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EP3009735A1 - Light module including a diode - Google Patents

Light module including a diode Download PDF

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Publication number
EP3009735A1
EP3009735A1 EP15189690.9A EP15189690A EP3009735A1 EP 3009735 A1 EP3009735 A1 EP 3009735A1 EP 15189690 A EP15189690 A EP 15189690A EP 3009735 A1 EP3009735 A1 EP 3009735A1
Authority
EP
European Patent Office
Prior art keywords
diode
heat sink
light module
housing
central axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15189690.9A
Other languages
German (de)
French (fr)
Inventor
Stephan Sommerschuh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Vision SAS
Original Assignee
Valeo Vision SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Vision SAS filed Critical Valeo Vision SAS
Publication of EP3009735A1 publication Critical patent/EP3009735A1/en
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/16—Laser light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/176—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/49—Attachment of the cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
    • F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention is concerned with the field of light diodes, and preferably with high power laser diodes, intended to equip, for example, lighting systems mounted on motor vehicles. These diodes make it possible to produce beams whose shape and light distribution can be modulated at will. Such devices are described by way of example in the publication EP 2,063,170 , or in the publication EP 2 690 352 .
  • the diode is then rotated around the central axis until this optimal position is reached.
  • connection or connection pins used to supply and control the diode are generally arranged on the rear part of the diode, and pass through the support to be connected to the external electrical connection members.
  • connection pins are located around the rear central portion of the diode and are located on a circle whose center is disposed substantially on the central axis of the diode. In the most frequent case where the diode comprises only two pins, the two pins are located on a circle whose diameter corresponds to the segment connecting the two pins and whose center is located on the central axis of the diode.
  • the support on which the diode is disposed comprises a single substantially circular orifice through which the connection pins extend.
  • the diode is then positioned so that its central axis coincides with the axis of the orifice. And the diameter of the orifice is adjusted to allow the passage of the connecting pins. The central axis of the diode then passes through the hole in which the pins extend.
  • connection pins are no longer arranged on a circle whose center is placed on the central axis of the diode. And when the diode comprises only two pins, the central axis of the diode no longer passes through the middle of the segment connecting the two pins, or by this segment itself.
  • this type of diode requires to further increase the diameter of the orifice through which the connection pins pass to allow the rotation of the diode around its central axis. And the advantages of this new arrangement are lost in that the orifice being of larger diameter, the central portion of the diode may even less than previously evacuate the heat generated by the diode.
  • the object of the invention is to propose a light module, in particular for lighting and / or signaling, comprising a heat sink on which is mounted a light diode comprising a central axis, the heat sink comprising a body of which a front face is maintained. in abutment against a rear face of the diode, the body having at least one orifice passing through said body and opening on its front face through which pass one or more pins extending from the rear face of the diode.
  • the orifice is circular or oblong
  • This light module is characterized in that the central axis of the diode does not pass through an orifice through the body and through which extends a pin.
  • connection pins and the orifices are arranged appropriately, to establish a permanent contact between the hot spot of the diode and the heat sink, and to benefit from the advantages provided by the diodes now proposed by the manufacturers. .
  • the invention also relates to a lighting device, in particular a lighting and / or signaling device for a motor vehicle, comprising a light module according to one or the other of the preceding characteristics, and which is fixed to a frame of said light device by intermediate case.
  • the closure element can usefully be formed by a boss forming part of the frame.
  • the diode 40 preferably a high power laser diode, represented in FIGS. Figures 1 and 2 , comprises a forward-facing portion may comprise one or more front faces 43a, 43b axially offset relative to each other, and a rear face 42. Connection pins 41 emerge from the rear face 42. Here in number of two, the number of pins is not limiting.
  • the diode comprises a central axis xx ', substantially perpendicular to the front 43a and rear 42 faces and passing through the emission zone 44 of the actual light, which is the hottest point of the diode 40. The amount of heat generated by the light emission zone 44 is therefore maximum at the central axis xx '.
  • the diode 40 comprises a lateral edge 45, here in the form of a flange, in which two notches 46 are made, the use of which will be described in detail below.
  • the figure 3 illustrates a light device 50 according to the invention formed of the assembly of a heat sink 20, a housing 10 and a positioning disk 30.
  • the heat sink 20 comprises a body 24 whose front face 21 constitutes the bearing face against which is held the rear face 42 of the diode 40.
  • An orifice 23 passes through the body 24 of the heat sink to receive the connection pins 41, which therefore extend through the body 24.
  • the connection pins are connected to a power supply (not shown) via a connector (not shown) to which they access through the rear part of the heat sink 20 .
  • the figure 3 As a support for the present description illustrates a case in which the two connecting pins 41 pass through the same orifice 23 which, preferably, under these conditions has a substantially oblong shape.
  • this embodiment is not limiting, and one can very well envisage providing as many ports as pins so as to increase the contact area between the rear face of the diode and the front face of the body of the heat sink in order to promote heat exchange between these two elements as illustrated in figure 3bis wherein the orifices 23 have a substantially circular shape.
  • the front face 21 of the heat sink also comprises two lugs 22 arranged to fit into the notches 46 formed on the edge 45 of the diode 40. These lugs are intended to allow precise positioning of the diode on the face before 21 of the body 24 of the heat sink 20 and block the rotation about its central axis xx 'of the diode 40 relative to the body 24 of the heat sink 20.
  • the figure 7 allows to illustrate in more detail the positioning of the lugs 22 with respect to the notches 46 when the rear face 42 of the diode 10 bears against the front face 21 of the heat sink.
  • the light module according to the invention also comprises a housing 10 in which is inserted the heat sink 20.
  • the heat sink bears against the bottom 13 of the housing 10.
  • the housing 10 and the heat sink 20 are of complementary shape .
  • the angular position of the heat sink 20 relative to the housing 10 is adjustable around an axis XX '.
  • This axis of rotation XX ' is substantially perpendicular to the front face 21 of the body of the heat sink.
  • the orifices 23 and the lugs 22 By positioning the orifices 23 and the lugs 22 appropriately, it is arranged to make coincide the central axis xx 'of the diode with the axis of rotation XX' of the heat sink in the housing 10 when the diode bears against the front face 21 of the body 24 of the heat sink 20, and that the lugs 22 are introduced into the notches 46.
  • the orifice 23 is also arranged so that, once the diode mounted on the heat sink 20, the central axis xx 'of the diode does not pass through said orifice 23.
  • a fictitious disk 26 also represented in dotted line, centered on the axis xx 'coincides with the axis XX', on which the fictitious disk 47 of the diode 40 bears, so as to promote heat exchange between the part central of the diode 40 corresponding to the hottest zone and the heatsink 20.
  • the device according to the invention then allows the rotation of the heat sink 20 on which is mounted the diode 40 in the housing 10 about its axis XX ', corresponding to the central axis xx' of the diode 40, to adjust the device. lighting in which is inserted the light module, while obtaining an optimal evacuation of the heat produced by the diode.
  • the light module according to the invention thus makes it possible to put in contact a zone 47 of the rear face of the diode centered around the hot point and of the central axis xx 'with a zone 26 of the front face of the dissipator, whatever the type of diode used.
  • a window 11 is formed in the wall 13 forming the bottom of the housing 10 to allow the passage of the connecting son.
  • a closure element 30 is associated with the housing 10 to which it is mechanically connected.
  • This closure element 30 has the object, by enclosing the heat sink and the diode to inside the case, keep the diode resting against the front of the heat sink.
  • An opening 31 is made in the center of the closure element 30 to allow the passage of light rays emitted by the source 44.
  • the closure element bears on the flange 45 of the diode.
  • threads respectively disposed on the inner side face 12 of the housing and on the side face 32 of the closure member 30 allow to establish a mechanical connection type screw / nut between the closure member and the housing.
  • the mechanical connection mode between the closure element and the housing is not limiting and can also be done, for example, by means of clipping or snap-fastening means.
  • the closure element 30 presses the rear face 42 of the diode 40 against the front face 21 of the heat sink, and the rear face of the body of the heat sink bears against the bottom 13 of the housing 10, so that the diode is held in a fixed angular position and determined inside the housing 10.
  • the closure element may be a stand-alone part, as illustrated in Figures 3 to 6 . In which case it constitutes a complementary piece of the housing 10. It can also constitute a connecting piece forming part or not of the frame of a lighting device, and for fixing the housing 10 on said frame.
  • the housing is screwed onto the closure element so as to put the diode 40 and the heat sink back under axial pressure, and to prohibit the movement of the heat sink and the diode at the same time. inside the case 10.
  • the figure 4 illustrates a light module 50 assembled, in a side sectional view, and comprising a diode 40 mounted on the body 24 of a heat sink 20, arranged in a housing 10 closed by a closure element 30.
  • the orifice 23 is sufficiently offset with respect to the central axis xx 'of the diode to allow contact between the hot spot of the diode and the front face of the heat sink. This contact helps to promote the flow of heat from the rear central portion to the heat sink that is the heatsink.
  • FIGS. 5 and 6 illustrate an alternative embodiment of the heat sink whose body 24 supports exchange elements 25 extending axially in the rear part of the body 24 and passing through the opening 11 of the bottom 13 of the housing 10.
  • the embodiments of the heat sink represented in support of the present description are not limiting, and the light module according to the invention can accommodate a heat sink comprising air circulation means, means for the circulation of a coolant or heat transfer fluid for discharging heat to an external cold source, or a heat sink comprising a thermoelectric system based on the physical principles known as the Peltier effect.
  • the figure 8 represents a lighting device comprising a light module 50 according to the invention.
  • the lighting device 60 comprises a housing 61 on which a lens 62 is mounted.
  • the box also comprises an optical device of the type described in the publication. EP 2 690 352 already cited by reference and whose light module 50 is the primary light source.
  • An optical imaging system 66, a wavelength converting device 65, a scanning device 64 and the light module 50 are mounted on a frame 63 also supporting the housing 61.
  • the radiation from the light source of the diode 40 is directed to the scanning device 64 which distributes the light beam onto the wavelength conversion device 65.
  • the light re-emitted by the wavelength conversion device 65 is directed to the imaging optical system 66 which projects the light beam forward of the illumination device 60 through the lens 62.
  • the light module 50 comprises a high power laser diode 40 mounted to bear against the heat sink 20 inserted in the housing 10.
  • the closure element is here formed by a boss 67 forming part of the frame 63 and on which the housing 10 is screwed.
  • the adjustment of the angular position of the laser diode around its axis xx 'coincides with the axis XX' of rotation of the heat sink in the housing 10 is simply by slightly unscrewing the housing 10 and rotating the heatsink until 'the optimum position is reached. Once the adjustment is completed, the housing 10 is raised on the boss 67 acting as closure element.
  • a laser diode it is also applicable to a light source comprising at least one semiconductor emitter chip, preferably a light emitting diode.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

Module lumineux (50), notamment d'éclairage et/ou de signalisation, comprenant un dissipateur thermique (20) sur lequel est montée une diode lumineuse (40) comportant un axe central (xx'), le dissipateur thermique (20) comprenant un corps (24) dont une face (21) avant est maintenue en appui contre une face arrière (42) de la diode (40), le corps (24) comportant au moins un orifice (23) traversant ledit corps (24) et débouchant sur sa face avant (21) au travers duquel passent une ou plusieurs broches de connexion (41) s'étendant depuis la face arrière (42) de la diode (40). L'axe central de la diode (xx') ne passe pas par un orifice (23) traversant le corps (24) et au travers duquel s'étend une broche de connexion (41).A light module (50), in particular for lighting and / or signaling, comprising a heat sink (20) on which is mounted a light diode (40) having a central axis (xx '), the heat sink (20) comprising a body (24), one face (21) of which is held in abutment against a rear face (42) of the diode (40), the body (24) having at least one orifice (23) passing through said body (24) and opening on its front face (21) through which pass one or more connecting pins (41) extending from the rear face (42) of the diode (40). The central axis of the diode (xx ') does not pass through an orifice (23) passing through the body (24) and through which a connecting pin (41) extends.

Description

L'invention s'intéresse au domaine des diodes lumineuse, et de préférence aux diodes laser de forte puissance, destinées à équiper par exemple des systèmes d'éclairage montés sur des véhicules automobiles. Ces diodes permettent de réaliser des faisceaux dont la forme et la distribution de lumière sont modulables à volonté. De tels dispositifs sont décrits à titre d'exemple dans la publication EP 2 063 170 , ou encore dans la publication EP 2 690 352 .The invention is concerned with the field of light diodes, and preferably with high power laser diodes, intended to equip, for example, lighting systems mounted on motor vehicles. These diodes make it possible to produce beams whose shape and light distribution can be modulated at will. Such devices are described by way of example in the publication EP 2,063,170 , or in the publication EP 2 690 352 .

Ces diodes nécessitent toutefois d'être associées avec un dispositif de refroidissement efficace, en raison des grandes quantités de chaleur qu'elles produisent.These diodes, however, need to be associated with an effective cooling device, because of the large amounts of heat they produce.

A cet effet, il a été proposé de monter les diodes sur des supports faisant office de radiateurs permettant d'assembler la diode dans le système d'éclairage.For this purpose, it has been proposed to mount the diodes on supports acting as radiators for assembling the diode in the lighting system.

Pour optimiser l'orientation du faisceau lumineux émis par la diode, il est nécessaire de procéder à un réglage préalable du dispositif optique dans lequel la diode est montée, et de positionner avec précision la position angulaire de la diode autour de son axe central, passant sensiblement au centre de la partie de la diode émettrice de lumière, de manière à optimiser le rendement lumineux du dispositif.To optimize the orientation of the light beam emitted by the diode, it is necessary to pre-adjust the optical device in which the diode is mounted, and to accurately position the angular position of the diode around its central axis, passing substantially in the center of the portion of the light-emitting diode so as to optimize the luminous efficiency of the device.

On fait alors tourner la diode autour de l'axe central jusqu'à ce que cette position optimale soit atteinte.The diode is then rotated around the central axis until this optimal position is reached.

Les broches de connexion ou de raccordement servant à alimenter et à piloter la diode sont disposées en règle générale sur la partie arrière de la diode, et traversent le support pour être reliées aux organes de connexion électrique externes.The connection or connection pins used to supply and control the diode are generally arranged on the rear part of the diode, and pass through the support to be connected to the external electrical connection members.

Ces broches de connexion sont implantées autour de la partie centrale arrière de la diode et sont situées sur un cercle dont le centre est disposé sensiblement sur l'axe central de la diode. Dans le cas le plus fréquent où la diode ne comprend que deux broches, les deux broches sont situées sur un cercle dont le diamètre correspond au segment reliant les deux broches et dont le centre est situé sur l'axe central de la diode.These connection pins are located around the rear central portion of the diode and are located on a circle whose center is disposed substantially on the central axis of the diode. In the most frequent case where the diode comprises only two pins, the two pins are located on a circle whose diameter corresponds to the segment connecting the two pins and whose center is located on the central axis of the diode.

En règle générale, le support sur lequel est disposée la diode comporte un orifice sensiblement circulaire unique au travers duquel s'étendent les broches de connexion. La diode est alors positionnée de manière à ce que son axe central soit confondu avec l'axe de l'orifice. Et le diamètre de l'orifice est ajusté pour autoriser le passage des broches de raccordement. L'axe central de la diode passe alors par l'orifice dans lequel s'étendent les broches.As a general rule, the support on which the diode is disposed comprises a single substantially circular orifice through which the connection pins extend. The diode is then positioned so that its central axis coincides with the axis of the orifice. And the diameter of the orifice is adjusted to allow the passage of the connecting pins. The central axis of the diode then passes through the hole in which the pins extend.

Il a été observé toutefois que le point le plus chaud de la diode se trouvait précisément au niveau d'une partie centrale située autour de l'axe central de la diode. Il résulte alors de cet aménagement que le contact entre la partie arrière de la diode située autour de l'axe central, et correspondant à ce point chaud, et les moyens de refroidissement, est alors perdu au niveau de l'orifice par lequel passent les broches de connexion. Cette disposition entraine une diminution de la capacité du radiateur à évacuer la chaleur engendrée par la diode, ce qui augmente le risque d'endommagement de la diode par l'excès de chaleur produite.It was observed, however, that the hottest point of the diode was precisely at level of a central portion located around the central axis of the diode. It then follows from this arrangement that the contact between the rear part of the diode situated around the central axis, and corresponding to this hot point, and the cooling means, is then lost at the orifice through which the connection pins. This arrangement causes a reduction in the capacity of the radiator to evacuate the heat generated by the diode, which increases the risk of damaging the diode by the excess heat produced.

Conscients de ce phénomène de point chaud central, les fabricants de diodes laser ont proposé de décentrer l'implantation des broches de connexion par rapport à l'axe central de la diode de manière à permettre un meilleur contact entre le système de refroidissement et la partie centrale arrière où se trouve ce point chaud. Les broches de connexion ne sont donc plus disposées sur un cercle dont le centre est placé sur l'axe central de la diode. Et lorsque la diode ne comprend que deux broches, l'axe central de la diode ne passe plus par le milieu du segment reliant les deux broches, voire par ce segment lui-même.Conscious of this phenomenon of central hot spot, the manufacturers of laser diodes proposed to decentralize the implantation of the connection pins with respect to the central axis of the diode so as to allow a better contact between the cooling system and the part central rear where is this hot spot. The connection pins are no longer arranged on a circle whose center is placed on the central axis of the diode. And when the diode comprises only two pins, the central axis of the diode no longer passes through the middle of the segment connecting the two pins, or by this segment itself.

L'utilisation de ce type de diode nécessite d'augmenter encore davantage le diamètre de l'orifice par lequel passent les broches de connexion pour autoriser la rotation de la diode autour de son axe central. Et les avantages liés à cette nouvelle disposition sont perdus en ce que l'orifice étant de plus grand diamètre, la partie centrale de la diode peut encore moins qu'auparavant évacuer la chaleur générée par la diode.The use of this type of diode requires to further increase the diameter of the orifice through which the connection pins pass to allow the rotation of the diode around its central axis. And the advantages of this new arrangement are lost in that the orifice being of larger diameter, the central portion of the diode may even less than previously evacuate the heat generated by the diode.

L'invention a pour objet de proposer un module lumineux, notamment d'éclairage et/ou de signalisation, comprenant un dissipateur thermique sur lequel est montée une diode lumineuse comportant un axe central, le dissipateur thermique comprenant un corps dont une face avant est maintenue en appui contre une face arrière de la diode, le corps comportant au moins un orifice traversant ledit corps et débouchant sur sa face avant au travers duquel passent une ou plusieurs broches s'étendant depuis la face arrière de la diode. De préférence, l'orifice est de forme circulaire ou oblongThe object of the invention is to propose a light module, in particular for lighting and / or signaling, comprising a heat sink on which is mounted a light diode comprising a central axis, the heat sink comprising a body of which a front face is maintained. in abutment against a rear face of the diode, the body having at least one orifice passing through said body and opening on its front face through which pass one or more pins extending from the rear face of the diode. Preferably, the orifice is circular or oblong

Ce module lumineux se caractérise en ce que l'axe central de la diode ne passe pas par un orifice traversant le corps et au travers duquel s'étend une broche.This light module is characterized in that the central axis of the diode does not pass through an orifice through the body and through which extends a pin.

De la sorte, le contact entre la face arrière de la diode située autour de l'axe central et correspondant au point chaud de la diode et la face avant du dissipateur thermique est rétabli.In this way, the contact between the rear face of the diode located around the central axis and corresponding to the hot spot of the diode and the front face of the heat sink is restored.

Ce montage permet ainsi, en disposant les broches de connexion et les orifices de manière appropriée, d'établir un contact permanent entre le point chaud de la diode et le dissipateur thermique, et de bénéficier des avantages procurés par les diodes proposées désormais par les fabricants.This arrangement thus makes it possible, by arranging the connection pins and the orifices appropriately, to establish a permanent contact between the hot spot of the diode and the heat sink, and to benefit from the advantages provided by the diodes now proposed by the manufacturers. .

Le module lumineux selon l'invention peut aussi comprendre isolément ou en combinaison les caractéristiques suivantes :

  • la face arrière de la diode comprend un disque fictif, centré sur l'axe central, qui est en contact avec la face avant du corps du dissipateur thermique.
  • le corps du dissipateur thermique est monté dans un boitier, de sorte que la position angulaire du corps du dissipateur thermique par rapport audit boitier est ajustable en rotation autour d'un axe sensiblement perpendiculaire à la face avant du corps dudit corps du dissipateur thermique.
  • Le boitier et le dissipateur thermique sont de forme complémentaire.
  • l'axe de rotation du dissipateur thermique dans le boitier et l'axe central de la diode sont confondus.
  • l'axe de rotation du dissipateur thermique ne passe pas par un orifice pratiqué dans le corps du dissipateur thermique.
  • le corps du dissipateur thermique comprend autant d'orifice, destinés chacun à recevoir une broche, que de broches s'étendant depuis la face arrière de la diode
  • le corps du dissipateur thermique et la diode comprennent des moyens pour bloquer la rotation de la diode autour de son axe central par rapport au corps du dissipateur thermique.
  • les moyens pour bloquer la rotation de la diode sont formés par des ergots, disposés sur la face avant du corps du dissipateur thermique, collaborant avec des entailles pratiquées sur des bords latéraux de la diode.
  • Le module lumineux comprend en outre un élément de fermeture venant en appui sur une partie avant de la diode laser pour maintenir ladite diode en appui sur la face avant du corps du dissipateur thermique.
  • l'élément de fermeture et le boitier sont liés mécaniquement l'un à l'autre de manière à prévenir la sortie du dissipateur thermique dudit boitier.
  • l'élément de fermeture et le boitier sont liés mécaniquement l'un à l'autre par une liaison de type vis/écrou ou par des moyens de clipsage ou d'encliquetage.
  • le dissipateur thermique comprend des éléments d'échange formant un puits de chaleur s'étendant au travers d'une fenêtre disposée dans un fond du boitier.
  • le dissipateur thermique comprend des moyens pour la circulation d'un liquide de refroidissement.
  • le dissipateur thermique comprend des moyens pour la circulation de l'air.
  • le dissipateur thermique comprend un système de refroidissement thermoélectrique.
  • la diode lumineuse est une diode laser de forte puissance.
The light module according to the invention may also comprise in isolation or in combination the following characteristics:
  • the rear face of the diode comprises a dummy disk, centered on the central axis, which is in contact with the front face of the body of the heat sink.
  • the body of the heat sink is mounted in a housing, so that the angular position of the body of the heat sink relative to said housing is adjustable in rotation about an axis substantially perpendicular to the front face of the body of said body of the heat sink.
  • The housing and the heat sink are of complementary shape.
  • the axis of rotation of the heat sink in the housing and the central axis of the diode are merged.
  • the axis of rotation of the heat sink does not pass through an orifice in the body of the heat sink.
  • the body of the heat sink comprises as many ports, each intended to receive a pin, as pins extending from the rear face of the diode
  • the body of the heat sink and the diode comprise means for blocking the rotation of the diode about its central axis relative to the body of the heat sink.
  • the means for blocking the rotation of the diode are formed by lugs, arranged on the front face of the body of the heat sink, collaborating with notches made on the lateral edges of the diode.
  • The light module further comprises a closure element bearing on a front portion of the laser diode to maintain said diode resting on the front face of the body of the heat sink.
  • the closure element and the housing are mechanically connected to each other so as to prevent the output of the heat sink from said housing.
  • the closure element and the housing are mechanically connected to each other by a screw / nut type connection or clipping or latching means.
  • the heat sink comprises heat exchange elements forming a heat sink extending through a window disposed in a bottom of the housing.
  • the heat sink comprises means for the circulation of a coolant.
  • the heat sink comprises means for the circulation of air.
  • the heat sink includes a thermoelectric cooling system.
  • the light diode is a high power laser diode.

L'invention concerne également un dispositif lumineux, notamment d'éclairage et/ou de signalisation pour véhicule automobile, comprenant un module lumineux selon l'une ou l'autre des caractéristiques précédentes, et qui est fixé à un châssis dudit dispositif lumineux par l'intermédiaire du boitier. L'élément de fermeture peut utilement être formé par un bossage faisant partie du châssis.The invention also relates to a lighting device, in particular a lighting and / or signaling device for a motor vehicle, comprising a light module according to one or the other of the preceding characteristics, and which is fixed to a frame of said light device by intermediate case. The closure element can usefully be formed by a boss forming part of the frame.

L'invention sera mieux comprise à la lecture des figures annexées, qui sont fournies à titre d'exemples et ne présentent aucun caractère limitatif, dans lesquelles :

  • Les figures 1 et 2 représentent des vues en perspectives de la face avant et arrière d'une diode laser.
  • La figure 3 représente une vue en perspective du module lumineux selon l'invention.
  • La figure 3bis représente une variante d'exécution du corps du dissipateur thermique.
  • La figure 4 représente une vue en coupe du module lumineux dans lequel est montée une diode laser.
  • La figure 5 représente une vue en perspective d'un module lumineux selon une forme alternative de réalisation dans lequel est montée une diode laser
  • La figure 6 représente une vue en coupe du module lumineux selon cette alternative.
  • La figure 7 représente une vue détaillée de la face avant du corps du dissipateur thermique sur laquelle est montée en appui une diode laser.
  • La figure 8 représente une vue schématique d'un dispositif d'éclairage comprenant une source lumineuse et un module lumineux selon l'invention.
The invention will be better understood on reading the appended figures, which are provided by way of examples and are in no way limiting, in which:
  • The Figures 1 and 2 represent perspective views of the front and rear face of a laser diode.
  • The figure 3 represents a perspective view of the light module according to the invention.
  • The figure 3bis represents an alternative embodiment of the body of the heat sink.
  • The figure 4 represents a sectional view of the light module in which a laser diode is mounted.
  • The figure 5 represents a perspective view of a light module according to an alternative embodiment in which a laser diode is mounted
  • The figure 6 represents a sectional view of the light module according to this alternative.
  • The figure 7 represents a detailed view of the front face of the body of the heat sink on which is mounted in support a laser diode.
  • The figure 8 is a schematic view of a lighting device comprising a light source and a light module according to the invention.

La diode 40, de préférence une diode laser de forte puissance, représentée aux figures 1 et 2, comprend une partie orientée vers l'avant pouvant comporter une ou plusieurs faces avant 43a, 43b décalées axialement les unes par rapport aux autres, et une face arrière 42. Des broches de connexion 41 émergent depuis la face arrière 42. Ici en nombre de deux, le nombre de broches n'est pas limitatif. La diode comprend un axe central xx', sensiblement perpendiculaire aux faces avant 43a et arrière 42 et passant par la zone d'émission 44 de la lumière proprement dite, qui constitue le point le plus chaud de la diode 40. La quantité de chaleur générée par la zone d'émission de lumière 44 est donc maximale au niveau de l'axe central xx'.The diode 40, preferably a high power laser diode, represented in FIGS. Figures 1 and 2 , comprises a forward-facing portion may comprise one or more front faces 43a, 43b axially offset relative to each other, and a rear face 42. Connection pins 41 emerge from the rear face 42. Here in number of two, the number of pins is not limiting. The diode comprises a central axis xx ', substantially perpendicular to the front 43a and rear 42 faces and passing through the emission zone 44 of the actual light, which is the hottest point of the diode 40. The amount of heat generated by the light emission zone 44 is therefore maximum at the central axis xx '.

Il existe un disque fictif 47, représenté en pointillé à la figure 2, centré sur l'axe central xx' de la diode et ne présentant aucune intersection avec les broches de connexion 41. On observera également que l'axe central xx' ne constitue pas un axe de symétrie pour les broches de connexion 41, qui sont de ce fait légèrement décentrées par rapport à cet axe. Ce type de diode, dite de forte puissance, et émettant une lumière d'une longueur d'onde comprise dans une plage de 350 nm à 850 nm, de préférence 445 nm, consomment une puissance électrique pouvant aller de 5 mW à 10 W. On peut aussi utiliser des diodes laser émettant dans le spectre ultraviolet, bleu, vert, rouge ou infrarouge.There is a fictional disk 47, represented in dotted line at figure 2 , centered on the central axis xx 'of the diode and having no intersection with the connection pins 41. It will also be observed that the central axis xx' does not constitute an axis of symmetry for the connection pins 41, which are therefore slightly off-center with respect to this axis. This type of diode, said high power, and emitting light of a wavelength in a range of 350 nm to 850 nm, preferably 445 nm, consume an electric power ranging from 5 mW to 10 W. Laser diodes emitting in the ultraviolet, blue, green, red or infrared spectrum can also be used.

La diode 40 comprend un bord latéral 45, ici en forme de collerette, dans lequel sont pratiquées deux entailles 46 dont l'usage sera décrit en détail ci-après.The diode 40 comprises a lateral edge 45, here in the form of a flange, in which two notches 46 are made, the use of which will be described in detail below.

La figure 3 illustre un dispositif lumineux 50 selon l'invention formé de l'assemblage d'un dissipateur thermique 20, d'un boitier 10 et d'un disque de positionnement 30.The figure 3 illustrates a light device 50 according to the invention formed of the assembly of a heat sink 20, a housing 10 and a positioning disk 30.

Le dissipateur thermique 20 comprend un corps 24 dont la face avant 21 constitue la face d'appui contre laquelle est maintenue la face arrière 42 de la diode 40. Un orifice 23 traverse le corps 24 du dissipateur thermique de manière à recevoir les broches de connexion 41, qui s'étendent donc au travers du corps 24. Les broches de connexion sont reliées à une alimentation électrique (non représentée) par l'intermédiaire d'un connecteur (non représenté) auquel elles accèdent par la partie arrière du dissipateur thermique 20.The heat sink 20 comprises a body 24 whose front face 21 constitutes the bearing face against which is held the rear face 42 of the diode 40. An orifice 23 passes through the body 24 of the heat sink to receive the connection pins 41, which therefore extend through the body 24. The connection pins are connected to a power supply (not shown) via a connector (not shown) to which they access through the rear part of the heat sink 20 .

La figure 3 servant de support à la présente description illustre un cas dans lequel les deux broches de connexion 41 passent par le même orifice 23 qui, de préférence, a dans ces conditions une forme sensiblement oblongue.The figure 3 As a support for the present description illustrates a case in which the two connecting pins 41 pass through the same orifice 23 which, preferably, under these conditions has a substantially oblong shape.

Toutefois ce mode de réalisation n'est pas limitatif, et on peut très bien envisager de prévoir autant d'orifice que de broches de manière à augmenter la surface de contact entre la face arrière de la diode et la face avant du corps du dissipateur thermique dans le but de favoriser les échanges de chaleur entre ces deux éléments comme cela est illustré à la figure 3bis dans laquelle les orifices 23 ont une forme sensiblement circulaire.However, this embodiment is not limiting, and one can very well envisage providing as many ports as pins so as to increase the contact area between the rear face of the diode and the front face of the body of the heat sink in order to promote heat exchange between these two elements as illustrated in figure 3bis wherein the orifices 23 have a substantially circular shape.

La face avant 21 du dissipateur thermique comprend également deux ergots 22 disposés de manière à venir s'insérer dans les entailles 46 pratiquées sur le bord 45 de la diode 40. Ces ergots ont pour objet de permettre un positionnement précis de la diode sur la face avant 21 du corps 24 du dissipateur thermique 20 et de bloquer la rotation autour de son axe central xx' de la diode 40 par rapport au corps 24 du dissipateur thermique 20.The front face 21 of the heat sink also comprises two lugs 22 arranged to fit into the notches 46 formed on the edge 45 of the diode 40. These lugs are intended to allow precise positioning of the diode on the face before 21 of the body 24 of the heat sink 20 and block the rotation about its central axis xx 'of the diode 40 relative to the body 24 of the heat sink 20.

La figure 7 permet d'illustrer plus en détail le positionnement des ergots 22 par rapport aux entailles 46 lorsque la face arrière 42 de la diode 10 est en appui contre la face avant 21 du dissipateur thermique.The figure 7 allows to illustrate in more detail the positioning of the lugs 22 with respect to the notches 46 when the rear face 42 of the diode 10 bears against the front face 21 of the heat sink.

Le module lumineux selon l'invention comprend également un boitier 10 dans lequel est inséré le dissipateur thermique 20. Le dissipateur thermique vient en appui contre le fond 13 du boitier 10. De préférence, le boitier 10 et le dissipateur thermique 20 sont de forme complémentaire.The light module according to the invention also comprises a housing 10 in which is inserted the heat sink 20. The heat sink bears against the bottom 13 of the housing 10. Preferably, the housing 10 and the heat sink 20 are of complementary shape .

La position angulaire du dissipateur thermique 20 par rapport au boitier 10 est ajustable autour d'un axe XX'. Cet axe de rotation XX' est sensiblement perpendiculaire à la face avant 21 du corps du dissipateur thermique.The angular position of the heat sink 20 relative to the housing 10 is adjustable around an axis XX '. This axis of rotation XX 'is substantially perpendicular to the front face 21 of the body of the heat sink.

En positionnant les orifices 23 et les ergots 22 de manière appropriée, on s'arrange pour faire coïncider l'axe central xx' de la diode avec l'axe de rotation XX' du dissipateur thermique dans le boitier 10 lorsque la diode vient en appui contre la face avant 21 du corps 24 du dissipateur thermique 20, et que les ergots 22 sont introduits dans les entailles 46.By positioning the orifices 23 and the lugs 22 appropriately, it is arranged to make coincide the central axis xx 'of the diode with the axis of rotation XX' of the heat sink in the housing 10 when the diode bears against the front face 21 of the body 24 of the heat sink 20, and that the lugs 22 are introduced into the notches 46.

De la sorte, la rotation d'une valeur angulaire donnée du dissipateur thermique autour de l'axe XX' entraine une rotation de même valeur angulaire de la diode autour de son axe central xx'.In this way, the rotation of a given angular value of the heat sink around the axis XX 'causes a rotation of the same angular value of the diode around its central axis xx'.

Comme on peut le voir à la figure 3, l'orifice 23 est également disposé de sorte que, une fois la diode montée sur le dissipateur thermique 20, l'axe central xx' de la diode ne traverse pas ledit orifice 23. Il existe donc sur la face avant 21 du dissipateur thermique 20 un disque fictif 26, également représenté en pointillé, centré sur l'axe xx' confondu avec l'axe XX', sur lequel le disque fictif 47 de la diode 40 vient en appui, de manière à favoriser les échanges thermiques entre la partie centrale de la diode 40 correspondant à la zone la plus chaude et le dissipateur thermique 20.As can be seen at figure 3 , the orifice 23 is also arranged so that, once the diode mounted on the heat sink 20, the central axis xx 'of the diode does not pass through said orifice 23. There is therefore on the front face 21 of the heat sink 20 a fictitious disk 26, also represented in dotted line, centered on the axis xx 'coincides with the axis XX', on which the fictitious disk 47 of the diode 40 bears, so as to promote heat exchange between the part central of the diode 40 corresponding to the hottest zone and the heatsink 20.

On observera qu'un arrangement similaire peut également être obtenu lorsque les broches sont disposées de manière sensiblement symétrique sur un cercle centré sur l'axe central xx' ou, dans le cas de deux broches, sur un cercle centré sur le milieu du segment passant par les bases des broches. Il suffit en effet de pratiquer dans le dissipateur 20 autant d'orifices 23 que de broches, chacun des orifices de section sensiblement circulaire ayant alors un diamètre réduit pour ne laisser passer qu'une seule broche, comme cela est illustré à la figure 3bis. Le dispositif selon l'invention autorise alors la rotation du dissipateur thermique 20 sur lequel est montée la diode 40 dans le boitier 10 autour de son axe XX', correspondant à l'axe central xx' de la diode 40, pour régler le dispositif d'éclairage dans lequel est inséré le module lumineux, tout en obtenant une évacuation optimale de la chaleur produite par la diode.It will be observed that a similar arrangement can also be obtained when the pins are arranged substantially symmetrically on a circle centered on the central axis xx 'or, in the case of two pins, on a circle centered on the middle of the passing segment. by the bases of the pins. It suffices to practice in the dissipator 20 as many orifices 23 as pins, each of the orifices of substantially circular section then having a reduced diameter to allow only one pin to pass, as illustrated in FIG. figure 3bis . The device according to the invention then allows the rotation of the heat sink 20 on which is mounted the diode 40 in the housing 10 about its axis XX ', corresponding to the central axis xx' of the diode 40, to adjust the device. lighting in which is inserted the light module, while obtaining an optimal evacuation of the heat produced by the diode.

Le module lumineux selon l'invention permet ainsi de mettre en contact une zone 47 de la face arrière de la diode centrée autour du point chaud et de l'axe central xx' avec une zone 26 de la face avant du dissipateur, quel que soit le type de diode employé.The light module according to the invention thus makes it possible to put in contact a zone 47 of the rear face of the diode centered around the hot point and of the central axis xx 'with a zone 26 of the front face of the dissipator, whatever the type of diode used.

Une fenêtre 11 est pratiquée dans la paroi 13 formant le fond du boitier 10 pour permettre le passage des fils de raccordement.A window 11 is formed in the wall 13 forming the bottom of the housing 10 to allow the passage of the connecting son.

Un élément de fermeture 30 est associé au boitier 10 auquel il est lié mécaniquement. Cet élément de fermeture 30 a pour objet, en enfermant le dissipateur thermique et la diode à l'intérieur du boitier, de maintenir la diode en appui contre la face avant du dissipateur thermique. Une ouverture 31 est pratiquée au centre de l'élément de fermeture 30 pour permettre le passage des rayons lumineux émis par la source 44. L'élément de fermeture prend appui sur la collerette 45 de la diode.A closure element 30 is associated with the housing 10 to which it is mechanically connected. This closure element 30 has the object, by enclosing the heat sink and the diode to inside the case, keep the diode resting against the front of the heat sink. An opening 31 is made in the center of the closure element 30 to allow the passage of light rays emitted by the source 44. The closure element bears on the flange 45 of the diode.

Dans le cas illustré aux figures 3 et 4, des filets disposés respectivement sur la face latérale intérieure 12 du boitier et sur la face latérale 32 de l'élément de fermeture 30 permettent d'établir une liaison mécanique de type vis/écrou entre l'élément de fermeture et le boitier. Toutefois, le mode de liaison mécanique entre l'élément de fermeture et le boitier n'est pas limitatif et peut également se faire, à titre d'exemple, à l'aide de moyens de clipsage ou par encliquetage.In the case illustrated Figures 3 and 4 , threads respectively disposed on the inner side face 12 of the housing and on the side face 32 of the closure member 30 allow to establish a mechanical connection type screw / nut between the closure member and the housing. However, the mechanical connection mode between the closure element and the housing is not limiting and can also be done, for example, by means of clipping or snap-fastening means.

Lorsque le module lumineux 50 est assemblé, l'élément de fermeture 30 vient presser la face arrière 42 de la diode 40 contre la face avant 21 du dissipateur thermique, et la face arrière du corps du dissipateur thermique vient en appui contre le fond 13 du boitier 10, de sorte que la diode est maintenue dans une position angulaire fixe et déterminée à l'intérieur du boitier 10.When the light module 50 is assembled, the closure element 30 presses the rear face 42 of the diode 40 against the front face 21 of the heat sink, and the rear face of the body of the heat sink bears against the bottom 13 of the housing 10, so that the diode is held in a fixed angular position and determined inside the housing 10.

L'élément de fermeture peut être une pièce autonome, comme cela est illustré aux figures 3 à 6. Auquel cas il constitue une pièce complémentaire du boitier 10. Il peut également constituer une pièce de raccordement formant partie ou non du châssis d'un dispositif d'éclairage, et permettant la fixation du boitier 10 sur ledit châssis.The closure element may be a stand-alone part, as illustrated in Figures 3 to 6 . In which case it constitutes a complementary piece of the housing 10. It can also constitute a connecting piece forming part or not of the frame of a lighting device, and for fixing the housing 10 on said frame.

Pour ajuster la position angulaire de la diode autour de son axe xx', il suffit de dévisser légèrement le boitier par rapport à l'élément de fermeture 30, et de faire tourner le dissipateur thermique 20 autour de l'axe XX', aligné avec l'axe central xx' de la diode, pour faire subir à la diode une rotation de même valeur angulaire autour de son axe xx'. Les ergots 22 privent la diode de toute rotation par rapport au corps du dissipateur thermique. Lorsque la position angulaire de la diode est jugée satisfaisante, on revisse le boitier sur l'élément de fermeture de manière à remettre la diode 40 et le dissipateur thermique en pression axiale, et à interdire le mouvement du dissipateur thermique et de la diode à l'intérieur du boitier 10.To adjust the angular position of the diode around its axis xx ', it is sufficient to slightly unscrew the housing relative to the closure element 30, and to turn the heat sink 20 around the axis XX', aligned with the central axis xx 'of the diode, to cause the diode to rotate the same angular value around its axis xx'. The lugs 22 deprive the diode of any rotation relative to the body of the heat sink. When the angular position of the diode is deemed satisfactory, the housing is screwed onto the closure element so as to put the diode 40 and the heat sink back under axial pressure, and to prohibit the movement of the heat sink and the diode at the same time. inside the case 10.

La figure 4 illustre un module lumineux 50 assemblé, selon une vue en coupe de côté, et comprenant une diode 40 montée sur le corps 24 d'un dissipateur thermique 20, disposés dans un boitier 10 fermé par un élément de fermeture 30.The figure 4 illustrates a light module 50 assembled, in a side sectional view, and comprising a diode 40 mounted on the body 24 of a heat sink 20, arranged in a housing 10 closed by a closure element 30.

On observera que l'orifice 23 est suffisamment décalé par rapport à l'axe central xx' de la diode pour permettre un contact entre le point chaud de la diode et la face avant du dissipateur thermique. Ce contact permet de favoriser l'écoulement de la chaleur depuis cette partie centrale arrière vers le puits de chaleur que constitue le dissipateur.It will be observed that the orifice 23 is sufficiently offset with respect to the central axis xx 'of the diode to allow contact between the hot spot of the diode and the front face of the heat sink. This contact helps to promote the flow of heat from the rear central portion to the heat sink that is the heatsink.

Les figures 5 et 6 illustrent une variante de réalisation du dissipateur thermique dont le corps 24 supporte des éléments d'échange 25 s'étendant axialement dans la partie arrière du corps 24 et passant par l'ouverture 11 du fond 13 du boitier 10.The Figures 5 and 6 illustrate an alternative embodiment of the heat sink whose body 24 supports exchange elements 25 extending axially in the rear part of the body 24 and passing through the opening 11 of the bottom 13 of the housing 10.

Les formes de réalisation du dissipateur thermique représentés en support de la présente description ne sont pas limitatives, et le module lumineux selon l'invention peut s'accommoder d'un dissipateur thermique comprenant des moyens de circulation de l'air, des moyens pour la circulation d'un liquide de refroidissement ou d'un fluide caloporteur permettant d'évacuer la chaleur vers une source froide externe, ou encore d'un dissipateur thermique comprenant un système thermoélectrique basé sur les principes physiques connus sous le nom d'effet Peltier.The embodiments of the heat sink represented in support of the present description are not limiting, and the light module according to the invention can accommodate a heat sink comprising air circulation means, means for the circulation of a coolant or heat transfer fluid for discharging heat to an external cold source, or a heat sink comprising a thermoelectric system based on the physical principles known as the Peltier effect.

La figure 8 représente un dispositif d'éclairage comprenant un module lumineux 50 selon l'invention.The figure 8 represents a lighting device comprising a light module 50 according to the invention.

Le dispositif d'éclairage 60 comprend un boitier 61 sur lequel est montée une lentille 62. Le boitier comprend également un dispositif optique du type de celui décrit dans la publication EP 2 690 352 déjà citée en référence et dont le module lumineux 50 constitue la source lumineuse primaire. Un système d'imagerie optique 66, un dispositif de conversion de longueur d'onde 65, un dispositif à balayage 64 et le module lumineux 50 sont montés sur un châssis 63 supportant également le boitier 61.The lighting device 60 comprises a housing 61 on which a lens 62 is mounted. The box also comprises an optical device of the type described in the publication. EP 2 690 352 already cited by reference and whose light module 50 is the primary light source. An optical imaging system 66, a wavelength converting device 65, a scanning device 64 and the light module 50 are mounted on a frame 63 also supporting the housing 61.

Le rayonnement issu de la source lumineuse de la diode 40 est dirigé vers le dispositif à balayage 64 qui répartit le faisceau de lumière sur le dispositif de conversion de longueur d'onde 65. La lumière réémise par le dispositif de conversion de longueur d'onde 65 est dirigée sur le système optique d'imagerie 66 qui projette le faisceau lumineux en avant du dispositif d'éclairage 60 en traversant la lentille 62.The radiation from the light source of the diode 40 is directed to the scanning device 64 which distributes the light beam onto the wavelength conversion device 65. The light re-emitted by the wavelength conversion device 65 is directed to the imaging optical system 66 which projects the light beam forward of the illumination device 60 through the lens 62.

Le module lumineux 50 comprend une diode laser de forte puissance 40, montée en appui contre le dissipateur thermique 20 inséré dans le boitier 10.The light module 50 comprises a high power laser diode 40 mounted to bear against the heat sink 20 inserted in the housing 10.

L'élément de fermeture est ici formé par un bossage 67 faisant partie du châssis 63 et sur lequel est vissé le boitier 10.The closure element is here formed by a boss 67 forming part of the frame 63 and on which the housing 10 is screwed.

Le réglage de la position angulaire de la diode laser autour de son axe xx' confondu avec l'axe XX' de rotation du dissipateur thermique dans le boitier 10 se fait tout simplement en dévissant légèrement le boitier 10 et en faisant tourner le dissipateur thermique jusqu'à ce que la position optimale soit atteinte. Une fois le réglage terminé on revisse le boitier 10 sur le bossage 67 faisant office d'élément de fermeture.The adjustment of the angular position of the laser diode around its axis xx 'coincides with the axis XX' of rotation of the heat sink in the housing 10 is simply by slightly unscrewing the housing 10 and rotating the heatsink until 'the optimum position is reached. Once the adjustment is completed, the housing 10 is raised on the boss 67 acting as closure element.

Bien que l'invention soit décrite pour une diode laser, elle est aussi applicable à une source de lumière comprenant au moins une puce émettrice à semi-conducteur, de préférence une diode électroluminescente.Although the invention is described for a laser diode, it is also applicable to a light source comprising at least one semiconductor emitter chip, preferably a light emitting diode.

Les modes de réalisation préférentiels de l'invention servant de base à la présente description, ne sont pas limitatifs et peuvent faire l'objet de variantes permettant d'obtenir les effets techniques tels que décrits et revendiqués, ou des effets équivalents et qui apparaîtront clairement à l'homme du métier.The preferred embodiments of the invention serving as a basis for the present description are not limiting and may be subject to variants making it possible to obtain the technical effects as described and claimed, or equivalent effects, which will become apparent. to the skilled person.

Claims (14)

Module lumineux (50), notamment d'éclairage et/ou de signalisation, comprenant un dissipateur thermique (20) sur lequel est montée une diode lumineuse (40) comportant un axe central (xx'), le dissipateur thermique (20) comprenant un corps (24) dont une face avant (21) est maintenue en appui contre une face arrière (42) de la diode (40), le corps (24) comportant au moins un orifice (23) traversant ledit corps (24) et débouchant sur sa face avant (21) au travers duquel passent une ou plusieurs broches de connexion (41) s'étendant depuis la face arrière (42) de la diode (40), caractérisé en ce que l'axe central de la diode (xx') ne passe pas par un orifice (23) traversant le corps (24) et au travers duquel s'étend une broche de connexion (41).A light module (50), in particular for lighting and / or signaling, comprising a heat sink (20) on which is mounted a light diode (40) having a central axis (xx '), the heat sink (20) comprising a body (24), a front face (21) is held in abutment against a rear face (42) of the diode (40), the body (24) having at least one orifice (23) passing through said body (24) and opening on its front face (21) through which pass one or more connecting pins (41) extending from the rear face (42) of the diode (40), characterized in that the central axis of the diode (xx) ') does not pass through an orifice (23) passing through the body (24) and through which a connection pin (41) extends. Module lumineux (50) selon la revendication 1, dans lequel la face arrière (42) de la diode comprend un disque fictif (47), centré sur l'axe central (xx'), qui est en contact avec la face avant (21) du corps (24) du dissipateur thermique (20).The light module (50) according to claim 1, wherein the rear face (42) of the diode comprises a dummy disk (47), centered on the central axis (xx '), which is in contact with the front face (21). ) of the body (24) of the heat sink (20). Module lumineux (50) selon la revendication 1 ou la revendication 2, dans lequel le dissipateur thermique (20) est monté dans un boitier (10), de sorte que la position angulaire du dissipateur thermique (20) par rapport audit boitier (10) est ajustable en rotation autour d'un axe (XX') sensiblement perpendiculaire à la face avant (21) du corps (24) dudit dissipateur thermique (20).The light module (50) according to claim 1 or claim 2, wherein the heat sink (20) is mounted in a housing (10), so that the angular position of the heat sink (20) relative to said housing (10) is adjustable in rotation about an axis (XX ') substantially perpendicular to the front face (21) of the body (24) of said heat sink (20). Module lumineux (50) selon la revendication 3, dans lequel l'axe de rotation (XX') du dissipateur thermique (20) dans le boitier (10) et l'axe central (xx') de la diode (40) sont confondus.Light module (50) according to claim 3, wherein the axis of rotation (XX ') of the heat sink (20) in the housing (10) and the central axis (xx') of the diode (40) coincide . Module lumineux (50) selon la revendication 3 ou la revendication 4, dans lequel l'axe de rotation (XX') du dissipateur thermique (20) ne passe pas par un orifice (23) pratiqué dans le corps (24) dudit dissipateur thermique (20).The light module (50) according to claim 3 or claim 4, wherein the axis of rotation (XX ') of the heat sink (20) does not pass through an orifice (23) formed in the body (24) of said heat sink (20). Module lumineux (50) selon l'une des revendications 1 à 5, dans lequel le corps (24) du dissipateur thermique (20) comprend autant d'orifice (23), destinés chacun à recevoir une broche de connexion, que de broches de connexion (41) s'étendant depuis la face arrière (42) de la diode (40).Light module (50) according to one of claims 1 to 5, wherein the body (24) of the heat sink (20) comprises as many ports (23), each intended to receive a connection pin, that pins of connection (41) extending from the rear face (42) of the diode (40). Module lumineux (50) selon l'une des revendications 1 à 6, dans lequel le corps (24) du dissipateur thermique et la diode (40) comprennent des moyens (22, 46) pour bloquer la rotation de la diode autour de son axe central (xx') par rapport au corps (24) du dissipateur thermique (20).Light module (50) according to one of claims 1 to 6, wherein the body (24) of the heat sink and the diode (40) comprise means (22, 46) for blocking the rotation of the diode about its axis central (xx ') with respect to the body (24) of the heat sink (20). Module lumineux (50) selon la revendication 7, dans lequel les moyens pour bloquer la rotation de la diode (40) sont formés par des ergots (22) disposés sur la face avant (21) du corps (24) du dissipateur thermique (20) collaborant avec des entailles (46) pratiquées sur des bords latéraux (45) de la diode (40).Light module (50) according to claim 7, wherein the means for blocking the rotation of the diode (40) are formed by lugs (22) arranged on the front face (21). the body (24) of the heat sink (20) collaborating with notches (46) on the side edges (45) of the diode (40). Module lumineux (50) selon l'une des revendications 1 à 8, comprenant en outre un élément de fermeture (30) venant en appui sur une partie avant (43b) de la diode (40) pour maintenir ladite diode (40) en appui sur la face avant (21) du corps (24) du dissipateur thermique (20).Light module (50) according to one of claims 1 to 8, further comprising a closure element (30) bearing on a front portion (43b) of the diode (40) for holding said diode (40) in support on the front face (21) of the body (24) of the heat sink (20). Module lumineux (50) selon la revendication 9, dans lequel l'élément de fermeture (30) et le boitier (10) sont liés mécaniquement l'un à l'autre, de manière à prévenir la sortie du dissipateur thermique (20) dudit boitier (10).The light module (50) according to claim 9, wherein the closure member (30) and the housing (10) are mechanically connected to each other so as to prevent the output of the heat sink (20) of said case (10). Module lumineux (50) selon la revendication 10, dans lequel l'élément de fermeture (30) et le boitier (10) sont liés mécaniquement l'un à l'autre par une liaison de type vis/écrou ou par des moyens de clipsage ou d'encliquetage.Light module (50) according to claim 10, wherein the closure element (30) and the housing (10) are mechanically connected to each other by a screw / nut type connection or by clipping means or latching. Module lumineux (50) selon l'une des revendications 1 à 11, dans lequel la diode (40) est une diode laser.The light module (50) according to one of claims 1 to 11, wherein the diode (40) is a laser diode. Dispositif lumineux, notamment d'éclairage et/ou de signalisation pour véhicule automobile (60) comprenant un module lumineux (50) selon l'une des revendications 1 à 12, fixé à un châssis (63) du dispositif lumineux (60) par l'intermédiaire du boitier (10).Luminous device, particularly for lighting and / or signaling for a motor vehicle (60), comprising a light module (50) according to one of claims 1 to 12, fixed to a frame (63) of the light device (60) by the intermediate case (10). Dispositif lumineux selon la revendication 13 prise en combinaison avec la revendication 9, dans lequel l'élément de fermeture est formé par un bossage (67) faisant partie du châssis (63).A light device according to claim 13 taken in combination with claim 9, wherein the closure member is formed by a boss (67) forming part of the frame (63).
EP15189690.9A 2014-10-16 2015-10-14 Light module including a diode Withdrawn EP3009735A1 (en)

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017103856A1 (en) * 2017-02-24 2018-08-30 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip
US10760777B2 (en) 2017-03-08 2020-09-01 Interamerica Stage, Inc. LED puck holder for wire rope tension grids

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050286580A1 (en) * 2004-06-29 2005-12-29 Tdk Corporation Heat-conducting member, laser diode attachment auxiliary member, optical head using the same, and optical recording/reproducing apparatus using the same
EP2063170A2 (en) 2007-11-21 2009-05-27 Audi AG Illumination device for a vehicle
US20120063157A1 (en) * 2010-09-10 2012-03-15 Yoshiaki Nakazato Lighting fixture
CN202631938U (en) * 2012-04-03 2012-12-26 深圳市光峰光电技术有限公司 Laser light source and related projection system
WO2013042193A1 (en) * 2011-09-20 2013-03-28 Ｎｅｃディスプレイソリューションズ株式会社 Light source device and projection-type display device
EP2690352A1 (en) 2012-07-27 2014-01-29 Valeo Vision Adaptive lighting system for an automobile
DE202014002809U1 (en) * 2014-03-31 2014-04-11 Osram Gmbh lighting device
DE202014000778U1 (en) * 2014-01-28 2014-05-12 Chen-Wei Hsu Vehicle headlight design
JP2014107229A (en) * 2012-11-29 2014-06-09 Toshiba Lighting & Technology Corp Light emitting device and lighting device for vehicle

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7806575B2 (en) * 2005-09-22 2010-10-05 Koninklijke Philips Electronics N.V. LED lighting module
US8262256B2 (en) * 2007-04-03 2012-09-11 Osram Ag Semiconductor light module
US7972038B2 (en) * 2007-08-01 2011-07-05 Osram Sylvania Inc. Direct view LED lamp with snap fit housing
US7762700B2 (en) * 2008-05-28 2010-07-27 Osram Sylvania Inc. Rear-loaded light emitting diode module for automotive rear combination lamps
US7905639B2 (en) * 2008-05-28 2011-03-15 Osram Sylvania Inc. Side-loaded light emitting diode module for automotive rear combination lamps
JP5297708B2 (en) * 2008-07-08 2013-09-25 株式会社小糸製作所 Light source module
CN202511019U (en) * 2011-10-12 2012-10-31 侯山礼 Rectifying low-voltage LED (Light Emitting Diode) lamp
CN202719475U (en) * 2011-12-29 2013-02-06 东莞市贻嘉光电科技有限公司 adjustable focus projector light
CN202757019U (en) * 2012-08-22 2013-02-27 宁波东星电子有限公司 Light-emitting diode (LED) lamp convenient to assemble
CN203560796U (en) * 2013-12-02 2014-04-23 广东凯西欧照明有限公司 Spring-limited bi-circle rotary focusing ceiling lamp

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050286580A1 (en) * 2004-06-29 2005-12-29 Tdk Corporation Heat-conducting member, laser diode attachment auxiliary member, optical head using the same, and optical recording/reproducing apparatus using the same
EP2063170A2 (en) 2007-11-21 2009-05-27 Audi AG Illumination device for a vehicle
US20120063157A1 (en) * 2010-09-10 2012-03-15 Yoshiaki Nakazato Lighting fixture
WO2013042193A1 (en) * 2011-09-20 2013-03-28 Ｎｅｃディスプレイソリューションズ株式会社 Light source device and projection-type display device
CN202631938U (en) * 2012-04-03 2012-12-26 深圳市光峰光电技术有限公司 Laser light source and related projection system
EP2690352A1 (en) 2012-07-27 2014-01-29 Valeo Vision Adaptive lighting system for an automobile
JP2014107229A (en) * 2012-11-29 2014-06-09 Toshiba Lighting & Technology Corp Light emitting device and lighting device for vehicle
DE202014000778U1 (en) * 2014-01-28 2014-05-12 Chen-Wei Hsu Vehicle headlight design
DE202014002809U1 (en) * 2014-03-31 2014-04-11 Osram Gmbh lighting device

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