-09	2013-09-25	新光電気工業株式会社	Wiring board and manufacturing method thereof
JP5499518B2 (en) *	2009-05-22	2014-05-21	パナソニック株式会社	Method for manufacturing thin film chip resistor
JP5355246B2 (en) *	2009-06-25	2013-11-27	京セラ株式会社	Multi-cavity wiring board, wiring board and electronic device
JP2012009767A (en) *	2009-11-27	2012-01-12	Kyocera Corp	Multi-piece wiring board, method of manufacturing same, wiring board, and method of manufacturing same
US8975535B2 (en) *	2009-12-24	2015-03-10	Kyocera Corporation	Many-up wiring substrate, wiring substrate, and electronic device
US9049793B2 (en) *	2010-10-08	2015-06-02	Ngk Spark Plug Co., Ltd.	Multi-piece-array and method of manufacturing the same
JP5308423B2 (en)	2010-10-12	2013-10-09	日本特殊陶業株式会社	GREEN SHEET GROOVE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING MULTI-PLEASE
JP5559717B2 (en) *	2011-02-01	2014-07-23	日本特殊陶業株式会社	Manufacturing method of electronic parts
JP6006474B2 (en) *	2011-04-25	2016-10-12	日本特殊陶業株式会社	Wiring board, multi-cavity wiring board, and manufacturing method thereof
JP2013125855A (en) *	2011-12-14	2013-06-24	Seiko Epson Corp	Ceramic substrate, electronic device and electronic apparatus, manufacturing method of electronic device and manufacturing method of ceramic substrate
WO2013099854A1 (en) *	2011-12-27	2013-07-04	日本特殊陶業株式会社	Circuit board and multi-cavity circuit board
CN103152990B (en) *	2013-03-25	2016-03-23	乐健科技（珠海）有限公司	For the preparation method of the ceramic base printed circuit board that LED installs

2017
- 2017-04-20 CN CN201780017194.8A patent/CN108781502B/en active Active
- 2017-04-20 KR KR1020177027706A patent/KR102021800B1/en active Active
- 2017-04-20 WO PCT/JP2017/015867 patent/WO2017183688A1/en active Application Filing
- 2017-04-20 JP JP2017548079A patent/JP6517942B2/en active Active
- 2017-04-20 EP EP17786025.1A patent/EP3448133B1/en active Active
- 2017-04-20 US US15/570,997 patent/US10499510B2/en active Active
2019
- 2019-12-02 US US16/700,791 patent/US10945338B2/en active Active

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20090166895A1 (en) *	2007-12-26	2009-07-02	Sanyo Electric Co., Ltd.	Circuit substrate, circuit device and manufacturing process thereof
WO2011049234A1 (en) *	2009-10-21	2011-04-28	三洋電機株式会社	Substrate and method for manufacturing circuit device using same
EP2514576A1 (en) *	2011-04-19	2012-10-24	NGK Insulators, Ltd.	A method of producing ceramic substrates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2017183688A1 *

Also Published As

Publication number	Publication date
JP6517942B2 (en)	2019-05-22
EP3448133A1 (en)	2019-02-27
KR20180116125A (en)	2018-10-24
CN108781502A (en)	2018-11-09
US10945338B2 (en)	2021-03-09
US10499510B2 (en)	2019-12-03
US20180324953A1 (en)	2018-11-08
JPWO2017183688A1 (en)	2018-04-26
KR102021800B1 (en)	2019-09-17
US20200107448A1 (en)	2020-04-02
WO2017183688A1 (en)	2017-10-26
CN108781502B (en)	2021-11-30
EP3448133B1 (en)	2020-12-02

Publication	Publication Date	Title
EP3322265A4 (en)	2019-03-06	METHOD OF MANUFACTURING WIRING BOARD
EP3345215A4 (en)	2019-02-20	SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
PT3319952T (en)	2020-04-22	CANABIDIOL AND DELTA-9-TETRAHYDROCANABINOL PRODUCTION PROCESS
EP3398645A4 (en)	2019-01-09	MICROSTRUCTURE FOR PERCUTANEOUS ABSORPTION AND METHOD FOR MANUFACTURING THE SAME
EP3302111A4 (en)	2019-02-20	KNITTED BRAKE AND METHOD FOR MANUFACTURING THE SAME
EP3484319A4 (en)	2020-04-08	CAP AND CAP MANUFACTURING METHOD
EP3336408A4 (en)	2019-03-20	FOLDABLE STRUCTURE, METHOD FOR MANUFACTURING FOLDABLE STRUCTURE, DEVICE FOR FABRICATING FOLDABLE STRUCTURE, AND PROGRAM
EP3406442A4 (en)	2019-07-03	LAMINATE AND METHOD FOR PRODUCING THE SAME
EP3660938A4 (en)	2021-04-07	ENCAPSULATION STRUCTURE, DISPLAY BOARD AND MANUFACTURING METHOD FOR IT
EP3381066A4 (en)	2019-07-24	MEMORIST DEVICE AND METHOD FOR MANUFACTURING THE SAME
FR3032064B1 (en)	2018-03-09	OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP3335255A4 (en)	2019-04-03	ORGANIC ELECTROLUMINESCENCE APPARATUS AND METHOD FOR MANUFACTURING THE SAME
EP3464656C0 (en)	2024-01-03	MANUFACTURING APPARATUS AND METHOD
EP3557349A4 (en)	2020-01-01	SUBSTRATE MANUFACTURING SYSTEM AND SUBSTRATE MANUFACTURING METHOD
EP3321987A4 (en)	2019-04-03	HOUSING STRUCTURE, SOFT SCREEN, AND METHOD FOR MANUFACTURING HOUSING STRUCTURE
EP3467880A4 (en)	2019-05-22	SOLAR MODULE AND METHOD FOR MANUFACTURING THE SAME
EP3308807A4 (en)	2019-02-13	POROUS STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
FR3023064B1 (en)	2018-02-02	PHOTOVOLTAIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP3346509A4 (en)	2019-04-17	DEEP ULTRAVIOLET LED AND METHOD FOR MANUFACTURING THE SAME
EP3388698C0 (en)	2024-05-01	BOLT AND ITS MANUFACTURING METHOD
EP3439760A4 (en)	2019-12-25	PASSIVE SAMPLER AND MANUFACTURING METHODS
FR3022396B1 (en)	2016-07-22	BISPECTRAL MATRIX SENSOR AND METHOD FOR MANUFACTURING THE SAME
KR102469316B9 (en)	2023-05-11	Airbag fabric and its manufacturing method
FR3019536B1 (en)	2016-05-13	BOTTLE AND METHOD FOR MANUFACTURING THE SAME
EP3704551A4 (en)	2021-08-18	DISTRIBUTED MANUFACTURING PROCESS

Legal Events

Date	Code	Title	Description
2017-10-28	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2019-01-25	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2019-01-25	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2019-02-27	17P	Request for examination filed	Effective date: 20171030
2019-02-27	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2019-02-27	AX	Request for extension of the european patent	Extension state: BA ME
2019-07-31	DAV	Request for validation of the european patent (deleted)
2019-07-31	DAX	Request for extension of the european patent (deleted)
2019-11-12	REG	Reference to a national code	Ref country code: DE Ref legal event code: R079 Ref document number: 602017028881 Country of ref document: DE Free format text: PREVIOUS MAIN CLASS: H05K0001020000 Ipc: H01L0023130000
2019-12-18	A4	Supplementary search report drawn up and despatched	Effective date: 20191118
2019-12-18	RIC1	Information provided on ipc code assigned before grant	Ipc: H05K 3/00 20060101ALI20191112BHEP Ipc: H01L 23/13 20060101AFI20191112BHEP
2020-08-02	GRAP	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOSNIGR1
2020-08-02	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: GRANT OF PATENT IS INTENDED
2020-09-02	INTG	Intention to grant announced	Effective date: 20200803
2020-10-28	GRAS	Grant fee paid	Free format text: ORIGINAL CODE: EPIDOSNIGR3
2020-10-30	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
2020-10-30	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE PATENT HAS BEEN GRANTED
2020-12-02	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2020-12-02	REG	Reference to a national code	Ref country code: GB Ref legal event code: FG4D
2020-12-15	REG	Reference to a national code	Ref country code: AT Ref legal event code: REF Ref document number: 1341850 Country of ref document: AT Kind code of ref document: T Effective date: 20201215 Ref country code: CH Ref legal event code: EP
2020-12-23	REG	Reference to a national code	Ref country code: IE Ref legal event code: FG4D
2020-12-24	REG	Reference to a national code	Ref country code: DE Ref legal event code: R096 Ref document number: 602017028881 Country of ref document: DE
2021-04-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210302 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210303 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202
2021-05-12	REG	Reference to a national code	Ref country code: NL Ref legal event code: MP Effective date: 20201202
2021-05-15	REG	Reference to a national code	Ref country code: AT Ref legal event code: MK05 Ref document number: 1341850 Country of ref document: AT Kind code of ref document: T Effective date: 20201202
2021-05-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210302
2021-06-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202
2021-07-12	REG	Reference to a national code	Ref country code: LT Ref legal event code: MG9D
2021-07-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210405
2021-08-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202
2021-09-03	REG	Reference to a national code	Ref country code: DE Ref legal event code: R097 Ref document number: 602017028881 Country of ref document: DE
2021-09-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210402
2021-10-08	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
2021-10-08	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT
2021-10-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202
2021-11-10	26N	No opposition filed	Effective date: 20210903
2021-11-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202
2021-12-29	GBPC	Gb: european patent ceased through non-payment of renewal fee	Effective date: 20210420
2021-12-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210420
2022-01-19	REG	Reference to a national code	Ref country code: BE Ref legal event code: MM Effective date: 20210430
2022-01-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210430 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210430 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202 Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210420
2022-04-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210420
2022-06-01	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210402
2022-07-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210430
2023-06-14	P01	Opt-out of the competence of the unified patent court (upc) registered	Effective date: 20230508
2023-06-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202
2023-07-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20170420
2024-04-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202
2024-05-31	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: FR Payment date: 20240308 Year of fee payment: 8
2024-06-28	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202
2024-07-10	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: DE Payment date: 20240227 Year of fee payment: 8
2024-09-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201202