EP0961928A4 - Procede servant a detecter des defauts par balayage sur des tranches a semi-conducteurs - Google Patents

Procede servant a detecter des defauts par balayage sur des tranches a semi-conducteurs

Info

Publication number: EP0961928A4
Authority: EP; European Patent Office
Prior art keywords: inspect; defects; semiconductor wafers; scanning semiconductor; scanning
Prior art date: 1997-02-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP98907527A

Other languages

German (de)

English (en)

Other versions

EP0961928A1 (fr

Inventor

Sidney Braginsky

Robert Parks

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Individual

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-02-21

Filing date

1998-02-20

Publication date

2000-04-26

1998-02-20 Application filed by Individual filed Critical Individual

1999-12-08 Publication of EP0961928A1 publication Critical patent/EP0961928A1/fr

2000-04-26 Publication of EP0961928A4 publication Critical patent/EP0961928A4/fr

Status Withdrawn legal-status Critical Current

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers

Landscapes

Physics & Mathematics (AREA)
Health & Medical Sciences (AREA)
Life Sciences & Earth Sciences (AREA)
Chemical & Material Sciences (AREA)
Analytical Chemistry (AREA)
Biochemistry (AREA)
General Health & Medical Sciences (AREA)
General Physics & Mathematics (AREA)
Immunology (AREA)
Pathology (AREA)
Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Length Measuring Devices By Optical Means (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)

EP98907527A 1997-02-21 1998-02-20 Procede servant a detecter des defauts par balayage sur des tranches a semi-conducteurs Withdrawn EP0961928A4 (fr)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US3901797P	1997-02-21	1997-02-21
US39017P		1997-02-21
PCT/US1998/003239 WO1998037404A1 (fr)	1997-02-21	1998-02-20	Procede servant a detecter des defauts par balayage sur des tranches a semi-conducteurs

Publications (2)

Publication Number	Publication Date
EP0961928A1 EP0961928A1 (fr)	1999-12-08
EP0961928A4 true EP0961928A4 (fr)	2000-04-26

Family

ID=21903212

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP98907527A Withdrawn EP0961928A4 (fr)	1997-02-21	1998-02-20	Procede servant a detecter des defauts par balayage sur des tranches a semi-conducteurs

Country Status (3)

Country	Link
EP (1)	EP0961928A4 (fr)
JP (1)	JP2001512576A (fr)
WO (1)	WO1998037404A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7042580B1 (en)	1999-02-01	2006-05-09	Tokyo Electron Limited	Apparatus for imaging metrology
US7177019B2 (en)	1999-02-01	2007-02-13	Tokyo Electron Limited	Apparatus for imaging metrology
US6690473B1 (en)	1999-02-01	2004-02-10	Sensys Instruments Corporation	Integrated surface metrology
US6563586B1 (en)	1999-02-01	2003-05-13	Therma-Wave, Inc.	Wafer metrology apparatus and method
TW493205B (en) *	1999-03-22	2002-07-01	Sensys Instr Corp	Method and apparatus for wafer metrology
TWI702390B (zh)	2014-12-05	2020-08-21	美商克萊譚克公司	在工作件中用於缺陷偵測的裝置，方法及電腦程式產品
JP2017116293A (ja) *	2015-12-21	2017-06-29	株式会社ディスコ	検査装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4505585A (en) *	1981-03-31	1985-03-19	Olympus Optical Co., Ltd.	System for detecting defects on an optical surface
US4740079A (en) *	1984-10-29	1988-04-26	Hitachi, Ltd.	Method of and apparatus for detecting foreign substances
US5135303A (en) *	1990-02-20	1992-08-04	Hitachi, Ltd.	Method of and apparatus for inspecting surface defects
US5225886A (en) *	1989-09-18	1993-07-06	Hitachi, Ltd.	Method of and apparatus for detecting foreign substances
US5402001A (en) *	1992-10-05	1995-03-28	Matsushita Electric Industrial Co., Ltd.	Method of checking for foreign matter on a substrate with light of maximum reflectivity for that substrate
JPH0830997A (ja) *	1994-07-15	1996-02-02	Yamaha Corp	ディスクドライブ装置のトラッキング制御装置
JPH08271438A (ja) *	1995-03-31	1996-10-18	New Kurieishiyon:Kk	検査装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4402613A (en) *	1979-03-29	1983-09-06	Advanced Semiconductor Materials America	Surface inspection system
US4938654A (en) *	1985-05-17	1990-07-03	Schram Richard R	Automated wafer inspection system
US4893932A (en) *	1986-05-02	1990-01-16	Particle Measuring Systems, Inc.	Surface analysis system and method
US5189481A (en) *	1991-07-26	1993-02-23	Tencor Instruments	Particle detector for rough surfaces

1998
- 1998-02-20 JP JP53687398A patent/JP2001512576A/ja active Pending
- 1998-02-20 EP EP98907527A patent/EP0961928A4/fr not_active Withdrawn
- 1998-02-20 WO PCT/US1998/003239 patent/WO1998037404A1/fr active Search and Examination

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4505585A (en) *	1981-03-31	1985-03-19	Olympus Optical Co., Ltd.	System for detecting defects on an optical surface
US4740079A (en) *	1984-10-29	1988-04-26	Hitachi, Ltd.	Method of and apparatus for detecting foreign substances
US5225886A (en) *	1989-09-18	1993-07-06	Hitachi, Ltd.	Method of and apparatus for detecting foreign substances
US5135303A (en) *	1990-02-20	1992-08-04	Hitachi, Ltd.	Method of and apparatus for inspecting surface defects
US5402001A (en) *	1992-10-05	1995-03-28	Matsushita Electric Industrial Co., Ltd.	Method of checking for foreign matter on a substrate with light of maximum reflectivity for that substrate
JPH0830997A (ja) *	1994-07-15	1996-02-02	Yamaha Corp	ディスクドライブ装置のトラッキング制御装置
JPH08271438A (ja) *	1995-03-31	1996-10-18	New Kurieishiyon:Kk	検査装置
US5757479A (en) *	1995-03-31	1998-05-26	New Creation Co., Ltd.	Optical inspection apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9837404A1 *

Also Published As

Publication number	Publication date
EP0961928A1 (fr)	1999-12-08
WO1998037404A1 (fr)	1998-08-27
JP2001512576A (ja)	2001-08-21

Publication	Publication Date	Title
EP1075652A4 (fr)	2007-06-06	Systeme et procede d'inspection de tranches de semi-conducteurs
IL137996A0 (en)	2001-10-31	Apparatus and method for cleaning semiconductor wafers
SG49948A1 (en)	1998-06-15	Apparatus and method for semiconductor wafer edge inspection
SG48688A1 (en)	1998-05-18	Method of manufacturing semiconductor chips for display
AU5947499A (en)	1999-11-16	Inspection system and method for leads of semiconductor devices
SG63637A1 (en)	1999-03-30	Apparatus and method for cleaning semiconductor wafers
IL113829A0 (en)	1995-08-31	Apparatus for optical inspection of wafers during polishing
DE69712561D1 (de)	2002-06-20	Vertikale Behälter für wafer
TW475491U (en)	2002-02-01	Apparatus of cleaning semiconductor wafer
AU2001281243A1 (en)	2002-02-25	Device and method for optical inspection of semiconductor wafer
DE69416771D1 (de)	1999-04-08	Inspektionsapparat für Halbleiterscheiben
SG67279A1 (en)	1999-09-21	Method for alignment of manufacturing semiconductor apparatus
GB2296818B (en)	1998-12-16	Method of producing semiconductor wafer
GB2306049B (en)	1999-12-01	Method for inspecting process defects occurring in semiconductor devices
GB2291267B (en)	1998-07-15	Method for detecting wafer defects
EP0720521A4 (fr)	1996-12-18	Appareil et procede de decoupage de tranches semi-conductrices
GB9914083D0 (en)	1999-08-18	Method and apparatus for improved semiconductor wafer polishing
EP0961928A4 (fr)	2000-04-26	Procede servant a detecter des defauts par balayage sur des tranches a semi-conducteurs
GB2356047B (en)	2003-11-26	Wafer surface inspection method
GB2317052B (en)	1998-10-21	Thermal processing apparatus for semiconductor wafers
EP0715349A3 (fr)	1997-04-16	Méthode d'évaluation de la durée de vie sur la surface de semi-conducteurs
EP1135659A4 (fr)	2005-04-13	Traitement thermique de substrats pour semi-conducteurs et appareil a cet effet
AU1411900A (en)	2000-06-19	Method and apparatus for wafer inspection
AU6341396A (en)	1997-02-05	Method for characterizing defects on semiconductor wafers
GB2309077B (en)	1998-10-07	Method of detecting defects of structure

Legal Events

Date	Code	Title	Description
1999-10-22	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1999-12-08	17P	Request for examination filed	Effective date: 19990818
1999-12-08	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
2000-04-26	A4	Supplementary search report drawn up and despatched	Effective date: 20000309
2000-04-26	AK	Designated contracting states	Kind code of ref document: A4 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
2000-04-26	RIC1	Information provided on ipc code assigned before grant	Free format text: 7G 01N 21/00 A, 7G 01N 21/84 B, 7G 01N 21/86 B, 7G 01B 9/08 B, 7G 01B 11/00 B, 7G 01N 21/88 B, 7H 01L 21/66 B
2002-01-25	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2002-03-13	18D	Application deemed to be withdrawn	Effective date: 20010901