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EP1765175B1 - Sonde a ultrasons et son procede de fabrication - Google Patents

Sonde a ultrasons et son procede de fabrication Download PDF

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Publication number
EP1765175B1
EP1765175B1 EP04733484.2A EP04733484A EP1765175B1 EP 1765175 B1 EP1765175 B1 EP 1765175B1 EP 04733484 A EP04733484 A EP 04733484A EP 1765175 B1 EP1765175 B1 EP 1765175B1
Authority
EP
European Patent Office
Prior art keywords
piezoelectric element
electrode
face
grooves
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP04733484.2A
Other languages
German (de)
English (en)
Other versions
EP1765175A4 (fr
EP1765175A1 (fr
Inventor
Sungmin Pureunmaeul Byucksan Apt. RHIM
Ho Jung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Humanscan Co Ltd
Original Assignee
Humanscan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Humanscan Co Ltd filed Critical Humanscan Co Ltd
Publication of EP1765175A1 publication Critical patent/EP1765175A1/fr
Publication of EP1765175A4 publication Critical patent/EP1765175A4/fr
Application granted granted Critical
Publication of EP1765175B1 publication Critical patent/EP1765175B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
    • B06B1/0677—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a high impedance backing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
    • B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
    • B06B1/0685—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure on the back only of piezoelectric elements

Definitions

  • the present invention relates to an ultrasonic probe having uniquely designed electrodes, and a method for the fabrication thereof.
  • US 5,810,009 A relates to an ultrasonic probe and a method of manufacturing said probe.
  • Ultrasonic imaging equipments have been widely used, and they conventionally comprise an ultrasonic probe for transducing an ultrasonic wave to an electric signal, a processing unit for processing the electric signal to an image and a display unit for displaying the image.
  • the ultrasonic probe plays an important role in obtaining high-resolution image, and it is required to have a high electromechanical coupling coefficient, as well as good ultrasonic wave pulse and focusing characteristics of ultrasonic beam.
  • An ultrasonic probe typically comprises an ultrasonic transmitting/receiving element consisting essentially of a piezoelectric element having a pair of electrodes, and as the piezoelectric element, lead zirconate titanate-based ceramics (PZT) was previously employed, but recently, a lead zirconia niobate-lead titanate(Pb(Zn 1/3 Nb 2/3 )0 3 -PbTiO 3 ; "PZN-PT”)- or lead magnesium niobate-lead titanate (Pb(Mg 1/3 Nb 2/3 )0 3 -PbTi0 3 ; "PMN-PT”) based piezoelectric single crystals have become favored because of their better properties.
  • PZT lead zirconate titanate-based ceramics
  • PZN-PT and PMN-PT have the disadvantage of poor thermal stability due to a low phase transition temperature.
  • PZT has a phase transition temperature range of about 200 to 385 °C
  • 0.67PMN-0.33PT exhibits the phase transition phenomena at about 150 °C. If a piezoelectric element is subjected to a temperature higher than the phase transition temperature, it will become depolarized, and thus, the preparing process of an ultrasonic probe using such piezoelectric elements should not involve a high-temperature step.
  • the electrical connection in an ultrasonic probe has been often achieved by using an epoxy paste which does not require a high temperature, rather than by soldering.
  • an epoxy paste layer tends to degrade the performance of the ultrasonic probe, and the connection of a flexible printed circuit board (FPCB) thereto requires an elaborate fabrication procedure.
  • FPCB flexible printed circuit board
  • a primary object of the invention to provide a novel ultrasonic probe comprising a piezoelectric element having uniquely designed electrodes and FPCB attached thereto in a way which is not influenced by the paste used for the attachment.
  • an ultrasonic probe as defined in claim 1.
  • the inventive ultrasonic probe is characterized by comprising uniquely designed electrodes and FPCB attached thereto in a form not influenced by the paste used for the attachment.
  • An ultrasonic probe conventionally contains a piezoelectric device (an ultrasonic transmitting/receiving element) comprising a piezoelectric element consisting essentially of a piezoelectric single crystal; a first and second electrodes formed on an ultrasonic wave transmitting/receiving face and the face opposite to the transmitting/receiving face of the piezoelectric element, respectively; acoustic matching layers formed on the first electrode; an acoustic lens formed to cover the entire surface of the acoustic matching layer; a ground electrode connected to the first electrode; and a flexible printed circuit board for signal, connected to the second electrode.
  • a piezoelectric device an ultrasonic transmitting/receiving element
  • a piezoelectric element consisting essentially of a piezoelectric single crystal
  • first and second electrodes formed on an ultrasonic wave transmitting/receiving face and the face opposite to the transmitting/receiving face of the piezoelectric element, respectively
  • the inventive ultrasonic probe is characterized in that the first electrode is formed on a substantial portion of a first main face, a first side face and a part of a second main face of the piezoelectric element, and the second electrode is formed on a substantial portion of a second main face, a second side face and a part of a first main face of the piezoelectric element, and that the two electrodes are isolated from each other by two grooves formed on the first and second main faces of the piezoelectric element, in a manner parallel to the side edges of the piezoelectric element, respectively, at positions separated from the second and first side edges by a given distance, respectively.
  • the inventive ultrasonic probe may be fabricated as shown in Figs. 2 and 3 .
  • electrode layer 20" is deposited on the first and second main faces 10a, 10b and the first and second side faces 10c, 10d of single crystal piezoelectric element or wafer 10 (see Fig. 2a ), to obtain a coated wafer (see Fig. 2b ).
  • the piezoelectric element may have a thickness of 20 to 500,000 ⁇ m, preferably 50 to 400 ⁇ m, in the direction of vibration.
  • the electrode layer may be made of a conductive metal such as Cr, Cu, Ni, Au, etc., and a combination thereof.
  • the deposition of the electrode layer may be conducted using a sputtering, electronic-beam, thermal-evaporation or electroplating method, and the thickness of the deposited electrode may range from 100 to 10,000 ⁇ .
  • first electrode 20 formed mainly on first main face 10a and first side face 10c (an ultrasonic wave transmitting/receiving face)
  • second electrode 20' formed mainly on second main face 10b and second side face 10d (the face opposite to the transmitting/receiving face), as shown in Fig. 2c .
  • the grooves 30, 30' may each be formed at a position separated from the side edge of the piezoelectric element by a given distance, for example a distance to make room for applying an epoxy paste to attach the electrode to a flexible printed circuit board or a ground electrode in a later step, using a dicing saw.
  • the grooves may be formed at the position of 1 to 1.5 mm inwardly from each side edge, and according to the invention, to a depth corresponding to 70 to 80% of the wafer thickness, in order to inhibit the generation of undesirable vibration.
  • the resulting assembly 100 is then used to fabricate the inventive ultrasonic probe, as shown in Figs. 3a to 3d .
  • Fig. 3a shows the step of attaching backing layer 40 to the electrode layer deposited on second main face 10b of the piezoelectric element, using an epoxy paste in a conventional manner
  • Fig. 3b shows the step of attaching ground electrode plate 50 and flexible printed circuit board 60 for signal.
  • ground electrode plate 50 is attached to first electrode 20 at first side face 10c of piezoelectric element 10
  • flexible printed circuit board 60 is attached to second electrode 20' in the front portion of the groove 30 positioned on first main face 10a of the piezoelectric element, extending from second side face 10d of the piezoelectric element, and bending at the end part at a right angle.
  • the attachment of the ground electrode plate and the flexible printed circuit board to the first and second electrodes, respectively, may be conventionally carried out using conductive epoxy paste 70, preferably a conductive silver epoxy paste, as shown in Fig. 3c , and the use of such bended end part make the bonding of the electrode with the flexible printed circuit board strong.
  • At least one acoustic matching layer 80 may be formed on the electrode layer deposited on the first main face of the piezoelectric element, as in Fig. 3d , and thereon an acoustic lens may be covered.
  • the ultrasonic probe fabricated by the inventive method can have excellent vibration characteristics, a wide frequency band, and a high sensitivity.
  • the piezoelectric single crystal used in the ultrasonic probe may be any strongly ferroelectric, homogeneous single crystal, preferably PMN-PT, of which an example may have the composition of formula (I): x(A)y(B)z(C)-p(P)n(N) (I) wherein,
  • the single crystal of formula (I) may be prepared by way of conducting a solid phase reaction followed by melting-crystallization, by a method described in Korean Patent No. 392754 .
  • the piezoelectric single crystal of formula (I) has a high dielectric constant of about 5,500 or higher, a piezoelectric constant of about 1,500 pC/N or higher at an ambient temperature, and a low temperature coefficient in a broad temperature range of 20 to 90°C.
  • the inventive ultrasonic probe has a relative dielectric constant ranging from about 1,000 to 10,000, the velocity of a sound wave generated on the (001) face ranging from 1,200 to 4,000 m/s (frequency constant: 1,400 to 2,000 Hz.m), and a high electromechanical coefficient (k 33 ') ranging from 80 to 95%. Accordingly, the inventive ultrasonic probe can be beneficially used for an ultrasonic diagnosis in medical, military, and industrial fields.
  • An ultrasonic probe as shown in Fig. 1 was fabricated by a method comprising the procedures as shown in Figs. 2 and 3 .
  • Piezoelectric single crystal substrate 10 having a (001) face (surface 10a) and a size of 20-25mm x 15-20mm x 0.4-0.5mm was prepared, and metal layer (Cr/Cu/Au) 20" was deposited using a DC sputtering method on surfaces10a, 10b, 10c and 10d of the substrate (but not on surfaces 10e and 10f) at an ambient temperature under a pressure of 1.2 x 10 -7 mmHg ( Figs. 2a and 2b ).
  • grooves 30 and 30' were formed on surfaces 10a and 10 b of the metal deposited piezoelectric single crystal substrate, respectively, to separate metal layer 20" into two electrodes 20 and 20' by using a dicing saw: Groove 30 was formed on electrode layer 20" deposited on surface 10a in a manner parallel to the edge formed with surface 10d at a distance of 1-1.5 mm from said edge, while groove 30' was formed on electrode layer 20" deposited on surface 10b at a distance of 1-1.5 mm from the side edge with surface 10c of the substrate ( Fig. 2c ). Each of two grooves 30, 30' had a depth of 0.25-0.35 mm.
  • Backing layer 40 was laminated on the electrode layer deposited on surface 10b of piezoelectric substrate 10 using an epoxy paste ( Fig. 3a ), and ground electrode plate 50 was attached to electrode 20 at first side face 10c of piezoelectric substrate 10 while flexible printed circuit board 60 was attached to electrode 20' at a part of the front of groove 30, beyond second side face 10d, of piezoelectric substrate 10, by bending at a right angle ( Fig. 3b ). Thereafter, two acoustic matching layers 80 were laminated on the electrode layer deposited on surface 10a of piezoelectric substrate 10, and thereon an acoustic lens was covered to fabricate the inventive ultrasonic probe, as shown in Fig. 1 .
  • Example 2 The procedures of Example were repeated except that the two electrodes 20, 20' were formed by coating an electrode material after a masking tape was covered on the isolation portions 30, 30' and then removing the masking tape after coating, to fabricate an ultrasonic probe.
  • Fig. 4b it can be seen that the piezoelectric element according to Comparative Example generates an undesirable vibration as shown in a dot-line box.
  • Fig. 4a shows that such undesirable vibration did not appear in the piezoelectric element according to the present invention.
  • the inventive probe comprising electrodes isolated by grooves having a given depth gives improved vibration performance.
  • the probing characteristics (the relative sensitivity and the band-width) of the ultrasonic probes fabricated in Example and Comparative Example were measured with a pulse-echo response test, and the results are shown in Table 1.
  • Table 1 shows that the inventive probe having electrode isolation grooves is better in terms of sensitivity and band-width than the probe of Comparative Example having a simple isolation portion.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Claims (8)

  1. Sonde à ultrasons comprenant :
    (A) un élément piézoélectrique essentiellement constitué d'un monocristal piézoélectrique et comportant des première et seconde faces principales (10a, 10b) et des première et seconde faces latérales (10c, 10d),
    (B) une première électrode (20) déposée sur une partie substantielle de la première face principale (10a), de la première face latérale (10c) et d'une partie de la seconde face principale (10b) de l'élément piézoélectrique, et une seconde électrode (20') déposée sur une partie substantielle de la seconde face principale (10b), de la seconde face latérale (10d) et d'une partie de la première face principale (10a) de l'élément piézoélectrique, les première et seconde électrodes étant isolées l'une de l'autre par deux rainures (30, 30') formées sur les première et seconde faces principales de l'élément piézoélectrique pour être respectivement parallèles aux bords latéraux de l'élément piézoélectrique à des positions respectivement séparées d'une distance donnée des second et premier bords latéraux,
    (C) une couche de support (40) fixée à la couche d'électrode déposée sur la seconde face principale (10b) de l'élément piézoélectrique,
    (D) une électrode de masse (50) fixée à la première électrode (20) au niveau de la première face latérale de l'élément piézoélectrique, et
    (E) caractérisée par une carte à circuit imprimé souple (60) fixée à la seconde électrode (20') sur la première face principale (10a), une partie terminale de la carte à circuit imprimé souple (60) étant fixée à la seconde électrode (20') entre la rainure (30) et la seconde face latérale (10d) de l'élément piézoélectrique, et se cintrant pour former un angle droit, la carte à circuit imprimé souple (60) s'étendant depuis la seconde face latérale (10d) de l'élément piézoélectrique,
    dans laquelle les deux rainures (30, 30') présentent une profondeur correspondant à 70 % à 80 % de l'épaisseur totale de l'élément piézoélectrique.
  2. Sonde à ultrasons selon la revendication 1, dans laquelle les rainures (30, 30') sont positionnées à une certaine distance pour laisser de la place permettant d'appliquer une pâte époxy pour fixer les électrodes à la carte à circuit imprimé souple (60) ou à l'électrode de masse (50) vers l'intérieur depuis les bords latéraux respectifs de l'élément piézoélectrique.
  3. Sonde à ultrasons selon la revendication 2, dans laquelle les deux rainures (30, 30') sont positionnées à une distance allant de 1 mm à 1,5 mm vers l'intérieur depuis les bords latéraux respectifs de l'élément piézoélectrique.
  4. Procédé de fabrication d'une sonde à ultrasons comprenant :
    (A) le dépôt d'une couche d'électrode (20") sur des première et seconde faces principales (10a, 10b) et des première et seconde faces latérales (10c, 10d) d'un élément piézoélectrique,
    (B) la formation de deux rainures (30, 30') sur les première et seconde faces principales (10a, 10b) de l'élément piézoélectrique pour qu'elles soient respectivement parallèles aux bords latéraux de l'élément piézoélectrique à des positions respectivement séparées d'une distance donnée des second et premier bords latéraux, dans le but de séparer la couche d'électrode en deux électrodes (20,20'),
    (C) la fixation d'une couche de support (40) à la couche d'électrode déposée sur la seconde face principale (10b) de l'élément piézoélectrique,
    (D) la fixation d'une électrode de masse (50) à la première électrode (20) au niveau de la face latérale de l'élément piézoélectrique, et
    (E) caractérisé par la fixation d'une carte à circuit imprimé souple (60) à la seconde électrode (20') sur la première face principale (10a), une partie terminale de la carte à circuit imprimé souple (60) étant fixée à la seconde électrode (20') entre la rainure (30) et la seconde face latérale (10d) de l'élément piézoélectrique, et se cintrant pour former un angle droit, la carte à circuit imprimé souple (60) s'étendant depuis la seconde face latérale (10d) de l'élément piézoélectrique,
    dans lequel les deux rainures (30, 30') présentent une profondeur correspondant à 70 % à 80 % de l'épaisseur totale de l'élément piézoélectrique.
  5. Procédé selon la revendication 4, dans lequel les deux rainures (30, 30') sont formées à une certaine distance pour laisser de la place permettant d'appliquer une pâte époxy pour fixer les électrodes à la carte à circuit imprimé souple (60) ou à l'électrode de masse (50) vers l'intérieur depuis les bords latéraux respectifs de l'élément piézoélectrique.
  6. Procédé selon la revendication 5, dans lequel les deux rainures (30, 30') sont formées à une position allant de 1 mm à 1,5 mm vers l'intérieur depuis les bords latéraux respectifs de l'élément piézoélectrique.
  7. Procédé selon la revendication 6, dans lequel la pâte époxy est une pâte époxy argent.
  8. Procédé selon la revendication 4, dans lequel les deux rainures (30, 30') sont formées en utilisant une scie de découpe de puces.
EP04733484.2A 2004-05-17 2004-05-17 Sonde a ultrasons et son procede de fabrication Expired - Lifetime EP1765175B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2004/001164 WO2005110235A1 (fr) 2004-05-17 2004-05-17 Sonde a ultrasons et son procede de fabrication

Publications (3)

Publication Number Publication Date
EP1765175A1 EP1765175A1 (fr) 2007-03-28
EP1765175A4 EP1765175A4 (fr) 2017-07-12
EP1765175B1 true EP1765175B1 (fr) 2019-01-16

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EP04733484.2A Expired - Lifetime EP1765175B1 (fr) 2004-05-17 2004-05-17 Sonde a ultrasons et son procede de fabrication

Country Status (4)

Country Link
EP (1) EP1765175B1 (fr)
JP (1) JP4486127B2 (fr)
CN (1) CN100473353C (fr)
WO (1) WO2005110235A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106446752B (zh) * 2015-08-04 2019-07-02 上海箩箕技术有限公司 电子产品

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56158648A (en) * 1980-05-09 1981-12-07 Tokyo Shibaura Electric Co Ultrasonic diagnostic apparatus
KR830004828A (ko) * 1981-03-31 1983-07-20 시바 쇼오이찌 초음파 진단장치
JPS61112500A (ja) * 1984-11-06 1986-05-30 Matsushita Electric Ind Co Ltd 超音波探触子
US5423220A (en) * 1993-01-29 1995-06-13 Parallel Design Ultrasonic transducer array and manufacturing method thereof
US5402791A (en) * 1993-08-06 1995-04-04 Kabushiki Kaisha Toshiba Piezoelectric single crystal, ultrasonic probe, and array-type ultrasonic probe
US5810009A (en) 1994-09-27 1998-09-22 Kabushiki Kaisha Toshiba Ultrasonic probe, ultrasonic probe device having the ultrasonic probe, and method of manufacturing the ultrasonic probe
US5857974A (en) * 1997-01-08 1999-01-12 Endosonics Corporation High resolution intravascular ultrasound transducer assembly having a flexible substrate
JP4153576B2 (ja) * 1997-11-25 2008-09-24 株式会社東芝 超音波トランスジューサ
US20040054287A1 (en) * 2002-08-29 2004-03-18 Stephens Douglas Neil Ultrasonic imaging devices and methods of fabrication

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
EP1765175A4 (fr) 2017-07-12
CN100473353C (zh) 2009-04-01
JP2007537818A (ja) 2007-12-27
EP1765175A1 (fr) 2007-03-28
CN1953710A (zh) 2007-04-25
WO2005110235A1 (fr) 2005-11-24
JP4486127B2 (ja) 2010-06-23

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