EP1253393A2 - Wärmeabführende Rippen mit Durchflusskanälen - Google Patents

Wärmeabführende Rippen mit Durchflusskanälen Download PDF

Info

Publication number: EP1253393A2
Authority: EP; European Patent Office
Prior art keywords: heat dissipating; fin set; dissipating fin; metal pieces; buckling
Prior art date: 2001-04-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP02001828A

Other languages

English (en)

French (fr)

Other versions

EP1253393B1 (de

EP1253393A3 (de

Inventor

Meng-Cheng Huang

Tony Wang

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nidec Chaun Choung Technology Corp

Original Assignee

Chaun Choung Technology Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-04-23

Filing date

2002-01-25

Publication date

2002-10-30

2002-01-25 Application filed by Chaun Choung Technology Corp filed Critical Chaun Choung Technology Corp

2002-10-30 Publication of EP1253393A2 publication Critical patent/EP1253393A2/de

2004-03-03 Publication of EP1253393A3 publication Critical patent/EP1253393A3/de

2006-04-12 Application granted granted Critical

2006-04-12 Publication of EP1253393B1 publication Critical patent/EP1253393B1/de

2022-01-25 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Images

Classifications

- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations

Definitions

the present invention relates to a flow channel type heat dissipating fin set, and especially to heat dissipating fin set with a preferred heat dissipating efficiency and having a preferred heat dissipating ability.
a heat dissipating fin set with a larger area is appended to the surface of the electronic heat emitting elements for assisting heat dissipation, so as to control the operation and lifetime of the electronic heat emitting element.
the current general used heat dissipating fin set are formed by aluminum extrusion type, molding and stacking.
the densities (total heat dissipating area of unit volume) of the aluminum extruding and molding heat dissipating fin sets are finite due to the confinement of the mechanic finishing ability. Therefore the heat dissipating fin set used to electronic heat emitting elements with large heat dissipation have larger volume and weight, while the stacking heat dissipating fin set has a higher density so as to replace the aluminum extruding or molding heat dissipating fin sets.
a prior art heat dissipating fin set 10a is illustrated, which is made by mechanically punching so as to punch a plurality of metal pieces 11a into a predetermined size.
the metal piece 11a is made of copper or aluminum or other materials.
the metal piece 11a is punched to be formed with a C shape,or L shape or I shape.
Each of the metal pieces 11 includes a body 12.
the body 12 has an upper and a lower side which are connected to parallel folded edges 13.
the metal pieces 11a are glued or welded to a heat dissipating seat 20a by the folding edges 13a at the lower side of the body 12.
the heat dissipating seat 20 is made of copper or aluminum so that it can be attached to the surface of an electronic heat dissipating elements.
heat dissipating fin set 10a is formed with a transverse gap between metal pieces 11a and thus air only flows between metal pieces 11a instead of flowing longitudinally between metal pieces 11. Therefore, heat dissipating fin set 10a has no preferred heat dissipating effect and thus, heat dissipation is not good.
the bottom of the heat dissipating fin set is formed as a plane which can not match the shapes of the surfaces of the heat dissipating seat and electronic heat emitting element. Thus, it can not be adhered to the heat dissipating seat and electronic heat emitting elements of various shapes. The application is strictly confined.
the metal pieces 11a are glued or welded to the heat dissipating seat 20a one by one, this is time and labor consumed. Therefore, a higher cost is necessary.
the primary object of the present invention is to provide a flow channel type heat dissipating fin set, wherein in the present invention, not only transversal gaps are formed between different metal pieces so that air flow can flow between metal pieces. Moreover, air flows along the flow channels formed by the via holes in the metal pieces. Therefore the heat dissipating fin set has a preferred heat dissipating efficiency so as to present a preferred heat dissipating ability.
Another object of the present invention is to provide a flow channel type heat dissipating fin set, wherein the longitudinal size of the buckling hole of the present invention is slightly larger than the size of the buckle, so that the longitudinal length of the heat dissipating fin set is telescopic and is flexible. Therefore the bottom of the heat dissipating fin set may be a cambered surface, a curved surface, etc., so as to match the shape of the surface of an electronic heat emitting element on the heat dissipating seat so as to be adhered to heat dissipating seats and electronic heat emitting elements of various shapes. Therefore the application of the present invention is flexible.
the present invention provides a flow channel type heat dissipating fin set formed by a plurality of metal pieces.
Each metal piece comprises a body; and a connecting piece installed on the body having one or more connecting pieces punched from the body; the connecting piece being protruded from one side of the body; a via hole being formed on the body; and buckles and buckling holes being formed on the body.
the metal pieces are combined by buckling the buckles and buckling holes so that the metal pieces are continuously buckled and stacked as a heat dissipating fin set; and via holes on the bodies of the metal pieces are formed as longitudinal flow channels.
the flow channel type heat dissipating fin set is formed.
the heat dissipating fin set is formed by a plurality of metal pieces 11 by mechanically punching.
the metal piece 11 is made of copper or aluminum or other material with better heat conductivity.
the metal piece 11 is punched to be formed with a C shape.
the metal piece 11 can be punched to have an L shape or an I shape, or other shapes.
Each of the metal pieces 11 includes a body 12.
the body 12 has an upper and a lower side which are connected to a first folded edge 13 and a second folded edge 14.
the first folded edge 13 and second folded edge 14 are perpendicular to the body 12.
the two folded edges 13, and 14 are parallel since abovesaid heat dissipating fin set has a structure approximately equal to the structure in the prior art and not the main scope of the present invention. Thus, the detail will be described herein.
a connecting unit 15 is installed on the body 12 of the metal piece 11, so that the metal pieces 15 are stacked Thereby, the connecting unit 15 will form with a heat dissipating fin set 10 with a certain volume.
the heat dissipating fin set 15 has one or more connecting pieces 16 punched from the body 12.
the connecting pieces 16 are protruded from one side of the body 12.
the shape of the connecting piece 16 is not confined, but is vertical to the body 12 and has a predetermined length for buckling one by one.
one or more via holes 19 with respective to the connecting pieces 16 are formed on the body 12.
a flow channels are formed by the via holes 19 so that air may flow smoothly.
One or more buckles 17 are punched from the connecting pieces 16.
two buckles 17 are formed.
One or more respective buckling holes 18 are shaped on the connecting piece 16.
one oblong buckling hole 18 is installed.
the buckle 17 and buckling hole 18 are installed at two respective surfaces of the connecting piece 16, i.e., at the bottom and top surface.
the shapes of the connecting piece 16, buckle 17 and buckling hole 18 are not confined, which can be varied as desired (referring to Figs. 6, 7 and 8). It may be round shapes, elliptical shapes, polygonal shapes, or other shapes. The numbers thereof are selectively as desired.
the connecting piece 16 on the body 12 of the metal piece 11 may be installed at the upper and lower sides.
the longitudinal size of the metal piece 11 may be slightly larger than that of the buckle 17 so that the after the buckle 17 is buckled to the buckling hole 18, a little gap is formed therebetween so that the longitudinal length of the heat dissipating fin set 10 is telescopic and is flexible.
the various metal pieces 11 are buckled by the buckle 17 and buckling hole 18 so that the metal pieces 11 are buckled continuously and stacked as a heat dissipating fin set 10.
the flow channel type heat dissipating fin set of the present invention is formed.
the heat dissipating fin set 10 of the present invention is glued or welded to a heat dissipating seat 20 through the second folded edge 14 at the lower side of the body 12.
the heat dissipating seat 20 is made of copper or aluminum so that by the heat dissipating seat 20, the present invention can be attached to the surface of an electronic heat emitting element (not shown) for heat dissipation.
This heat dissipating fin set has a high density heat dissipating area.
the metal pieces 11 of heat dissipating fin set of the present invention are buckled and stacked by the connecting units 15, so as to be formed with a heat dissipating fin set 10 with a finite volume. Then, they are connected to the heat dissipating seat 20 without needing to connect the metal piece 11 to the heat dissipating seat 20.
the assembly work is time and labor saving and thus the cost is reduced greatly.
the connecting unit 15 is installed to the body 12 of the metal piece 11. Therefore as the connecting unit 15 is formed, the via hole 19 can be also formed on the body 12. As the metal pieces 11 are buckled by the buckles 17 and the buckling holes 18 so as to be formed as the heat dissipating fin set 10, longitudinal flow channels are formed.
the heat dissipating fin set 10 has a preferred heat dissipating efficiency so as to present a preferred heat dissipating ability.
the connecting unit 15 is installed on the body 12 of the metal piece 11, and thus, the first folded edge 13 and second folded edge 14 at the upper an lower sides of the body 12 are not affected.
the shapes of the first folded edge 13 and second folded edge 14 may be modified as desired.
the longitudinal size of the buckling hole 18 of the present invention is slightly larger than the size of the buckle 17, so that the longitudinal length of the heat dissipating fin set is telescopic and flexible. Therefore the bottom of the heat dissipating fin set 10 may be a cambered surface, a curved surface, etc., so as to match the shape of the shape on the surface of an electronic heat emitting element on the heat dissipating seat, so as to be adhered to heat dissipating seats and electronic heat emitting elements of various shapes. Therefore the application of the present invention is flexible.
the present invention has improved the defects in the prior art, such as air can not flow between metal pieces longitudinally, the heat dissipating fins has no preferred heat dissipating efficiency, so that the heat dissipating ability is not preferred, further, the bottom of the heat dissipating fin is formed as a plane, so that it can not be modified as desired, therefore, the application is confined. Therefore all above said defects in the prior art is improved.

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Mechanical Engineering (AREA)
General Engineering & Computer Science (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)

EP02001828A 2001-04-23 2002-01-25 Wärmeabführende Rippen mit Durchflusskanälen Expired - Lifetime EP1253393B1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
CN01220105		2001-04-23
CN01220105U CN2478253Y (zh)	2001-04-23	2001-04-23	流道式散热鳍片结构

Publications (3)

Publication Number	Publication Date
EP1253393A2 true EP1253393A2 (de)	2002-10-30
EP1253393A3 EP1253393A3 (de)	2004-03-03
EP1253393B1 EP1253393B1 (de)	2006-04-12

Family

ID=4693685

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP02001828A Expired - Lifetime EP1253393B1 (de)	2001-04-23	2002-01-25	Wärmeabführende Rippen mit Durchflusskanälen

Country Status (4)

Country	Link
EP (1)	EP1253393B1 (de)
CN (1)	CN2478253Y (de)
AT (1)	ATE323272T1 (de)
DE (1)	DE60210536T2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
ES2207394A1 (es) *	2002-07-10	2004-05-16	Salicru, S.A.	Dispositivo para la disipacion de calor, en especial para componentes semiconductores o componentes similares.
CN116713706A (zh) *	2023-05-31	2023-09-08	深圳市鸿慷电子有限公司	一种鳍片式散热器加工方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN101652053B (zh) *	2008-08-13	2012-03-14	富准精密工业(深圳)有限公司	散热装置
CN108323110B (zh) *	2018-02-07	2020-12-04	奇鋐科技股份有限公司	散热鳍片及其结合结构
CN113804042A (zh) *	2021-08-10	2021-12-17	昆山双仔电子科技有限公司	一种散热片及cnc加工工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1592069A (en) *	1976-09-16	1981-07-01	Pasilac As	Heat exchange plate for heat-exchangers
DE3616746A1 (de) *	1986-05-17	1987-11-19	Moll Hermann Dipl Ing Fh	Plattenwaermeaustauscher
US5529120A (en) *	1994-02-01	1996-06-25	Hubbell Incorporated	Heat exchanger for electrical cabinet or the like
US5558155A (en) *	1993-08-06	1996-09-24	Mitsubishi Denki Kabushiki Kaisha	Cooling apparatus and assembling method thereof
US6205662B1 (en) *	1999-05-14	2001-03-27	Yun-Ching Chen	Method of producing a built-up heat exchanger and product thereof

2001
- 2001-04-23 CN CN01220105U patent/CN2478253Y/zh not_active Expired - Fee Related
2002
- 2002-01-25 EP EP02001828A patent/EP1253393B1/de not_active Expired - Lifetime
- 2002-01-25 AT AT02001828T patent/ATE323272T1/de not_active IP Right Cessation
- 2002-01-25 DE DE60210536T patent/DE60210536T2/de not_active Expired - Fee Related

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1592069A (en) *	1976-09-16	1981-07-01	Pasilac As	Heat exchange plate for heat-exchangers
DE3616746A1 (de) *	1986-05-17	1987-11-19	Moll Hermann Dipl Ing Fh	Plattenwaermeaustauscher
US5558155A (en) *	1993-08-06	1996-09-24	Mitsubishi Denki Kabushiki Kaisha	Cooling apparatus and assembling method thereof
US5529120A (en) *	1994-02-01	1996-06-25	Hubbell Incorporated	Heat exchanger for electrical cabinet or the like
US6205662B1 (en) *	1999-05-14	2001-03-27	Yun-Ching Chen	Method of producing a built-up heat exchanger and product thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
ES2207394A1 (es) *	2002-07-10	2004-05-16	Salicru, S.A.	Dispositivo para la disipacion de calor, en especial para componentes semiconductores o componentes similares.
CN116713706A (zh) *	2023-05-31	2023-09-08	深圳市鸿慷电子有限公司	一种鳍片式散热器加工方法

Also Published As

Publication number	Publication date
DE60210536T2 (de)	2007-01-25
EP1253393B1 (de)	2006-04-12
DE60210536D1 (de)	2006-05-24
CN2478253Y (zh)	2002-02-20
EP1253393A3 (de)	2004-03-03
ATE323272T1 (de)	2006-04-15

Publication	Publication Date	Title
US6340056B1 (en)	2002-01-22	Flow channel type heat dissipating fin set
US7312996B2 (en)	2007-12-25	Heat sink for memory strips
US7686480B2 (en)	2010-03-30	Light valve device
US6698500B2 (en)	2004-03-02	Heat sink with fins
US7204303B2 (en)	2007-04-17	Flat tube cold plate assembly
US20070089869A1 (en)	2007-04-26	Heat sink
CN107923607A (zh)	2018-04-17	散热器、照明设备和用于制造散热器的方法
US6819564B2 (en)	2004-11-16	Heat dissipation module
EP1253393B1 (de)	2006-04-12	Wärmeabführende Rippen mit Durchflusskanälen
US20060096737A1 (en)	2006-05-11	Heat exchanger
JP2007281504A (ja)	2007-10-25	ヒートシンクおよびフィンモジュール
JP4157768B2 (ja)	2008-10-01	蒸発器
US20080216993A1 (en)	2008-09-11	Heat dissipating device
JPH0955457A (ja)	1997-02-25	ヒートシンクおよびその製造方法
US6861293B2 (en)	2005-03-01	Stacked fin heat sink and method of making
US6899164B1 (en)	2005-05-31	Heat sink with guiding fins
US20070215318A1 (en)	2007-09-20	Heat dissipating device
US20070137849A1 (en)	2007-06-21	Heatsink with offset fins
CN215121666U (zh)	2021-12-10	散热器
JP3220724B2 (ja)	2001-10-22	ヒートシンク
JP3091858U (ja)	2003-02-21	放熱装置の結合構造
JP2003142863A (ja)	2003-05-16	ヒートシンクおよびフィンモジュール
US6754078B1 (en)	2004-06-22	Heat dissipating device with slanting engaged heat dissipating sheets and bottom plate
US20070284080A1 (en)	2007-12-13	Heat dissipation device
JP2004022830A (ja)	2004-01-22	ヒートシンク

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EP1253393A2 - Wärmeabführende Rippen mit Durchflusskanälen - Google Patents

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Publications (3)

Family

ID=4693685

Family Applications (1)

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Cited By (2)

Families Citing this family (3)

Citations (5)

Patent Citations (5)

Cited By (2)

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