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EP2145986A1 - Lösung und Verfahren zur elektrochemischen Abscheidung eines Metalls auf ein Substrat - Google Patents

Lösung und Verfahren zur elektrochemischen Abscheidung eines Metalls auf ein Substrat Download PDF

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Publication number
EP2145986A1
EP2145986A1 EP08075637A EP08075637A EP2145986A1 EP 2145986 A1 EP2145986 A1 EP 2145986A1 EP 08075637 A EP08075637 A EP 08075637A EP 08075637 A EP08075637 A EP 08075637A EP 2145986 A1 EP2145986 A1 EP 2145986A1
Authority
EP
European Patent Office
Prior art keywords
metal
nickel
solution
silica particles
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08075637A
Other languages
English (en)
French (fr)
Other versions
EP2145986B1 (de
Inventor
Hermann-Josef Middeke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE602008000878T priority Critical patent/DE602008000878D1/de
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to ES08075637T priority patent/ES2339614T3/es
Priority to EP08075637A priority patent/EP2145986B1/de
Priority to PL08075637T priority patent/PL2145986T3/pl
Priority to AT08075637T priority patent/ATE462025T1/de
Priority to CA2723827A priority patent/CA2723827A1/en
Priority to KR1020117000690A priority patent/KR20110039438A/ko
Priority to CN2009801225315A priority patent/CN102066622B/zh
Priority to JP2011517816A priority patent/JP5674655B2/ja
Priority to BRPI0915785A priority patent/BRPI0915785A2/pt
Priority to US12/994,325 priority patent/US20110132766A1/en
Priority to PCT/EP2009/005192 priority patent/WO2010006800A1/en
Publication of EP2145986A1 publication Critical patent/EP2145986A1/de
Application granted granted Critical
Publication of EP2145986B1 publication Critical patent/EP2145986B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Definitions

  • Porous hydrophilic silica (or glass particles) (which are commercially available in almost any size or porosity) is chosen instead of ground alumina or minerals like talc, because it is easily dispersible in water or electrolyte for a long time.
  • High porosity of the silica particles offers the additional benefit of attributing the particles a low specific gravity which in turn causes more uniform distribution thereof in the plating solution because of a lower tendency to sediment. This in turn makes sophisticated and complicated air injection into the bath solution unnecessary which would otherwise be required to keep the particles suspended.
  • the at least one organic moiety is bound to the silica particles.
  • a chemical (covalent) bond is formed between corresponding reactive centers on the organic moiety on the one hand and the silica surface on the other hand.
  • Chemical bonding ensures that the moieties imparting the silica particles the positive charge are not desorbed or otherwise peeled away from the silica particles.
  • the positive charge delivered to the silica particles by the organic moieties is constant and does not depend from any surface effects like an equilibrium which forms in the electrolyte deposition solution.
  • Metal may be deposited onto the substrate using direct current or pulsed current, including unipolar or bipolar pulsed current. Alternatively, metal may be deposited using a sequence of time periods wherein direct current time periods alternate with pulsed current time periods.
  • Plating may furthermore be performed in a conventional plant using dip tanks and racks holding the articles to be plated and dipping same into the electrolyte solution of the invention contained in such tanks with anodes facing the articles to be plated. The articles may also be contained in drums which are dipped into the plating solution. Alternatively, the articles to be plated may be placed and treated in a conveyorized plating plant which uses trays to accommodate the articles.
  • the anodes may be placed at one or, preferably, at both sides of the articles to be plated and may be soluble anodes, i . e ., anodes which dissolve due to the electroplating operation because they are made substantially from the same metal as the metal being deposited. Or the anodes are made from a material which does not dissolve during the electroplating operation, i . e ., is inert against the solution and under the plating conditions. Plating is performed using more or less vigorous agitation of the solution, including air injection.
  • the first nickel layer may be deposited using a so-called Watts electrolyte which contains nickel chloride, nickel sulfate and boric acid, for example about 60 g NiCl 2 ⁇ 6 H 2 O, 270 g NiSO 4 ⁇ 6 H 2 O and 45 g boric acid per liter plating solution.
  • This bath typically contains besides salicylic acid ethyne derivatives like hexynediol or butynediol or propargyl alcohol derivatives as additives or a mixture of a plurality of additives.
  • the second nickel layer may be deposited using a Watts electrolyte which differs from the electrolyte used to deposit the first nickel layer by using typically sulfur containing compounds like toluene sulfonic acid or propargylsulfonates and in addition saccharine instead of salicylic acid as the additive or a mixture of a plurality of additives.
  • the pore count for conventional silica particles in the nickel electroplating bath is about 27,000 cm -2 at a current density of 5 A/dm 2
  • the pore obtained with silica particles modified with the silicon containing organic moieties according to the invention is about 50,000 cm -2 at the same current density.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Battery Electrode And Active Subsutance (AREA)
EP08075637A 2008-07-15 2008-07-15 Lösung und Verfahren zur elektrochemischen Abscheidung eines Metalls auf ein Substrat Active EP2145986B1 (de)

Priority Applications (12)

Application Number Priority Date Filing Date Title
ES08075637T ES2339614T3 (es) 2008-07-15 2008-07-15 Solucion y metodo para depositar electroquimicamente un metal sobre un sustrato.
EP08075637A EP2145986B1 (de) 2008-07-15 2008-07-15 Lösung und Verfahren zur elektrochemischen Abscheidung eines Metalls auf ein Substrat
PL08075637T PL2145986T3 (pl) 2008-07-15 2008-07-15 Roztwór i sposób elektrochemicznego osadzania metalu na substracie
AT08075637T ATE462025T1 (de) 2008-07-15 2008-07-15 Lösung und verfahren zur elektrochemischen abscheidung eines metalls auf ein substrat
DE602008000878T DE602008000878D1 (de) 2008-07-15 2008-07-15 Lösung und Verfahren zur elektrochemischen Abscheidung eines Metalls auf ein Substrat
KR1020117000690A KR20110039438A (ko) 2008-07-15 2009-07-10 기재에 금속을 전해 증착하는 방법
CA2723827A CA2723827A1 (en) 2008-07-15 2009-07-10 Method for electrochemically depositing a metal on a substrate
CN2009801225315A CN102066622B (zh) 2008-07-15 2009-07-10 在基材上电化学沉积金属的方法
JP2011517816A JP5674655B2 (ja) 2008-07-15 2009-07-10 基材上に金属を電着する方法
BRPI0915785A BRPI0915785A2 (pt) 2008-07-15 2009-07-10 método para depositar eletroquimicamente um metal sobre um substrato
US12/994,325 US20110132766A1 (en) 2008-07-15 2009-07-10 Method for Electrochemically Depositing a Metal on a Substrate
PCT/EP2009/005192 WO2010006800A1 (en) 2008-07-15 2009-07-10 Method for electrochemically depositing a metal on a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08075637A EP2145986B1 (de) 2008-07-15 2008-07-15 Lösung und Verfahren zur elektrochemischen Abscheidung eines Metalls auf ein Substrat

Publications (2)

Publication Number Publication Date
EP2145986A1 true EP2145986A1 (de) 2010-01-20
EP2145986B1 EP2145986B1 (de) 2010-03-24

Family

ID=40010705

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08075637A Active EP2145986B1 (de) 2008-07-15 2008-07-15 Lösung und Verfahren zur elektrochemischen Abscheidung eines Metalls auf ein Substrat

Country Status (12)

Country Link
US (1) US20110132766A1 (de)
EP (1) EP2145986B1 (de)
JP (1) JP5674655B2 (de)
KR (1) KR20110039438A (de)
CN (1) CN102066622B (de)
AT (1) ATE462025T1 (de)
BR (1) BRPI0915785A2 (de)
CA (1) CA2723827A1 (de)
DE (1) DE602008000878D1 (de)
ES (1) ES2339614T3 (de)
PL (1) PL2145986T3 (de)
WO (1) WO2010006800A1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016062880A3 (de) * 2014-10-24 2016-06-16 Basf Se Nicht-ampholytische, quaternierbare und wasserlösliche polymere zur modifikation der oberflächenladung fester teilchen
EP3067443A1 (de) * 2015-03-11 2016-09-14 Jiaxing Minhui Automotive Parts Co.,Ltd Vernickeltes und/oder verchromtes element und verfahren zur herstellung davon
PL423721A1 (pl) * 2017-12-04 2019-06-17 Zakład Wyrobów Galanteryjnych Spółka Z Ograniczoną Odpowiedzialnością Sposób elektrochemicznego wytwarzania wielowarstwowych powłok metalicznych, zwłaszcza niklowych, o zwiększonej odporności na korozję
CN113436775A (zh) * 2021-06-23 2021-09-24 中国核动力研究设计院 一种无衬底超薄镍-63放射源的制备方法

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US20110155582A1 (en) 2009-11-18 2011-06-30 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
EP2551375A1 (de) * 2011-07-26 2013-01-30 Atotech Deutschland GmbH Stromlose Vernickelungsbadzusammensetzung
US8871077B2 (en) * 2011-10-14 2014-10-28 GM Global Technology Operations LLC Corrosion-resistant plating system
JP6024714B2 (ja) * 2013-10-03 2016-11-16 トヨタ自動車株式会社 成膜用ニッケル溶液およびこれを用いた成膜方法
DE102014207778B3 (de) 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht
WO2015199646A1 (en) * 2014-06-23 2015-12-30 Hewlett-Packard Development Company, L.P. Multilayer coatings on substrates
JP6524939B2 (ja) * 2016-02-26 2019-06-05 豊田合成株式会社 ニッケルめっき皮膜及びその製造方法
EP3456870A1 (de) * 2017-09-13 2019-03-20 ATOTECH Deutschland GmbH Bad und verfahren zum füllen eines senkrechten verbindungszugangs für ein werkstück mit nickel oder nickellegierung
DE102018005348A1 (de) * 2018-07-05 2020-01-09 Dr.-Ing. Max Schlötter GmbH & Co KG Silberelektrolyt zur Abscheidung von Dispersions-Silberschichten und Kontaktoberflächen mit Dispersions-Silberschichten
CN108914173B (zh) * 2018-07-13 2021-03-23 中国科学院金属研究所 一种含有二氧化硅颗粒的铁镍复合镀层的制备方法
CN109183131B (zh) * 2018-07-16 2020-06-16 东南大学 一种SiO2基复合超疏水金属表面的制备方法
CN112899741B (zh) * 2021-01-21 2022-03-15 长春理工大学 在金属表面加工二氧化硅-镍复合疏水耐腐蚀涂层的方法
CN115012008B (zh) * 2022-03-31 2023-09-19 九牧厨卫股份有限公司 一种提高附着力的环保复合涂镀层及其制备方法
CN118272877B (zh) * 2024-04-07 2024-10-15 深圳御矿新材料有限公司 高强度铝镁合金预镀镍带材及其生成工艺

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016062880A3 (de) * 2014-10-24 2016-06-16 Basf Se Nicht-ampholytische, quaternierbare und wasserlösliche polymere zur modifikation der oberflächenladung fester teilchen
US10899932B2 (en) 2014-10-24 2021-01-26 Basf Se Non-amphoteric, quaternisable and water-soluble polymers for modifying the surface charge of solid particles
EP3067443A1 (de) * 2015-03-11 2016-09-14 Jiaxing Minhui Automotive Parts Co.,Ltd Vernickeltes und/oder verchromtes element und verfahren zur herstellung davon
PL423721A1 (pl) * 2017-12-04 2019-06-17 Zakład Wyrobów Galanteryjnych Spółka Z Ograniczoną Odpowiedzialnością Sposób elektrochemicznego wytwarzania wielowarstwowych powłok metalicznych, zwłaszcza niklowych, o zwiększonej odporności na korozję
CN113436775A (zh) * 2021-06-23 2021-09-24 中国核动力研究设计院 一种无衬底超薄镍-63放射源的制备方法

Also Published As

Publication number Publication date
ATE462025T1 (de) 2010-04-15
KR20110039438A (ko) 2011-04-18
EP2145986B1 (de) 2010-03-24
US20110132766A1 (en) 2011-06-09
CN102066622B (zh) 2013-03-27
ES2339614T3 (es) 2010-05-21
CA2723827A1 (en) 2010-01-21
PL2145986T3 (pl) 2010-09-30
WO2010006800A1 (en) 2010-01-21
DE602008000878D1 (de) 2010-05-06
JP5674655B2 (ja) 2015-02-25
CN102066622A (zh) 2011-05-18
BRPI0915785A2 (pt) 2015-11-10
JP2011528063A (ja) 2011-11-10

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