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EP2028912A2 - Agencement de dispositif de cuisson - Google Patents

Agencement de dispositif de cuisson Download PDF

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Publication number
EP2028912A2
EP2028912A2 EP20080105057 EP08105057A EP2028912A2 EP 2028912 A2 EP2028912 A2 EP 2028912A2 EP 20080105057 EP20080105057 EP 20080105057 EP 08105057 A EP08105057 A EP 08105057A EP 2028912 A2 EP2028912 A2 EP 2028912A2
Authority
EP
European Patent Office
Prior art keywords
heating
arrangement
power
heat sink
cooking device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20080105057
Other languages
German (de)
English (en)
Other versions
EP2028912A3 (fr
Inventor
Adolfo Arnal Valero
Jose Ignacio Artigas Maestre
Luis Angel Barragan Perez
Ignacio Garde Aranda
Pablo Jesus Hernandez Blasco
Oscar Pallares Zaera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSH Hausgeraete GmbH
Original Assignee
BSH Bosch und Siemens Hausgeraete GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BSH Bosch und Siemens Hausgeraete GmbH filed Critical BSH Bosch und Siemens Hausgeraete GmbH
Publication of EP2028912A2 publication Critical patent/EP2028912A2/fr
Publication of EP2028912A3 publication Critical patent/EP2028912A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12—Cooking devices
    • H05B6/1209—Cooking devices induction cooking plates or the like and devices to be used in combination with them
    • H05B6/1245—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements
    • H05B6/1263—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements using coil cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12—Cooking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2206/00—Aspects relating to heating by electric, magnetic, or electromagnetic fields covered by group H05B6/00
    • H05B2206/02—Induction heating
    • H05B2206/022—Special supports for the induction coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2213/00—Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
    • H05B2213/03—Heating plates made out of a matrix of heating elements that can define heating areas adapted to cookware randomly placed on the heating plate

Definitions

  • the invention is based on a cooking device arrangement according to the preamble of claim 1.
  • a cooking apparatus comprising a cooking plate for laying a preparation utensil and a set of induction coils forming a contiguous cooking area of the cooking plate.
  • the heating of the preparation harness is carried out by means of a heating group of induction coils, which is formed depending on a selection position of the preparation dishes in the cooking area.
  • the object of the invention is in particular to provide a generic device with improved properties in terms of a compact design.
  • the invention is based on a cooking device arrangement with a heating arrangement of heating units, a heating group formation unit which is provided to form a heating unit of heating units adapted to a selection position of a preparation tableware, and a power arrangement of power units for generating heating power for the heating arrangement.
  • the cooking device arrangement comprises a heat sink unit which forms at least a first heat absorption area for receiving a heat generated by the power arrangement and is arranged in a basic installation position below the heating arrangement. It can be achieved by a particularly compact design of Kochvoriquessan ever.
  • a particularly flexible cooking process can be achieved.
  • a "voting position” in particular a position of the cooking utensil, which can be arbitrarily selected by an operator within a cohesive cooking area for heating a cooking utensil.
  • a "cooking area for heating a cooking utensil” is to be understood in this context, in particular a range of cooking appliance, which is suitable for a cooking operation of the cooking utensil.
  • the cooking area preferably corresponds to a portion of a cooking plate of the cooking device, which is stretched by all the heating units of the cooking device arrangement.
  • the cooking area coherently constitutes a substantial part, in particular more than 50%, advantageously more than 75% and preferably more than 90% of the total surface the hotplate, which is suitable for a cooking operation, whereby a particularly high degree of flexibility in the choice of a cooking position of the cooking utensil can be achieved.
  • the heating group formation unit is provided in particular for forming the heating group of heating units for heating the preparation tableware in a selection position of the preparation tableware in the cooking area.
  • a position of the cooking utensil "in the cooking area” is to be understood in particular to mean a position of the cooking utensil relative to the cooking area in which the cooking utensil floor is arranged completely in the cooking area.
  • the cooker assembly preferably has at least 10, preferably at least 20 and preferably at least 40 heating units, wherein the entire set of heating units may be subdivided into a plurality of heating arrangements. With such a number of heating units, a particularly large installation space can be saved by arranging the heat sink unit provided for cooling the power arrangement below the heating arrangement. In this context, it is advantageous if the heat sink unit forms a coherent heat absorption area, which is provided for cooling of at least five power units.
  • a "heating unit” is to be understood as meaning, in particular, a unit which is provided for the purpose of transmitting a heat energy to a preparation tableware.
  • the heating unit has at least one heating body, which is designed, for example, as an inductive heating means or as a radiation body.
  • a heating unit for transmitting the heating energy is expediently supplied with electric power by means of a power unit of the power arrangement.
  • the power units are preferably designed as inverters, which are provided by means of switching operations for generating an alternating current with a heating frequency for feeding into the heating units.
  • a “basic installation position” is to be understood in particular to mean a position of the cooking device arrangement which is present under normal or prescribed conditions of use when using a cooking device, in particular an induction hob, in which the cooking device arrangement according to the invention is used.
  • the heating units are distributed within a horizontal plane and they are arranged in the vertical direction below a cooking plate.
  • the heat sink unit in the vertical upward direction of the heating arrangement is at least partially covered.
  • a heat that is generated by the power arrangement should in particular be understood as meaning a heat that is generated by at least one power unit, in particular a plurality of power units of the power arrangement.
  • the heat sink unit is arranged between the heating arrangement and the power arrangement, whereby an advantageous separation of the heating arrangement from the power arrangement and thereby an advantageous protection of the power arrangement by the heat sink unit can be achieved.
  • the heat sink unit may serve as an electromagnetic shield which shields power units of the power assembly from a heater field generated by the heater assembly.
  • the arrangement of the heat sink unit "between" the heating arrangement and the power arrangement should in particular be understood as an arrangement in which there is at least one straight segment connecting a point of the power arrangement to a point of the heating arrangement which intersects the heat sink unit between the points. In particular, this straight segment has a vertical component in the basic installation position.
  • advantageous cooling of the heating arrangement can be achieved in a compact manner if the cooling body unit forms a second heat absorption area for cooling the heating arrangement.
  • the second heat receiving area is formed at least by a portion of a side of the heat sink unit, which faces a cooking plate in a basic installation position of the cooking device arrangement.
  • the first heat receiving area and the second heat receiving area are formed at least as partial areas of at least two mutually adjacent sides of the heat sink unit, whereby a particularly simple design can be achieved.
  • the heat sink unit is preferably cuboidal.
  • the first heat absorption area is arranged on a shell side of the heat sink unit, whereby a heat dissipation over a large cooling surface can be achieved.
  • power units of the power arrangement are preferably arranged laterally of the heat sink unit.
  • a "shell side" of the heat sink unit should be understood as meaning, in particular, a side of the heat sink unit that is different from the top side and the bottom side of the heat sink unit.
  • a shell side adjoins the upper side and / or the underside of the heat sink unit and is preferably vertically aligned in a basic installation position of the cooking device arrangement.
  • an "upper side” or a "lower side” of the heat sink unit corresponds to one side, in particular a side oriented horizontally in a basic installation position of the cooking device arrangement, which faces or faces away from a cooking plate.
  • At least the first heat absorption area is designed as a contact cooling surface for at least one power unit, whereby an effective cooling can be achieved.
  • a "contact cooling surface” is to be understood in particular as a surface which is provided for conducting a heat absorbed by a power unit present on the surface.
  • at least one power unit in particular at least a substantial part of the power arrangement, is applied to a contact cooling surface.
  • a particularly high space savings can be achieved if the power arrangement has two rows of power units, which are arranged on both sides of the heat sink unit.
  • a "series" of power units may, in particular, be understood to mean a set of at least three heating units, which are arranged following one another along a common row axis.
  • the heat sink unit is formed as a one-piece heat sink.
  • the one-piece heat sink for cooling a power arrangement of at least five, preferably at least ten power units provided.
  • the cooling effect can be further increased if the heat sink unit forms at least one heat removal channel.
  • the power units are arranged outside a heat removal channel and are preferably separated from the heat removal channel by means of a subregion of the heat sink unit.
  • the heat sink unit forms a portion which serves as a protection means for protecting at least a portion of the power assembly against an electromagnetic field, which structurally simple high protection of power electronics can be achieved.
  • the subregion serves as an electromagnetic shield for shielding power units of the power arrangement from a heating field generated by heating units of the heating arrangement. This can be achieved particularly easily if the heat sink unit is arranged between the heating arrangement and the power arrangement.
  • An "electromagnetic field” can be understood in this context as a magnetic and / or electrical field.
  • the portion of the heat sink unit may in particular be made of a non-magnetic material, e.g. a non-ferromagnetic material, whereby a magnetic shield can be advantageously achieved by this portion.
  • the heat sink unit is used for fastening the heating arrangement and the power arrangement, whereby it is possible to dispense with additional fastening elements during assembly of the cooking apparatus arrangement.
  • the heat sink unit expediently forms a fastening interface for fastening the heating arrangement and the power arrangement.
  • the cooking device arrangement has a carrier body for carrying the heating arrangement, which is fastened to the heat sink unit.
  • the cooking device arrangement according to the invention is suitable with a compact design, in particular for cooling a large number of power units.
  • an effective heating operation with a high number of power units and effective cooling can be achieved if a heating unit of the heating arrangement is assigned in each case a different power unit of the power arrangement.
  • the cooking device arrangement has at least one printed circuit board arranged below the heat sink unit in a basic installation position for connection to power units of the power arrangement, whereby a compact construction and an advantageous protection of the printed circuit board can be achieved.
  • the power arrangement is subdivided into groups of at least four power units, each of which is connected to a common circuit board, each of which is different for the groups.
  • a cost-effective embodiment can also be achieved if a group is assigned to a different group control unit for controlling the group.
  • FIG. 1 shows a trained as induction cooktop cooking device 10 in a view from above.
  • the cooking apparatus 10 includes a mounting frame 12 for attachment to a countertop, a cook top 14 for placing cookware, and a control panel 16 for starting, stopping, and adjusting a cooking operation.
  • the cooking plate 14 is bounded by the mounting frame and the control panel 16.
  • the cooking device 10 is formed substantially square with a side length of about 60 cm.
  • two prepared as a pot preparation harnesses 18, 20 are arranged, which are each shown schematically by a solid circle.
  • the cooking device 10 has a cooking device assembly disposed below the cooking plate 14. To perform a cooking operation of the cooking apparatus 10, the cooker assembly is provided with a set of heating units 22.
  • heating means 24 each comprise an induction coil designed as heating means 24, which in FIG. 1 is shown schematically by a dashed rectangle.
  • a heating unit 22 is formed by the heating means 24 as a magnetic alternating field Heating signal generated, which has a heating frequency, for example, is 25 kHz.
  • the heating signal induces electrical currents in the metallic bottom of the cooking utensils 18, 20. These electric currents heat up a food in the cooking utensils 18, 20.
  • a heating means 24 in operation of the corresponding heating unit 22 is supplied to generate the heating signal with an alternating electrical current, which oscillates with the heating frequency.
  • the cooking appliance arrangement is provided with power units 26 designed as inverters, which in FIG. 2 are shown.
  • the cooking apparatus 10 is provided for heating the cooking utensils 18, 20 by means of a group operation of the heating units 22.
  • the heating units 22 with a in FIG. 5 provided sensor means 25 can be detected by means of which it can be detected whether the corresponding heating means 24 is at least partially covered by one of the preparation harnesses 18, 20.
  • This sensor means 25 may in particular be formed by a heating means 24.
  • Heating groups 28, 30 are formed by heating units 22, each associated with one of the preparation utensils 18, 20, by means of a grouping process which is not described in more detail.
  • this cooking operation is carried out by means of the heating units 22 of both heating groups 28, 30, while the further heating units 22 which do not belong to any of the heating groups 28, 30, remain undriven. If the operator adjusts one of the preparation utensils 18, 20 on the cooking plate 14 or if he places another cookware on the hotplate 14, corresponding heating groups of heating units 22 are adapted or newly formed on the basis of the new arrangement of objects to be heated relative to the heating means 24.
  • the grouping processes for forming the heating groups 28, 30 are carried out by means of a in FIG.
  • the entire group of heating units 22, which has a number N of heating units 22, is subdivided into n groups each having a heating arrangement 34.1 to 34.n of N / n heating units 22.
  • a simple construction can be achieved if the number N is an even number.
  • the entire group of heating units 22 is subdivided into four heating arrangements 34.1 to 34.4 each having twelve heating units 22.
  • the entire set of heating units 24 the cooker assembly is further arranged in a matrix arrangement.
  • the array has six rows and eight columns. Further embodiments of the matrix arrangement with further combinations of row and column numbers are conceivable.
  • the heating arrangements 34.1 to 34.4 in this case correspond in each case to two adjacent matrix columns of the matrix arrangement.
  • FIG. 2 shows the Kochvoriquessan Aunt the cooking device 10 and in particular the heating assembly 34.1 of twelve heating units 22 in a view from above.
  • the following text which is limited to the description of the heating arrangement 34.1, also applies to the other heating arrangements 34.2, 34.3, 34.4 application.
  • the heating units 22 of the heating arrangement 34.1 each have one of the induction coils designed as heating means 24, which consists of two partial windings, which are shown schematically in the figure as solid rectangles. These partial windings are wound around a common axis, which is aligned parallel to the cooking plate 14.
  • the heating units 22 constituting these heating groups 28 and 30, respectively are supplied with an alternating current generated by power units 26, whereby the heating units 22 are supplied with heating power.
  • each heating unit 22 is assigned a power unit 26.
  • an alternating current for feeding a respective different heating unit 22 is generated by the power units 26.
  • a power unit 26 is assigned to a plurality of heating units 22.
  • the power units 26, which are arranged in the figure below the heating arrangement 34.1 (see also FIG. 4 ) and therefore shown in dashed lines, are each designed as an inverter.
  • These power units 26 generate an alternating current with the heating frequency during operation of the respective heating unit 22 by means of switching processes which are effected by switching means 36 ( FIG. 5 ).
  • These switching means 36 are designed as semiconductor switches, in particular as switching transistors.
  • the power units 26 each comprise a pair of switching means 36 implemented as IGBTs (Insulated-Gate Bipolar Transistor or Bipolar Transistor).
  • IGBTs Insulated-Gate Bipolar Transistor or Bipolar Transistor
  • Alternative embodiments of the switching means 36 such as as FET transistors (field effect transistors), are also conceivable.
  • the cooking device 10 four power arrangements 38.1 to 38.4, of which a power arrangement 38.1 in FIG. 2 is shown.
  • the power arrangement 38.1 has two rows 40, 42 of power units 26, which are aligned parallel to each other. In this case, the power units 26 are arranged following one another in a row 40 or 42 along a straight line whose orientation 44 is in particular parallel to an edge of the cooking plate 14.
  • heat is generated by the corresponding power unit 26, in particular by losses of its switching means 36.
  • the heat generated by an operating heating group 28 or 30 of heating units 22 is dissipated in order to avoid overheating of the cooking device 10.
  • the temperature of the cooking device 10 is to be maintained below the value of 125 ° C.
  • the in FIG. 2 Cooker assembly shown provided with a heat sink unit 46 which is disposed below the heating assembly 34.1. This arrangement of the heat sink unit 46 below the heating arrangement 34.1 is realized in a basic installation position of the cooking device arrangement.
  • the cooker assembly is mounted in the cooking apparatus 10, which is available for use by an end user under proper conditions with the cooking plate 14 horizontally aligned for placement of cookware.
  • the heat sink unit 46 is covered by the heating arrangement 34.1 in a direction 48 perpendicular to the cooking plate 14 upwards, ie towards the cooking plate 14, this direction 48 corresponds in the basic installation position of the vertical direction (see FIG. 4 ).
  • a respective heat sink unit 46 is provided, reference being made to the description of the heat sink unit 46 assigned to the power arrangement 38.1 for the description of these further heat sink units 46.
  • the heat sink unit 46 is a heat sink made of a heat conducting material and integrally executed heat sink.
  • a "heat-conducting material” should be understood as meaning a material which has a specific thermal conductivity ⁇ with a value of at least 50 W / (m K).
  • the heat sink unit 46 is made of aluminum in the considered embodiment.
  • the heat sink unit 46 is parallelepiped-shaped and its longitudinal direction is parallel to the column direction of the matrix arrangement of heating units 22. In particular, the longitudinal direction of the heat sink unit 46 corresponds to the orientation 44 of the rows 40, 42 of the power arrangement 38.1.
  • the heat sink unit 46 has an upper side 50, which in the basic installation position FIG. 1 the bottom of the cooking plate 14 faces and extends parallel to this bottom. In the basic installation position, the upper side 50 is aligned horizontally.
  • the heat sink unit 46 further has two shell sides 52, 54 which adjoin the top 50 and are aligned parallel to the alignment 44 of the rows 40, 42. In the basic installation position, the shell sides 52, 54 are vertically aligned (see also FIG. 4 ). Again FIG. 2 can be removed, the rows 40, 42 of power units 26 are arranged on both sides of the heat sink unit 46.
  • the heat sink unit 46 serves to cool the rows 40, 42 of the power arrangement 38.1.
  • the shell sides 52, 54 form with their surface in each case a heat receiving area 56 or 58, which is provided for receiving a heat generated by power units 26 of the series 40 and 42, respectively.
  • These heat receiving areas 56, 58 are each formed as a contiguous, over the entire shell side 52 and 54 extending heat receiving surface.
  • the projection of the power units 26 in a direction perpendicular to the shell side 52 and 54 on the shell side 52 and 54 out in the heat receiving region 56 and 58 is arranged, as by dashed rectangles in FIG. 3 is indicated schematically.
  • the heat receiving areas 56, 58 are formed as contact cooling surfaces.
  • the power units 26 of the rows 40, 42 abut the heat receiving areas 56 and 58, wherein heat can be dissipated by means of heat conduction from a contact point at which a power unit 26 contacts the respective heat receiving area 56 or 58.
  • This can be done indirectly by the power units 26 are arranged with a small distance to the heat receiving area 56 and 58 respectively.
  • a heat-conducting agent such as a thermal compound, for connecting the power units 26 to the heat-absorbing area 56 or 58, respectively.
  • FIG. 1 In a group operation of the heating units 22, the in FIG. 1 shown entire set of heating units 22 among the heating groups 28, 30 and the remaining, idle remaining heating units 22 divided.
  • heat generated by the operated power units 26 assigned to the heating groups 28, 30 can be dissipated via areas of the heat sink unit 46 facing the power units 26 that have been driven are.
  • a fast and effective temperature compensation between regions of the heat sink unit 46 can be achieved, corresponding to the heating groups 28, 30 on the one hand and undriven heating units 22 on the other.
  • the upper side 50 of the heat sink unit 46 also forms a further heat absorption area 60, which serves to cool the heating arrangement 34.1 of heating units 22.
  • This heat receiving area 60 is arranged in the basic installation position below the heating arrangement 34.1.
  • the heat receiving areas 56, 58, 60 are formed by the sides of the heat sink unit 46 adjacent to each other.
  • the top 50 continues in the longitudinal direction of the heat sink unit 46 and on both sides of the heat receiving area 60 as a web formed as a portion 62, below which a fan 64 can be arranged.
  • the underside 66 of the heat sink unit 46 which is opposite the top 50, adjacent to the shell sides 52, 54 and facing away from the cooking plate 14 in the basic installation position, further comprises ribs 68, which heat removal channels 70 form (see also FIG. 4 ). Through these heat removal channels 70, which extend in the main extension direction of the heat sink unit 46, a particularly effective temperature compensation between regions of the heat sink unit 46 can be achieved.
  • FIG. 4 is a sectional view through a part of the cooking device arrangement FIG. 2 shown along the line IV-IV.
  • the heating means 24 of the heating arrangement 34.1 and the heat sink unit 46 can be seen.
  • the heat sink unit 46 forms, as described above, with their shell sides 52, 54, the heat receiving areas 56 and 58, which serve on both sides of the heat sink unit 46 in each case for cooling a row 40 or 42 of power units 26.
  • the upper side 50 above which the heating means 24 designed as induction coils are arranged, and the ribs 68 forming the heat removal channels 70 can be seen.
  • the cooker assembly is disposed below the cooking plate 14. In this case, the heating arrangement 34.1 faces the cooking plate 14 and is arranged above the heat sink unit 46.
  • the heat sink unit 46 is disposed between the heater assembly 34 and the power assembly 38.1, each between the heater assembly 34 and a row 40 and 42 of power units 26, respectively.
  • the heating arrangement 34.1 and the power arrangement 38.1, partial areas 84, 86 of the heat sink unit 46 which are covered in the basic installation position by heating means 24 in an upward vertical direction, serve as electromagnetic shielding for protecting power units 26 from one of the heating means 24 generated heating field.
  • a circuit board 72 is further arranged, to which power units 26 of the rows 40 and 42 are connected.
  • the cooker assembly has a set of three printed circuit boards 72 associated with the power assembly 38.
  • the power arrangement 38.1 is subdivided into g groups with a number of N / (ng) power units 26 each.
  • the power arrangement 38.1 with twelve power units 26 is subdivided into three groups of four power units 26 each.
  • the power units 26 of a group are each connected to a common circuit board 72, which is different for the groups.
  • a power arrangement is assigned a number g, three printed circuit boards 72 in the considered case.
  • the printed circuit boards 72 which are associated with the power arrangement 38.1 and are arranged in the basic installation position below the heat sink unit 46, are in FIG FIG. 6 shown.
  • To each circuit board 72 four power units 26 are connected.
  • each group of power units 26 is assigned a respectively different group control unit 74, which serves to control the corresponding group of power units 26 and which is arranged on the corresponding circuit board 72.
  • a group control unit 74 may be assigned to a different number of power units 26. It is also conceivable that each power unit 26 is controlled in each case by a different control unit.
  • the arrangement of the printed circuit boards 72 below the heat sink unit 46 and in particular below the heat removal channels 70 can advantageously maintain a circulating cooling air flow in the heat removal channels 70 can be achieved by means of the printed circuit boards 72.
  • the heat sink unit 46 further forms a fastening interface for fastening the power arrangement 38.1 and the heating arrangement 34.1.
  • the cooking device arrangement has a carrier body 76 which serves to support the heating arrangement 34.1.
  • This carrier body 76 which is also in FIG. 2 is to be seen, is formed as a support matrix made of plastic, having the receiving areas 78, in which the heating means 24 and the partial windings of the heating means 24 are inserted and which is placed on the top 50 of the heat sink unit 46.
  • the carrier body 76 is held on the heat sink unit 46, for example by producing a force and / or positive connection.
  • the printed circuit boards 72 are further attached to the heat sink unit 46 by means of schematically illustrated fasteners 80.
  • this structural module is held on the mounting housing 82 by means of an attachment of the heat sink unit 46 to this mounting housing 82. In this way, a particularly simple installation and easy separation of the building module from the mounting housing 82 can be achieved only by the dissolution of the heat sink unit 46 of the mounting housing 82.
  • FIG. 7 shows an alternative embodiment of the heating assembly 34.1 in the view of FIG. 2
  • the heating means 24 of the heating units 22 are formed as a planar spiral winding, the winding plane in the basic installation position parallel to the cooking plate 14, that is aligned horizontally.
  • These heating means 24 are placed in particular directly on the upper side 50 of the heat sink unit 46, whereby cooling of the heating units 22 by heat removal from a contact point at which a heating means 24, the heat sink unit 46 contacted directly, can be achieved by means of heat conduction.
  • these heating means 24 may be accommodated in a carrier body fastened to the heat sink unit 46.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Electric Stoves And Ranges (AREA)
  • Baking, Grill, Roasting (AREA)
  • Cookers (AREA)
  • Induction Heating Cooking Devices (AREA)
EP20080105057 2007-08-24 2008-08-18 Agencement de dispositif de cuisson Withdrawn EP2028912A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES200702373A ES2321467B1 (es) 2007-08-24 2007-08-24 Disposicion de dispositivo de coccion.

Publications (2)

Publication Number Publication Date
EP2028912A2 true EP2028912A2 (fr) 2009-02-25
EP2028912A3 EP2028912A3 (fr) 2009-10-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP20080105057 Withdrawn EP2028912A3 (fr) 2007-08-24 2008-08-18 Agencement de dispositif de cuisson

Country Status (2)

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EP (1) EP2028912A3 (fr)
ES (1) ES2321467B1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011154373A1 (fr) 2010-06-07 2011-12-15 Arcelik Anonim Sirketi Cuiseur à chauffage par induction
EP2451245A1 (fr) * 2009-07-03 2012-05-09 Panasonic Corporation Dispositif de chauffage par induction
CN102721089A (zh) * 2011-03-28 2012-10-10 三星电子株式会社 感应加热炊具
EP2506671A3 (fr) * 2011-03-29 2013-02-13 BSH Bosch und Siemens Hausgeräte GmbH Dispositif de commutation
EP2498576B1 (fr) 2011-03-10 2017-08-02 BSH Hausgeräte GmbH Porte-circuit pour un champ de cuisson à induction sur lequel sont agencés des composants électroniques, ainsi que champ de cuisson à induction doté d'un porte-circuit
EP3544376A1 (fr) * 2018-03-23 2019-09-25 Whirlpool Corporation Interface de connexion pour réseau de bobines d'induction
US11310874B2 (en) 2018-03-23 2022-04-19 Whirlpool Corporation Induction cooktop with improved magnetic flux concentrating foil
US11405989B2 (en) 2018-03-23 2022-08-02 Whirlpool Corporation Temperature sensor compression features for induction cooktop assembly

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2394996B1 (es) * 2011-01-10 2014-01-17 BSH Electrodomésticos España S.A. Dispositivo de campo de cocción

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105489A (ja) * 1987-10-16 1989-04-21 Matsushita Electric Ind Co Ltd 誘導加熱調理器
EP0561219A1 (fr) * 1992-03-14 1993-09-22 E.G.O. Elektro-Geräte Blanc und Fischer GmbH & Co. KG Places de cuisson à chauffage inductif
DE10033361A1 (de) * 2000-07-08 2002-01-24 Thomas Wartmann Matrix-Kochfeld
US6498325B1 (en) * 1999-04-09 2002-12-24 Jaeger Regulation Modular induction heated cooking hob having reduced radiation and a method of making the same
DE102004003126A1 (de) * 2004-01-14 2005-08-04 E.G.O. Elektro-Gerätebau GmbH Ansteuerungsverfahren für Heizelemente und Vorrichtung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19603845B4 (de) * 1996-02-05 2010-07-22 E.G.O. Elektro-Gerätebau GmbH Elektrischer Strahlungsheizkörper mit einem aktiven Sensor zur Kochgefäßerkennung
ES2115525B1 (es) * 1996-03-20 1999-02-16 Lato Ventura Vale Sistema de aprovechamiento de la superficie total de vitroceramica para cocina.
ES2146533B1 (es) * 1998-02-12 2001-03-01 Balay Sa Conjunto inductor para coccion.
DE10112234C1 (de) * 2001-03-06 2002-07-25 Schott Glas Keramik-Kochfeld
JP2004241215A (ja) * 2003-02-05 2004-08-26 Mitsubishi Electric Corp 電磁誘導加熱装置
DE102005056501A1 (de) * 2005-11-28 2007-05-31 Schott Ag Flaches Induktionskochsystem

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105489A (ja) * 1987-10-16 1989-04-21 Matsushita Electric Ind Co Ltd 誘導加熱調理器
EP0561219A1 (fr) * 1992-03-14 1993-09-22 E.G.O. Elektro-Geräte Blanc und Fischer GmbH & Co. KG Places de cuisson à chauffage inductif
US6498325B1 (en) * 1999-04-09 2002-12-24 Jaeger Regulation Modular induction heated cooking hob having reduced radiation and a method of making the same
DE10033361A1 (de) * 2000-07-08 2002-01-24 Thomas Wartmann Matrix-Kochfeld
DE102004003126A1 (de) * 2004-01-14 2005-08-04 E.G.O. Elektro-Gerätebau GmbH Ansteuerungsverfahren für Heizelemente und Vorrichtung

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8993941B2 (en) 2009-07-03 2015-03-31 Panasonic Intellectual Property Management Co., Ltd. Induction heating device
EP2451245A1 (fr) * 2009-07-03 2012-05-09 Panasonic Corporation Dispositif de chauffage par induction
EP2451245A4 (fr) * 2009-07-03 2012-10-03 Panasonic Corp Dispositif de chauffage par induction
WO2011154373A1 (fr) 2010-06-07 2011-12-15 Arcelik Anonim Sirketi Cuiseur à chauffage par induction
EP2498576B1 (fr) 2011-03-10 2017-08-02 BSH Hausgeräte GmbH Porte-circuit pour un champ de cuisson à induction sur lequel sont agencés des composants électroniques, ainsi que champ de cuisson à induction doté d'un porte-circuit
EP2506675A3 (fr) * 2011-03-28 2013-10-02 Samsung Electronics Co., Ltd. Appareil de cuisson chauffant par induction
US9277598B2 (en) 2011-03-28 2016-03-01 Samsung Electronics Co. Ltd. Induction heating cooker
CN102721089B (zh) * 2011-03-28 2016-05-18 三星电子株式会社 感应加热炊具
CN102721089A (zh) * 2011-03-28 2012-10-10 三星电子株式会社 感应加热炊具
EP2506671A3 (fr) * 2011-03-29 2013-02-13 BSH Bosch und Siemens Hausgeräte GmbH Dispositif de commutation
EP2506671B1 (fr) 2011-03-29 2017-09-13 BSH Hausgeräte GmbH Dispositif de commutation
EP3544376A1 (fr) * 2018-03-23 2019-09-25 Whirlpool Corporation Interface de connexion pour réseau de bobines d'induction
US11310874B2 (en) 2018-03-23 2022-04-19 Whirlpool Corporation Induction cooktop with improved magnetic flux concentrating foil
US11388785B2 (en) 2018-03-23 2022-07-12 Whirlpool Corporation Connection interface for induction coil array
US11405989B2 (en) 2018-03-23 2022-08-02 Whirlpool Corporation Temperature sensor compression features for induction cooktop assembly

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EP2028912A3 (fr) 2009-10-14
ES2321467B1 (es) 2010-03-04

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