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EP1638732A4 - Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes - Google Patents

Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes

Info

Publication number
EP1638732A4
EP1638732A4 EP04754300A EP04754300A EP1638732A4 EP 1638732 A4 EP1638732 A4 EP 1638732A4 EP 04754300 A EP04754300 A EP 04754300A EP 04754300 A EP04754300 A EP 04754300A EP 1638732 A4 EP1638732 A4 EP 1638732A4
Authority
EP
European Patent Office
Prior art keywords
systems
methods
multiple electrodes
microfeature workpieces
processing microfeature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04754300A
Other languages
German (de)
French (fr)
Other versions
EP1638732A2 (en
Inventor
Paul R Mchugh
Gregory J Wilson
Daniel J Woodruff
Nolan Zimmerman
James J Erickson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/734,100 external-priority patent/US7390382B2/en
Priority claimed from US10/733,807 external-priority patent/US7393439B2/en
Application filed by Semitool Inc filed Critical Semitool Inc
Publication of EP1638732A2 publication Critical patent/EP1638732A2/en
Publication of EP1638732A4 publication Critical patent/EP1638732A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Weting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
EP04754300A 2003-06-06 2004-06-03 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes Withdrawn EP1638732A4 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US47678603P 2003-06-06 2003-06-06
US48460403P 2003-07-01 2003-07-01
US48460303P 2003-07-01 2003-07-01
US10/734,100 US7390382B2 (en) 2003-07-01 2003-12-11 Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods
US10/734,098 US7390383B2 (en) 2003-07-01 2003-12-11 Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces
US10/733,807 US7393439B2 (en) 2003-06-06 2003-12-11 Integrated microfeature workpiece processing tools with registration systems for paddle reactors
PCT/US2004/017670 WO2004110698A2 (en) 2003-06-06 2004-06-03 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes

Publications (2)

Publication Number Publication Date
EP1638732A2 EP1638732A2 (en) 2006-03-29
EP1638732A4 true EP1638732A4 (en) 2007-06-06

Family

ID=33556803

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04754300A Withdrawn EP1638732A4 (en) 2003-06-06 2004-06-03 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes

Country Status (4)

Country Link
EP (1) EP1638732A4 (en)
JP (1) JP2007527948A (en)
KR (1) KR20060024792A (en)
WO (1) WO2004110698A2 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6747734B1 (en) 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
US7313462B2 (en) 2003-06-06 2007-12-25 Semitool, Inc. Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces
US7393439B2 (en) 2003-06-06 2008-07-01 Semitool, Inc. Integrated microfeature workpiece processing tools with registration systems for paddle reactors
US7390383B2 (en) 2003-07-01 2008-06-24 Semitool, Inc. Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces
JP2009517543A (en) * 2005-11-23 2009-04-30 セミトゥール・インコーポレイテッド Apparatus and method for vibrating liquids during wet chemical processing of microstructured workpieces
US7842173B2 (en) 2007-01-29 2010-11-30 Semitool, Inc. Apparatus and methods for electrochemical processing of microfeature wafers
JP5038024B2 (en) 2007-06-06 2012-10-03 上村工業株式会社 Work surface treatment system
US8177944B2 (en) 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
JP5184308B2 (en) 2007-12-04 2013-04-17 株式会社荏原製作所 Plating apparatus and plating method
FR2966282B1 (en) 2010-10-18 2013-02-15 Nexcis CONTROL OF LAYER I-III-VI STOICHIOMETRY FOR PHOTOVOLTAIC APPLICATIONS FROM IMPROVED ELECTROLYSIS CONDITIONS.
JP6100049B2 (en) * 2013-03-25 2017-03-22 株式会社荏原製作所 Plating equipment
KR102194716B1 (en) * 2014-03-06 2020-12-23 삼성전기주식회사 Plating apparatus
JP6411943B2 (en) * 2014-05-26 2018-10-24 株式会社荏原製作所 Substrate electrolytic treatment apparatus and paddle used for the substrate electrolytic treatment apparatus
US10227706B2 (en) * 2015-07-22 2019-03-12 Applied Materials, Inc. Electroplating apparatus with electrolyte agitation
US10240248B2 (en) * 2015-08-18 2019-03-26 Applied Materials, Inc. Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control
JP6890528B2 (en) * 2017-12-15 2021-06-18 株式会社荏原製作所 Plating device with wave-dissipating member and wave-dissipating member that can be attached to the paddle
JP6790016B2 (en) * 2018-04-10 2020-11-25 上村工業株式会社 Surface treatment equipment, surface treatment method and paddle
TWI671435B (en) * 2018-06-08 2019-09-11 台灣創智成功科技有限公司 Plating device
GB201905138D0 (en) * 2019-04-11 2019-05-29 Spts Technologies Ltd Apparatus and method for processing a substrate
CN118829749A (en) * 2022-12-20 2024-10-22 株式会社荏原制作所 Plating device and operating method of plating device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379511B1 (en) * 1999-09-23 2002-04-30 International Business Machines Corporation Paddle design for plating bath

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3477051A (en) * 1967-12-26 1969-11-04 Ibm Die casting of core windings
US4749601A (en) * 1985-04-25 1988-06-07 Hillinger Brad O Composite structure
US5516412A (en) * 1995-05-16 1996-05-14 International Business Machines Corporation Vertical paddle plating cell
US6099702A (en) * 1998-06-10 2000-08-08 Novellus Systems, Inc. Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability
US6136163A (en) * 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
US6454918B1 (en) * 1999-03-23 2002-09-24 Electroplating Engineers Of Japan Limited Cup type plating apparatus
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US6231743B1 (en) * 2000-01-03 2001-05-15 Motorola, Inc. Method for forming a semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379511B1 (en) * 1999-09-23 2002-04-30 International Business Machines Corporation Paddle design for plating bath

Also Published As

Publication number Publication date
JP2007527948A (en) 2007-10-04
EP1638732A2 (en) 2006-03-29
WO2004110698A3 (en) 2006-08-24
KR20060024792A (en) 2006-03-17
WO2004110698A2 (en) 2004-12-23

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20070508

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: APPLIED MATERIALS, INC.

17Q First examination report despatched

Effective date: 20140313

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Effective date: 20160105