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EP1926127A4 - Exposure apparatus, exposure method, and device manufacturing method - Google Patents

Exposure apparatus, exposure method, and device manufacturing method

Info

Publication number
EP1926127A4
EP1926127A4 EP06796631A EP06796631A EP1926127A4 EP 1926127 A4 EP1926127 A4 EP 1926127A4 EP 06796631 A EP06796631 A EP 06796631A EP 06796631 A EP06796631 A EP 06796631A EP 1926127 A4 EP1926127 A4 EP 1926127A4
Authority
EP
European Patent Office
Prior art keywords
exposure
liquid
device manufacturing
exposure apparatus
feed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06796631A
Other languages
German (de)
French (fr)
Japanese (ja)
Other versions
EP1926127A1 (en
Inventor
Tomoharu Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of EP1926127A1 publication Critical patent/EP1926127A1/en
Publication of EP1926127A4 publication Critical patent/EP1926127A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

Landscapes

  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

An exposure apparatus comprising a feed port for feeding a liquid to an optical path space for an exposure light and a feed flow passage allowing the liquid to flow therein and hydraulically connected to the feed port. In the feed flow passage, the amounts of predetermined substances mixed in the liquid are set to predetermined values or below.
EP06796631A 2005-08-23 2006-08-22 Exposure apparatus, exposure method, and device manufacturing method Withdrawn EP1926127A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005241054 2005-08-23
JP2005371591 2005-12-26
PCT/JP2006/316417 WO2007023813A1 (en) 2005-08-23 2006-08-22 Exposure apparatus, exposure method, and device manufacturing method

Publications (2)

Publication Number Publication Date
EP1926127A1 EP1926127A1 (en) 2008-05-28
EP1926127A4 true EP1926127A4 (en) 2009-06-03

Family

ID=37771556

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06796631A Withdrawn EP1926127A4 (en) 2005-08-23 2006-08-22 Exposure apparatus, exposure method, and device manufacturing method

Country Status (6)

Country Link
US (2) US8018571B2 (en)
EP (1) EP1926127A4 (en)
JP (1) JP5040653B2 (en)
KR (1) KR101449055B1 (en)
TW (1) TWI430039B (en)
WO (1) WO2007023813A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3505722B2 (en) 1992-01-20 2004-03-15 ソニー株式会社 Signal level control device
US8953143B2 (en) * 2009-04-24 2015-02-10 Nikon Corporation Liquid immersion member
NL2004808A (en) 2009-06-30 2011-01-12 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
NL2006648A (en) 2010-06-01 2011-12-06 Asml Netherlands Bv A fluid supply system, a lithographic apparatus, a method of varying fluid flow rate and a device manufacturing method.
JPWO2016001973A1 (en) * 2014-06-30 2017-04-27 ギガフォトン株式会社 Target supply device, target material purification method, target material purification program, recording medium recording target material purification program, and target generator
CN112631082B (en) * 2020-12-25 2024-04-05 浙江启尔机电技术有限公司 Immersion liquid supply device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1524558A1 (en) * 2003-10-15 2005-04-20 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005109426A (en) * 2003-02-26 2005-04-21 Nikon Corp Aligner, exposure method, and device manufacturing method
WO2005071717A1 (en) * 2004-01-26 2005-08-04 Nikon Corporation Exposure apparatus and device producing method
US20050178535A1 (en) * 2004-02-18 2005-08-18 Pierluigi Ricci Connection between a cooled double-wall pipe and an uncooled pipe and double-pipe heat exchanger including said connection

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5271980A (en) * 1991-07-19 1993-12-21 Bell Dennis J Flexible evacuated insulating panel
JPH06124873A (en) 1992-10-09 1994-05-06 Canon Inc Liquid-soaking type projection exposure apparatus
JP2753930B2 (en) 1992-11-27 1998-05-20 キヤノン株式会社 Immersion type projection exposure equipment
US6721034B1 (en) 1994-06-16 2004-04-13 Nikon Corporation Stage unit, drive table, and scanning exposure apparatus using the same
JP3484684B2 (en) 1994-11-01 2004-01-06 株式会社ニコン Stage apparatus and scanning type exposure apparatus
US5874664A (en) * 1996-01-30 1999-02-23 Denso Corporation Air fuel ratio sensor and method for assembling the same
JP3870301B2 (en) 1996-06-11 2007-01-17 ヤマハ株式会社 Semiconductor device assembly method, semiconductor device and continuous assembly system of semiconductor device
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
CN1244020C (en) 1996-11-28 2006-03-01 株式会社尼康 Exposure device
JP4029183B2 (en) 1996-11-28 2008-01-09 株式会社ニコン Projection exposure apparatus and projection exposure method
JP4029182B2 (en) 1996-11-28 2008-01-09 株式会社ニコン Exposure method
EP0890136B9 (en) 1996-12-24 2003-12-10 ASML Netherlands B.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
JP3747566B2 (en) 1997-04-23 2006-02-22 株式会社ニコン Immersion exposure equipment
KR100243291B1 (en) 1997-04-30 2000-03-02 윤종용 Method for forming silicide layers in processes fabricating a semiconductor device
JP4210871B2 (en) 1997-10-31 2009-01-21 株式会社ニコン Exposure equipment
US6020964A (en) 1997-12-02 2000-02-01 Asm Lithography B.V. Interferometer system and lithograph apparatus including an interferometer system
JP4264676B2 (en) 1998-11-30 2009-05-20 株式会社ニコン Exposure apparatus and exposure method
US6897963B1 (en) 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
JP4383626B2 (en) * 2000-04-13 2009-12-16 キヤノン株式会社 Positioning apparatus and exposure apparatus
WO2002069049A2 (en) 2001-02-27 2002-09-06 Asml Us, Inc. Simultaneous imaging of two reticles
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
JP3878452B2 (en) * 2001-10-31 2007-02-07 株式会社ルネサステクノロジ Manufacturing method of semiconductor integrated circuit device
AU2003256081A1 (en) 2002-08-23 2004-03-11 Nikon Corporation Projection optical system and method for photolithography and exposure apparatus and method using same
TWI232357B (en) 2002-11-12 2005-05-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1420298B1 (en) 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographic apparatus
JP4608876B2 (en) * 2002-12-10 2011-01-12 株式会社ニコン Exposure apparatus and device manufacturing method
DE60326384D1 (en) 2002-12-13 2009-04-09 Koninkl Philips Electronics Nv LIQUID REMOVAL IN A PROCESS AND DEVICE FOR IRRADIATING STAIN ON A LAYER
ATE335272T1 (en) 2002-12-19 2006-08-15 Koninkl Philips Electronics Nv METHOD AND ARRANGEMENT FOR IRRADIATION OF A LAYER USING A LIGHT POINT
KR101288767B1 (en) 2003-02-26 2013-07-23 가부시키가이샤 니콘 Exposure apparatus and method, and method of producing apparatus
JP4729876B2 (en) * 2003-07-09 2011-07-20 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
WO2005006418A1 (en) 2003-07-09 2005-01-20 Nikon Corporation Exposure apparatus and method for manufacturing device
JP2006528835A (en) * 2003-07-24 2006-12-21 カール・ツアイス・エスエムテイ・アーゲー Microlithography projection exposure apparatus and method for introducing immersion liquid into immersion space
TWI245163B (en) 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
WO2005029559A1 (en) 2003-09-19 2005-03-31 Nikon Corporation Exposure apparatus and device producing method
JP4513299B2 (en) * 2003-10-02 2010-07-28 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
JP2005136374A (en) * 2003-10-06 2005-05-26 Matsushita Electric Ind Co Ltd Semiconductor manufacturing apparatus and pattern forming method using the same
KR20060071430A (en) * 2003-10-22 2006-06-26 가부시키가이샤 니콘 Exposure apparatus, exposure method, manufacturing method of device
JP2005209705A (en) * 2004-01-20 2005-08-04 Nikon Corp Exposure device and manufacturing method for device
JP2005236047A (en) * 2004-02-19 2005-09-02 Canon Inc Exposure system and method therefor
JP4486377B2 (en) 2004-02-24 2010-06-23 新日鉄エンジニアリング株式会社 Waste melting treatment method using powdery biomass
US20050231695A1 (en) * 2004-04-15 2005-10-20 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for immersion lithography using high PH immersion fluid
JP2006073906A (en) * 2004-09-06 2006-03-16 Canon Inc Aligner, exposure system, and device manufacturing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005109426A (en) * 2003-02-26 2005-04-21 Nikon Corp Aligner, exposure method, and device manufacturing method
EP1524558A1 (en) * 2003-10-15 2005-04-20 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005071717A1 (en) * 2004-01-26 2005-08-04 Nikon Corporation Exposure apparatus and device producing method
US20070242241A1 (en) * 2004-01-26 2007-10-18 Nikon Corporation Exposure Apparatus and Device Manufacturing Method
US20050178535A1 (en) * 2004-02-18 2005-08-18 Pierluigi Ricci Connection between a cooled double-wall pipe and an uncooled pipe and double-pipe heat exchanger including said connection

Also Published As

Publication number Publication date
US20110317139A1 (en) 2011-12-29
TW200712793A (en) 2007-04-01
US20080226332A1 (en) 2008-09-18
JPWO2007023813A1 (en) 2009-02-26
JP5040653B2 (en) 2012-10-03
EP1926127A1 (en) 2008-05-28
TWI430039B (en) 2014-03-11
US8018571B2 (en) 2011-09-13
WO2007023813A1 (en) 2007-03-01
KR20080036186A (en) 2008-04-25
KR101449055B1 (en) 2014-10-08

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