CN103152990B - For the preparation method of the ceramic base printed circuit board that LED installs - Google Patents
For the preparation method of the ceramic base printed circuit board that LED installs Download PDFInfo
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- CN103152990B CN103152990B CN201310096704.9A CN201310096704A CN103152990B CN 103152990 B CN103152990 B CN 103152990B CN 201310096704 A CN201310096704 A CN 201310096704A CN 103152990 B CN103152990 B CN 103152990B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 113
- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- 238000009434 installation Methods 0.000 claims abstract description 22
- 230000011218 segmentation Effects 0.000 claims abstract description 20
- 238000003698 laser cutting Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 30
- 239000011368 organic material Substances 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- Led Device Packages (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a kind of preparation method of the ceramic base printed circuit board for LED installation, it comprises: preparation comprises the Combined ceramic base printed circuit board in multiple printed circuit board (PCB) region, and each printed circuit board (PCB) region forms a ceramic base printed circuit board; Slot segmentation is formed between the adjacent printed circuit boards region of described Combined ceramic base printed circuit board; Bend described Combined ceramic base printed circuit board along described slot segmentation, thus this Combined ceramic base printed circuit board is split as multiple ceramic base printed circuit board.The present invention forms slot segmentation by the mode of laser cutting or machine cuts between the adjacent printed circuit boards region of Combined ceramic base printed circuit board, Combined ceramic base printed circuit board carried out splitting along slot segmentation and disposablely obtains multiple ceramic base printed circuit board, improve the production efficiency of ceramic base printed circuit board.
Description
Technical field
The present invention relates to LED applied technical field, be specifically related to a kind of preparation method of the ceramic base printed circuit board for LED installation.
Background technology
In recent years, LED light source, due to the remarkable advantage that its life-span is long, light efficiency is high, radiation is low with low in energy consumption, is widely applied in various fields.
Adjoint in recent years to the requirement of LED light device miniaturization, the size for the printed circuit board (PCB) of LED installation pursues miniaturization.The miniaturization of LED light device is had higher requirement to the heat radiation of the printed circuit board (PCB) installed for LED and electric property simultaneously, for this reason, proposes the technical scheme adopting ceramic base printed circuit board as LED installation base plate.
Miniaturization for the ceramic base printed circuit board of LED installation adds the preparation difficulty of ceramic base printed circuit board, makes the preparation efficiency of ceramic base printed circuit board lower.
Summary of the invention
In view of this, be necessary the problem mentioned for background technology, a kind of method preparing ceramic base printed circuit board is expeditiously provided.
The object of the invention is to be achieved through the following technical solutions:
For a preparation method for the ceramic base printed circuit board that LED installs, it comprises the following steps:
S1, preparation comprise the Combined ceramic base printed circuit board in multiple printed circuit board (PCB) region, and each printed circuit board (PCB) region forms a ceramic base printed circuit board, and the preparation method of described Combined ceramic base printed circuit board comprises:
S11, ceramic substrate is provided, is formed with the organic material circuit board of multiple first through hole and is formed with the adhesive layer of multiple second through hole;
S12, by superimposed successively to described ceramic substrate, adhesive layer and organic material circuit board, ensureing in lamination process that the first through hole and the second through hole one_to_one corresponding form the blind slot for installing LED, is ceramic base plate surface bottom blind slot;
S13, superimposed good ceramic substrate, adhesive layer and organic material circuit board are put into press equipment carry out pressing;
S2, between the adjacent printed circuit boards region of described Combined ceramic base printed circuit board, form slot segmentation;
S3, bend described Combined ceramic base printed circuit board along described slot segmentation, thus this Combined ceramic base printed circuit board is split as multiple ceramic base printed circuit board.
The preparation method of described Combined ceramic base printed circuit board also comprises:
S14, offer the installation through hole for fixedly mounting ceramic base printed circuit board in each printed circuit board (PCB) region of Combined ceramic base printed circuit board.Or the preparation method of the described ceramic base printed circuit board for LED installation, also comprises:
S4, on described multiple ceramic base printed circuit board, offer installation through hole for fixedly mounting ceramic base printed circuit board respectively.
Described slot segmentation is formed by the mode of machine cuts or laser cutting.
Described slot segmentation is V-arrangement or U-lag, and its degree of depth is the half of the gross thickness of ceramic base printed circuit board.
Described ceramic substrate to have the reflecting rate of more than 88% for the surface of installing LED to visible ray.
Described ceramic substrate to have the reflecting rate of more than 90% for the surface of installing LED to visible ray.
Described organic material circuit board is individual layer, bilayer or multilayer board.
Compared with prior art, the present invention possesses following advantage:
The present invention forms slot segmentation by the mode of laser cutting or machine cuts between the adjacent printed circuit boards region of Combined ceramic base printed circuit board, Combined ceramic base printed circuit board carried out splitting along slot segmentation and disposablely obtains multiple ceramic base printed circuit board, improve the production efficiency of ceramic base printed circuit board.
Accompanying drawing explanation
Fig. 1 is the Facad structure schematic diagram of the ceramic base printed circuit board adopting the method for the embodiment of the present invention to make;
Fig. 2 is the cross-sectional view of the ceramic base printed circuit board adopting the method for the embodiment of the present invention to make;
Fig. 3 is the cross-sectional view of ceramic substrate in the S11 of the embodiment of the present invention, organic material circuit board and adhesive layer.
Fig. 4 is in the S12 of the embodiment of the present invention, the cross-sectional view that ceramic substrate, adhesive layer and organic material circuit board are superimposed successively;
Fig. 5 is the cross-sectional view forming slot segmentation in the S2 of the embodiment of the present invention between the adjacent printed circuit boards region of Combined ceramic base printed circuit board.
Embodiment
As shown in Figures 1 and 2, the ceramic base printed circuit board for LED installation of the present embodiment comprises: the ceramic substrate 1 be combined as a whole by adhesive layer 2 and organic material circuit board 3, described organic material circuit board 3 is formed with some first through holes 31, described adhesive layer 2 is formed with some second through holes 21, the shape of described first through hole 31 and the second through hole 21 and size one_to_one corresponding respectively, described ceramic substrate 1 is exposed by the first through hole 31 and the second through hole 21, thus on ceramic base printed circuit board described in the present embodiment, form some blind slots 4 for installing LED.Described LED can be arranged on the surface of the described ceramic substrate 1 bottom as described blind slot 4, and the heat that LED is produced can conduct to described ceramic substrate 1 in time and realize heat radiation.
As shown in Figure 1, ceramic base printed circuit board is rectangle, and its a pair across corner is offered one respectively and installed through hole 5, for passing for secure components such as screws thus being fixed by this ceramic base printed circuit board.In fact, the correct position of the ceramic base printed circuit board of the present invention all can be offered at least one and install through hole, and described ceramic base printed circuit board can be fixed installation by the cooperation of the secure components such as screw and described installation through hole.Certainly, ceramic base printed circuit board also can be other shapes such as circle, hexagon.
Described ceramic substrate 1 can be the ceramic substrate that aluminium oxide ceramic substrate, aluminum nitride ceramic substrate etc. have excellent thermal conductivity and reflectivity.Described ceramic substrate 1 to have the reflecting rate of more than 88% for the surface of installing LED to visible ray, preferably there is the reflecting rate of more than 90%, make the ceramic base printed circuit board of the present embodiment have excellent reflective function thus, thus the light that the LED be mounted thereon is launched can be fully utilized.Described adhesive layer 2 is epoxy glue layer in the present embodiment, it is easily understood that this adhesive layer 2 also can be the adhesive material that organic material circuit board and ceramic substrate combine can be prepared from by any other.Described organic material circuit board 3 is single layer board, comprises organic material substrate 32, is formed in the layers of copper circuit 33 of this organic material substrate 32 outer surface and covers the outer surface of described organic material substrate 32 and the solder mask 34 of corresponding layers of copper circuit 33.Wherein, described organic material substrate 32 is prepared from by the organic material of such as FR4 or BT etc.Be understandable that, organic material circuit board can also be double-deck or multilayer circuit board.
The method preparing the above-mentioned ceramic base printed circuit board for LED installation comprises the following steps:
S1, preparation comprise the Combined ceramic base printed circuit board in multiple printed circuit board (PCB) region, and each printed circuit board (PCB) region forms a ceramic base printed circuit board, and the preparation method of described Combined ceramic base printed circuit board specifically comprises:
S11, as shown in Figure 3, provides ceramic substrate 1, is formed with the organic material circuit board 3 of multiple first through hole 31 and is formed with the adhesive layer 2 of multiple second through hole 21;
S12, as shown in Figure 4, by superimposed successively to described ceramic substrate 1, adhesive layer 2 and organic material circuit board 3, in lamination process, ensure the first through hole 31 and the second through hole 21 one_to_one corresponding;
S13, superimposed good ceramic substrate 1, adhesive layer 2 and organic material circuit board 3 are put into press equipment carry out pressing;
S14, offer the installation through hole 5 for fixedly mounting ceramic base printed circuit board in each printed circuit board (PCB) region of Combined ceramic base printed circuit board; The method preparing ceramic substrate, adhesive layer and organic material circuit board is the ordinary technical knowledge of those skilled in the art, therefore does not explain at this.
S2, as shown in Figure 5, slot segmentation 6 is formed between the adjacent printed circuit boards region of Combined ceramic base printed circuit board, slot segmentation 6 can be formed by the mode of machine cuts or laser cutting, its shape and size only need make modular printing circuit board can carry out splitting along slot segmentation, such as: slot segmentation 6 is V-arrangement or U-lag, and its degree of depth is roughly the half of ceramic base printed circuit board gross thickness;
S3, bend described Combined ceramic base printed circuit board along described slot segmentation 6, thus this Combined ceramic base printed circuit board is split as multiple ceramic base printed circuit board.
Can once prepare multiple ceramic base printed circuit board thus, improve the production efficiency of ceramic base printed circuit board.
In fact, offering the step of installing through hole 5 and also can carry out after S3 completes, namely offering the installation through hole 5 for fixedly mounting ceramic base printed circuit board respectively at the correct position of the multiple ceramic base printed circuit boards made.Described suitable position can be edge or the corner location of ceramic base printed circuit board.
Described press equipment can select traditional laminating machine or fast press, and the temperature and time of hot pressing is substantially suitable with the time with hot pressing temperature when preparing organic material circuit board.
Claims (7)
1., for a preparation method for the ceramic base printed circuit board of LED installation, it is characterized in that comprising:
S1, preparation comprise the Combined ceramic base printed circuit board in multiple printed circuit board (PCB) region, and each printed circuit board (PCB) region forms a ceramic base printed circuit board, and the preparation method of described Combined ceramic base printed circuit board comprises:
S11, ceramic substrate is provided, is formed with the organic material circuit board of multiple first through hole and is formed with the adhesive layer of multiple second through hole;
S12, by superimposed successively to described ceramic substrate, adhesive layer and organic material circuit board, ensureing in lamination process that the first through hole and the second through hole one_to_one corresponding form the blind slot for installing LED, is ceramic base plate surface bottom blind slot;
S13, superimposed good ceramic substrate, adhesive layer and organic material circuit board are put into press equipment carry out pressing;
S2, between the adjacent printed circuit boards region of described Combined ceramic base printed circuit board, form slot segmentation;
S3, bend described Combined ceramic base printed circuit board along described slot segmentation, thus this Combined ceramic base printed circuit board is split as multiple ceramic base printed circuit board;
The described ceramic substrate provided in S11 to have the reflecting rate of more than 88% for the surface of installing LED to visible ray.
2. the preparation method of the ceramic base printed circuit board for LED installation according to claim 1, is characterized in that: in the preparation method of described Combined ceramic base printed circuit board, after described S13, also comprise:
S14, offer the installation through hole for fixedly mounting ceramic base printed circuit board in each printed circuit board (PCB) region of Combined ceramic base printed circuit board.
3. the preparation method of the ceramic base printed circuit board for LED installation according to claim 1, is characterized in that: after described S3, also comprise:
S4, on described multiple ceramic base printed circuit board, offer installation through hole for fixedly mounting ceramic base printed circuit board respectively.
4. the preparation method of the ceramic base printed circuit board for LED installation according to claim 1, it is characterized in that: in S2, described slot segmentation is formed by the mode of machine cuts or laser cutting.
5. the preparation method of the ceramic base printed circuit board for LED installation according to claim 4, it is characterized in that: described slot segmentation is V-arrangement or U-lag, its degree of depth is the half of the gross thickness of described ceramic base printed circuit board.
6. the preparation method of ceramic base printed circuit board installed for LED according to claim 1, is characterized in that: the described ceramic substrate provided in S11 to have the reflecting rate of more than 90% for the surface of installing LED to visible ray.
7. the preparation method of the ceramic base printed circuit board for LED installation according to claim 1, is characterized in that: the described organic material circuit board provided in S11 is single or multiple lift printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310096704.9A CN103152990B (en) | 2013-03-25 | 2013-03-25 | For the preparation method of the ceramic base printed circuit board that LED installs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310096704.9A CN103152990B (en) | 2013-03-25 | 2013-03-25 | For the preparation method of the ceramic base printed circuit board that LED installs |
Publications (2)
| Publication Number | Publication Date |
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| CN103152990A CN103152990A (en) | 2013-06-12 |
| CN103152990B true CN103152990B (en) | 2016-03-23 |
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| CN201310096704.9A Active CN103152990B (en) | 2013-03-25 | 2013-03-25 | For the preparation method of the ceramic base printed circuit board that LED installs |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470215B (en) * | 2014-11-26 | 2017-12-26 | 乐健科技（珠海）有限公司 | The preparation method and products obtained therefrom of printed circuit board (PCB) with micro- radiator |
| US10499510B2 (en) * | 2016-04-22 | 2019-12-03 | Kyocera Corporation | Multi-piece wiring substrate, wiring substrate, and method for manufacturing multi-piece wiring substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1212820A (en) * | 1997-01-29 | 1999-03-31 | 摩托罗拉公司 | Method and combined circuit board for preventing delamination and sagging in course of manufacturing complex circuit board |
| CN101290913A (en) * | 2007-04-17 | 2008-10-22 | 晶元光电股份有限公司 | Electronic component assembly with composite carrier |
| US7745832B2 (en) * | 2004-09-24 | 2010-06-29 | Epistar Corporation | Semiconductor light-emitting element assembly with a composite substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008109055A (en) * | 2006-10-27 | 2008-05-08 | Cmk Corp | Collective printed wiring board |
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2013
- 2013-03-25 CN CN201310096704.9A patent/CN103152990B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1212820A (en) * | 1997-01-29 | 1999-03-31 | 摩托罗拉公司 | Method and combined circuit board for preventing delamination and sagging in course of manufacturing complex circuit board |
| US7745832B2 (en) * | 2004-09-24 | 2010-06-29 | Epistar Corporation | Semiconductor light-emitting element assembly with a composite substrate |
| CN101290913A (en) * | 2007-04-17 | 2008-10-22 | 晶元光电股份有限公司 | Electronic component assembly with composite carrier |
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| CN103152990A (en) | 2013-06-12 |
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