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EP2289100A2 - Method for the manufacture of an electronic assembly - Google Patents

Method for the manufacture of an electronic assembly

Info

Publication number
EP2289100A2
EP2289100A2 EP09765709A EP09765709A EP2289100A2 EP 2289100 A2 EP2289100 A2 EP 2289100A2 EP 09765709 A EP09765709 A EP 09765709A EP 09765709 A EP09765709 A EP 09765709A EP 2289100 A2 EP2289100 A2 EP 2289100A2
Authority
EP
European Patent Office
Prior art keywords
electronic component
layer
conductive
electronic
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP09765709A
Other languages
German (de)
French (fr)
Inventor
Ulrich Schaaf
Andreas Kugler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2289100A2 publication Critical patent/EP2289100A2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/0332—Structure of the conductor
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    • H05K2201/0355—Metal foils
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Definitions

  • the invention relates to a method for producing an electronic assembly comprising at least one electronic component and a conductor track structure, with which the at least one electronic component is contacted.
  • Electronic components used to manufacture the electronic package include integrated circuits (IC), for example. These are, for example, in order to encapsulate and increase the land use on the electronic circuit substrate, accommodated in a substrate. As a result, a protection of the electronic components is possible. From US Pat. No. 6,512,182 it is known, for example, to mill receptacles in a printed circuit board substrate into which the electronic components are inserted. After inserting the electronic components, the recordings are filled, then smoothed and overlaminated. By embedding the electronic components, a smooth surface of the electronic assembly can be achieved.
  • IC integrated circuits
  • a disadvantage of this module is that first recordings are milled into the printed circuit board substrate, in which the electronic components are used. An exact positioning of the electronic components is difficult in this way possible.
  • a method for producing an electrical circuit comprising electrical components which are mechanically interconnected by a potting compound is known from DE-A 10 2005 003 125.
  • On at least one side of the potting compound at least one layer of conductor tracks is provided, which electrically connects the components to one another.
  • the components are applied to a carrier film and then encapsulated with a potting compound. Subsequently, the carrier film is removed and on the side on which the components were connected to the carrier film, one or more layers of conductor tracks are applied, which electrically connect the components to one another. In order to ensure a functional interconnection of the However, it must be ensured that the carrier film must be removed without residue.
  • An inventive method for producing an electronic assembly comprising at least one electronic component and a conductor track structure, with which the at least one electronic component is contacted, comprises the following steps:
  • Components with which the printed conductor structure is equipped are, for example, integrated circuits (IC), batteries, solar modules or other electronic components known to the person skilled in the art, which are usually used for the production of electronic assemblies.
  • IC integrated circuits
  • batteries batteries
  • solar modules or other electronic components known to the person skilled in the art, which are usually used for the production of electronic assemblies.
  • a film deformable assemblies can be made for example of a thermoplastic material.
  • the thermoplastic film is, for example, the further film laminated onto the conductive film or a deformable, for example thermoplastic film is used as carrier film, which is connected to the conductive film.
  • the further foil which is laminated onto the conductive foil populated with the at least one electronic component is likewise a conductive foil which is equipped with at least one electronic component.
  • the lamination is preferably carried out in such a way that the electronic components of the two films face each other, so that the conductive films are located on the outside of the layer composite. In this way, the land use can be significantly increased.
  • the layer which is introduced between the two conductive films is a plastic layer.
  • a plastic for example, a thermoplastic is used. However, it is also possible to use any other plastic.
  • the layer which is introduced between the two conductive films is preferably used to fix the components and to ensure the contact.
  • plastic coating can be applied before or after the structuring of the film to form the conductor track structure.
  • the application of the plastic coating prior to structuring of the conductive film has the advantage that a continuous base is maintained by the plastic layer, on which the metal layer is patterned. This can not be done by, for example, careless handling moving or kinking of individual tracks.
  • the conductive foil is not provided with a plastic layer, it is necessary to leave the conductive foil on a support, the structured foil then being handled so carefully that no displacement or kinking of the individual tracks of the structure occurs ,
  • the plastic layer it is also possible, for example, for the plastic layer to be applied to the foil on which the at least one electronic component is positioned only after the conductive foil has been loaded on the side. Furthermore, it is also possible that after loading the conductive foil, a further plastic layer is applied to the foil. In this case, the plastic coating that has been applied before the placement of the conductive foil may be arranged on the side on which the foil has been fitted with the electronic components or on the side of the foil facing away from the components.
  • vias may be introduced for a connection of the conductor track structures structured from the conductive foils.
  • the introduction of the plated-through holes can take place, for example, in that holes are formed and these are then metallized.
  • the plated-through holes it is also possible for the plated-through holes to be produced, for example, by a deep drawing process in which the upper layer of the conductive foil is pressed through the dielectric via a mandrel until it contacts the lower conductive foil.
  • an insulating layer is applied to at least one of the outwardly facing sides of the electronic assembly.
  • the insulating layer is usually made of a dielectric material.
  • Particularly preferred as an insulating layer are plastics.
  • the insulation layer is made of a thermoplastic material.
  • thermoplastics or thermosetting plastics it is alternatively also possible to use, for example, elastomers or ductile silicones for the dielectric and optionally the at least one insulating layer.
  • elastomers or stretchable silicones in conjunction with suitably designed interconnect structures, electronic circuits can be produced which are flexible in all spatial directions.
  • electronic assemblies can also be stretched, for example.
  • a forming force must generally be used for stretching or recalculation and, if appropriate, the electronic assembly should be heated.
  • At least two electronic assemblies are connected together to form a composite layer. Due to the layer composite, more than just two layers of the printed circuit board equipped with electronic components can also be used. structures are interconnected. The individual layers can be electrically contacted by plated-through holes.
  • an electrically conductive foil to be equipped on its upper side and on its lower side with at least one electronic component. In this case, further films are laminated both at the top and at the bottom of the electrically conductive film.
  • a dielectric is introduced in each case between two films.
  • the dielectric is, for example, a plastic or a silicone.
  • the electronic component In order to achieve an improved encapsulation of the electronic component, it is preferable to additionally enclose the electronic component with a molding compound.
  • a molding compound By enclosing the component with a molding compound, for example, an additional stabilization of the electronic component and the contact can be achieved, so that this does not break, for example, in a bending of the electronic assembly.
  • the electronic assembly is formed into a molding in a final step.
  • the forming can be done for example by deep drawing or other forming processes. Forming is possible in particular when a deformable material is used as the dielectric. In order to avoid that electronic components with which the film is loaded, are damaged in the forming process, it is on the one hand possible to design the assembly that no electronic components are applied to bending points or kinks of the molded part. Alternatively, it is also possible, for example, to use flexible electronic components that can be bent, for example.
  • the inventive method by the use of flexible electronics completely flexible and deformable circuits can be produced by the inventive method.
  • the electronic component which is formed into a molded part in a concluding step, can also be used, for example, as a housing part.
  • the housing parts can be connected, for example, by gluing or embossing with the actual housing and contacted if necessary.
  • FIGS. 1 to 7 show steps of a method for producing an electronic assembly
  • FIG. 8 shows an electronic assembly produced according to the invention.
  • an electrically conductive film 1 is structured to form a conductor track structure.
  • the structuring takes place here only on an electrically conductive layer 3 of the electrically conductive film 1.
  • the electrically conductive layer 3 is applied to an electrically non-conductive layer 5.
  • the electrically non-conductive layer 5 serves as a carrier layer and is not structured.
  • the electrically non-conductive layer 5 is, for example, a plastic layer.
  • As an electrically conductive layer 3 are particularly suitable special metals, for example copper or silver. Also suitable are gold, palladium or laminates, for example NiPdAu.
  • the electrically non-conductive layer 5 may be applied to the electrically conductive layer 3, for example, by lamination or doctoring. The application of the electrically non-conductive layer 5 can take place either after the structuring of the electrically conductive layer 3 or before the structuring of the electrically conductive layer 3.
  • an electrically conductive film 1 which has only one electrically conductive layer 3.
  • the electrically conductive film 1 is equipped with electronic components 9.
  • the loading of the electrically conductive foil 1 takes place, for example, in flip-chip technology.
  • 9 contact points 11 (bumps) are attached to the electronic components.
  • the contact points 11 are pressed through the electrically non-conductive layer so that they contact the conductor track structure 7, which has been structured from the electrically conductive layer 3.
  • the electrically non-conductive layer 5 can serve here simultaneously as a connection medium.
  • connection of the contact points 11 with the conductor track structure 7 takes place, for example, by a temperature and pressure process, for example so-called heatsealing. Also suitable is an NCA process (non-conductive adhesive). Alternatively, it is also possible, for example, to contact the electronic components 9 by a soldering process to the printed conductor structure 7. In this case, for example, acids contained in the electrically non-conductive layer 5 can serve as a flux for the soldering process. As a material for the electrically non-conductive layer 5 is suitable in this case, for example, an epoxy resin.
  • the electrically conductive film 1 consists only of the electrically conductive layer 3 and no electrically non-conductive layer 5 is provided, it is possible to solder the electronic components 9 first with contact points 11 on the wiring pattern 7 and then the electronic component 9 with an adhesive to underfill. Alternatively, so-called ICA bonding (isotropic conductive adhesive) is possible.
  • a second carrier strip 13 can optionally also be produced, for example.
  • the second carrier strip 13 likewise comprises a conductive film 1 with an electrically conductive layer 3, from which a printed conductor structure 7 has been patterned, and an electrically non-conductive layer 5.
  • the electrically non-conductive layer 5 is at least one other structure in another structure applied an electronic component 9, which is provided with a contact point 11.
  • the contact point 11 is pressed through the electrically non-conductive layer 5 and contacts the electronic component 9 with the conductor track structure 7.
  • the first carrier strip 12 and second carrier strip 13 produced in this way can later be connected to form a layer composite.
  • the placement and structure of the conductor tracks of the first carrier strip 12 and of the second carrier strip 13 usually differs.
  • An additional stabilization of the electronic components 9 can be achieved, for example, by enclosing them, as shown in FIG. 4, by a molding compound 15.
  • enclosing the electronic components 9 with the molding compound 15 is only necessary if the electronic components 9 are very sensitive or, for example, even if the carrier strip is to be bent, without the electronic components being bent.
  • the molding compound 15 serves as additional mechanical stabilization.
  • the second carrier strip 13 connected to the first carrier strip 12 is shown in FIG.
  • the first carrier strip 12 and the second carrier strip 13 are connected to one another such that the electrically conductive layer 3 of the two carrier strips 12, 13 lies on the outer side in each case.
  • the electrically non-conductive layer 5 of the first carrier strip 12 and of the second carrier strip 13 forms a dielectric, by which it is avoided that the electrically conductive layers 3, which form the conductor track structure 7, are contacted with one another at undesired positions.
  • the connection of the carrier strips 12, 13 takes place by means of a conventional laminating method known to the person skilled in the art.
  • a dielectric is suitable in this case, for example, a plastic film.
  • the two carrier strips 12, 13 laminated together with the intervening plastic film.
  • the second carrier strip 13 As an alternative to laminating the second carrier strip 13 onto the first carrier strip 12, it is also possible, for example, to laminate a dielectric onto the first carrier strip 12 and to provide only one conductive layer. Furthermore, it is also possible to apply a dielectric to the outside of the electrically conductive layer 3 and to laminate a further electrically conductive layer. In this case, for example, at least one electronic element 9 can also be arranged on the upper side and the lower side of the electrically conductive layer 3. In this case, it is furthermore preferred for the electrically conductive layer 3 to be provided with an electrically nonconductive layer on the second side after structuring to form the conductor track structure 7.
  • the strip conductor structures 7, which have been patterned from the electrically conductive layers 3, can be connected to one another by plated-through holes 17.
  • the through contacts 17 can be produced, for example, by introducing bores into the circuit carrier and then metallizing the bores.
  • the electrically conductive layer 3 of one of the two carrier strips 12, 13 is pressed over a mandrel through the dielectric which is formed by the electrically non-conductive layer 5 until it is the second electrically conductive layer 3 contacted.
  • an insulating layer 19 is preferably applied to the outside.
  • the insulation layer 19 for example, a plastic film can be applied to the layer composite of the first carrier strip 12 and the second carrier strip 13. Alternatively, it is also possible to apply a plastic layer by any other method on the composite layer.
  • the insulation layer 19 which is applied to the outside of the composite layer, can be optionally structured, for example, to be able to attach connectors or cables. This makes it possible to contact the electronic module.
  • this can be embossed in any shape.
  • a flexible film-like circuit This is shown in FIG.
  • electronic components 9 are applied to an electrically conductive foil which has been patterned into a conductor track structure 7, which are enclosed by the molding compound 15 in order to protect it from damage.
  • a dielectric 21 is applied to the layer in order to achieve a uniform layer thickness and a further encapsulation of the electronic components 9.
  • a material for the dielectric 21 a material is selected which is flexible and allows deformation of the layer composite.
  • Such a flexible film-like circuit can be used for example in garments.
  • Such apparel-integrated electronics are useful, for example, in skis or mountaineering equipment, for example, to locate a wearer of such garment that may have been spilled by an avalanche.
  • the electronics can be used, for example, as theft protection. It is also possible, for example, to store product information on a corresponding circuit.
  • circuit is not used as a flexible film-like circuit, it is also possible, for example, to transform the layer composite into a molded part. This is done for example by embossing the layer composite, as shown in Figure 7. As a result, for example, a housing with integrated electronics can be generated.

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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
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  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

The invention relates to a method for the manufacture of an electronic assembly, comprising at least one electronic component (9) and also a conductor track structure (7) which is used to make contact with the at least one electronic component (9). The method involves a first step being used to pattern a conductive foil (1) to produce the conductor track structure (7). In a second step, the conductor track structure (7) has the at least one electronic component (9) fitted. In a final step, a further foil is laminated onto the conductive foil (1) fitted with the at least one electronic component (9) on the side on which the conductive foil (1) has the at least one electronic component (9) fitted.

Description

Beschreibung description
Titeltitle
Verfahren zur Herstellung einer elektronischen BaugruppeMethod for producing an electronic assembly
Stand der TechnikState of the art
Die Erfindung betrifft ein Verfahren zur Herstellung einer elektronischen Baugruppe, umfassend mindestens ein elektronisches Bauelement sowie eine Leiterbahnstruktur, mit der das mindestens eine elektronische Bauelement kontaktiert wird.The invention relates to a method for producing an electronic assembly comprising at least one electronic component and a conductor track structure, with which the at least one electronic component is contacted.
Elektronische Bauelemente, die zur Herstellung der elektronischen Baugruppe eingesetzt werden, sind zum Beispiel integrierte Schaltkreise (IC). Diese werden, zum Beispiel um sie zu verkapseln und die Flächennutzung auf dem elektronischen Schaltungsträger zu steigern, in ein Substrat aufgenommen. Hierdurch ist ein Schutz der elektronischen Bauelemente möglich. Aus US-B 6,512,182 ist es zum Beispiel bekannt, in ein Leiterplattensubstrat Aufnahmen einzufräsen, in die die elektronischen Bauelemente eingelegt werden. Nach dem Einlegen der elektronischen Bauelemente werden die Aufnahmen aufgefüllt, anschließend geglättet und überlaminiert. Durch das Einbetten der elektronischen Bauelemente lässt sich eine glatte Oberfläche der elektronischen Baugruppe erzielen.Electronic components used to manufacture the electronic package include integrated circuits (IC), for example. These are, for example, in order to encapsulate and increase the land use on the electronic circuit substrate, accommodated in a substrate. As a result, a protection of the electronic components is possible. From US Pat. No. 6,512,182 it is known, for example, to mill receptacles in a printed circuit board substrate into which the electronic components are inserted. After inserting the electronic components, the recordings are filled, then smoothed and overlaminated. By embedding the electronic components, a smooth surface of the electronic assembly can be achieved.
Ein Nachteil dieser Baugruppe ist es, dass zunächst Aufnahmen in das Leiterplattensubstrat eingefräst werden, in die die elektronischen Bauelemente eingesetzt werden. Eine exakte Positionierung der elektronischen Bauelemente ist auf diese Weise nur schwer möglich.A disadvantage of this module is that first recordings are milled into the printed circuit board substrate, in which the electronic components are used. An exact positioning of the electronic components is difficult in this way possible.
Ein Verfahren zur Herstellung einer elektrischen Schaltung, die elektrische Bauelemente aufweist, die mechanisch durch eine Vergussmasse miteinander verbunden sind, ist aus DE- A 10 2005 003 125 bekannt. Auf mindestens einer Seite der Vergussmasse ist mindestens eine Schicht Leiterbahnen vorgesehen, die die Bauelemente elektrisch miteinander verbindet. Zur Herstellung der Schaltung werden die Bauelemente auf einer Trägerfolie aufge- bracht und anschließend mit einer Vergussmasse umgössen. Daran anschließend wird die Trägerfolie entfernt und auf der Seite, auf der die Bauelemente mit der Trägerfolie verbunden waren, werden ein oder mehrere Schichten von Leiterbahnen aufgebracht, die die Bauelemente elektrisch miteinander verbinden. Um eine funktionsfähige Verschaltung der elekt- rischen Schaltung zu erzielen ist es hierbei jedoch erforderlich, dass die Trägerfolie rückstandsfrei entfernt werden muss.A method for producing an electrical circuit comprising electrical components which are mechanically interconnected by a potting compound is known from DE-A 10 2005 003 125. On at least one side of the potting compound, at least one layer of conductor tracks is provided, which electrically connects the components to one another. To produce the circuit, the components are applied to a carrier film and then encapsulated with a potting compound. Subsequently, the carrier film is removed and on the side on which the components were connected to the carrier film, one or more layers of conductor tracks are applied, which electrically connect the components to one another. In order to ensure a functional interconnection of the However, it must be ensured that the carrier film must be removed without residue.
Weitere Nachteile der aus dem Stand der Technik bekannten elektronischen Baugruppen sind deren vergleichsweise große Dicke aufgrund des eingesetzten Leiterplattensubstrates. Zudem sind die nach dem Stand der Technik hergestellten elektronischen Baugruppen starr und nicht verformbar. Wenn die elektronische Baugruppe zum Beispiel in einem Kleidungsstück eingesetzt werden soll, beispielsweise als Sender, um von Lawinen verschüttete Personen aufzufinden oder auch als Diebstahlschutz, ist es gewünscht, flexible elektronische Baugruppen einzusetzen, die sich einer Bewegung des Kleidungsstückes anpassen können.Further disadvantages of the known from the prior art electronic modules are their comparatively large thickness due to the printed circuit substrate used. In addition, the electronic assemblies manufactured according to the prior art are rigid and not deformable. For example, if the electronic assembly is to be used in a garment, such as a sender, to locate people trapped by avalanches, or as a theft deterrent, it is desirable to use flexible electronic assemblies that can accommodate movement of the garment.
Offenbarung der ErfindungDisclosure of the invention
Vorteile der ErfindungAdvantages of the invention
Ein erfindungsgemäßes Verfahren zur Herstellung einer elektronischen Baugruppe, umfassend mindestens ein elektronisches Bauelement sowie eine Leiterbahnstruktur, mit der das mindestens eine elektronische Bauelement kontaktiert wird, umfasst folgende Schritte:An inventive method for producing an electronic assembly, comprising at least one electronic component and a conductor track structure, with which the at least one electronic component is contacted, comprises the following steps:
(a) Strukturieren einer leitfähigen Folie zum Ausbilden der Leiterbahnstruktur,(a) patterning a conductive film for forming the wiring pattern,
(b) Bestücken der Leiterbahnstruktur mit dem mindestens einen elektronischen Bauelement,(b) equipping the conductor track structure with the at least one electronic component,
(c) Auflaminieren einer weiteren Folie auf die mit dem mindestens einen elektronischen Bauelement bestückte leitfähige Folie auf der Seite, auf der die leitfähige Folie mit dem mindestens einen elektronischen Bauelement bestückt ist.(C) lamination of a further film on the equipped with the at least one electronic component conductive film on the side on which the conductive film is equipped with the at least one electronic component.
Durch das Auflaminieren der Folie auf die mit dem mindestens einen elektronischen Bau- elements bestückte leitfähige Folie auf der Seite, auf der die leitfähige Folie mit dem mindestens einen elektronischen Bauelement bestückt ist, wird das Bauelement komplett gekapselt. Hierdurch lässt sich eine hohe Zuverlässigkeit insbesondere von empfindlichen Bauelementen erzielen.By laminating the film on the equipped with the at least one electronic component conductive foil on the side on which the conductive foil is equipped with the at least one electronic component, the device is completely encapsulated. This makes it possible to achieve high reliability, in particular of sensitive components.
Bauelemente, mit denen die Leiterbahnstruktur bestückt wird, sind zum Beispiel integrierte Schaltkreise (IC), Batterien, Solarmodule oder andere, dem Fachmann bekannte elektronische Bauteile, die üblicherweise zur Herstellung von elektronischen Baugruppen eingesetzt werden. Durch das Strukturieren der leitfähigen Folie, die mit dem mindestens einen elekt- ronischen Bauelement bestückt wird und das anschließende Auflaminieren einer weiteren Folie wird ein flexibler Verbund erzielt. Zudem können bei Einsatz einer Folie zum Beispiel aus einem thermoplastischen Material verformbare Baugruppen hergestellt werden. Die thermoplastische Folie ist dabei zum Beispiel die auf die leitfähige Folie auflaminierte weite- re Folie oder es wird eine verformbare, beispielsweise thermoplastische Folie als Trägerfolie, die mit der leitfähigen Folie verbunden ist, eingesetzt.Components with which the printed conductor structure is equipped are, for example, integrated circuits (IC), batteries, solar modules or other electronic components known to the person skilled in the art, which are usually used for the production of electronic assemblies. By structuring the conductive foil associated with the at least one Ronic component is equipped and the subsequent lamination of another film is achieved a flexible composite. In addition, when using a film deformable assemblies can be made for example of a thermoplastic material. The thermoplastic film is, for example, the further film laminated onto the conductive film or a deformable, for example thermoplastic film is used as carrier film, which is connected to the conductive film.
In einer Ausführungsform ist die weitere Folie, die auf die mit dem mindestens einen elektronischen Bauelement bestückte leitfähige Folie auflaminiert wird, ebenfalls eine leitfähige Folie, die mit mindestens einem elektronischen Bauteil bestückt ist. Das Auflaminieren erfolgt dabei vorzugsweise derart, dass die elektronische Bauteile der beiden Folien zueinander weisen, so dass die leitfähigen Folien sich an der Außenseite des Schichtverbundes befinden. Auf diese Weise lässt sich die Flächennutzung deutlich steigern. Um zu vermeiden, dass durch das Auflaminieren der weiteren Folie auf die leitfähige Folie unerwünschte elekt- rische Verbindungen entstehen, ist es bevorzugt, zwischen die zwei leitfähigen Folien eine Schicht aus einem dielektrischen Material einzubringen. Bevorzugt ist die Schicht, die zwischen die zwei leitfähigen Folien eingebracht wird eine Kunststoffschicht. Als Kunststoff wird zum Beispiel ein Thermoplast eingesetzt. Es ist jedoch auch möglich, jeden beliebigen anderen Kunststoff zu verwenden. Die Schicht, die zwischen die zwei leitfähigen Folien eingebracht wird, wird vorzugsweise verwendet, um die Bauteile zu fixieren und die Kon- taktierung sicherzustellen.In one embodiment, the further foil which is laminated onto the conductive foil populated with the at least one electronic component is likewise a conductive foil which is equipped with at least one electronic component. The lamination is preferably carried out in such a way that the electronic components of the two films face each other, so that the conductive films are located on the outside of the layer composite. In this way, the land use can be significantly increased. In order to avoid that unwanted electrical connections are formed by laminating the further film to the conductive film, it is preferable to introduce a layer of a dielectric material between the two conductive films. Preferably, the layer which is introduced between the two conductive films is a plastic layer. As a plastic, for example, a thermoplastic is used. However, it is also possible to use any other plastic. The layer which is introduced between the two conductive films is preferably used to fix the components and to ensure the contact.
Um die Kunststoffschicht zwischen die zwei leitfähigen Folien einzubringen, ist es zum Beispiel möglich, auf die leitfähige Folie vor dem Bestücken mit dem mindestens einen elektro- nischen Bauelement eine Kunststoffbeschichtung aufzubringen. Die Kunststoffbeschichtung kann dabei vor oder nach dem Strukturieren der Folie zum Ausbilden der Leiterbahnstruktur aufgebracht werden. Das Aufbringen der Kunststoffbeschichtung vor dem Strukturieren der leitfähigen Folie hat den Vorteil, dass durch die Kunststoffschicht eine durchgängige Unterlage erhalten bleibt, auf der die Metallschicht strukturiert wird. Hierdurch kann nicht durch beispielsweise unachtsame Handhabung ein Verschieben oder Abknicken von einzelnen Leiterbahnen erfolgen. Im Unterschied dazu ist es notwendig, wenn die leitfähige Folie nicht mit einer Kunststoffschicht versehen ist, die leitfähige Folie auf einen Träger zu belassen, wobei die strukturiere Folie dann so sorgfältig zu handhaben ist, dass ein Verschieben oder Abknicken der einzelnen Leiterbahnen der Struktur nicht erfolgt.In order to introduce the plastic layer between the two conductive films, it is possible, for example, to apply a plastic coating to the conductive film before it is equipped with the at least one electronic component. The plastic coating can be applied before or after the structuring of the film to form the conductor track structure. The application of the plastic coating prior to structuring of the conductive film has the advantage that a continuous base is maintained by the plastic layer, on which the metal layer is patterned. This can not be done by, for example, careless handling moving or kinking of individual tracks. In contrast, when the conductive foil is not provided with a plastic layer, it is necessary to leave the conductive foil on a support, the structured foil then being handled so carefully that no displacement or kinking of the individual tracks of the structure occurs ,
Alternativ ist es jedoch zum Beispiel auch möglich, dass die Kunststoffschicht erst nach dem Bestücken der leitfähigen Folie auf der Seite auf die Folie aufgebracht wird, auf der das mindestens eine elektronische Bauteil positioniert ist. Weiterhin ist es auch möglich, dass nach dem Bestücken der leitfähigen Folie eine weitere Kunststoffschicht auf die Folie aufgebracht wird. Dabei kann die Kunststoffbeschichtung, die vor dem Bestücken der leitfähigen Folie aufgebracht wurde, auf der Seite angeordnet sein, auf der die Folie mit den elektronischen Bauelementen bestückt wurde oder auf der den Bauteilen abgewandten Seite der Folie.Alternatively, however, it is also possible, for example, for the plastic layer to be applied to the foil on which the at least one electronic component is positioned only after the conductive foil has been loaded on the side. Furthermore, it is also possible that after loading the conductive foil, a further plastic layer is applied to the foil. In this case, the plastic coating that has been applied before the placement of the conductive foil may be arranged on the side on which the foil has been fitted with the electronic components or on the side of the foil facing away from the components.
Wenn die weitere Folie, die auf die mit dem mindestens einen elektronischen Bauelement bestückte leitfähige Folie auflaminierte Folie ebenfalls eine leitfähige Folie ist, so können in einer Ausführungsform für eine Verbindung der aus den leitfähigen Folien strukturierten Leiterbahnstrukturen Durchkontaktierungen eingebracht werden. Das Einbringen der Durchkontaktierungen kann zum Beispiel dadurch erfolgen, dass Bohrungen ausgebildet werden und diese anschließend metallisiert werden. Alternativ ist es auch möglich, dass die Durchkontaktierungen zum Beispiel durch einen Tiefziehprozess hergestellt werden, bei dem die obere Lage der leitfähigen Folie über einen Dorn durch das Dielektrikum gedrückt wird, bis dieses die untere leitfähige Folie kontaktiert.If the further film which is laminated onto the conductive foil laminated with the at least one electronic component is likewise a conductive foil, in one embodiment vias may be introduced for a connection of the conductor track structures structured from the conductive foils. The introduction of the plated-through holes can take place, for example, in that holes are formed and these are then metallized. Alternatively, it is also possible for the plated-through holes to be produced, for example, by a deep drawing process in which the upper layer of the conductive foil is pressed through the dielectric via a mandrel until it contacts the lower conductive foil.
Um zu vermeiden, dass unerwünschte Kontakte an der leitfähigen Folie erfolgen, die zum Beispiel zu einer Fehlfunktion der elektronischen Baugruppe führen, ist es bevorzugt, dass auf mindestens einer der nach außen weisenden Seiten der elektronischen Baugruppe eine Isolationsschicht aufgebracht wird. Die Isolationsschicht ist üblicherweise aus einem dielektrischen Material gefertigt. Besonders bevorzugt als Isolationsschicht eignen sich Kunststoffe. Insbesondere, wenn die elektronische Baugruppe verformt werden soll, ist es vorteilhaft, wenn die Isolationsschicht aus einem thermoplastischen Material gefertigt wird.In order to avoid that unwanted contacts take place on the conductive foil, which lead for example to a malfunction of the electronic assembly, it is preferred that an insulating layer is applied to at least one of the outwardly facing sides of the electronic assembly. The insulating layer is usually made of a dielectric material. Particularly preferred as an insulating layer are plastics. In particular, when the electronic assembly is to be deformed, it is advantageous if the insulation layer is made of a thermoplastic material.
Neben der Verwendung von thermoplastischen Kunststoffen oder duroplastischen Kunststoffen ist es alternativ auch möglich, zum Beispiel Elastomere oder dehnbare Silikone für das Dielektrikum und gegebenenfalls die mindestens eine Isolationsschicht einzusetzen. Durch den Einsatz von Elastomeren oder dehnbaren Silikonen können in Verbindung mit geeignet gestalteten Leiterbahnstrukturen elektronische Schaltungen erzeugt werden, die in allen Raumrichtungen flexibel sind. Insbesondere lassen sich solche elektronischen Baugruppen zum Beispiel auch dehnen. Bei plastisch verformbaren Materialien ist für eine Dehnung oder Umkrummung im Allgemeinen eine Umformkraft aufzuwenden und gegebenenfalls die elektronische Baugruppe zu erwärmen.In addition to the use of thermoplastics or thermosetting plastics, it is alternatively also possible to use, for example, elastomers or ductile silicones for the dielectric and optionally the at least one insulating layer. Through the use of elastomers or stretchable silicones, in conjunction with suitably designed interconnect structures, electronic circuits can be produced which are flexible in all spatial directions. In particular, such electronic assemblies can also be stretched, for example. In the case of plastically deformable materials, a forming force must generally be used for stretching or recalculation and, if appropriate, the electronic assembly should be heated.
In einer Ausführungsform der Erfindung werden mindestens zwei elektronische Baugruppen miteinander zu einem Schichtverbund verbunden. Durch den Schichtverbund können auch mehr als nur zwei Schichten der mit elektronischen Bauelementen bestückten Leiterbahn- strukturen miteinander verbunden werden. Die einzelnen Schichten können dabei durch Durchkontaktierungen miteinander elektrisch kontaktiert werden.In one embodiment of the invention, at least two electronic assemblies are connected together to form a composite layer. Due to the layer composite, more than just two layers of the printed circuit board equipped with electronic components can also be used. structures are interconnected. The individual layers can be electrically contacted by plated-through holes.
Wenn ein Schichtverbund aus mehr als zwei Schichten hergestellt werden soll, so ist es auch möglich, dass eine elektrisch leitfähige Folie an ihrer Oberseite und an ihrer Unterseite jeweils mit mindestens einem elektronischen Bauelement bestückt wird. In diesem Fall werden weitere Folien sowohl an der Oberseite als auch an der Unterseite der elektrisch leitfähigen Folie auflaminiert.If a layer composite is to be produced from more than two layers, then it is also possible for an electrically conductive foil to be equipped on its upper side and on its lower side with at least one electronic component. In this case, further films are laminated both at the top and at the bottom of the electrically conductive film.
Weiterhin ist es möglich, zum Beispiel auch mehrere beidseitig mit jeweils mindestens einem elektronischen Bauelement bestückte Folien zu einem Schichtverbund miteinander zu verbinden. In diesem Fall wird jeweils zwischen zwei Folien ein Dielektrikum eingebracht. Das Dielektrikum ist wie zuvor bereits erwähnt zum Beispiel ein Kunststoff oder ein Silikon.Furthermore, it is possible, for example, to connect a plurality of films populated on both sides with in each case at least one electronic component to form a layer composite. In this case, a dielectric is introduced in each case between two films. As already mentioned, the dielectric is, for example, a plastic or a silicone.
Um eine verbesserte Verkapselung des elektronischen Bauelementes zu erzielen, ist es bevorzugt, das elektronische Bauelement zusätzlich mit einer Formmasse zu umschließen. Durch das Umschließen des Bauelementes mit einer Formmasse kann zum Beispiel eine zusätzliche Stabilisierung des elektronischen Bauelementes und der Kontaktierung erzielt werden, so dass dieses beispielsweise bei einer Biegung der elektronischen Baugruppe nicht bricht.In order to achieve an improved encapsulation of the electronic component, it is preferable to additionally enclose the electronic component with a molding compound. By enclosing the component with a molding compound, for example, an additional stabilization of the electronic component and the contact can be achieved, so that this does not break, for example, in a bending of the electronic assembly.
In einer Ausführungsform wird die elektronische Baugruppe in einem abschließenden Schritt zu einem Formteil umgeformt. Das Umformen kann zum Beispiel durch Tiefziehen oder andere Umformverfahren erfolgen. Ein Umformen ist insbesondere dann möglich, wenn als Dielektrikum ein umformbares Material eingesetzt wird. Um zu vermeiden, dass elektronische Bauelemente, mit denen die Folie bestückt ist, bei dem Umformvorgang beschädigt werden, ist es einerseits möglich, die Bestückung zu gestalten, dass an Biegestellen oder Knickstellen des Formteiles keine elektronischen Bauelemente aufgebracht sind. Alternativ ist es jedoch zum Beispiel auch möglich, flexible elektronische Bauteile einzusetzen, die beispielsweise gebogen werden können.In one embodiment, the electronic assembly is formed into a molding in a final step. The forming can be done for example by deep drawing or other forming processes. Forming is possible in particular when a deformable material is used as the dielectric. In order to avoid that electronic components with which the film is loaded, are damaged in the forming process, it is on the one hand possible to design the assembly that no electronic components are applied to bending points or kinks of the molded part. Alternatively, it is also possible, for example, to use flexible electronic components that can be bent, for example.
Durch das erfindungsgemäße Verfahren ist es möglich, kostengünstig durch den Einsatz von Prozessen auf vielen Modulen gleichzeitig und eine Reel-to-Reel-Fertigung eine kostengünstige Verdrahtung und Verkapselung zu erzielen. Weiterhin ist es möglich, die elektroni- sehe Baugruppe beispielsweise als Standard-Bauteil weiter zu verarbeiten. Die Ankontaktie- rung der elektronischen Bauelemente bei dem erfindungsgemäßen Verfahren erfolgt gleichzeitig mit der Montage. Dies macht weniger Prozessschritte erforderlich als bei den aus dem Stand der Technik bekannten Verfahren. Ein weiterer Vorteil ist es, dass auch kostengünstige Kunststoffe als Dielektrikum eingesetzt werden. Derartige Kunststoffe sind dem Fachmann zum Beispiel von RFIDs bekannt. Diese Kunststoffe können insbesondere bei Anwendungen im niedrigen Temperaturbereich einge- setzt werden.By means of the method according to the invention, it is possible to inexpensively achieve cost-effective wiring and encapsulation by the use of processes on many modules at the same time and a reel-to-reel production. Furthermore, it is possible to further process the electronic assembly, for example as a standard component. The contacting of the electronic components in the method according to the invention takes place simultaneously with the assembly. This requires fewer process steps than the methods known from the prior art. Another advantage is that even inexpensive plastics are used as a dielectric. Such plastics are known to the person skilled in the art, for example, from RFIDs. These plastics can be used in particular in applications in the low temperature range.
Insbesondere durch den Einsatz von flexibler Elektronik können durch das erfindungsgemäße Verfahren vollständig flexible und verformbare Schaltungen hergestellt werden. Wenn plastisch verformbare Schaltungsträger eingesetzt werden, kann die elektronische Baugrup- pe, die in einem abschließenden Schritt zu einem Formteil umgeformt wird, zum Beispiel auch als ein Gehäuseteil eingesetzt werden. Die Gehäuseteile können zum Beispiel durch Kleben oder Prägen mit dem eigentlichen Gehäuse verbunden und bei Bedarf kontaktiert werden.In particular, by the use of flexible electronics completely flexible and deformable circuits can be produced by the inventive method. If plastically deformable circuit carriers are used, the electronic component, which is formed into a molded part in a concluding step, can also be used, for example, as a housing part. The housing parts can be connected, for example, by gluing or embossing with the actual housing and contacted if necessary.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Ausführungsformen der Erfindung sind in den Zeichnungen dargestellt und werden in der nachfolgenden Beschreibung näher erläutert.Embodiments of the invention are illustrated in the drawings and are explained in more detail in the following description.
Es zeigenShow it
Figur 1 bis 7 Schritte eines Verfahrens zur Herstellung einer elektronischen Baugruppe,FIGS. 1 to 7 show steps of a method for producing an electronic assembly,
Figur 8 eine erfϊndungsgemäß hergestellte elektronische Baugruppe.FIG. 8 shows an electronic assembly produced according to the invention.
Ausführungsformen der ErfindungEmbodiments of the invention
In den Figuren 1 bis 7 sind einzelne Verfahrensschritte zur Herstellung eines erfmdungsge- maß ausgebildeten elektronischen Bauteils dargestellt.In the figures 1 to 7 individual process steps for the production of a erfmdungsge- trained electronic component are shown.
In einem ersten Schritt, der in Figur 1 dargestellt ist, wird eine elektrisch leitfähige Folie 1 zum Ausbilden einer Leiterbahnstruktur strukturiert. Die Strukturierung erfolgt dabei lediglich an einer elektrisch leitfähigen Schicht 3 der elektrisch leitfähigen Folie 1. In der hier dargestellten Ausführungsform ist die elektrisch leitfähige Schicht 3 auf einer elektrisch nicht leitfähigen Schicht 5 aufgebracht. Die elektrisch nicht leitfähige Schicht 5 dient dabei als Trägerschicht und wird nicht strukturiert. Die elektrisch nicht leitfähige Schicht 5 ist zum Beispiel eine Kunststoffschicht. Als elektrisch leitfähige Schicht 3 eignen sich insbe- sondere Metalle, beispielsweise Kupfer oder Silber. Weiterhin eignen sich auch Gold, Palladium oder Schichtverbunde, beispielsweise NiPdAu. Die elektrisch nicht leitfähige Schicht 5 kann zum Beispiel durch Laminieren oder Rakeln auf die elektrisch leitfähige Schicht 3 aufgebracht werden. Das Aufbringen der elektrisch nicht leitfähigen Schicht 5 kann entweder nach dem Strukturieren der elektrisch leitfähigen Schicht 3 oder vor dem Strukturieren der elektrisch leitfähigen Schicht 3 erfolgen.In a first step, which is illustrated in FIG. 1, an electrically conductive film 1 is structured to form a conductor track structure. The structuring takes place here only on an electrically conductive layer 3 of the electrically conductive film 1. In the embodiment shown here, the electrically conductive layer 3 is applied to an electrically non-conductive layer 5. The electrically non-conductive layer 5 serves as a carrier layer and is not structured. The electrically non-conductive layer 5 is, for example, a plastic layer. As an electrically conductive layer 3 are particularly suitable special metals, for example copper or silver. Also suitable are gold, palladium or laminates, for example NiPdAu. The electrically non-conductive layer 5 may be applied to the electrically conductive layer 3, for example, by lamination or doctoring. The application of the electrically non-conductive layer 5 can take place either after the structuring of the electrically conductive layer 3 or before the structuring of the electrically conductive layer 3.
Alternativ ist es auch möglich, zum Beispiel eine elektrisch leitfähige Folie 1 einzusetzen, die nur eine elektrisch leitfähige Schicht 3 aufweist. In diesem Fall ist es jedoch erforderlich, die elektrisch leitfähige Folie 1, die nur die elektrisch leitfähige Schicht 3 aufweist, auf einem Trägermaterial aufzulegen, um zu vermeiden, dass nach dem Strukturieren der Leiterbahnstruktur 7 eine Verschiebung der einzelnen Leiterbahnen auftritt.Alternatively, it is also possible, for example, to use an electrically conductive film 1 which has only one electrically conductive layer 3. In this case, however, it is necessary to place the electrically conductive film 1, which has only the electrically conductive layer 3, on a carrier material, in order to avoid that, after the structuring of the conductor track structure 7, a displacement of the individual conductor tracks occurs.
Nach dem Strukturieren der Leiterbahnstruktur aus der elektrisch leitfähigen Schicht 3 der elektrisch leitfähigen Folie 1 wird die elektrisch leitfähige Folie 1 mit elektronischen Bauelementen 9 bestückt. Das Bestücken der elektrisch leitfähigen Folie 1 erfolgt zum Beispiel in Flip-Chip-Technologie. Hierzu sind an den elektronischen Bauelementen 9 Kontaktpunkte 11 (Bumps) angebracht. Die Kontaktpunkte 11 werden durch die elektrisch nicht leitfähige Schicht hindurchgedrückt, so dass diese die Leiterbahnstruktur 7, die aus der elektrisch leitfähigen Schicht 3 strukturiert wurde, kontaktieren. Die elektrisch nicht leitfähige Schicht 5 kann hierbei gleichzeitig als Verbindungsmedium dienen. Hierzu ist es zum Beispiel möglich, als elektrisch nicht leitfähige Schicht 5 eine Klebstoffbeschichtung einzusetzen.After the patterning of the conductor track structure from the electrically conductive layer 3 of the electrically conductive film 1, the electrically conductive film 1 is equipped with electronic components 9. The loading of the electrically conductive foil 1 takes place, for example, in flip-chip technology. For this purpose, 9 contact points 11 (bumps) are attached to the electronic components. The contact points 11 are pressed through the electrically non-conductive layer so that they contact the conductor track structure 7, which has been structured from the electrically conductive layer 3. The electrically non-conductive layer 5 can serve here simultaneously as a connection medium. For this purpose, it is possible, for example, to use an adhesive coating as the electrically non-conductive layer 5.
Die Verbindung der Kontaktpunkte 11 mit der Leiterbahnstruktur 7 erfolgt zum Beispiel durch einen Temperatur- und Druckprozess, beispielsweise so genanntes Heatsealen. Weiterhin geeignet ist auch ein NCA-Prozess (Non conductive adhesive). Alternativ ist es zum Beispiel auch möglich, die elektronischen Bauelemente 9 durch einen Lötprozess an die Leiterbahnstruktur 7 zu kontaktieren. Hierbei können zum Beispiel in der elektrisch nicht leitfähigen Schicht 5 enthaltene Säuren als Flussmittel für den Lötprozess dienen. Als Mate- rial für die elektrisch nicht leitfähige Schicht 5 eignet sich in diesem Fall zum Beispiel auch ein Epoxidharz.The connection of the contact points 11 with the conductor track structure 7 takes place, for example, by a temperature and pressure process, for example so-called heatsealing. Also suitable is an NCA process (non-conductive adhesive). Alternatively, it is also possible, for example, to contact the electronic components 9 by a soldering process to the printed conductor structure 7. In this case, for example, acids contained in the electrically non-conductive layer 5 can serve as a flux for the soldering process. As a material for the electrically non-conductive layer 5 is suitable in this case, for example, an epoxy resin.
Wenn die elektrisch leitfähige Folie 1 nur aus der elektrisch leitfähigen Schicht 3 besteht und keine elektrisch nicht leitfähige Schicht 5 vorgesehen ist, ist es möglich, die elektronischen Bauelemente 9 zunächst mit Kontaktpunkten 11 auf die Leiterbahnstruktur 7 aufzulöten und das elektronische Bauelement 9 anschließend mit einem Klebstoff zu unterfüllen. Alternativ ist auch das sogenannte ICA-Kleben (isotropic conductive adhesive) möglich. Auf die gleiche Art wie in den Figuren 1 und 2 dargestellt, lässt sich optional zum Beispiel auch ein zweiter Trägerstreifen 13 herstellen. Der zweite Trägerstreifen 13 umfasst ebenfalls eine leitfähige Folie 1 mit einer elektrisch leitfähigen Schicht 3, aus der eine Leiterbahn- Struktur 7 strukturiert wurde, und einer elektrisch nicht leitfähigen Schicht 5. Auf die elekt- risch nicht leitfähige Schicht 5 ist in einer anderen Struktur mindestens ein elektronisches Bauelement 9 aufgebracht, das mit einem Kontaktpunkt 11 versehen ist. Der Kontaktpunkt 11 wird durch die elektrisch nicht leitfähige Schicht 5 hindurchgedrückt und kontaktiert das elektronische Bauelement 9 mit der Leiterbahnstruktur 7. Der so hergestellte erste Trägerstreifen 12 und zweite Trägerstreifen 13 können später zu einem Schichtverbund miteinan- der verbunden werden. Hierbei unterscheidet sich üblicherweise die Bestückung und Struktur der Leiterbahnen des ersten Trägerstreifens 12 und des zweiten Trägerstreifens 13. So ist es zum Beispiel auch möglich, dass nur einer der beiden Trägerstreifen 12, 13 mit dem mindestens einen elektronischen Bauelement 9 bestückt ist und der andere Trägerstreifen 13, 12 unbestückt ist.If the electrically conductive film 1 consists only of the electrically conductive layer 3 and no electrically non-conductive layer 5 is provided, it is possible to solder the electronic components 9 first with contact points 11 on the wiring pattern 7 and then the electronic component 9 with an adhesive to underfill. Alternatively, so-called ICA bonding (isotropic conductive adhesive) is possible. In the same way as shown in FIGS. 1 and 2, a second carrier strip 13 can optionally also be produced, for example. The second carrier strip 13 likewise comprises a conductive film 1 with an electrically conductive layer 3, from which a printed conductor structure 7 has been patterned, and an electrically non-conductive layer 5. The electrically non-conductive layer 5 is at least one other structure in another structure applied an electronic component 9, which is provided with a contact point 11. The contact point 11 is pressed through the electrically non-conductive layer 5 and contacts the electronic component 9 with the conductor track structure 7. The first carrier strip 12 and second carrier strip 13 produced in this way can later be connected to form a layer composite. In this case, the placement and structure of the conductor tracks of the first carrier strip 12 and of the second carrier strip 13 usually differs. For example, it is also possible that only one of the two carrier strips 12, 13 is equipped with the at least one electronic component 9 and the other carrier strip 13, 12 is empty.
Eine zusätzliche Stabilisierung der elektronischen Bauelemente 9 kann zum Beispiel dadurch erzielt werden, dass diese, wie in Figur 4 dargestellt, von einer Formmasse 15 umschlossen werden. Das Umschließen der elektronischen Bauelemente 9 mit der Formmasse 15 ist jedoch nur erforderlich, wenn die elektronischen Bauelemente 9 sehr empfindlich sind oder zum Beispiel auch wenn der Trägerstreifen gebogen werden soll, ohne dass die elektronischen Bauelemente dabei verbogen werden. In diesem Fall dient die Formmasse 15 als zusätzliche mechanische Stabilisierung.An additional stabilization of the electronic components 9 can be achieved, for example, by enclosing them, as shown in FIG. 4, by a molding compound 15. However, enclosing the electronic components 9 with the molding compound 15 is only necessary if the electronic components 9 are very sensitive or, for example, even if the carrier strip is to be bent, without the electronic components being bent. In this case, the molding compound 15 serves as additional mechanical stabilization.
Der mit dem ersten Trägerstreifen 12 verbundene zweite Trägerstreifen 13 ist in Figur 5 dargestellt. Hierbei sind der erste Trägerstreifen 12 und der zweite Trägerstreifen 13 derart miteinander verbunden, dass die elektrisch leitfähige Schicht 3 der beiden Trägerstreifen 12, 13 jeweils an der Außenseite liegt. Die elektrisch nicht leitfähige Schicht 5 des ersten Trägerstreifens 12 und des zweiten Trägerstreifens 13 bildet ein Dielektrikum, durch welches vermieden wird, dass die elektrisch leitfähigen Schichten 3, die die Leiterbahnstruktur 7 bilden, an unerwünschten Positionen miteinander kontaktiert werden. Um eine gleichmäßige Schichtdicke zu erzielen ist es möglich, zusätzlich zur elektrisch nicht leitfähigen Schicht 5, die bereits auf die elektrisch leitfähige Schicht 3 aufgetragen wurde, ein zusätzliches Dielektrikum einzubringen, das auch die elektronischen Bauelemente 9 umschließt. Die Verbindung der Trägerstreifen 12, 13 erfolgt durch ein übliches, dem Fachmann bekanntes Lami- nierverfahren.The second carrier strip 13 connected to the first carrier strip 12 is shown in FIG. In this case, the first carrier strip 12 and the second carrier strip 13 are connected to one another such that the electrically conductive layer 3 of the two carrier strips 12, 13 lies on the outer side in each case. The electrically non-conductive layer 5 of the first carrier strip 12 and of the second carrier strip 13 forms a dielectric, by which it is avoided that the electrically conductive layers 3, which form the conductor track structure 7, are contacted with one another at undesired positions. In order to achieve a uniform layer thickness, it is possible, in addition to the electrically non-conductive layer 5, which has already been applied to the electrically conductive layer 3, to introduce an additional dielectric, which also encloses the electronic components 9. The connection of the carrier strips 12, 13 takes place by means of a conventional laminating method known to the person skilled in the art.
Wenn zwei elektrisch leitfähige Folien 1 miteinander verbunden werden sollen, die jeweils keine elektrisch nicht leitfähige Schicht 5 aufweisen, so wird vor dem Auflaminieren des zweiten Trägerstreifens 13 auf den ersten Trägerstreifen 12 auf zumindest einen der beiden Trägerstreifen 12, 13 ein Dielektrikum aufgebracht. Als Dielektrikum eignet sich in diesem Fall zum Beispiel eine Kunststofffolie. In diesem Fall werden die beiden Trägerstreifen 12, 13 mit der dazwischen liegenden Kunststofffolie zusammenlaminiert.If two electrically conductive films 1 are to be connected to each other, each having no electrically non-conductive layer 5, so before the lamination of the second carrier strip 13 on the first carrier strip 12 on at least one of the two carrier strips 12, 13 applied a dielectric. As a dielectric is suitable in this case, for example, a plastic film. In this case, the two carrier strips 12, 13 laminated together with the intervening plastic film.
Alternativ zu dem Auflaminieren des zweiten Trägerstreifens 13 auf den ersten Trägerstreifen 12 ist es auch möglich, zum Beispiel ein Dielektrikum auf den ersten Trägerstreifen 12 aufzulaminieren und nur eine leitfähige Schicht vorzusehen. Weiterhin ist es auch möglich, auch an der Außenseite der elektrisch leitfähigen Schicht 3 ein Dielektrikum aufzubringen und eine weitere elektrisch leitfähige Schicht aufzulaminieren. Hierbei kann zum Beispiel auch an der Oberseite und der Unterseite der elektrisch leitfähigen Schicht 3 je mindestens ein elektronisches Element 9 angeordnet sein. In diesem Fall ist es weiterhin bevorzugt, dass die elektrisch leitfähige Schicht 3 nach dem Strukturieren zur Leiterbahnstruktur 7 auch auf der zweiten Seite mit einer elektrisch nicht leitfähigen Schicht versehen wird.As an alternative to laminating the second carrier strip 13 onto the first carrier strip 12, it is also possible, for example, to laminate a dielectric onto the first carrier strip 12 and to provide only one conductive layer. Furthermore, it is also possible to apply a dielectric to the outside of the electrically conductive layer 3 and to laminate a further electrically conductive layer. In this case, for example, at least one electronic element 9 can also be arranged on the upper side and the lower side of the electrically conductive layer 3. In this case, it is furthermore preferred for the electrically conductive layer 3 to be provided with an electrically nonconductive layer on the second side after structuring to form the conductor track structure 7.
Nach dem Auflaminieren des zweiten Trägerstreifens 13 auf den ersten Trägerstreifen 12 können die Leiterbahnstrukturen 7, die aus den elektrisch leitfähigen Schichten 3 strukturiert wurden, mit Durchkontaktierungen 17 miteinander verbunden werden. Die Durchkon- taktierungen 17 lassen sich zum Beispiel durch Einbringen von Bohrungen in den Schal- tungsträger und anschließendes Metallisieren der Bohrungen erzeugen. Alternativ ist es zum Beispiel auch möglich, dass beispielsweise die elektrisch leitfähige Schicht 3 eines der beiden Trägerstreifen 12, 13 über einen Dorn durch das Dielektrikum, das durch die elektrisch nicht leitfähige Schicht 5 gebildet wird, gedrückt wird, bis diese die zweite elektrisch leitfähige Schicht 3 kontaktiert.After the second carrier strip 13 has been laminated onto the first carrier strip 12, the strip conductor structures 7, which have been patterned from the electrically conductive layers 3, can be connected to one another by plated-through holes 17. The through contacts 17 can be produced, for example, by introducing bores into the circuit carrier and then metallizing the bores. Alternatively, it is also possible, for example, for example, that the electrically conductive layer 3 of one of the two carrier strips 12, 13 is pressed over a mandrel through the dielectric which is formed by the electrically non-conductive layer 5 until it is the second electrically conductive layer 3 contacted.
Nach dem Verbinden des ersten Trägerstreifens 12 und mit dem zweiten Trägerstreifen 13 wird vorzugsweise an der Außenseite eine Isolationsschicht 19 aufgebracht. Durch die Isolationsschicht 19 wird vermieden, dass elektrisch leitfähige Teile nach außen hin freiliegen. Als Isolationsschicht 19 kann zum Beispiel eine Kunststofffolie auf den Schichtverbund aus dem ersten Trägerstreifen 12 und dem zweiten Trägerstreifen 13 aufgebracht werden. Alternativ ist es auch möglich, eine Kunststoffschicht durch ein beliebiges anderes Verfahren auf den Schichtverbund aufzubringen.After joining the first carrier strip 12 and with the second carrier strip 13, an insulating layer 19 is preferably applied to the outside. By the insulating layer 19 is avoided that electrically conductive parts exposed to the outside. As the insulation layer 19, for example, a plastic film can be applied to the layer composite of the first carrier strip 12 and the second carrier strip 13. Alternatively, it is also possible to apply a plastic layer by any other method on the composite layer.
Wenn nur eine elektrisch leitfähige Schicht 3 umfasst ist, ist es ausreichend, auf der nach außen weisenden elektrisch leitfähigen Schicht 3 die Isolationsschicht 19 aufzubringen. Die Isolationsschicht 19, die an der Außenseite des Schichtverbundes aufgebracht wird, kann optional strukturiert werden, um zum Beispiel Steckverbinder oder Kabel anbringen zu können. Hierdurch lässt sich die elektronische Baugruppe ankontaktieren.If only one electrically conductive layer 3 is included, it is sufficient to apply the insulation layer 19 to the outwardly facing electrically conductive layer 3. The insulation layer 19, which is applied to the outside of the composite layer, can be optionally structured, for example, to be able to attach connectors or cables. This makes it possible to contact the electronic module.
Nach dem Aufbringen der Isolationsschicht 19 ist es weiterhin möglich, weitere Trägerstreifen aufzubringen, die jeweils elektrisch leitfähige Schichten 3 umfassen, die mit elektronischen Bauelementen 9 kontaktiert sind. Weiterhin ist es auch möglich, mehrere elektronische Baugruppen, wie sie in Figur 7 dargestellt sind, miteinander zum Beispiel durch Lami- nieren zu verbinden.After the application of the insulation layer 19, it is furthermore possible to apply further carrier strips which each comprise electrically conductive layers 3 which are in contact with electronic components 9. Furthermore, it is also possible to connect several electronic assemblies, as shown in FIG. 7, to one another, for example by laminating.
Nach der Herstellung des Schichtverbundes, kann dieser in eine beliebige Form geprägt werden. Alternativ ist es auch möglich, zum Beispiel eine flexible folienartige Schaltung zu erzeugen. Dies ist in Figur 8 dargestellt. Hierbei sind auf einer elektrisch leitfähigen Folie, die zu einer Leiterbahnstruktur 7 strukturiert wurde, elektronische Bauelemente 9 aufge- bracht, die von der Formmasse 15 umschlossen sind, um sie vor Beschädigungen zu schützen. Anschließend ist ein Dielektrikum 21 auf die Schicht aufgebracht, um eine gleichmäßige Schichtdicke zu erzielen und eine weitere Kapselung der elektronischen Bauelemente 9. Als Material für das Dielektrikum 21 wird ein Werkstoff gewählt, der flexibel ist und eine Verformung des Schichtverbundes ermöglicht. Eine solche flexible folienartige Schaltung, kann zum Beispiel in Kleidungsstücken eingesetzt werden. Solche in Kleidung integrierte Elektronik eignet sich zum Beispiel in Skifahrerausrüstungen oder Bergsteigerausrüstungen, um zum Beispiel einen Träger eines solchen Kleidungsstückes, der möglicherweise von einer Lawine verschüttet wurde, aufzufinden. Alternativ kann die Elektronik zum Beispiel auch als Diebstahlschutz eingesetzt werden. Auch lassen sich zum Beispiel auf einer ent- sprechenden Schaltung Produktinformationen speichern.After the production of the layer composite, this can be embossed in any shape. Alternatively, it is also possible to produce, for example, a flexible film-like circuit. This is shown in FIG. In this case, electronic components 9 are applied to an electrically conductive foil which has been patterned into a conductor track structure 7, which are enclosed by the molding compound 15 in order to protect it from damage. Subsequently, a dielectric 21 is applied to the layer in order to achieve a uniform layer thickness and a further encapsulation of the electronic components 9. As a material for the dielectric 21, a material is selected which is flexible and allows deformation of the layer composite. Such a flexible film-like circuit can be used for example in garments. Such apparel-integrated electronics are useful, for example, in skis or mountaineering equipment, for example, to locate a wearer of such garment that may have been spilled by an avalanche. Alternatively, the electronics can be used, for example, as theft protection. It is also possible, for example, to store product information on a corresponding circuit.
Wenn die Schaltung nicht als flexible folienartige Schaltung eingesetzt wird, ist es zum Beispiel auch möglich, den Schichtverbund zu einem Formteil umzuformen. Dies erfolgt zum Beispiel durch Prägen des Schichtverbundes, wie er in Figur 7 dargestellt ist. Hierdurch lässt sich beispielsweise ein Gehäuse mit integrierter Elektronik erzeugen. If the circuit is not used as a flexible film-like circuit, it is also possible, for example, to transform the layer composite into a molded part. This is done for example by embossing the layer composite, as shown in Figure 7. As a result, for example, a housing with integrated electronics can be generated.

Claims

Ansprüche claims
1. Verfahren zur Herstellung einer elektronischen Baugruppe, umfassend mindestens ein elektronisches Bauelement (9) sowie eine Leiterbahnstruktur (7), mit der das mindes- tens eine elektronische Bauelement (9) kontaktiert wird, folgende Schritte umfassend:1. A method for producing an electronic assembly, comprising at least one electronic component (9) and a printed conductor structure (7), with which the at least one electronic component (9) is contacted, comprising the following steps:
(a) Strukturieren einer elektrisch leitfähigen Schicht (3) einer leitfähigen Folie (1) zum Ausbilden der Leiterbahnstruktur (7),(a) structuring an electrically conductive layer (3) of a conductive film (1) to form the printed conductor structure (7),
(b) Bestücken der Leiterbahnstruktur (7) mit dem mindestens einen elektronischen(B) equipping the conductor track structure (7) with the at least one electronic
Bauelement (9),Component (9),
(c) Auflaminieren einer weiteren Folie auf die mit dem mindestens einen elektronischen Bauelement (9) bestückte leitfähige Folie (1) auf der Seite, auf der die leitfähige Folie (1) mit dem mindestens einen elektronischen Bauelement (9) bestückt ist.(c) laminating a further film onto the conductive film (1) equipped with the at least one electronic component (9) on the side on which the conductive film (1) is fitted with the at least one electronic component (9).
2. Verfahren gemäß Anspruch 1, dadurch gekennzeichnet, dass die weitere Folie ebenfalls eine leitfähige Folie (1) ist, die mit mindestens einem elektronischen Bauteil (9) be- stückt ist.2. The method according to claim 1, characterized in that the further film is also a conductive foil (1) which is equipped with at least one electronic component (9).
3. Verfahren gemäß Anspruch 1 oder 2, dadurch gekennzeichnet, dass zwischen die zwei leitfähigen Folien (1) ein Dielektrikum eingebracht ist.3. The method according to claim 1 or 2, characterized in that between the two conductive films (1) a dielectric is introduced.
4. Verfahren gemäß Anspruch 3, dadurch gekennzeichnet, dass auf die leitfähige Folie (1) vor dem Bestücken mit dem mindestens einen elektronischen Bauelement (9) eine Be- schichtung aus einem Dielektrikum aufgebracht wird, wobei die Beschichtung aus dem Dielektrikum vor oder nach dem Strukturieren der leitfähigen Schicht (3) der leitfähigen Folie (1) zum Ausbilden der Leiterbahnstruktur (7) aufgebracht werden kann.4. The method according to claim 3, characterized in that on the conductive film (1) before loading with the at least one electronic component (9) a coating of a dielectric is applied, wherein the coating of the dielectric before or after the Structuring the conductive layer (3) of the conductive film (1) for forming the conductor track structure (7) can be applied.
5. Verfahren gemäß Anspruch 3 oder 4, dadurch gekennzeichnet, dass das Dielektrikum nach dem Bestücken der leitfähigen Folie (1) auf der Seite auf die leitfähige Folie (1) aufgebracht wird, auf der das mindestens eine elektronische Bauteil (9) positioniert ist.5. The method according to claim 3 or 4, characterized in that the dielectric after the placement of the conductive film (1) on the side of the conductive film (1) is applied, on which the at least one electronic component (9) is positioned.
6. Verfahren gemäß einem der Ansprüche 3 bis 5, dadurch gekennzeichnet, dass das Dielektrikum eine Kunststoffschicht ist. 6. The method according to any one of claims 3 to 5, characterized in that the dielectric is a plastic layer.
7. Verfahren gemäß einem der Ansprüche 2 bis 6, dadurch gekennzeichnet, dass für eine Verbindung der aus der leitfähigen Schicht (3) der leitfähigen Folien (1) strukturierten Leiterbahnstrukturen (7) Durchkontaktierungen (17) eingebracht werden.7. The method according to any one of claims 2 to 6, characterized in that for a compound of the conductive layer (3) of the conductive films (1) structured interconnect structures (7) vias (17) are introduced.
8. Verfahren gemäß einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass auf mindestens einer nach außen weisenden Seite der elektronischen Baugruppe eine Isolationsschicht (19) aufgebracht wird.8. The method according to any one of claims 1 to 7, characterized in that on at least one outwardly facing side of the electronic assembly, an insulating layer (19) is applied.
9. Verfahren gemäß einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass mindes- tens zwei elektronische Baugruppen miteinander zu einem Schichtverbund verbunden werden.9. The method according to any one of claims 1 to 8, characterized in that at least two electronic modules are connected together to form a composite layer.
10. Verfahren gemäß einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass die elektrisch leitfähige Folie (1) an ihrer Oberseite und an ihrer Unterseite jeweils mit min- destens einem elektronischen Bauelement (9) bestückt wird.10. The method according to any one of claims 1 to 9, characterized in that the electrically conductive film (1) at its top and on its underside each with at least one electronic component (9) is fitted.
11. Verfahren gemäß Anspruch 10, dadurch gekennzeichnet, dass mehrere beidseitig mit jeweils mindestens einem elektronischen Bauelement (9) bestückte leitfähige Folien (1) zu einem Schichtverbund miteinander verbunden werden, wobei jeweils zwischen zwei leitfähigen Folien (1) ein Dielektrikum eingebracht wird.11. The method according to claim 10, characterized in that a plurality on both sides each with at least one electronic component (9) equipped conductive films (1) are connected to form a composite layer, wherein in each case between two conductive films (1) a dielectric is introduced.
12. Verfahren gemäß einem der Ansprüche 1 bis 11, dadurch gekennzeichnet, dass mindestens ein elektronisches Bauelement (9), mit dem die leitfähige Folie (1) bestückt ist, von einer Formmasse (15) umschlossen wird.12. The method according to any one of claims 1 to 11, characterized in that at least one electronic component (9), with which the conductive film (1) is equipped, is enclosed by a molding compound (15).
13. Verfahren gemäß einem der Ansprüche 1 bis 12, dadurch gekennzeichnet, dass die elektronische Baugruppe in einem abschließenden Schritt zu einem Formteil umgeformt wird. 13. The method according to any one of claims 1 to 12, characterized in that the electronic assembly is formed in a final step to a molded part.
EP09765709A 2008-06-19 2009-05-25 Method for the manufacture of an electronic assembly Ceased EP2289100A2 (en)

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DE102008002532A DE102008002532A1 (en) 2008-06-19 2008-06-19 Method for producing an electronic assembly
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010014579A1 (en) * 2010-04-09 2011-10-13 Würth Elektronik Rot am See GmbH & Co. KG Producing electronic assembly, comprises providing electrically conductive film including support film and electrical component with electrical contact point, and forming component with electrical contact point on conductive film
DE102010030528A1 (en) * 2010-06-25 2011-12-29 Robert Bosch Gmbh Encapsulated control module for a motor vehicle
US10820437B2 (en) * 2016-09-28 2020-10-27 Intel Corporation Flexible packaging for a wearable electronic device
DE102017203381A1 (en) * 2017-03-02 2018-04-05 Robert Bosch Gmbh Microelectronic component arrangement and corresponding manufacturing method
US20230102508A1 (en) * 2020-01-24 2023-03-30 Jyri Kaija Functional Housing Structure for an Electronic Device
DE102021108701A1 (en) 2021-04-08 2022-10-13 Innome Gmbh Sensor component and method of manufacturing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030137045A1 (en) * 2002-01-23 2003-07-24 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method of manufacturing the same
US20050006142A1 (en) * 2003-07-09 2005-01-13 Matsushita Electric Industrial Co., Ltd. Circuit board with in-built electronic component and method for manufacturing the same
US20050218491A1 (en) * 2004-03-31 2005-10-06 Alps Electric Co., Ltd. Circuit component module and method of manufacturing the same
US20070099449A1 (en) * 2005-10-31 2007-05-03 Daigo Suzuki Printed circuit board, electronic device, and manufacturing method for printed circuit board

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2816028B2 (en) * 1991-02-18 1998-10-27 株式会社東芝 Method for manufacturing semiconductor device
US5686172A (en) * 1994-11-30 1997-11-11 Mitsubishi Gas Chemical Company, Inc. Metal-foil-clad composite ceramic board and process for the production thereof
JP3359910B2 (en) * 1998-01-22 2002-12-24 フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン Microsystem and method of manufacturing microsystem
DE19830540A1 (en) * 1998-07-08 2000-01-13 Siemens Ag Electronic flexible type circuit board especially for power semiconductors, sensors and passive components
JP2000151057A (en) 1998-11-09 2000-05-30 Hitachi Ltd Electronic component mounting structure, method of manufacturing the same, wireless IC card and method of manufacturing the same
US6512182B2 (en) 2001-03-12 2003-01-28 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
JP2005045228A (en) * 2003-07-09 2005-02-17 Matsushita Electric Ind Co Ltd Circuit board with built-in electronic component and its manufacturing method
US6928726B2 (en) * 2003-07-24 2005-08-16 Motorola, Inc. Circuit board with embedded components and method of manufacture
TW200539246A (en) 2004-05-26 2005-12-01 Matsushita Electric Ind Co Ltd Semiconductor device and method for manufacturing the same
DE102005003125A1 (en) 2005-01-21 2006-07-27 Robert Bosch Gmbh High-frequency electrical circuit for multi-chip module, has electrical components mechanically connected with each other by sealing compound and provided with conductive strip layers, which electrically connects components with each other
DE102006055576A1 (en) * 2006-11-21 2008-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for manufacturing a stretchable circuit carrier and expandable circuit carrier

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030137045A1 (en) * 2002-01-23 2003-07-24 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method of manufacturing the same
US20050006142A1 (en) * 2003-07-09 2005-01-13 Matsushita Electric Industrial Co., Ltd. Circuit board with in-built electronic component and method for manufacturing the same
US20050218491A1 (en) * 2004-03-31 2005-10-06 Alps Electric Co., Ltd. Circuit component module and method of manufacturing the same
US20070099449A1 (en) * 2005-10-31 2007-05-03 Daigo Suzuki Printed circuit board, electronic device, and manufacturing method for printed circuit board

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WO2009153129A3 (en) 2010-03-04
CN102124560B (en) 2014-05-07
WO2009153129A2 (en) 2009-12-23
CN102124560A (en) 2011-07-13
DE102008002532A1 (en) 2009-12-24
US20110138620A1 (en) 2011-06-16
JP2011524645A (en) 2011-09-01

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