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EP2143313A4 - METHOD AND ARRANGEMENT FOR COOLING A DEVICE BOX - Google Patents

METHOD AND ARRANGEMENT FOR COOLING A DEVICE BOX

Info

Publication number
EP2143313A4
EP2143313A4 EP08750453.6A EP08750453A EP2143313A4 EP 2143313 A4 EP2143313 A4 EP 2143313A4 EP 08750453 A EP08750453 A EP 08750453A EP 2143313 A4 EP2143313 A4 EP 2143313A4
Authority
EP
European Patent Office
Prior art keywords
arrangement
equipment box
cooling equipment
cooling
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08750453.6A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2143313A1 (en
Inventor
Jukka Pekka Antero Ohtonen
Visa Panu Pellervo Viertola
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ponsse Oyj
Original Assignee
Ponsse Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ponsse Oyj filed Critical Ponsse Oyj
Publication of EP2143313A1 publication Critical patent/EP2143313A1/en
Publication of EP2143313A4 publication Critical patent/EP2143313A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20154Heat dissipaters coupled to components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP08750453.6A 2007-04-23 2008-04-22 METHOD AND ARRANGEMENT FOR COOLING A DEVICE BOX Withdrawn EP2143313A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20070318A FI121949B (fi) 2007-04-23 2007-04-23 Menetelmä ja järjestely laitekotelon jäähdyttämiseksi
PCT/FI2008/050210 WO2008129134A1 (en) 2007-04-23 2008-04-22 Method and arrangement for cooling equipment box

Publications (2)

Publication Number Publication Date
EP2143313A1 EP2143313A1 (en) 2010-01-13
EP2143313A4 true EP2143313A4 (en) 2016-11-16

Family

ID=38009856

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08750453.6A Withdrawn EP2143313A4 (en) 2007-04-23 2008-04-22 METHOD AND ARRANGEMENT FOR COOLING A DEVICE BOX

Country Status (3)

Country Link
EP (1) EP2143313A4 (fi)
FI (1) FI121949B (fi)
WO (1) WO2008129134A1 (fi)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019207039B4 (de) * 2019-05-15 2025-06-18 Fronius International Gmbh Wechselrichtergehäuse, insbesondere Photovoltaik-Wechselrichtergehäuse
CN210725817U (zh) * 2019-09-04 2020-06-09 中兴通讯股份有限公司 一种复合齿散热器及通讯基站
CN113543575A (zh) * 2020-04-21 2021-10-22 深圳市英维克科技股份有限公司 散热器和通讯设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5091823A (en) * 1988-08-31 1992-02-25 Hitachi, Ltd. Inverter device
GB2411050A (en) * 2004-02-16 2005-08-17 E2V Tech Uk Ltd Electrical apparatus cooling system
EP1628514A2 (en) * 2004-08-09 2006-02-22 Omron Corporation Heat radiating structure for electronic equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4520425A (en) * 1982-08-12 1985-05-28 Mitsubishi Denki Kabushiki Kaisha Control apparatus with improved structure for cooling circuit elements
AT384343B (de) * 1985-04-16 1987-10-27 Siemens Ag Oesterreich Gehaeuseanordnung fuer belueftete geraete, vorzugsweise der leistungselektronik
DE10143547B4 (de) * 2001-09-06 2005-03-10 Rexroth Indramat Gmbh Aktiv außengekühltes Gehäuse mit zumindest einem wärmeverlustleistungserzeugenden Elektronikbaustein
JP2003298268A (ja) * 2002-03-29 2003-10-17 Denso Corp 電子制御装置の筐体構造及び電子制御装置の冷却構造
JP2005044953A (ja) * 2003-07-28 2005-02-17 Hitachi Industrial Equipment Systems Co Ltd 電力変換装置
US7142423B2 (en) * 2004-10-26 2006-11-28 Comarco Wireless Technologies, Inc. Power adapter with fan assembly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5091823A (en) * 1988-08-31 1992-02-25 Hitachi, Ltd. Inverter device
GB2411050A (en) * 2004-02-16 2005-08-17 E2V Tech Uk Ltd Electrical apparatus cooling system
EP1628514A2 (en) * 2004-08-09 2006-02-22 Omron Corporation Heat radiating structure for electronic equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008129134A1 *

Also Published As

Publication number Publication date
WO2008129134A1 (en) 2008-10-30
FI121949B (fi) 2011-06-15
FI20070318L (fi) 2008-10-24
FI20070318A0 (fi) 2007-04-23
EP2143313A1 (en) 2010-01-13

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20091111

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DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: PONSSE OYJ

RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20161018

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 7/20 20060101AFI20161012BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

17Q First examination report despatched

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Effective date: 20200514