EP2564142A1

EP2564142A1 - Heat exchanger arrangement

Info

Publication number: EP2564142A1
Application number: EP11713838A
Authority: EP
Inventors: Josef Riha
Original assignee: A-Heat Allied Heat Exchange Technology AG Austria
Current assignee: A-Heat Allied Heat Exchange Technology AG Austria
Priority date: 2010-04-29
Filing date: 2011-04-12
Publication date: 2013-03-06
Also published as: WO2011134786A1

Abstract

A heat exchanger arrangement (2) comprises multiple microchannel heat transfer elements (6.1, 6.1', 6.1", 6.2, 6.2', 6.2") that are interconnected in a heat-conducting manner and form two groups, one or more microchannel heat transfer elements (6.1, 6.1', 6.1") from one group being connected in a heat-conducting manner to one or more microchannel heat transfer elements (6.2, 6.2', 6.2") from the other group. In addition, each group comprises its own collective inlet duct (8.1, 8.2) and its own collective discharge duct (9.1, 9.2) which are fluidically connected to the microchannel heat transfer elements of the respective group.

Description

A-HEAT Allied Heat Exchange Technology AG, A-1 120 Vienna (Austria)

Warmeaustauscheranordnung

The invention relates to a heat exchanger assembly according to the preamble of claim 1 and the use of such

Heat exchanger arrangement according to one of claims 12 to 14. Heat exchangers are found in a variety of technical

Applications, for example, in cooling systems and devices for

Refrigerators or household refrigerators, in heaters and air conditioning systems for buildings or transport such as cars, buses, ships and aircraft, or as coolers in power plants, internal combustion engines,

Computers, or other heat generating devices. In practical use, the heat exchangers are usually connected to a circuit containing a heat transfer medium such as a refrigerant, the heat exchanger heat directly, i. without phase transformation from the liquid or gaseous

Absorb or transfer heat transfer medium to the same, or as a condenser or evaporator for the

Heat transfer medium can be effective.

An embodiment of a current heat exchanger is described in document EP 1 557 622 A2. The heat exchanger described here is used in a condensation system of a cooling system in order to condense a refrigerant vaporized for cooling purposes. The

Condensing plant contains several cooling coils, each as Heat exchangers, hereinafter also referred to as heat exchanger modules, are executed, and one or more fans for generating an air flow through the heat exchanger modules. each

Heat exchanger module includes a plurality of so-called microchannel heat transfer elements, which are designed as flat tubes, and which are arranged parallel and spaced from each other, and cooling fins, which are arranged between the flat tubes and connected to the same. The cooling fins each form a zig-zag pattern between two

neighboring pipes. Further, the heat exchanger modules each include an inlet and an outlet collection channel communicating with the

Microchannel heat transfer elements of each

Heat exchanger module are connected.

The microchannel heat transfer elements may for example be designed as an extruded profile, which consists of a material with good

Thermal conductivity such as aluminum is made. The

Microchannel heat transfer elements contain a variety of channels with a diameter of typically 1 mm for the

Heat transfer medium. Of course, there are others too

Diameters are possible, which may for example be in the range of 0.5 mm to 3 mm or 0.5 mm to 2 mm.

An additional, widespread execution is the laminated one

Heat exchanger, which is known for example from Hauhaltkühlschränken. In the simplest case, a laminated heat exchanger consists of a tube for the passage of a heat transfer medium and a plurality of fins, which are connected to the tube and are in operation in communication with a second medium. This construction is particularly useful when the second medium is gaseous and, for example, consists of ambient air, since this is a comparatively low

Has heat transfer coefficients, which can be compensated by a correspondingly large surface of the slats. Of course, the laminated heat exchanger per lamella can also contain a plurality of tubes, which can be connected to the respective application according to parallel and / or in series. In laminated heat exchanger designs are known which contain several tubes per slat for more than one heat transfer medium and / or for more than one heat cycle. Depending on the number of different heat circuits to which the heat exchanger is connected, this is also referred to as a two- or multi-circuit heat exchanger. Laminated two- or multi-circuit heat exchangers are also used as safety heat exchangers, as the

Heat transfer media of the heat cycles are separated from each other and no possibility of direct leakage between the

Heat transfer media consists.

In a laminated two- or multi-circuit heat exchanger, the larger the conductivity and thickness of the fins, the more effective the heat transfer and the smaller the mutual spacing of the tubes.

In terms of efficiency, it is thus advantageous if many tubes are used. However, many tubes also mean higher material and

Processing costs, so that a higher efficiency is associated with higher costs.

The object of the present invention is to provide a

Heat exchanger arrangement can be used, which can be used as a two- and multi-circuit heat exchanger, and which allows, given a material and / or processing effort against a laminated two- or multi-circuit heat exchanger between the

Circuits to achieve a higher heat transfer. Another object is to provide uses for such

Heat exchanger arrangement to provide.

This object is achieved according to the invention by the heat exchanger arrangement defined in claim 1 and by the uses defined in claims 12 to 14.

The inventive heat exchanger arrangement contains a plurality of microchannel heat transfer elements, which are connected to one another in a heat-conducting manner, wherein the microchannel heat transfer elements form at least two groups and in each case one or more microchannel heat transfer elements. Heat transfer elements of a group are thermally conductively connected to one or more microchannel heat transfer elements of the other group. In addition, each group includes its own inlet collection channel and its own outlet collection channel, which are fluidly connected to the microchannel heat transfer elements of the respective group. In an advantageous embodiment, there is no liquid-conducting connection between the microchannel heat transfer elements of the one group and the microchannel heat transfer elements of the other group. In a further advantageous embodiment variant, in each case one or more microchannel heat transfer elements of one group are arranged next to one or more microchannel heat transfer elements of the other group and in a further advantageous manner

Embodiment variant are alternately one or more microchannel heat transfer elements of a group in addition to one or more microchannel heat transfer elements of the other group

are arranged.

In an advantageous embodiment, microchannel heat transfer elements arranged next to one another are connected in a heat-conducting manner by means of solder joints. The microchannel heat transfer elements can be used directly or via spacer elements

be thermally conductively connected.

In a further advantageous embodiment, juxtaposed microchannel heat transfer elements via

Heat exchange ribs connected thermally conductive. The

Heat exchange ribs have an advantage compared to

Heat exchange ribs of conventional microchannel heat transfer elements a smaller height and a greater thickness, for example, a height of 2 mm to 6 mm and / or a thickness of 0.12 mm to 0.50 mm. Typically, air passages are formed between the heat exchange fins.

Regardless of the above-mentioned embodiments and

Variants are the microchannel heat transfer elements in the areas in which they are thermally conductively connected, advantageously arranged substantially parallel and / or form, if appropriate, in the areas in which they are thermally conductively connected, in each case a planar arrangement. In a further advantageous embodiment, the microchannel heat transfer elements form one group with the microchannel heat transfer elements of the other group

A safety heat exchanger for or with at least two separate heat circuits, in which the microchannel heat transfer elements of one group are connected in a heat-conducting manner via heat exchange ribs to the microchannel heat transfer elements of the other group.

In a further advantageous embodiment, the microchannel heat transfer elements of one group with the microchannel heat transfer elements of the other group form a subcooler for or with at least two separate heat circuits.

Furthermore, the invention comprises the use of a

Heat exchanger assembly according to one or more of the above

described embodiments and variants as

Safety heat exchanger for or with at least two separate circuits for heat transfer media and / or refrigerants, the

Use of a heat exchanger arrangement according to one or more of the above-described embodiments and variants as subcooler for or with at least one refrigerant circuit and at least one subcoolant circuit and the use of a

Heat exchanger assembly according to one or more of the above

described embodiments and variants as evaporator A / emflüssigerkombination for or with a first

Heat transfer medium which is liquefied and / or cooled in the condenser, and a second heat transfer medium which is vaporized and / or heated in the evaporator. In addition, the invention also includes a method of operating a heat exchanger assembly according to one or more of the above

described embodiments and variants as

Safety heat exchanger and / or as a subcooler and / or as

Evaporator A / erflüssigerkombination.

Also part of the invention is a system with at least two

Heat cycles and with at least one heat exchanger assembly according to one or more of the embodiments and variants described above.

The inventive heat exchanger assembly and the uses of the invention described above

Heat exchanger arrangements have the advantage that a higher heat transfer between the heat circuits can be achieved in comparison with two-circuit or multi-circuit heat exchangers from the prior art, and that the heat exchanger arrangement can be made more compact and lighter compared to laminated two-or multi-circuit heat exchangers.

The above description of embodiments and variants is merely an example. Further advantageous embodiments will become apparent from the dependent claims and the drawings. In addition, in the context of the present invention, individual features of the described or shown embodiments and variants

be combined together to form new embodiments.

In the following the invention will be explained in more detail with reference to the embodiments and with reference to the drawing. Show it:

1 is a schematic representation of an embodiment of a system for a heat exchanger assembly according to the present invention,

2A shows a heat exchanger arrangement from the prior art, FIG. 2B shows an integrated heat exchanger arrangement from the prior art, FIG.

Fig. 3 shows a detail of a laminated two-circuit heat exchanger from the prior art, Fig. 4 Course of the air and refrigerant temperatures in the

Heat exchanger arrangements according to FIGS. 2A, 2B and 3,

Fig. 5A, 5B an embodiment of a heat exchanger assembly according to the present invention, view in the direction of

Air flow and transverse to the air flow, Fig. 5C shows a variant of the embodiment according to FIG.

5A and 5B,

6A, 6B, a second embodiment of a

Heat exchanger arrangement according to the present invention with a fitted heat exchanger and subcooler, view in the direction of the air flow and transversely to the air flow,

Fig. 7A, 7B, a third embodiment of a

Heat exchanger assembly according to the present invention with multi-pass heat exchanger and subcooler, view in the direction of air flow and transverse to the air flow, and Fig. 7C shows a detail of a variant of a

Subcooler from the embodiment of FIGS. 7A and 7B.

Fig. 1 shows a schematic representation of an embodiment of a system 1 for a heat exchanger assembly according to the present invention. The system 1 shown contains a first and second circuit 3.1, 3.2, each for a heat transfer medium. The first circuit includes an evaporator 2.0, a compressor 10, a heat exchanger 2.1, which may be formed as a condenser and / or gas cooler, and an expansion device 1 1. As Wärmeübertragungsmediunn example, a refrigerant can be used. The heat exchanger 2.1 of the first

Circulation is thermal with a heat exchanger 2.2 of the second

Coupled, wherein the heat exchanger of the second circuit may be formed as an evaporator of a heat pump cycle and / or as a heat exchanger of a heating circuit. The coupling takes place in

Conventional heat exchanger arrangements, for example, characterized in that an air stream 4 in the heat exchanger 2.1 of the first circuit heated and at least a portion of the entrained heat subsequently in

Heat exchanger 2.2 of the second circuit is discharged again. From the second circuit 3.2, only the heat exchanger 2.2 is shown in Fig. 1.

Such a conventional heat exchanger assembly is shown in FIG. 2A. A heat exchanger 2.1 a first circuit and a

Heat exchangers 2.2 of a second circuit are arranged one behind the other in a housing or an air duct section 2 a, of a

Air flow 4 can be flowed through. Another heat exchanger arrangement is shown in FIG. 2B, in which a heat exchanger of a first circuit and a heat exchanger of a second circuit are integrated in a block 2. The block 2 is typically arranged in an air duct section, which can be traversed by an air flow 4.

The heat exchangers integrated in block 2 can be designed, for example, as a laminated two-circuit heat exchanger. Fig. 3 shows a section of a conventional laminated two-circuit heat exchanger. The illustrated two-circuit heat exchanger 2 'includes a plurality of fins 5ai - 5a ₃ of a thermally conductive material, one or more tubes 5.1' - 5.1 "'of a first circuit 3.1 and one or more tubes 5.2' - 5.2"'of a second circuit 3.2, wherein the tubes of the first and second circuits are thermally conductively connected to the lamellae. The two circuits are thus coupled via the lamellae heat-conducting together. An additional thermal coupling can be achieved by an air flow 4, which flows through between the slats 5ai - 5a ₃ and in the region of the tubes 5.1 '- 5.1 "' of the first circuit cools and / or liquefies a refrigerant flowing therein, wherein the air flow is heated and at least a portion of the entrained heat is then released again in the region of the tubes 5.2 '- 5.2 "' of the second circuit.

Fig. 4 shows the course of the air and refrigerant temperatures T ₃ , T in the conventional heat exchanger assemblies according to Fig. 2A, 2B and 3. The air temperature increases in a first section 4.1 a, in which the

Refrigerant of the first cycle is cooled and / or liquefied, and then in a second section 4.2a, in which the

Heat transfer medium of the second circuit is heated and / or evaporated, to sink again. The refrigerant temperature in the first cycle can have the course shown in section 3.1 a and initially fall until the temperature by the liquefaction of the

Refrigerant is kept constant. If enough is cooled, the temperature of the liquefied refrigerant can reach the outlet of the

Heat exchanger arrangement down further. In the second cycle, the temperature of the heat transfer medium remains e.g. first, as shown in Section 4.2a, constant until the heat transfer medium has evaporated to then rise to the exit of the heat exchanger assembly.

Figures 5A and 5B show a first embodiment of a

Heat exchanger arrangement according to the present invention with a view (FIG. 5A) in the direction of the air flow and a view (FIG. 5B) transverse to the air flow. In the embodiment shown contains the

Heat exchanger arrangement 2 a plurality of microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2, 6.2', 6.2", which are thermally conductively connected to each other, wherein the microchannel heat transfer elements form at least two groups and one or more microchannel heat transfer elements 6.1, 6.1 ', 6.1 "of a group are thermally conductively connected to one or more Microchannel heat transfer elements 6.2, 6.2 ', 6.2" of the other group. In addition, each group has its own

Inlet collection channel 8.1, 8.2 and a separate outlet collection channel 9.1, 9.2, which are liquid-conductively connected to the microchannel heat transfer elements of each group. In an advantageous embodiment exists between the

Microchannel heat transfer elements of a group no liquid-conducting connection to the Microchannel Wärmeübertragungselennenten the other group. In a further advantageous embodiment variant, in each case one or more microchannel heat transfer elements of one group are arranged next to one or more microchannel heat transfer elements of the other group and in a further advantageous manner

are arranged.

In an advantageous embodiment, juxtaposed microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2, 6.2', 6.2" are thermally conductively connected by means of solder joints. The can

Microchannel heat transfer elements directly or via

Distance elements be thermally conductively connected.

In a further advantageous embodiment, microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2", 6.2', 6.2 "arranged side by side are connected in a heat-conducting manner via heat exchange ribs 7. The heat exchange ribs may for example have a height of 2 mm to 6 mm and / or a thickness of 0.12 mm to 0.50 mm. Most 7 air channels are formed between the heat exchange ribs. Typically, the heat exchange fins are of a folded or bent

Produced sheet metal strip, for example, have a zig-zag pattern or may be bent several times U-shaped.

Regardless of the above-mentioned embodiments and

Embodiments are the microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2, 6.2', 6.2" in the areas where they are thermally conductively connected, advantageously arranged substantially parallel and / or form, if appropriate, in the areas in which they are thermally conductively connected, each having a planar arrangement. In a further advantageous embodiment, the microchannel heat transfer elements 6.1, 6.1 ', 6.1 "form the one group with the

Microchannel heat transfer elements 6.2, 6.2 ', 6.2 "of the other group a safety heat exchanger for at least two separate heat circuits 3.1, 3.2, in which the microchannel heat transfer elements of a group via heat exchange ribs 7 are thermally conductively connected to the microchannel heat transfer elements of the other group.

FIG. 5C shows a variant of a heat exchanger arrangement for the embodiment described above according to FIGS. 5A and 5B. In the embodiment shown, in pairs, a microchannel heat transfer element 6.1, 6.1 'of a group with a

Microchannel heat transfer element 6.2, 6.2 'of the other group directly connected thermally conductive, for example by means of a solder joint between the microchannel heat transfer elements of a pair. In addition, in the embodiment variant shown in FIG. 5C, two pair-connected microchannel heat transfer elements 6.1, 6.2 are connected in a heat-conducting manner via heat exchange ribs 7 to at least two further paired microchannel heat transfer elements 6.1 ', 6.2'.

Advantageously, the microchannel heat transfer elements 6.1, 6.1 'shown in FIG. 5C form one group with the

Microchannel heat transfer elements 6.2, 6.2 'of the other group an evaporator A / ligerigerkombination for or with a first

Heat transfer medium, which is liquefied and / or cooled in the condenser, and a second heat transfer medium, which is vaporized and / or heated in the evaporator, wherein the evaporator can be used for example in a heat pump cycle or in a heating circuit. Thanks to the direct heat conducting connection between the

Microchannel heat transfer elements of a pair may be higher than the heat exchanger arrangement shown in FIG. 5A

Heat transfer can be achieved. Figures 6A and 6B show a second embodiment of a

Heat exchanger arrangement according to the present invention with a Einpass- heat exchanger and subcooler, with a view (Fig. 6A) in the direction of air flow and a view (Fig. 6B) transverse to the air flow. In the illustrated embodiment, the heat exchanger assembly 2 includes a plurality of microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2, 6.2', 6.2", which are thermally conductively connected to each other, wherein the microchannel heat transfer elements form at least two groups and one or more microchannel heat transfer elements 6.1, 6.1 ', 6.1 "of a group are thermally conductively connected to one or more microchannel heat transfer elements 6.2, 6.2', 6.2" of the other group. In addition, each group has its own

Inlet collection channel 8.1, 8.2 and a separate outlet collection channel 9.1, 9.2, which are liquid-conductively connected to the microchannel heat transfer elements of each group. In this case, as shown in Figures 6A and 6B, the microchannel heat transfer elements 6.1, 6.1 ', 6.1 "of a group only in part of the

Heat exchanger assembly 2 thermally conductively connected to the microchannel heat transfer elements 6.2, 6.2 ', 6.2 "of the other group.

In an advantageous embodiment exists between the

Microchannel heat transfer elements of a group no liquid-conducting connection to the microchannel heat transfer elements of the other group. In a further advantageous embodiment variant, in each case one or more microchannel heat transfer elements of one group are arranged next to one or more microchannel heat transfer elements of the other group and in a further advantageous manner

are arranged. In an advantageous embodiment, juxtaposed microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2, 6.2', 6.2" are thermally conductively connected by means of solder joints. The can

Microchannel heat transfer elements directly or via

Distance elements be thermally conductively connected.

In a further advantageous embodiment, microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2", 6.2', 6.2 "arranged side by side are connected in a heat-conducting manner via heat exchange ribs 7. The

Heat exchange ribs may for example have a height of 2 mm to 6 mm and / or a thickness of 0.12 mm to 0.50 mm. Most 7 air channels are formed between the heat exchange ribs. Typically, the heat exchange fins are of a folded or bent

Produced sheet metal strip, for example, have a zig-zag pattern or may be bent several times U-shaped. Regardless of the above-mentioned embodiments and

Embodiments are the microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2, 6.2', 6.2" in the areas where they are thermally conductively connected, advantageously arranged substantially parallel and / or form, if appropriate, in the areas in to them

are thermally conductively connected, each having a planar arrangement.

In a further advantageous embodiment, the microchannel heat transfer elements 6.1, 6.1 ', 6.1 "form the one group with the

Microchannel heat transfer elements 6.2, 6.2 ', 6.2 "of the other group a subcooler 12 for or with at least two separate

Heat cycles 3.1, 3.2, for example, a refrigerant circuit comprising the microchannel heat transfer elements 6.1, 6.1 ', 6.1 "of a group, and a subcoolant circuit comprising the microchannel heat transfer elements 6.2, 6.2', 6.2" of the other group.

The heat transfer assembly 2 may, as shown in Figures 6A and 6B, comprise two parts, a first part which contains only Microchannel heat transfer elements 6.1, 6.1 ', 6.1 "of a group which are connected to each other via heat exchange ribs 7' and a Einpass-heat exchanger 2.1 form, and a second part in which one or more microchannel heat transfer elements 6.1, 6.1 ', 6.1 "one group each heat-conducting ribs 7 thermally conductively connected to one or more heat transfer elements 6.2, 6.2', 6.2" of the other group are and form a subcooler 12.

Figures 7A and 7B show a third embodiment of a

Heat exchanger arrangement according to the present invention with multi-pass heat exchanger and subcooler, with a view (Fig. 7A) in the direction of air flow and a view (Fig. 7B) transverse to the air flow. In the illustrated embodiment, the heat exchanger assembly 2 includes a plurality of microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2, 6.2', which are thermally conductively connected to each other, the microchannel heat transfer elements form at least two groups and one or more microchannel heat transfer elements 6.1, 6.1 ', 6.1 "of a group are thermally conductively connected to one or more microchannel heat transfer elements 6.2, 6.2' of the other group. In addition, each group comprises its own inlet duct 8.1, 8.1 '8.2 and its own outlet collection channel 9.1, 9.1', 9.2, which are fluidly connected to the microchannel heat transfer elements of the respective group.

In an advantageous embodiment exists between the

Microchannel heat transfer elements of a group no liquid-conducting connection to the microchannel heat transfer elements of the other group. The heat exchanger assembly shown in Figures 7A and 7B is a multi-pass heat exchanger. Of the

Intake duct of the one group is therefore divided into an initial section 8.1 and an intermediate section 8.1 'and the outlet collection channel into an intermediate section 9.1' and an end section 9.1. The

Microchannel heat transfer elements 6.1, 6.1 ', 6.1 "of this group are connected to the sections 8.1, 8.1', 9.1, 9.1 'in such a way that the refrigerant from the initial section 8.1 through microchannel heat transfer elements 6.1, 6.1' in a first flow direction to the intermediate section 9.1 ' of Outlet collection channel can flow, from there by other Microchannel heat transfer elements in a second, usually

opposite flow direction in the intermediate section 8.1 'of the

Inlet collecting channel and from there by other Microchannel heat transfer elements 6.1 "in a third flow direction, which normally corresponds to the first, in the end section 9.1.

In a further advantageous embodiment variant, in each case one or more microchannel heat transfer elements of one group are arranged next to one or more microchannel heat transfer elements of the other group and in a further advantageous manner

are arranged. In an advantageous embodiment, microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2, 6.2' arranged side by side are connected in a heat-conducting manner by means of solder joints, whereby the microchannel heat transfer elements can be used directly or via spacer elements

be thermally conductively connected. In a further advantageous embodiment, microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2, 6.2' arranged side by side can be connected to one another in a heat-conducting manner via heat exchange ribs 7. In most cases, air ducts are formed between the heat exchange ribs 7. Typically, the heat exchange ribs are made of a folded or curved sheet metal strip produced, for example, have a zig-zag pattern or may be bent several times U-shaped.

Regardless of the above-mentioned embodiments and

Embodiments are the microchannel heat transfer elements 6.1, 6.1 ', 6.1 ", 6.2, 6.2' in the areas where they are thermally conductively connected, advantageously arranged substantially parallel and / or form, if appropriate, in the areas where they heat conductive are connected, each a planar arrangement. In a further advantageous embodiment, microchannel heat transfer elements 6.1 "form one group with the microchannel heat transfer elements 6.2, 6.2 'of the other group

Subcooler 12 for or with at least two separate heat circuits 3.1, 3.2, for example, a refrigerant circuit comprising the Microchannel heat transfer elements 6.1, 6.1 ', 6.1 "of a group, and a subcoolant circuit, the Microchannel- heat transfer elements 6.2, 6.2' of the other group includes.

The heat transfer assembly 2 may, as shown in Figures 7A and 7B, comprise two parts, a first part which contains only Microchannel heat transfer elements 6.1, 6.1 'of a group, which are connected to each other via heat exchange ribs 7' and a on or Form multi-pass heat exchanger 2.1, and a second part, in which one or more other microchannel heat transfer elements 6.1 "of a group each thermally conductive with one or more

Heat transfer elements 6.2, 6.2 'of the other group are connected and form a subcooler 12. Depending on the application, it may be advantageous to provide the subcooler 12 with a thermal insulation 12a.

FIG. 7C shows a section of an advantageous embodiment variant of a subcooler 12 'from the exemplary embodiment according to FIGS. 7A and 7B. In the embodiment shown, one or more microchannel heat transfer elements 6.1 "of one group are heat-conductively connected directly to one or more heat transfer elements 6.2, 6.2 'of the other group, the heat-conducting connection consisting partially or exclusively of solder joints individual channels 6.2a of the microchannel heat transfer elements visible.

Furthermore, the invention comprises the use of a

Heat exchanger assembly 2 according to one or more of the embodiments and variants described above as

Use of a heat exchanger assembly according to one or more the embodiments and variants described above as subcooler 12 for or with at least one refrigerant circuit 3.1 and at least one subcoolant circuit 3.2 and the use of a

Heat exchanger assembly according to one or more of the above

described embodiments and variants as

Safety heat exchanger and / or as a subcooler and / or as

Evaporator A / erflüssigerkombination. Also part of the invention is a system with at least two

Heat cycles 3.1, 3.2 and at least one

Heat exchanger assembly 2 according to one or more of the embodiments and variants described above.

The heat exchanger arrangements described above have the advantage that, thanks to the use of microchannel heat transfer elements with comparable material and labor costs compared to conventional laminated two- or multi-circuit heat exchangers, a higher COP value can be achieved, or that the heat exchanger arrangements at a given heat and / or or cooling capacity can be made lighter and more compact.

Claims

claims

Heat exchanger assembly (2) with a plurality of microchannel heat transfer elements (6.1, 6.1 ', 6.1 ", 6.2, 6.2', 6.2"), which are thermally conductively connected to each other, characterized in that the microchannel heat transfer elements form at least two groups that each one or a plurality of microchannel heat transfer elements (6.1, 6.1 ', 6.1 ") of a group are thermally conductively connected to one or more microchannel heat transfer elements (6.2, 6.2', 6.2") of the other group, and that each group has its own

Inlet intake duct (8.1, 8.2) and a separate outlet duct (9.1, 9.2), which are connected fluid-conducting with the Microchannel heat transfer elements (6.1, 6.2) of the respective group.

A heat exchanger assembly according to claim 1, wherein there is no fluid conducting connection to the microchannel heat transfer elements of the other group between the microchannel heat transfer elements of the one group.

Heat exchanger arrangement according to claim 1 or 2, wherein in each case one or more microchannel heat transfer elements (6.1, 6.1 '6.1 ") of a group next to one or more microchannel heat transfer elements (6.2, 6.2', 6.2") of the other group are arranged.

A heat exchanger assembly according to any one of claims 1 to 3, wherein one or more microchannel heat transfer elements of one group are alternately disposed adjacent to one or more microchannel heat transfer elements of the other group.

5. Warnneaustauscheranordnung according to any one of claims 1 to 4, wherein juxtaposed Microchannel heat transfer elements are connected in a heat-conducting manner by means of solder joints.

6. Heat exchanger arrangement according to one of claims 1 to 5, wherein juxtaposed Microchannel- heat transfer elements directly or via heat exchange ribs (7, 7 ') connected thermally conductively.

Heat exchanger arrangement according to one of claims 1 to 6, wherein between the heat exchange ribs (6.1, 6.1 ', 6.1 ", 6.2, 6.2', 6.2") air channels are formed, and / or wherein the heat exchange ribs (7) has a height of 2 mm to 6 mm and / or have a thickness of 0.12 mm to 0.50 mm.

Heat exchanger arrangement according to one of claims 1 to 7, wherein the microchannel heat transfer elements (6.1, 6.1 ', 6.1 ", 6.2, 6.2', 6.2") are arranged substantially parallel in the areas in which they are thermally conductively connected.

Heat exchanger arrangement according to one of claims 1 to 8, wherein the microchannel heat transfer elements (6.1, 6.1 ', 6.1 ", 6.2, 6.2', 6.2") form a planar arrangement in the areas in which they are thermally conductively connected.

Heat exchanger arrangement according to one of claims 1 to 9, wherein the microchannel heat transfer elements (6.1, 6.1 ', 6.1 ") of one group with the microchannel heat transfer elements (6.2, 6.2', 6.2") of the other group a safety heat exchanger for or with at least two form separate heat cycles (3.1, 3.2), in which the microchannel heat transfer elements of a group by means of heat exchange ribs (7) thermally conductive with the

Microchannel heat transfer elements of the other group are connected.

1 1. Heat exchanger arrangement according to one of claims 1 to 10,

wherein the microchannel heat transfer elements (6.1) of one group with the microchannel heat transfer elements (6.2) of the other group form a subcooler for or with at least two separate heat circuits.

12. Use of a heat exchanger assembly according to one of

Claims 1 to 1 1 as a safety heat exchanger for or with at least two separate circuits for heat transfer media and / or refrigerant.

Use of a heat exchanger arrangement according to one of claims 1 to 11 as a subcooler for or with at least one refrigerant circuit and at least one subcoolant circuit.

14. Use of a heat exchanger assembly according to one of

Claims 1 to 1 1 as an evaporator / liquid combination for or with a first heat transfer medium, which is liquefied and / or cooled in the condenser, and a second

Heat transfer medium which is vaporized and / or heated in the evaporator.

15. Plant with at least two heat circuits and with at least one heat exchanger arrangement according to one of claims 1 to 1 first